JP4789726B2 - 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法 - Google Patents

感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法 Download PDF

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JP4789726B2
JP4789726B2 JP2006194591A JP2006194591A JP4789726B2 JP 4789726 B2 JP4789726 B2 JP 4789726B2 JP 2006194591 A JP2006194591 A JP 2006194591A JP 2006194591 A JP2006194591 A JP 2006194591A JP 4789726 B2 JP4789726 B2 JP 4789726B2
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resin composition
photosensitive resin
pattern
phenyl
composition
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JP2008020839A5 (enExample
JP2008020839A (ja
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禎之 小野
亮 酒井
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Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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Priority to JP2006194591A priority Critical patent/JP4789726B2/ja
Priority to TW96125748A priority patent/TWI408500B/zh
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  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2006194591A 2006-07-14 2006-07-14 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法 Active JP4789726B2 (ja)

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JP2006194591A JP4789726B2 (ja) 2006-07-14 2006-07-14 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法
TW96125748A TWI408500B (zh) 2006-07-14 2007-07-13 感光性樹脂組成物、其層合物、其硬化物及使用該組成物之圖型的形成方法（１）

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JP2006194591A JP4789726B2 (ja) 2006-07-14 2006-07-14 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法

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JP2008020839A JP2008020839A (ja) 2008-01-31
JP2008020839A5 JP2008020839A5 (enExample) 2009-07-23
JP4789726B2 true JP4789726B2 (ja) 2011-10-12

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Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5072101B2 (ja) * 2008-04-25 2012-11-14 日本化薬株式会社 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物
JP5137674B2 (ja) * 2008-04-26 2013-02-06 日本化薬株式会社 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物
JP5137673B2 (ja) * 2008-04-26 2013-02-06 日本化薬株式会社 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物
JP5247396B2 (ja) * 2008-07-02 2013-07-24 日本化薬株式会社 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物
KR101700980B1 (ko) 2009-02-20 2017-01-31 산아프로 가부시키가이샤 술포늄염, 광산 발생제 및 감광성 수지 조성물
JP5967824B2 (ja) * 2012-10-26 2016-08-10 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP5901070B2 (ja) * 2012-10-26 2016-04-06 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP6066413B2 (ja) * 2012-11-22 2017-01-25 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP5939964B2 (ja) * 2012-11-22 2016-06-29 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP5939965B2 (ja) * 2012-11-22 2016-06-29 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP5939963B2 (ja) * 2012-11-22 2016-06-29 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP6021180B2 (ja) * 2012-11-22 2016-11-09 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP6066414B2 (ja) * 2012-11-22 2017-01-25 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
US20240027901A1 (en) 2020-12-14 2024-01-25 San-Apro Ltd. Photoacid generator, and photosensitive composition using same
CN114940857A (zh) * 2022-06-23 2022-08-26 上海镭利电子材料有限公司 一种抗腐蚀复合型环氧树脂光固化薄膜及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03245149A (ja) * 1990-02-23 1991-10-31 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性エレメント
JPH05140267A (ja) * 1991-11-25 1993-06-08 Nippon Kayaku Co Ltd 樹脂組成物、透明薄膜の形成法及び透明薄膜
JPH08165333A (ja) * 1994-12-14 1996-06-25 Sumitomo Bakelite Co Ltd プリプレグの製造方法
JPH0987366A (ja) * 1995-09-22 1997-03-31 Hitachi Ltd 感光性樹脂組成物とそれを用いた多層配線板の製法
JPH1097068A (ja) * 1996-09-20 1998-04-14 Nippon Kayaku Co Ltd 樹脂組成物、永久レジスト樹脂組成物及びこれらの硬化物
JPH115826A (ja) * 1997-04-22 1999-01-12 Matsushita Electric Works Ltd ビルドアップ用エポキシ樹脂組成物
US5844062A (en) * 1997-04-29 1998-12-01 Industrial Technology Research Institute Process for preparing phenolepoxy resins in the absence of an aqueous phase
JP5095208B2 (ja) * 2004-05-28 2012-12-12 サンアプロ株式会社 新規なオニウムおよび遷移金属錯体のフッ素化アルキルフルオロリン酸塩

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TWI408500B (zh) 2013-09-11
JP2008020839A (ja) 2008-01-31
TW200813633A (en) 2008-03-16

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