JP4811672B2 - 可溶栓用合金および可溶栓 - Google Patents
可溶栓用合金および可溶栓 Download PDFInfo
- Publication number
- JP4811672B2 JP4811672B2 JP2007520990A JP2007520990A JP4811672B2 JP 4811672 B2 JP4811672 B2 JP 4811672B2 JP 2007520990 A JP2007520990 A JP 2007520990A JP 2007520990 A JP2007520990 A JP 2007520990A JP 4811672 B2 JP4811672 B2 JP 4811672B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- fusible
- stopper
- mass
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910045601 alloy Inorganic materials 0.000 title claims description 87
- 239000000956 alloy Substances 0.000 title claims description 87
- 229910052797 bismuth Inorganic materials 0.000 claims description 10
- 229910052787 antimony Inorganic materials 0.000 claims description 4
- 238000005057 refrigeration Methods 0.000 description 25
- 239000003507 refrigerant Substances 0.000 description 20
- 229910017835 Sb—Sn Inorganic materials 0.000 description 12
- 230000008018 melting Effects 0.000 description 12
- 238000002844 melting Methods 0.000 description 12
- 238000012360 testing method Methods 0.000 description 11
- 229910052793 cadmium Inorganic materials 0.000 description 9
- 229910052745 lead Inorganic materials 0.000 description 9
- 239000007790 solid phase Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 229910052718 tin Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004455 differential thermal analysis Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910018956 Sn—In Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- PSMFTUMUGZHOOU-UHFFFAOYSA-N [In].[Sn].[Bi] Chemical compound [In].[Sn].[Bi] PSMFTUMUGZHOOU-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 239000005437 stratosphere Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K17/00—Safety valves; Equalising valves, e.g. pressure relief valves
- F16K17/36—Safety valves; Equalising valves, e.g. pressure relief valves actuated in consequence of extraneous circumstances, e.g. shock, change of position
- F16K17/38—Safety valves; Equalising valves, e.g. pressure relief valves actuated in consequence of extraneous circumstances, e.g. shock, change of position of excessive temperature
- F16K17/383—Safety valves; Equalising valves, e.g. pressure relief valves actuated in consequence of extraneous circumstances, e.g. shock, change of position of excessive temperature the valve comprising fusible, softening or meltable elements, e.g. used as link, blocking element, seal, closure plug
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/16—Receivers
- F25B2400/162—Receivers characterised by the plug or stop
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/12—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overpressure
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Safety Valves (AREA)
- Turbine Rotor Nozzle Sealing (AREA)
Description
本発明の約66〜70℃に固相・ピーク温度を有する合金であるBi-In-Sb-Sn系合金においてSnの量が5質量%未満では、合金自体の機械的強度が低いため耐圧試験における合金の飛び出しが所定量を超えてしまうと言う欠点があり、Snの量を8質量%より多くすると、Bi-In-Sb-Sn系合金の固相温度が低下するため合金の溶融温度が使用される温度域に近くなって、合金の強度の劣化が起こり、作動温度域でのクリープ特性を劣化させる。そのために本発明のBi-In-Sb-Sn系合金では、Sn含有量が5〜8質量%でなくではならない。またBi含有量が31質量%未満では、Bi-In-Sb-Sn系合金の液相温度が上昇しすぎて合金の溶融性が悪くなり溶融試験に合格しなくなり、Biの量が34質量%より多くなるとSn-In合金の共晶点を外れてしまうため、液相温度が上昇しすぎて合金の溶融性が悪くなり溶融試験に合格しなくなる。さらに本発明の約66〜70℃に固相・ピーク温度を有する合金は、Bi-In-Sn系合金に、さらにSbを添加している。これは、約66〜70℃に固相・ピーク温度を有する合金が使用される冷凍機には、R404Aなどの凝固圧の高い溶媒が用いられるので、より耐圧性に強い合金が求められるからである。本発明ではSbを添加することにより、凝固圧の高い溶媒であるR404Aの使用に対しても充分な耐圧性を維持することが可能である。本発明のBi-In-Sb-Sn系合金のSbの量が0.2質量%未満では、合金自体の機械的強度が低いため耐圧試験における合金の飛び出しが所定量を超えてしまうと言う欠点があり、Sbの量を4質量%より多くすると、Bi-In-Sb-Sn系合金の固相温度が低下するため合金の溶融温度が使用される温度域に近くなって、合金の強度の劣化が起こり、作動温度域でのクリープ特性を劣化させる。そのため本発明のBi-In-Sb-Sn系合金は、Sb含有量が0.2〜4質量%でなくではならない。本発明では、Sn5〜8質量%、Bi31〜34質量%、Sb0.2〜4質量%、残部Inとすることで、66〜70℃の使用温度域で強いクリープ特性の可溶栓用合金を得ることが可能になる。さらに望むべきは、Sn5質量%、Bi33質量%、Sb2質量%、残部Inの合金とすることで、作動温度域が狭く、クリープ特性に強い可溶栓用合金を得ることが可能になる。本発明の可溶栓用合金の基本構成成分であるSn、Bi、Sbが上述の組成範囲から外れた場合、溶融温度域が広くなってしまい、作動安定性が損なわれてしまう。
表1に示した可溶性合金を作り、各合金組成の示差熱分析による加熱曲線を測定して吸熱ピークの開始点、吸熱ピークの最下点、吸熱ピークの終了点をもって、固相温度、ピーク温度、液相温度を測定した。表1に各合金の溶融温度を示す。
表1の中で比較例3および5は、特許文献2の可溶栓用合金である。
溶融温度の測定条件は次の通り。
1.示差熱分析の測定
・示差熱分析測定装置 SII製示差走査熱量計
・昇温速度:5deg/min
・試料重量:10 mg
1.) 本発明のBi-In-Sb-Sn系合金を充填した可溶栓を65℃に設定した恒温室中に入れ、コンプレッサーに接続して、12.5MPaの圧力を掛ける。
2.) 24時間後に可溶栓を恒温室中から取り出し、コンプレッサーとの接続を解除する。
3.) 24時間放置後に、充填した可溶合金がブランク材から抜け出た長さを測定する。
4.) 表1に耐圧試験を実施した時に伸びた合金の長さを、図2に表1の実施例と比較例の合金組成を65℃の条件で測定した代表的写真を示す。写真の中で、1は実施例4の可溶栓、2は比較例5の可溶栓の結果である。
1.) 可溶栓をコンプレッサーに接続して、3MPaの圧力を掛ける。
2.) コンプレッサーに接続した可溶栓を水槽中に投入して、水槽の水を加熱する。
3.) 水槽中の可溶栓から一気に空気が抜けた温度を作動温度として測定する。
2 可溶栓合金
3 ネジ
Claims (3)
- Sn5〜8質量%、Bi31〜34質量%、Sb0.2〜4質量%、残部Inとする合金からなることを特徴とする作動温度が66〜70℃である可溶栓用合金。
- 前記可溶栓用合金に、さらにCu0.1〜1.0質量%、Ge0.1〜1.0質量%、Ag0.1〜0.7質量%、Au0.1〜0.6質量%、Zn0.2〜0.6質量%、Ni0.02〜0.1質量%、La族0.01〜0.1質量%の強度添加元素の中で最低でも1元素以上を合計2.0質量%以下添加したものからなる請求項1に記載の作動温度が66〜70℃である可溶栓用合金。
- 請求項1または2に記載の可溶栓用合金を用いた作動温度が66〜70℃である可溶栓。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2005/007214 WO2006112015A1 (ja) | 2005-04-14 | 2005-04-14 | 可溶栓用合金および可溶栓 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2006112015A1 JPWO2006112015A1 (ja) | 2008-11-27 |
JP4811672B2 true JP4811672B2 (ja) | 2011-11-09 |
Family
ID=37114768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007520990A Active JP4811672B2 (ja) | 2005-04-14 | 2005-04-14 | 可溶栓用合金および可溶栓 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10036479B2 (ja) |
JP (1) | JP4811672B2 (ja) |
CN (1) | CN101180483B (ja) |
WO (1) | WO2006112015A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5469922B2 (ja) * | 2009-06-02 | 2014-04-16 | 株式会社不二工機 | 可溶栓 |
JP6291333B2 (ja) * | 2014-04-22 | 2018-03-14 | 東芝キヤリア株式会社 | 冷凍サイクル装置 |
CN106756381B (zh) * | 2016-12-05 | 2018-08-31 | 佛山新瑞科创金属材料有限公司 | 一种具有反熔特性用于80-90℃散热的液态金属 |
CN106756382B (zh) * | 2016-12-05 | 2018-08-31 | 佛山新瑞科创金属材料有限公司 | 一种具有反熔特性用于54-61℃散热的液态金属 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001214985A (ja) * | 2000-01-31 | 2001-08-10 | Mitsubishi Electric Corp | 可溶栓用低温溶融合金、この合金を用いた可溶栓、および、この可溶栓を用いた冷凍装置 |
JP2002310543A (ja) * | 2001-04-06 | 2002-10-23 | Mitsubishi Electric Corp | 可溶栓およびその製造方法 |
JP2003130240A (ja) * | 2001-10-29 | 2003-05-08 | Mitsubishi Electric Corp | 可溶栓、その製造方法及びこれを備えた冷凍装置 |
JP2004296422A (ja) * | 2003-02-05 | 2004-10-21 | Uchihashi Estec Co Ltd | 保護素子 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1059373A (zh) * | 1990-08-28 | 1992-03-11 | 沈阳市铝制品厂 | 制作易熔片的低熔点合金 |
JP2002115940A (ja) * | 2000-10-06 | 2002-04-19 | Senju Sprinkler Kk | 可溶栓 |
JP4911836B2 (ja) * | 2001-06-28 | 2012-04-04 | ソルダーコート株式会社 | 温度ヒューズ用可溶性合金および温度ヒューズ用線材および温度ヒューズ |
JP3990169B2 (ja) * | 2002-03-06 | 2007-10-10 | 内橋エステック株式会社 | 合金型温度ヒュ−ズ |
JP2005063792A (ja) | 2003-08-11 | 2005-03-10 | Uchihashi Estec Co Ltd | 感熱エレメント及びサーモプロテクタ。 |
US20060067852A1 (en) * | 2004-09-29 | 2006-03-30 | Daewoong Suh | Low melting-point solders, articles made thereby, and processes of making same |
-
2005
- 2005-04-14 JP JP2007520990A patent/JP4811672B2/ja active Active
- 2005-04-14 WO PCT/JP2005/007214 patent/WO2006112015A1/ja active Application Filing
- 2005-04-14 US US11/918,255 patent/US10036479B2/en active Active
- 2005-04-14 CN CN2005800498270A patent/CN101180483B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001214985A (ja) * | 2000-01-31 | 2001-08-10 | Mitsubishi Electric Corp | 可溶栓用低温溶融合金、この合金を用いた可溶栓、および、この可溶栓を用いた冷凍装置 |
JP2002310543A (ja) * | 2001-04-06 | 2002-10-23 | Mitsubishi Electric Corp | 可溶栓およびその製造方法 |
JP2003130240A (ja) * | 2001-10-29 | 2003-05-08 | Mitsubishi Electric Corp | 可溶栓、その製造方法及びこれを備えた冷凍装置 |
JP2004296422A (ja) * | 2003-02-05 | 2004-10-21 | Uchihashi Estec Co Ltd | 保護素子 |
Also Published As
Publication number | Publication date |
---|---|
WO2006112015A1 (ja) | 2006-10-26 |
JPWO2006112015A1 (ja) | 2008-11-27 |
CN101180483A (zh) | 2008-05-14 |
US20090148338A1 (en) | 2009-06-11 |
US10036479B2 (en) | 2018-07-31 |
CN101180483B (zh) | 2010-07-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1147160B1 (en) | Vaporisable composition | |
EP3704203B1 (en) | Low gwp refrigerant blends | |
JP5599449B2 (ja) | 省エネルギーランプ用のアマルガム球及びそれらの製造 | |
JP4032094B2 (ja) | 可溶栓用合金および可溶栓 | |
JP4043042B2 (ja) | 可溶栓 | |
JP4811672B2 (ja) | 可溶栓用合金および可溶栓 | |
JP3681060B2 (ja) | 可溶栓、その製造方法及びこれを備えた冷凍装置 | |
EP1916313B1 (en) | Sprinkler head | |
JP3630400B2 (ja) | 可溶栓用低温溶融合金、この合金を用いた可溶栓、および、この可溶栓を用いた冷凍装置 | |
EP4077580B1 (en) | Refrigerant | |
KR20070084517A (ko) | 가용 플러그용 합금 및 가용 플러그 | |
JP3630409B2 (ja) | 可溶栓およびその製造方法 | |
JP3885995B2 (ja) | 温度ヒューズ | |
JP4692822B2 (ja) | 温度ヒューズ用合金 | |
JP2011202874A (ja) | 可溶栓用合金およびそれを用いた可溶栓並びに冷凍装置 | |
US20100303668A1 (en) | Fusible alloy for pressure relief devices | |
GB2109812A (en) | An improved soldering alloy | |
CA2153648A1 (fr) | Melanges non azeotropiques de difluoromethane, trifluoromethane et 1,1,1,2-tetrafluoroethane, et leur application comme fluides frigorigenes |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A529 | Written submission of copy of amendment under article 34 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A5211 Effective date: 20070827 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070903 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20070919 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070918 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100817 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100901 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110728 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110810 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4811672 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140902 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140902 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |