JP4736445B2 - 半導体デバイス用基板洗浄液及び洗浄方法 - Google Patents

半導体デバイス用基板洗浄液及び洗浄方法 Download PDF

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Publication number
JP4736445B2
JP4736445B2 JP2005023550A JP2005023550A JP4736445B2 JP 4736445 B2 JP4736445 B2 JP 4736445B2 JP 2005023550 A JP2005023550 A JP 2005023550A JP 2005023550 A JP2005023550 A JP 2005023550A JP 4736445 B2 JP4736445 B2 JP 4736445B2
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Prior art keywords
component
cleaning
substrate
semiconductor device
acid
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JP2005023550A
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Japanese (ja)
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JP2005260213A (ja
JP2005260213A5 (enExample
Inventor
慎 池本
均 森永
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Mitsubishi Chemical Corp
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Mitsubishi Chemical Corp
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Priority to JP2005023550A priority Critical patent/JP4736445B2/ja
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Publication of JP2005260213A5 publication Critical patent/JP2005260213A5/ja
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2005023550A 2004-02-09 2005-01-31 半導体デバイス用基板洗浄液及び洗浄方法 Expired - Fee Related JP4736445B2 (ja)

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JP2005023550A JP4736445B2 (ja) 2004-02-09 2005-01-31 半導体デバイス用基板洗浄液及び洗浄方法

Applications Claiming Priority (3)

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JP2004032222 2004-02-09
JP2004032222 2004-02-09
JP2005023550A JP4736445B2 (ja) 2004-02-09 2005-01-31 半導体デバイス用基板洗浄液及び洗浄方法

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JP2005260213A JP2005260213A (ja) 2005-09-22
JP2005260213A5 JP2005260213A5 (enExample) 2007-11-29
JP4736445B2 true JP4736445B2 (ja) 2011-07-27

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Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7737097B2 (en) * 2003-06-27 2010-06-15 Lam Research Corporation Method for removing contamination from a substrate and for making a cleaning solution
US8372757B2 (en) 2003-10-20 2013-02-12 Novellus Systems, Inc. Wet etching methods for copper removal and planarization in semiconductor processing
TW200745313A (en) * 2006-05-26 2007-12-16 Wako Pure Chem Ind Ltd Substrate etching liquid
JP4777197B2 (ja) * 2006-09-11 2011-09-21 富士フイルム株式会社 洗浄液及びそれを用いた洗浄方法
JP5428200B2 (ja) 2007-05-18 2014-02-26 三菱化学株式会社 半導体デバイス用基板洗浄液、半導体デバイス用基板の洗浄方法及び半導体デバイス用基板の製造方法
JP2009099945A (ja) 2007-09-28 2009-05-07 Fujifilm Corp 半導体デバイス用洗浄剤及びそれを用いた洗浄方法
JP5086893B2 (ja) 2008-05-26 2012-11-28 花王株式会社 半導体デバイス用基板用の洗浄液
WO2010086893A1 (ja) * 2009-01-27 2010-08-05 三洋化成工業株式会社 銅配線半導体用洗浄剤
JP5605535B2 (ja) * 2009-07-29 2014-10-15 ノベラス・システムズ・インコーポレーテッド 等方性銅エッチングのためのエッチング調合物
WO2011028667A2 (en) 2009-09-02 2011-03-10 Novellus Systems, Inc. Reduced isotropic etchant material consumption and waste generation
US8883701B2 (en) * 2010-07-09 2014-11-11 Air Products And Chemicals, Inc. Method for wafer dicing and composition useful thereof
JP6298588B2 (ja) * 2011-06-22 2018-03-20 日立化成株式会社 洗浄液及び基板の研磨方法
JP2017011225A (ja) * 2015-06-25 2017-01-12 株式会社フジミインコーポレーテッド 研磨方法及び不純物除去用組成物並びに基板及びその製造方法
WO2017169832A1 (ja) 2016-03-31 2017-10-05 富士フイルム株式会社 半導体製造用処理液、半導体製造用処理液が収容された収容容器、パターン形成方法及び電子デバイスの製造方法
KR102111305B1 (ko) 2016-04-28 2020-05-15 후지필름 가부시키가이샤 조성물, 조성물 수용체, 조성물의 제조 방법
WO2017208767A1 (ja) 2016-06-03 2017-12-07 富士フイルム株式会社 処理液、基板洗浄方法およびレジストの除去方法
US11085011B2 (en) * 2018-08-28 2021-08-10 Entegris, Inc. Post CMP cleaning compositions for ceria particles
US11060051B2 (en) * 2018-10-12 2021-07-13 Fujimi Incorporated Composition for rinsing or cleaning a surface with ceria particles adhered
KR102888183B1 (ko) 2021-06-14 2025-11-19 후지필름 가부시키가이샤 세정 조성물, 반도체 기판의 세정 방법, 반도체 소자의 제조 방법
JP7212974B1 (ja) * 2022-04-14 2023-01-26 メック株式会社 洗浄剤、洗浄方法、および補給液
CN117107248A (zh) * 2023-08-04 2023-11-24 品度生物科技(深圳)有限公司 雾化芯引脚的清洗方法
CN117380617A (zh) * 2023-10-30 2024-01-12 广东先导微电子科技有限公司 磷化铟晶片清洗方法及半导体晶片清洗装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864594A (ja) * 1994-08-18 1996-03-08 Sumitomo Metal Ind Ltd 配線の形成方法
JP4130514B2 (ja) * 1999-05-07 2008-08-06 多摩化学工業株式会社 精密洗浄剤組成物
JP2002299300A (ja) * 2001-03-30 2002-10-11 Kaijo Corp 基板処理方法
JP3797541B2 (ja) * 2001-08-31 2006-07-19 東京応化工業株式会社 ホトレジスト用剥離液
JP4304988B2 (ja) * 2002-01-28 2009-07-29 三菱化学株式会社 半導体デバイス用基板の洗浄方法

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