JP4724663B2 - 光学部品用型 - Google Patents

光学部品用型 Download PDF

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Publication number
JP4724663B2
JP4724663B2 JP2006534328A JP2006534328A JP4724663B2 JP 4724663 B2 JP4724663 B2 JP 4724663B2 JP 2006534328 A JP2006534328 A JP 2006534328A JP 2006534328 A JP2006534328 A JP 2006534328A JP 4724663 B2 JP4724663 B2 JP 4724663B2
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JP
Japan
Prior art keywords
laser
mold
shape
pulse
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2006534328A
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English (en)
Japanese (ja)
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JP2007507358A5 (enExample
JP2007507358A (ja
Inventor
秀直 片岡
シンビン リウ，
クリスチャン エフ． グレイグ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Publication of JP2007507358A publication Critical patent/JP2007507358A/ja
Publication of JP2007507358A5 publication Critical patent/JP2007507358A5/ja
Application granted granted Critical
Publication of JP4724663B2 publication Critical patent/JP4724663B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
JP2006534328A 2003-09-30 2004-09-30 光学部品用型 Expired - Lifetime JP4724663B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US50766003P 2003-09-30 2003-09-30
US60/507,660 2003-09-30
PCT/US2004/033055 WO2005032757A1 (en) 2003-09-30 2004-09-30 Mold for optical components

Publications (3)

Publication Number Publication Date
JP2007507358A JP2007507358A (ja) 2007-03-29
JP2007507358A5 JP2007507358A5 (enExample) 2007-10-11
JP4724663B2 true JP4724663B2 (ja) 2011-07-13

Family

ID=34421646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006534328A Expired - Lifetime JP4724663B2 (ja) 2003-09-30 2004-09-30 光学部品用型

Country Status (4)

Country Link
US (1) US8491353B2 (enExample)
JP (1) JP4724663B2 (enExample)
CN (1) CN1758983B (enExample)
WO (1) WO2005032757A1 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1674822A1 (en) * 2004-12-22 2006-06-28 Novartis AG Device and method for non-contact scanning of contact lens mold geometry
JP5192646B2 (ja) * 2006-01-16 2013-05-08 Ｔｏｗａ株式会社 光素子の樹脂封止方法、その樹脂封止装置、および、その製造方法
US9889043B2 (en) * 2006-01-20 2018-02-13 Lensar, Inc. System and apparatus for delivering a laser beam to the lens of an eye
US20080000887A1 (en) * 2006-06-28 2008-01-03 Seagate Technology Llc Method of laser honing
US8540906B2 (en) * 2007-06-14 2013-09-24 Aji Co., Ltd. Method of molding, process for producing lens, molding apparatus, process for producing stamper, master production apparatus, stamper production system, and stamper production apparatus
CN101424756B (zh) * 2007-10-31 2012-05-30 鸿富锦精密工业（深圳）有限公司 非球面镜面集成加工系统及方法
CN101487917B (zh) * 2008-01-16 2011-12-21 鸿富锦精密工业（深圳）有限公司 模仁的制造方法
US8270719B2 (en) * 2008-10-14 2012-09-18 Gemological Appraisal Association, Inc. Gem pattern matching algorithm to determine the percentage match of a target gem pattern to a database of gem patterns
JP4612733B2 (ja) * 2008-12-24 2011-01-12 東芝機械株式会社 パルスレーザ加工装置
US8704198B2 (en) * 2009-12-14 2014-04-22 Massachusetts Institute Of Technology Efficient high-harmonic-generation-based EUV source driven by short wavelength light
US8950217B2 (en) 2010-05-14 2015-02-10 Hamamatsu Photonics K.K. Method of cutting object to be processed, method of cutting strengthened glass sheet and method of manufacturing strengthened glass member
JP5670647B2 (ja) * 2010-05-14 2015-02-18 浜松ホトニクス株式会社 加工対象物切断方法
JP5632662B2 (ja) * 2010-06-24 2014-11-26 東芝機械株式会社 パルスレーザ加工方法
JP5634765B2 (ja) * 2010-06-24 2014-12-03 東芝機械株式会社 パルスレーザ加工方法およびパルスレーザ加工用データ作成方法
CN102001040A (zh) * 2010-10-21 2011-04-06 厦门大学 一种用于光学非球面加工的无线倾角测量装置
US9057595B2 (en) 2011-11-30 2015-06-16 Novartis Ag Combination of mirror images to improve signal quality for contact lenses
JP5910075B2 (ja) * 2011-12-27 2016-04-27 三星ダイヤモンド工業株式会社 被加工物の加工方法
GB201310212D0 (en) 2013-06-07 2013-07-24 Element Six Ltd Post-synthesis processing of diamond and related super-hard materials
US20150115129A1 (en) * 2013-10-29 2015-04-30 Omnivision Technologies, Inc. Coated Diamond-Turned Replication Master And Associated Process
WO2016026987A1 (de) * 2014-08-22 2016-02-25 Ceramtec-Etec Gmbh Verfahren zur herstellung von präzisionsbauteilen aus transparenten werkstoffen
US10449698B2 (en) 2014-08-22 2019-10-22 Omron Corporation Bonded structure and method for producing bonded structure
CN108367387B (zh) * 2015-12-22 2021-12-07 贺利氏德国有限责任两合公司 使用皮秒激光生产金属陶瓷基材的方法
US10488006B2 (en) * 2016-07-15 2019-11-26 Ford Global Technologies, Llc Vehicular lighting assemblies with invisible fluted regions and methods of making the same
DE102017000290B3 (de) * 2017-01-13 2018-06-14 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zur Überwachung eines Fräsvorgangs
US10481577B2 (en) * 2017-02-23 2019-11-19 GM Global Technology Operations LLC System and method for object distance detection and positioning
EP3666389B1 (en) 2018-12-10 2021-08-04 Alfa Laval Corporate AB Centrifugal separator
CN115210035B (zh) * 2020-03-05 2024-06-25 松下知识产权经营株式会社 焊道外观检查装置、焊道外观检查方法、程序和焊道外观检查系统
DE102021101598A1 (de) * 2021-01-26 2022-07-28 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung und Verfahren zum Laserbearbeiten eines Werkstücks
US12316940B2 (en) * 2021-05-19 2025-05-27 Magna Electronics Inc. Vehicular camera assembly process using laser etching for active focusing after lens is secured relative to imager
CN113998869B (zh) * 2021-10-19 2024-06-07 襄阳宇驰光学科技有限公司 一种光学镜头照相机用光学玻璃型件压制成型工艺
KR20240156382A (ko) * 2022-03-14 2024-10-29 닛토덴코 가부시키가이샤 광학 적층체, 렌즈부 및 표시 방법
KR20240155880A (ko) * 2022-03-14 2024-10-29 닛토덴코 가부시키가이샤 광학 적층체, 렌즈부 및 표시 방법
KR20240157034A (ko) * 2022-03-14 2024-10-31 닛토덴코 가부시키가이샤 광학 적층체, 렌즈부 및 표시 방법
TWI884709B (zh) * 2024-02-20 2025-05-21 中強光電股份有限公司 成型用模具的製造方法
DE102024110083B4 (de) * 2024-04-11 2025-11-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und Vorrichtung zur Formkorrektur eines optischen Bauelements mittels Laserstrahlung

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62159006A (ja) * 1986-01-06 1987-07-15 Toyota Motor Corp レ−ザビ−ム法による金型製作の修正表示装置
US5490849A (en) * 1990-07-13 1996-02-13 Smith; Robert F. Uniform-radiation caustic surface for photoablation
JP2585830Y2 (ja) 1992-02-14 1998-11-25 株式会社ニデック 光治療装置
US5257706A (en) * 1992-09-29 1993-11-02 Bausch & Lomb Incorporated Method of cleaning laser ablation debris
US5350374A (en) * 1993-03-18 1994-09-27 Smith Robert F Topography feedback control system for photoablation
JP3381885B2 (ja) 1994-09-13 2003-03-04 理化学研究所 レーザー加工方法およびレーザー加工装置
US5782822A (en) * 1995-10-27 1998-07-21 Ir Vision, Inc. Method and apparatus for removing corneal tissue with infrared laser radiation
JPH09168881A (ja) * 1995-12-19 1997-06-30 Nikon Corp レーザ加工装置
US5609779A (en) 1996-05-15 1997-03-11 General Electric Company Laser drilling of non-circular apertures
AU735854B2 (en) * 1997-04-25 2001-07-19 Technolas Gmbh Ophthalmologische Systeme Dual mode ophthalmic laser ablation
JP3800795B2 (ja) * 1998-02-23 2006-07-26 富士ゼロックス株式会社 レーザ加工条件自動設定方法およびレーザ加工条件自動設定装置
DE59813035D1 (de) * 1998-09-30 2005-10-06 Lasertec Gmbh Laserbearbeitungsvorrichtung mit schichtweisem Abtrag mit Gesenktiefenspeicherung zur späteren Ansteuerung
WO2001015592A2 (en) * 1999-08-27 2001-03-08 Westar Photonics, Inc. Laser patterning system for microsurgery
CN1124189C (zh) * 1999-11-12 2003-10-15 中国科学院长春光学精密机械研究所 光学元件面形及波纹度误差实时修正方法及装置
JP2003526418A (ja) * 2000-03-04 2003-09-09 カタナ テクノロジーズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 固体レーザーを用いた角膜のカスタムレーザー切除
JP3530114B2 (ja) 2000-07-11 2004-05-24 忠弘 大見 単結晶の切断方法
US6566627B2 (en) * 2000-08-11 2003-05-20 Westar Photonics, Inc. Laser method for shaping of optical lenses
JP4595207B2 (ja) 2001-01-29 2010-12-08 パナソニック株式会社 窒化物半導体基板の製造方法
US6887232B2 (en) * 2002-11-13 2005-05-03 20/10 Perfect Vision Optische Geraete Gmbh Closed loop control for intrastromal wavefront-guided ablation

Also Published As

Publication number Publication date
CN1758983A (zh) 2006-04-12
WO2005032757A1 (en) 2005-04-14
CN1758983B (zh) 2011-08-17
US8491353B2 (en) 2013-07-23
JP2007507358A (ja) 2007-03-29
US20080030876A1 (en) 2008-02-07

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