JP4799130B2 - Ｉｃチップおよびｉｃチップの作製方法 - Google Patents

Ｉｃチップおよびｉｃチップの作製方法 Download PDF

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Publication number
JP4799130B2
JP4799130B2 JP2005322333A JP2005322333A JP4799130B2 JP 4799130 B2 JP4799130 B2 JP 4799130B2 JP 2005322333 A JP2005322333 A JP 2005322333A JP 2005322333 A JP2005322333 A JP 2005322333A JP 4799130 B2 JP4799130 B2 JP 4799130B2
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Japan
Prior art keywords
film
resin film
integrated circuit
chip
resin
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Expired - Fee Related
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JP2005322333A
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Japanese (ja)
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JP2006164249A5 (enExample
JP2006164249A (ja
Inventor
直人 楠本
卓也 鶴目
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2005322333A priority Critical patent/JP4799130B2/ja
Publication of JP2006164249A publication Critical patent/JP2006164249A/ja
Publication of JP2006164249A5 publication Critical patent/JP2006164249A5/ja
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Publication of JP4799130B2 publication Critical patent/JP4799130B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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JP2005322333A 2004-11-09 2005-11-07 Ｉｃチップおよびｉｃチップの作製方法 Expired - Fee Related JP4799130B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005322333A JP4799130B2 (ja) 2004-11-09 2005-11-07 Ｉｃチップおよびｉｃチップの作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004324948 2004-11-09
JP2004324948 2004-11-09
JP2005322333A JP4799130B2 (ja) 2004-11-09 2005-11-07 Ｉｃチップおよびｉｃチップの作製方法

Publications (3)

Publication Number Publication Date
JP2006164249A JP2006164249A (ja) 2006-06-22
JP2006164249A5 JP2006164249A5 (enExample) 2008-12-18
JP4799130B2 true JP4799130B2 (ja) 2011-10-26

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ID=36666140

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JP2005322333A Expired - Fee Related JP4799130B2 (ja) 2004-11-09 2005-11-07 Ｉｃチップおよびｉｃチップの作製方法

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JP (1) JP4799130B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5094232B2 (ja) * 2006-06-26 2012-12-12 株式会社半導体エネルギー研究所 半導体装置を内包する用紙およびその作製方法
CN101479747B (zh) 2006-06-26 2011-05-18 株式会社半导体能源研究所 包括半导体器件的纸及其制造方法
JP5256935B2 (ja) 2008-08-26 2013-08-07 富士通株式会社 Ｉｄタグの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0574624A (ja) * 1991-09-13 1993-03-26 Matsushita Electric Ind Co Ltd コイル

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Publication number Publication date
JP2006164249A (ja) 2006-06-22

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