JP4799130B2 - Icチップおよびicチップの作製方法 - Google Patents
Icチップおよびicチップの作製方法 Download PDFInfo
- Publication number
- JP4799130B2 JP4799130B2 JP2005322333A JP2005322333A JP4799130B2 JP 4799130 B2 JP4799130 B2 JP 4799130B2 JP 2005322333 A JP2005322333 A JP 2005322333A JP 2005322333 A JP2005322333 A JP 2005322333A JP 4799130 B2 JP4799130 B2 JP 4799130B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- resin film
- integrated circuit
- chip
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
Landscapes
- Details Of Aerials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005322333A JP4799130B2 (ja) | 2004-11-09 | 2005-11-07 | Icチップおよびicチップの作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004324948 | 2004-11-09 | ||
| JP2004324948 | 2004-11-09 | ||
| JP2005322333A JP4799130B2 (ja) | 2004-11-09 | 2005-11-07 | Icチップおよびicチップの作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006164249A JP2006164249A (ja) | 2006-06-22 |
| JP2006164249A5 JP2006164249A5 (https=) | 2008-12-18 |
| JP4799130B2 true JP4799130B2 (ja) | 2011-10-26 |
Family
ID=36666140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005322333A Expired - Fee Related JP4799130B2 (ja) | 2004-11-09 | 2005-11-07 | Icチップおよびicチップの作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4799130B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5094232B2 (ja) * | 2006-06-26 | 2012-12-12 | 株式会社半導体エネルギー研究所 | 半導体装置を内包する用紙およびその作製方法 |
| CN101479747B (zh) | 2006-06-26 | 2011-05-18 | 株式会社半导体能源研究所 | 包括半导体器件的纸及其制造方法 |
| JP5256935B2 (ja) | 2008-08-26 | 2013-08-07 | 富士通株式会社 | Idタグの製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0574624A (ja) * | 1991-09-13 | 1993-03-26 | Matsushita Electric Ind Co Ltd | コイル |
-
2005
- 2005-11-07 JP JP2005322333A patent/JP4799130B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006164249A (ja) | 2006-06-22 |
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