JP4719054B2 - 薄膜トランジスタの作製方法 - Google Patents

薄膜トランジスタの作製方法 Download PDF

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Publication number
JP4719054B2
JP4719054B2 JP2006102623A JP2006102623A JP4719054B2 JP 4719054 B2 JP4719054 B2 JP 4719054B2 JP 2006102623 A JP2006102623 A JP 2006102623A JP 2006102623 A JP2006102623 A JP 2006102623A JP 4719054 B2 JP4719054 B2 JP 4719054B2
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Prior art keywords
film
layer
gate electrode
thin film
substrate
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Japanese (ja)
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JP2006332603A5 (enExample
JP2006332603A (ja
Inventor
敦生 磯部
舜平 山崎
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Publication of JP2006332603A5 publication Critical patent/JP2006332603A5/ja
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  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thin Film Transistor (AREA)
  • Recrystallisation Techniques (AREA)
JP2006102623A 2005-04-28 2006-04-04 薄膜トランジスタの作製方法 Expired - Fee Related JP4719054B2 (ja)

Priority Applications (1)

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JP2006102623A JP4719054B2 (ja) 2005-04-28 2006-04-04 薄膜トランジスタの作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005133661 2005-04-28
JP2005133661 2005-04-28
JP2006102623A JP4719054B2 (ja) 2005-04-28 2006-04-04 薄膜トランジスタの作製方法

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JP2006332603A JP2006332603A (ja) 2006-12-07
JP2006332603A5 JP2006332603A5 (enExample) 2009-03-12
JP4719054B2 true JP4719054B2 (ja) 2011-07-06

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JP2006102623A Expired - Fee Related JP4719054B2 (ja) 2005-04-28 2006-04-04 薄膜トランジスタの作製方法

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009049207A (ja) * 2007-08-20 2009-03-05 Spansion Llc 半導体装置の製造方法
WO2009130822A1 (ja) * 2008-04-25 2009-10-29 シャープ株式会社 多層配線、半導体装置、表示装置用基板及び表示装置
US8592879B2 (en) 2010-09-13 2013-11-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR102781934B1 (ko) * 2016-12-30 2025-03-19 삼성디스플레이 주식회사 도전 패턴 및 이를 구비하는 표시 장치
CN110313057A (zh) * 2017-02-28 2019-10-08 夏普株式会社 有源矩阵基板的制造方法和有机el显示装置的制造方法
WO2018163287A1 (ja) * 2017-03-07 2018-09-13 シャープ株式会社 アクティブマトリクス基板の製造方法、有機ｅｌ表示装置の製造方法およびアクティブマトリクス基板
CN107910327B (zh) * 2017-11-07 2024-05-14 长鑫存储技术有限公司 电容器阵列结构及其制造方法
KR102637201B1 (ko) * 2018-03-01 2024-02-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06112222A (ja) * 1992-09-28 1994-04-22 Seiko Epson Corp 薄膜半導体装置及びその製造方法
JP4197270B2 (ja) * 1994-04-29 2008-12-17 株式会社半導体エネルギー研究所 半導体集積回路の作製方法
WO1998033362A1 (en) * 1997-01-29 1998-07-30 Tadahiro Ohmi Plasma device

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JP2006332603A (ja) 2006-12-07

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