JP4720184B2 - プリント回路基板及びそれを備えた電子機器 - Google Patents
プリント回路基板及びそれを備えた電子機器 Download PDFInfo
- Publication number
- JP4720184B2 JP4720184B2 JP2005002360A JP2005002360A JP4720184B2 JP 4720184 B2 JP4720184 B2 JP 4720184B2 JP 2005002360 A JP2005002360 A JP 2005002360A JP 2005002360 A JP2005002360 A JP 2005002360A JP 4720184 B2 JP4720184 B2 JP 4720184B2
- Authority
- JP
- Japan
- Prior art keywords
- chassis
- printed circuit
- circuit board
- usb
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
9 シャーシ
11 プリント回路基板
13 USB端子
21 第1層
22 第2層
D+ USB信号ライン
D− USB信号ライン
Claims (4)
- USB2.0の規格に準拠するUSB端子が実装され、電子機器の金属板から成るシャーシに搭載されるプリント回路基板において、
少なくともUSB信号ラインが形成された第1層と、少なくとも電源ラインが形成された第2層の2層で構成され、
前記シャーシに略平行に隣接して搭載され、
前記シャーシとの間に絶縁体が介在されていることにより、前記第1層と前記シャーシとの間の浮遊容量が適正化され、
前記シャーシを基板の略全領域をカバーするGNDベタパターン層として機能させることにより、基板内にGNDベタパターン層を設けることなく、USB信号ラインの差動インピーダンスをUSB2.0の規格内に収めて、2層基板を用いながらUSB2.0の規格に対応できるようにしたことを特徴とするプリント回路基板。 - 電子部品が実装され、信号ラインが形成され、電子機器の金属板から成るシャーシに搭載されるプリント回路基板において、
前記プリント回路基板は、前記シャーシに略平行に隣接して搭載され、
前記シャーシが基板の略全領域をカバーするGNDベタパターン層として機能していることを特徴とするプリント回路基板。 - 前記シャーシと基板の間には、絶縁体が介在されていることを特徴とする請求項2に記載のプリント回路基板。
- 請求項1乃至3に記載のプリント回路基板を備えたことを特徴とする電子機器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005002360A JP4720184B2 (ja) | 2005-01-07 | 2005-01-07 | プリント回路基板及びそれを備えた電子機器 |
US11/324,240 US20060154526A1 (en) | 2005-01-07 | 2006-01-04 | Printed circuit board and electronic apparatus equipped with the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005002360A JP4720184B2 (ja) | 2005-01-07 | 2005-01-07 | プリント回路基板及びそれを備えた電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006190873A JP2006190873A (ja) | 2006-07-20 |
JP4720184B2 true JP4720184B2 (ja) | 2011-07-13 |
Family
ID=36653856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005002360A Expired - Fee Related JP4720184B2 (ja) | 2005-01-07 | 2005-01-07 | プリント回路基板及びそれを備えた電子機器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20060154526A1 (ja) |
JP (1) | JP4720184B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109743834A (zh) * | 2018-12-28 | 2019-05-10 | 郑州云海信息技术有限公司 | 一种优化usb链路阻抗的方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7427719B2 (en) * | 2006-03-21 | 2008-09-23 | Intel Corporation | Shifted segment layout for differential signal traces to mitigate bundle weave effect |
CN101472385A (zh) * | 2007-12-26 | 2009-07-01 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
US8335087B2 (en) * | 2008-12-22 | 2012-12-18 | Huawei Device Co., Ltd. | Method and apparatus for improving radio performance of wireless data terminal device |
CN201323599Y (zh) * | 2008-12-22 | 2009-10-07 | 深圳华为通信技术有限公司 | 一种无线数据终端设备 |
CN201789539U (zh) * | 2010-09-09 | 2011-04-06 | 中兴通讯股份有限公司 | 一种移动终端 |
CN102646086A (zh) * | 2011-02-18 | 2012-08-22 | 鸿富锦精密工业(深圳)有限公司 | Usb接口组件及其线路板 |
CN105636421B (zh) * | 2016-01-22 | 2020-04-17 | 青岛海尔洗衣机有限公司 | 家用电器及减少干扰电压的装置 |
WO2018103158A1 (zh) * | 2016-12-08 | 2018-06-14 | 华为技术有限公司 | 一种带usb端口的设备 |
JP7081294B2 (ja) * | 2018-05-11 | 2022-06-07 | トヨタ自動車株式会社 | 電子ユニット |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51113145U (ja) * | 1975-02-20 | 1976-09-13 | ||
JPH11205012A (ja) * | 1998-01-14 | 1999-07-30 | Mitsubishi Electric Corp | 高周波回路 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51113145A (en) * | 1975-03-31 | 1976-10-06 | Hitachi Ltd | Pluggin type relay |
US5761051A (en) * | 1994-12-29 | 1998-06-02 | Compaq Computer Corporation | Multi-layer circuit board having a supply bus and discrete voltage supply planes |
JP2638567B2 (ja) * | 1995-06-08 | 1997-08-06 | 日本電気株式会社 | 多層配線基板 |
US6140575A (en) * | 1997-10-28 | 2000-10-31 | 3Com Corporation | Shielded electronic circuit assembly |
JP2003078279A (ja) * | 2001-09-04 | 2003-03-14 | Konica Corp | プリント基板のシールド方法及びその方法を用いたプリント基板が装着された装置 |
US6650549B1 (en) * | 2002-10-23 | 2003-11-18 | D-Link Corp. | Hub having a bluetooth system |
-
2005
- 2005-01-07 JP JP2005002360A patent/JP4720184B2/ja not_active Expired - Fee Related
-
2006
- 2006-01-04 US US11/324,240 patent/US20060154526A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51113145U (ja) * | 1975-02-20 | 1976-09-13 | ||
JPH11205012A (ja) * | 1998-01-14 | 1999-07-30 | Mitsubishi Electric Corp | 高周波回路 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109743834A (zh) * | 2018-12-28 | 2019-05-10 | 郑州云海信息技术有限公司 | 一种优化usb链路阻抗的方法 |
CN109743834B (zh) * | 2018-12-28 | 2020-07-28 | 苏州浪潮智能科技有限公司 | 一种优化usb链路阻抗的方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006190873A (ja) | 2006-07-20 |
US20060154526A1 (en) | 2006-07-13 |
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