JP4771092B2 - 撮像装置 - Google Patents
撮像装置 Download PDFInfo
- Publication number
- JP4771092B2 JP4771092B2 JP2007518887A JP2007518887A JP4771092B2 JP 4771092 B2 JP4771092 B2 JP 4771092B2 JP 2007518887 A JP2007518887 A JP 2007518887A JP 2007518887 A JP2007518887 A JP 2007518887A JP 4771092 B2 JP4771092 B2 JP 4771092B2
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- JP
- Japan
- Prior art keywords
- imaging
- signal
- imaging device
- temperature
- processing chip
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000003384 imaging method Methods 0.000 title claims description 193
- 238000006243 chemical reaction Methods 0.000 claims description 62
- 238000001514 detection method Methods 0.000 claims description 19
- 239000003990 capacitor Substances 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013144 data compression Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/63—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to dark current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/571—Control of the dynamic range involving a non-linear response
- H04N25/573—Control of the dynamic range involving a non-linear response the logarithmic type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Description
請求の範囲第4項記載の発明によれば、入射光量に応じて、(傾きの異なる)複数の線形変換特性を切換可能な撮像素子を備えることにより、温度変化に起因する線形変換特性の傾き変動や、切換え点変動を補正することができる。
請求の範囲第4項記載の発明によれば、入射光量に応じて、(傾きの異なる)複数の線形変換特性を切換可能な撮像素子を備えることにより、温度変化に起因する線形変換特性の傾き変動や、切換え点変動を補正することができる。
2 筐体
3 レンズ
4 基板
5 撮像素子
6 信号処理チップ
7 マイクロレンズアレイ
8 温度センサ
9,10 電極パッド
11 ワイヤ
12 電極パッド
13 システム制御部
14 レンズユニット
15 制御部
16 信号処理部
17 タイミング生成部
18 電源ライン
19 垂直走査回路
20 水平走査回路
21 補正回路
32,33 配線用孔
34,35 バンプ電極
36,37 接着層
本発明の第1の実施形態について、図1〜図8を参照して説明する。
本発明の第2の実施形態について、図9を参照して説明する。なお、第1の実施形態と同一部分には同一符号を付してその説明を省略し、第1の実施形態と異なる構成及びその作用について説明する。
Claims (10)
- 入射光を電気信号に変換する撮像素子と、
前記撮像素子と積層して実装される信号処理チップと、
前記撮像素子と前記信号処理チップとを積層した状態で前記撮像素子に近接するように前記信号処理チップに組み込まれた温度センサと、を備えることを特徴とする撮像装置。 - 前記温度センサの検出結果に基づいて温度変化に起因する前記撮像素子の出力信号のばらつきを補正する制御部を備えることを特徴とする請求の範囲第1項に記載の撮像装置。
- 前記撮像素子は入射光を電気信号に線形変換する線形変換動作と対数変換する対数変換動作とを入射光量に応じて切り換え可能な複数の画素を有することを特徴とする請求の範囲第1項又は第2項に記載の撮像装置。
- 前記撮像素子は、入射光量に応じて複数の線形変換特性を切換可能であり、温度変化に起因する線形変換特性の傾き変動や、切換え点変動を補正することができることを特徴とする請求の範囲第1項〜第3項のいずれか1項に記載の撮像装置。
- 前記温度センサは前記撮像素子と前記信号処理チップとを積層した状態で前記撮像素子の撮像エリアの後面側に近接するように組み込まれていることを特徴とする請求の範囲第1項〜第4項のいずれか1項に記載の撮像装置。
- 1つの前記温度センサが前記撮像素子と前記信号処理チップとを積層した状態で前記撮像素子の撮像エリアの中心付近に近接するように前記信号処理チップに組み込まれていることを特徴とする請求の範囲第1項〜第5項のいずれか1項に記載の撮像装置。
- 前記温度センサは前記撮像素子の撮像エリアに重なる部分に設けてあることを特徴とする請求の範囲第1項〜第6項のいずれか1項に記載の撮像装置。
- 複数の前記温度センサが前記信号処理チップに組み込まれていることを特徴とする請求の範囲第1項〜第5項のいずれか1項に記載の撮像装置。
- 前記撮像素子及び前記信号処理チップはバンプ電極によって電気的に接続されていることを特徴とする請求の範囲第1項〜第8項のいずれか1項に記載の撮像装置。
- 前記撮像素子及び前記信号処理チップの端部周辺には配線を挿通するための複数の配線用孔がそれぞれ形成されていることを特徴とする請求の範囲第1項〜第9項いずれか1項に記載の撮像装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007518887A JP4771092B2 (ja) | 2005-06-03 | 2006-05-12 | 撮像装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005164306 | 2005-06-03 | ||
JP2005164306 | 2005-06-03 | ||
JP2007518887A JP4771092B2 (ja) | 2005-06-03 | 2006-05-12 | 撮像装置 |
PCT/JP2006/309541 WO2006129460A1 (ja) | 2005-06-03 | 2006-05-12 | 撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2006129460A1 JPWO2006129460A1 (ja) | 2008-12-25 |
JP4771092B2 true JP4771092B2 (ja) | 2011-09-14 |
Family
ID=37481391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007518887A Expired - Fee Related JP4771092B2 (ja) | 2005-06-03 | 2006-05-12 | 撮像装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090140125A1 (ja) |
JP (1) | JP4771092B2 (ja) |
CN (1) | CN101204085B (ja) |
WO (1) | WO2006129460A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7862232B2 (en) * | 2007-09-27 | 2011-01-04 | Micron Technology, Inc. | Temperature sensor, device and system including same, and method of operation |
TWI400944B (zh) * | 2009-07-16 | 2013-07-01 | Au Optronics Corp | 影像感測器 |
JP5413280B2 (ja) * | 2010-04-05 | 2014-02-12 | 株式会社島津製作所 | 撮像装置 |
US8743207B2 (en) | 2010-07-27 | 2014-06-03 | Flir Systems Inc. | Infrared camera architecture systems and methods |
KR20130100275A (ko) | 2010-07-27 | 2013-09-10 | 플리어 시스템즈, 인크. | 적외선 카메라 구조 시스템 및 방법 |
US8773451B2 (en) * | 2011-05-03 | 2014-07-08 | Apple Inc. | Color correction method and apparatus for displays |
TWI516133B (zh) * | 2012-01-18 | 2016-01-01 | 聯詠科技股份有限公司 | 影像處理裝置及方法 |
CN103220476B (zh) * | 2012-01-20 | 2016-03-16 | 联咏科技股份有限公司 | 图像处理装置及方法 |
JP6123170B2 (ja) * | 2012-05-01 | 2017-05-10 | 株式会社ニコン | 撮像素子および撮像装置 |
EP2728322A1 (en) * | 2012-10-31 | 2014-05-07 | ams AG | Light sensor arrangement and method for temperature compensation in a light sensor arrangement |
CN103837174B (zh) * | 2012-11-23 | 2017-10-03 | 原相科技股份有限公司 | 近接式光传感器及制作方法 |
WO2014083750A1 (ja) * | 2012-11-30 | 2014-06-05 | パナソニック株式会社 | 光学装置及びその製造方法 |
WO2014105989A1 (en) | 2012-12-31 | 2014-07-03 | Flir Systems, Inc. | Wafer level packaging of microbolometer vacuum package assemblies |
CN105684436B (zh) * | 2013-09-26 | 2020-05-01 | 株式会社尼康 | 摄像元件以及摄像装置 |
US9939636B2 (en) * | 2014-12-01 | 2018-04-10 | Visteon Global Technologies, Inc. | Forward looking light sensor with a rounded aperture, and an optimal thickness and radius for the aperture |
WO2017150240A1 (ja) * | 2016-03-04 | 2017-09-08 | ソニー株式会社 | 固体撮像素子、駆動方法、および電子機器 |
CN109963065B (zh) * | 2017-12-22 | 2020-12-29 | 群光电子股份有限公司 | 具有影像校正功能的摄像系统 |
CN112378540B (zh) * | 2020-11-03 | 2022-10-25 | 上海艾为电子技术股份有限公司 | 一种镜头模组外部温度的测量方法、测量装置及电子设备 |
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JPH04100488A (ja) * | 1990-08-20 | 1992-04-02 | Sony Corp | 画素ムラ補正装置 |
JPH05268535A (ja) * | 1992-03-24 | 1993-10-15 | Toshiba Corp | 視覚センサー |
JPH0794882A (ja) * | 1994-08-29 | 1995-04-07 | Olympus Optical Co Ltd | 電子冷却装置 |
JPH09113574A (ja) * | 1995-10-13 | 1997-05-02 | Sony Corp | 半導体素子の測定方法 |
JPH11298799A (ja) * | 1998-04-15 | 1999-10-29 | Honda Motor Co Ltd | 光センサ信号処理装置 |
JPH11308532A (ja) * | 1998-04-17 | 1999-11-05 | Nec Corp | 多素子化センサ装置 |
JP2001078084A (ja) * | 1999-09-03 | 2001-03-23 | Asahi Optical Co Ltd | 電子スチルカメラの露光制御装置 |
JP2001358976A (ja) * | 2000-06-09 | 2001-12-26 | Olympus Optical Co Ltd | 撮像装置 |
JP2002077733A (ja) * | 2000-08-31 | 2002-03-15 | Minolta Co Ltd | 固体撮像装置 |
JP2002262182A (ja) * | 2000-12-28 | 2002-09-13 | Honda Motor Co Ltd | イメージセンサの出力補正装置 |
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JP4349232B2 (ja) * | 2004-07-30 | 2009-10-21 | ソニー株式会社 | 半導体モジュール及びmos型固体撮像装置 |
JP4748648B2 (ja) * | 2005-03-31 | 2011-08-17 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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2006
- 2006-05-12 CN CN2006800191943A patent/CN101204085B/zh not_active Expired - Fee Related
- 2006-05-12 US US11/915,762 patent/US20090140125A1/en not_active Abandoned
- 2006-05-12 WO PCT/JP2006/309541 patent/WO2006129460A1/ja active Application Filing
- 2006-05-12 JP JP2007518887A patent/JP4771092B2/ja not_active Expired - Fee Related
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH04100488A (ja) * | 1990-08-20 | 1992-04-02 | Sony Corp | 画素ムラ補正装置 |
JPH05268535A (ja) * | 1992-03-24 | 1993-10-15 | Toshiba Corp | 視覚センサー |
JPH0794882A (ja) * | 1994-08-29 | 1995-04-07 | Olympus Optical Co Ltd | 電子冷却装置 |
JPH09113574A (ja) * | 1995-10-13 | 1997-05-02 | Sony Corp | 半導体素子の測定方法 |
JPH11298799A (ja) * | 1998-04-15 | 1999-10-29 | Honda Motor Co Ltd | 光センサ信号処理装置 |
JPH11308532A (ja) * | 1998-04-17 | 1999-11-05 | Nec Corp | 多素子化センサ装置 |
JP2001078084A (ja) * | 1999-09-03 | 2001-03-23 | Asahi Optical Co Ltd | 電子スチルカメラの露光制御装置 |
JP2001358976A (ja) * | 2000-06-09 | 2001-12-26 | Olympus Optical Co Ltd | 撮像装置 |
JP2002077733A (ja) * | 2000-08-31 | 2002-03-15 | Minolta Co Ltd | 固体撮像装置 |
JP2002262182A (ja) * | 2000-12-28 | 2002-09-13 | Honda Motor Co Ltd | イメージセンサの出力補正装置 |
JP2002290835A (ja) * | 2001-03-26 | 2002-10-04 | Minolta Co Ltd | 固体撮像装置 |
JP2003101000A (ja) * | 2001-09-21 | 2003-04-04 | Sharp Corp | 固体撮像装置 |
JP2003219228A (ja) * | 2002-01-18 | 2003-07-31 | Seiko Precision Inc | 固体撮像装置 |
JP2004165240A (ja) * | 2002-11-11 | 2004-06-10 | Sony Corp | 半導体装置及びその製造方法、並びに固体撮像カメラモジュール及びその製造方法 |
JP2007220087A (ja) * | 2005-12-21 | 2007-08-30 | Siemens Ag | 集積回路および集積回路を有する半導体材料の温度調節方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2006129460A1 (ja) | 2008-12-25 |
WO2006129460A1 (ja) | 2006-12-07 |
CN101204085A (zh) | 2008-06-18 |
US20090140125A1 (en) | 2009-06-04 |
CN101204085B (zh) | 2010-05-19 |
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