JP4779485B2 - 基板シート及び回路基板の製造方法 - Google Patents
基板シート及び回路基板の製造方法 Download PDFInfo
- Publication number
- JP4779485B2 JP4779485B2 JP2005213382A JP2005213382A JP4779485B2 JP 4779485 B2 JP4779485 B2 JP 4779485B2 JP 2005213382 A JP2005213382 A JP 2005213382A JP 2005213382 A JP2005213382 A JP 2005213382A JP 4779485 B2 JP4779485 B2 JP 4779485B2
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- JP
- Japan
- Prior art keywords
- external
- electrode
- electrodes
- circuit board
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17526—Electrical contacts to the cartridge
- B41J2/1753—Details of contacts on the cartridge, e.g. protection of contacts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17503—Ink cartridges
- B41J2/17559—Cartridge manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
12a,12b,22a,22b テスト電極
13a,13b,23a,23b 延設導体
3 基板シート
4 回路基板
52 圧電アクチュエータプレート(外部の機器)
521c,521m 第1個別電極
522c,522m 第1接地電極
H ハンダ(導電性のろう材)
Claims (6)
- 回路基板の輪郭の少なくとも一辺に沿う領域に複数の外部電極、その各外部電極から前記輪郭の外へ延設した延設導体を介して前記外部電極と接続した複数のテスト電極をそれぞれ備え、前記各外部電極には、外部機器と接合するための導電性ろう材が付着されており、前記複数の外部電極を含み、前記延設導体は含まない前記回路基板を切り出すための基板シートであって、
前記延設導体の前記延設方向と直角方向の幅は、前記外部電極及びテスト電極の前記延設方向と直角方向の幅よりも小さいことを特徴とする基板シート。 - 前記回路基板の対向する2辺に沿う各領域にそれぞれ前記外部電極が設けられ、その各領域からそれぞれ反対方向へ前記延設電極が延設されて前記各外部電極に前記各テスト電極が接続されていることを特徴とする請求項1に記載の基材シート。
- 前記各延設導体は、隣接する延設導体と前記延設方向の長さを異にして形成されるとともに前記各テスト電極は、隣接するテスト電極と前記延設導体の延設方向の位置を異にして配置され、その各テスト電極の前記幅は、前記外部電極の前記幅よりも大きいことを特徴とする請求項1または2に記載の基板シート。
- 回路基板をそれよりも大きい基材シートから切り出して製造する方法であって、
前記基材シートの、回路基板の輪郭の少なくとも一辺に沿う領域に複数の外部電極、その各外部電極から前記輪郭の外へ延設した延設導体を介して前記外部電極と接続した複数のテスト電極をそれぞれ形成し、その際、前記延設導体の前記延設方向と直角方向の幅は、前記外部電極及びテスト電極の前記延設方向と直角方向の幅よりも小さく形成し、
前記各外部電極に、外部機器と接合するための導電性ろう材を付着し、
前記複数の外部電極を含み、前記延設導体は含まない前記回路基板を、前記基板シートから切り出すことを特徴とする回路基板の製造方法。 - 前記導電性ろう材は、前記延設導体の延設方向と平行に前記基板シートを搬送している状態で、前記各外部電極に対して付着させることを特徴とする請求項4に記載の回路基板の製造方法。
- 複数の前記回路基板に対応する複数組の外部電極、延設導体及びテスト電極を相互に平行に配置して前記基板シートに形成し、
その基板シートを複数組の外部電極、延設導体及びテスト電極の配置方向に搬送して、前記外部電極に前記ろう材を付着させることを特徴とする請求項5に記載の回路基板の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005213382A JP4779485B2 (ja) | 2005-07-22 | 2005-07-22 | 基板シート及び回路基板の製造方法 |
US11/490,204 US7656038B2 (en) | 2005-07-22 | 2006-07-21 | Substrate sheet, manufacturing method of circuit substrate, and ink jet head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005213382A JP4779485B2 (ja) | 2005-07-22 | 2005-07-22 | 基板シート及び回路基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007035730A JP2007035730A (ja) | 2007-02-08 |
JP4779485B2 true JP4779485B2 (ja) | 2011-09-28 |
Family
ID=37678668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005213382A Expired - Fee Related JP4779485B2 (ja) | 2005-07-22 | 2005-07-22 | 基板シート及び回路基板の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7656038B2 (ja) |
JP (1) | JP4779485B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102893585B (zh) * | 2010-05-07 | 2015-09-23 | 黑莓有限公司 | 用于基于移动设备标识模块来配置设备个性的方法和设备 |
US11158619B2 (en) * | 2016-10-31 | 2021-10-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Redistribution layers in semiconductor packages and methods of forming same |
JP7041547B2 (ja) | 2018-02-20 | 2022-03-24 | 東芝テック株式会社 | インクジェットヘッド、インクジェットプリンタ、インクジェットヘッドの製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61168677A (ja) * | 1985-01-22 | 1986-07-30 | Pentel Kk | 水性顔料インキ |
JPH01259592A (ja) * | 1988-04-08 | 1989-10-17 | Fujitsu Ltd | 印刷配線板 |
JPH03270197A (ja) | 1990-03-20 | 1991-12-02 | Toshiba Corp | 索状体の保持装置 |
JPH08250844A (ja) * | 1995-03-09 | 1996-09-27 | Oki Data:Kk | プリント配線板 |
US6078100A (en) * | 1999-01-13 | 2000-06-20 | Micron Technology, Inc. | Utilization of die repattern layers for die internal connections |
JP4592875B2 (ja) * | 2000-06-12 | 2010-12-08 | Nec液晶テクノロジー株式会社 | フレキシブル配線基板及びその製造方法並びに表示装置 |
JP4151250B2 (ja) | 2001-09-11 | 2008-09-17 | ブラザー工業株式会社 | 記録装置 |
US7149090B2 (en) | 2001-09-11 | 2006-12-12 | Brother Kogyo Kabushiki Kaisha | Structure of flexible printed circuit board |
US6977431B1 (en) * | 2003-11-05 | 2005-12-20 | Amkor Technology, Inc. | Stackable semiconductor package and manufacturing method thereof |
-
2005
- 2005-07-22 JP JP2005213382A patent/JP4779485B2/ja not_active Expired - Fee Related
-
2006
- 2006-07-21 US US11/490,204 patent/US7656038B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US7656038B2 (en) | 2010-02-02 |
US20070019060A1 (en) | 2007-01-25 |
JP2007035730A (ja) | 2007-02-08 |
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