JP4715969B1 - 導電粒子 - Google Patents

導電粒子 Download PDF

Info

Publication number
JP4715969B1
JP4715969B1 JP2010176528A JP2010176528A JP4715969B1 JP 4715969 B1 JP4715969 B1 JP 4715969B1 JP 2010176528 A JP2010176528 A JP 2010176528A JP 2010176528 A JP2010176528 A JP 2010176528A JP 4715969 B1 JP4715969 B1 JP 4715969B1
Authority
JP
Japan
Prior art keywords
particles
palladium
particle
conductive
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010176528A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011175956A (ja
Inventor
邦彦 赤井
健次 高井
光晴 松沢
憂子 永原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2010176528A priority Critical patent/JP4715969B1/ja
Application granted granted Critical
Publication of JP4715969B1 publication Critical patent/JP4715969B1/ja
Publication of JP2011175956A publication Critical patent/JP2011175956A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2010176528A 2009-08-06 2010-08-05 導電粒子 Active JP4715969B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010176528A JP4715969B1 (ja) 2009-08-06 2010-08-05 導電粒子

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2009183836 2009-08-06
JP2009183836 2009-08-06
JP2010015607 2010-01-27
JP2010015607 2010-01-27
JP2010176528A JP4715969B1 (ja) 2009-08-06 2010-08-05 導電粒子

Publications (2)

Publication Number Publication Date
JP4715969B1 true JP4715969B1 (ja) 2011-07-06
JP2011175956A JP2011175956A (ja) 2011-09-08

Family

ID=43544419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010176528A Active JP4715969B1 (ja) 2009-08-06 2010-08-05 導電粒子

Country Status (5)

Country Link
JP (1) JP4715969B1 (zh)
KR (1) KR101205041B1 (zh)
CN (2) CN102719814A (zh)
TW (1) TW201120920A (zh)
WO (1) WO2011016524A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5512306B2 (ja) * 2010-01-29 2014-06-04 日本化学工業株式会社 導電性粒子の製造方法
JP5549352B2 (ja) * 2010-04-26 2014-07-16 日立化成株式会社 導電粒子、接着剤組成物、回路接続材料及び接続構造体
JP5703836B2 (ja) * 2011-02-25 2015-04-22 日立化成株式会社 導電粒子、接着剤組成物、回路接続材料及び接続構造体
JP6079425B2 (ja) * 2012-05-16 2017-02-15 日立化成株式会社 導電粒子、異方性導電接着剤フィルム及び接続構造体
KR102008463B1 (ko) * 2019-04-08 2019-08-08 주식회사 프로이천 패널 테스트를 위한 프로브 핀의 제조 방법
CN114364162B (zh) * 2022-01-05 2023-11-21 业成科技（成都）有限公司 电极接合方法和接合组件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5247968B2 (ja) * 2003-12-02 2013-07-24 日立化成株式会社 回路接続材料、及びこれを用いた回路部材の接続構造
JP4728665B2 (ja) * 2004-07-15 2011-07-20 積水化学工業株式会社 導電性微粒子、導電性微粒子の製造方法、及び異方性導電材料
KR101178745B1 (ko) * 2004-07-15 2012-09-07 세키스이가가쿠 고교가부시키가이샤 도전성 미립자, 도전성 미립자의 제조 방법, 및 이방성도전 재료
KR100722493B1 (ko) * 2005-09-02 2007-05-28 제일모직주식회사 절연 전도성 미립자 및 이를 이용한 이방 전도성 접착필름
JP4703585B2 (ja) * 2006-02-09 2011-06-15 株式会社東芝 半導体集積回路及び静電型アクチュエータの駆動方法
JP2007242307A (ja) * 2006-03-06 2007-09-20 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP5151920B2 (ja) * 2008-02-05 2013-02-27 日立化成工業株式会社 導電粒子及び導電粒子の製造方法
JP4991666B2 (ja) * 2008-09-19 2012-08-01 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体

Also Published As

Publication number Publication date
CN102292780B (zh) 2012-08-22
KR20110086166A (ko) 2011-07-27
TWI348168B (zh) 2011-09-01
JP2011175956A (ja) 2011-09-08
KR101205041B1 (ko) 2012-11-27
TW201120920A (en) 2011-06-16
CN102719814A (zh) 2012-10-10
WO2011016524A1 (ja) 2011-02-10
CN102292780A (zh) 2011-12-21

Similar Documents

Publication Publication Date Title
JP5151920B2 (ja) 導電粒子及び導電粒子の製造方法
JP4780197B2 (ja) 被覆粒子及びその製造方法、並びに、被覆粒子を用いた異方導電性接着剤組成物及び異方導電性接着剤フィルム
KR101261184B1 (ko) 피복 도전 입자 및 그의 제조 방법
JP5440645B2 (ja) 導電粒子、絶縁被覆導電粒子及びその製造方法、異方導電性接着剤
JP5472332B2 (ja) 導電粒子、その製造方法及び絶縁被覆導電粒子の製造方法、並びに異方導電性接着剤フィルム
JP4640532B2 (ja) 被覆導電粒子
JP5549069B2 (ja) 異方性導電接着剤用粒子状導電材料及びその製造方法、並びに異方性導電接着剤
JP4640531B2 (ja) 導電粒子
WO2011002084A1 (ja) 導電粒子
JP4715969B1 (ja) 導電粒子
JP5589361B2 (ja) 導電粒子及びその製造方法
JP5549352B2 (ja) 導電粒子、接着剤組成物、回路接続材料及び接続構造体
KR101151072B1 (ko) 도전 입자, 절연 피복 도전 입자 및 그의 제조 방법, 및 이방 도전성 접착제
JP5626288B2 (ja) 導電粒子、異方導電性接着剤、接続構造体、及び接続構造体の製造方法

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110301

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110314

R151 Written notification of patent or utility model registration

Ref document number: 4715969

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140408

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140408

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350