JP4801133B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4801133B2
JP4801133B2 JP2008318134A JP2008318134A JP4801133B2 JP 4801133 B2 JP4801133 B2 JP 4801133B2 JP 2008318134 A JP2008318134 A JP 2008318134A JP 2008318134 A JP2008318134 A JP 2008318134A JP 4801133 B2 JP4801133 B2 JP 4801133B2
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JP
Japan
Prior art keywords
semiconductor chip
semiconductor
electrode pad
chip
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008318134A
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English (en)
Japanese (ja)
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JP2009088557A5 (https=
JP2009088557A (ja
Inventor
連也 川野
信明 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2008318134A priority Critical patent/JP4801133B2/ja
Publication of JP2009088557A publication Critical patent/JP2009088557A/ja
Publication of JP2009088557A5 publication Critical patent/JP2009088557A5/ja
Application granted granted Critical
Publication of JP4801133B2 publication Critical patent/JP4801133B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2008318134A 2008-12-15 2008-12-15 半導体装置 Expired - Fee Related JP4801133B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008318134A JP4801133B2 (ja) 2008-12-15 2008-12-15 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008318134A JP4801133B2 (ja) 2008-12-15 2008-12-15 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004095965A Division JP4580671B2 (ja) 2004-03-29 2004-03-29 半導体装置

Publications (3)

Publication Number Publication Date
JP2009088557A JP2009088557A (ja) 2009-04-23
JP2009088557A5 JP2009088557A5 (https=) 2010-07-15
JP4801133B2 true JP4801133B2 (ja) 2011-10-26

Family

ID=40661468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008318134A Expired - Fee Related JP4801133B2 (ja) 2008-12-15 2008-12-15 半導体装置

Country Status (1)

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JP (1) JP4801133B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014136156A1 (ja) * 2013-03-08 2017-02-09 パナソニック株式会社 半導体装置
KR102605617B1 (ko) * 2016-11-10 2023-11-23 삼성전자주식회사 적층 반도체 패키지

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0548001A (ja) * 1991-08-19 1993-02-26 Fujitsu Ltd 半導体集積回路の実装方法
JPH08213545A (ja) * 1995-02-06 1996-08-20 Mitsui High Tec Inc 半導体装置
JP2001024150A (ja) * 1999-07-06 2001-01-26 Sony Corp 半導体装置
JP2003060153A (ja) * 2001-07-27 2003-02-28 Nokia Corp 半導体パッケージ

Also Published As

Publication number Publication date
JP2009088557A (ja) 2009-04-23

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