JP4696862B2 - Image processing apparatus, image processing method, and drawing apparatus - Google Patents

Description

The present invention relates to an image processing device, an image processing method, and a drawing device that specify a drawing region using metal ink from among image regions.

2. Description of the Related Art In recent years, a functional liquid droplet ejection device that uses a metal ink as a functional liquid and manufactures a liquid crystal display device, an organic EL (Electro-Luminescence) device, a PDP (Plasma-Display-Panel) device, etc. by an inkjet method is known. (For example, Patent Document 1). In this type of functional liquid droplet ejection, metal ink is ejected from each nozzle of the inkjet head while moving the workpiece (substrate) and the inkjet head relative to each other in the X direction and the Y direction. A metal ink pattern is formed at the position. For this reason, it is important to maintain the relative position between the workpiece and the inkjet head with high accuracy, and alignment is appropriately performed. Usually, this alignment is performed by imaging an alignment mark formed by ejecting metal ink onto a workpiece a plurality of times by an inkjet head using an imaging device, and placing the workpiece using the imaging result (image recognition result). This is done by correcting the position of the table and / or the head unit.
Japanese Patent Laid-Open No. 2003-266738

  However, since the alignment mark formed using the metal ink has irregularities on the surface, it is difficult to detect the mark position (center of gravity position) using the image recognition result. That is, when the image recognition result is simply binarized, white spots and black spots are disturbed (see FIG. 8), and the drawing area cannot be accurately specified.

In view of such problems, it is an object of the present invention to provide an image processing apparatus, an image processing method, and a drawing apparatus that can accurately specify a drawing area using metal ink.

An image processing apparatus according to the present invention is an image processing apparatus that acquires image data and identifies a drawing area using metal ink from an image area represented by the image data. As described above, it is set whether to detect a portion that is brighter than a predetermined first threshold value or a portion that is darker than a predetermined second threshold value (where the second threshold value is a lightness that satisfies the second threshold value ≦ the first threshold value). According to the setting of the feature portion setting means, the feature portion detection means for detecting the feature portion, the feature portion is expanded with a predetermined parameter, and a region surrounding the overlapped feature portions is specified as the first region. 1 area specifying means, 2nd area specifying means for specifying an area contracted from the first area by a predetermined parameter as a second area, and a drawing area specifying means for specifying the second area as a drawing area Characterized by comprising a and.
In the image processing apparatus described above, it is preferable that the feature part setting unit sets which of a bright part and a dark part is extracted as a feature part according to a state in the image region.
In the image processing apparatus described above, it is preferable that the feature portion setting unit extracts, as the feature portion, a bright portion and a dark portion having a higher area ratio in the image region.
In the image processing apparatus described above, the first region specifying unit determines whether or not a region surrounding the overlapped feature portion after expansion is within a predetermined area range, and is within the predetermined area range. It is preferable to specify the first region only when it is determined.
In the image processing apparatus described above, it is preferable that the image processing apparatus further includes a closing processing unit that performs a closing process on the second region, and the drawing region specifying unit specifies the second region after the closing process as a drawing region.
The image processing apparatus according to above SL, image data is preferably captured result captured by the imaging device of the coaxial incident illumination type or ring illumination method.
An image processing method according to the present invention is an image processing method for acquiring image data and specifying a drawing region with metal ink from an image region represented by the image data. As described above, it is set whether to detect a portion that is brighter than a predetermined first threshold value or a portion that is darker than a predetermined second threshold value (where the second threshold value is a lightness that satisfies the second threshold value ≦ the first threshold value). A step of detecting a feature portion in accordance with the setting, a step of expanding the feature portion with a predetermined parameter, specifying a region surrounding the overlapped feature portion as a first region, and a first region corresponding to a predetermined parameter. The method includes a step of specifying the contracted region as a second region, and a step of specifying the second region as a drawing region.
The drawing apparatus of the present invention is characterized by comprising each means in the image processing apparatus described above and a drawing means for drawing with metal ink.
The following configuration may be used.
An image processing apparatus according to the present invention is an image processing apparatus that acquires image data and identifies a drawing area using metal ink from an image area represented by the image data. Feature portion detection means for detecting a feature portion that is brighter than the first threshold value or a feature portion that is darker than a predetermined second threshold value (where the second threshold value is a lightness that satisfies the second threshold value ≦ the first threshold value); A first region specifying means for expanding a feature portion with a predetermined parameter and specifying a region surrounding the overlapped feature portion as a first region; and a region obtained by shrinking the first region by a predetermined parameter as a second region A second area specifying means for specifying and a drawing area specifying means for specifying the second area as a drawing area are provided.

  The image processing method of the present invention is an image processing method for acquiring image data and specifying a drawing area with metal ink from an image area represented by the image data. Detecting a feature portion corresponding to a portion that is brighter than a predetermined first threshold value or a portion that is darker than a predetermined second threshold value (where the second threshold value is a lightness that satisfies a second threshold value ≦ the first threshold value); Inflating the feature portion with a predetermined parameter and specifying a region surrounding the overlapped feature portion as a first region; specifying the first region as a region contracted by a predetermined parameter as a second region; and And a step of specifying the second area as a drawing area.

According to these configurations, a feature portion (a portion brighter than a predetermined first threshold value or a portion darker than a predetermined second threshold value) detected from the image region is expanded (diffused), contracted ( Since the region is specified by performing image processing such as (erosion), it is possible to accurately specify even a drawing region using metal ink. That is, when drawing with metal ink, unevenness occurs on the surface, so it is difficult to specify the drawing area simply by binarization. Can be specified. Further, along with this, it is possible to accurately recognize the shape of the drawing area and calculate the position of the center of gravity.
Note that it is possible to determine which of the “bright part” and the “dark part” is adopted as the characteristic part based on the area ratio. That is, the area occupied by each part in the predetermined region may be compared, and the higher area ratio may be adopted. Further, which one is to be adopted may be set in advance, or a configuration in which the user selects each time an image is captured.

  In the image processing apparatus described above, the first region specifying unit determines whether or not a region surrounding the overlapped feature portion after expansion is within a predetermined area range, and is within the predetermined area range. It is preferable to specify the first region only when it is determined.

  According to this configuration, it is possible to prevent erroneous detection that detects a non-target object by setting only a region within a predetermined area range, that is, a target size as a processing target. Further, the influence of dust and the like can be eliminated.

  In the image processing apparatus described above, it is preferable that the image processing apparatus further includes a closing processing unit that performs a closing process on the second region, and the drawing region specifying unit specifies the second region after the closing process as a drawing region.

  According to this configuration, the defective portion of the drawing area can be repaired by the closing process, and the drawing area of the metal ink can be specified more accurately.

  In the image processing apparatus described above, it is preferable that the image processing apparatus further includes an opening processing unit that performs an opening process on the second area, and the drawing area specifying unit specifies the second area after the opening process as the drawing area.

  According to this configuration, the protruding portion of the drawing area can be deleted by the opening process, and the drawing area made of metal ink can be specified more accurately.

  In the image processing apparatus described above, it is preferable that the expansion rate and / or the contraction rate in the closing process and / or the opening process are parameters different from the predetermined parameters.

  According to this configuration, the closing process and / or the opening process can be performed effectively.

  In the image processing apparatus described above, it is preferable that the image data is an imaging result captured by an imaging apparatus of a coaxial incident illumination system or a ring illumination system.

  According to this configuration, by using the coaxial incident illumination method or the ring illumination method, there is a problem that a shadow portion is generated on the opposite side by irradiation from one direction as compared with the case where the side illumination method or the like is used. Therefore, it is unlikely that the entire shape of the drawing area is damaged, and a good imaging result can be obtained.

  The drawing apparatus of the present invention is characterized by comprising each means in the image processing apparatus described above and a drawing means for drawing with metal ink.

  According to this configuration, it is possible to use the identification result of the drawing area with the metal ink for alignment processing, inspection of the drawing result, and the like, thereby improving the drawing accuracy.

  The method of manufacturing an electro-optical device according to the present invention is characterized in that the film forming unit is formed using metal ink by using the above-described drawing device.

  An electro-optical device according to the present invention is characterized in that a film-forming portion made of metal ink is formed using the above-described drawing device.

  According to these configurations, since a drawing apparatus capable of performing high-precision drawing is used, a high-quality electro-optical device can be manufactured. As an electro-optical device (flat panel display: FPD), a color filter, a liquid crystal display device, an organic EL device, a PDP device, an electron emission device, and the like are conceivable. The electron emission device is a concept including a so-called FED (Field Emission Display) or SED (Surface-conduction Electron-Emitter Display) device. Further, as the electro-optical device, devices including metal wiring formation, lens formation, resist formation, light diffuser formation, and the like are conceivable.

  An electronic apparatus according to an aspect of the invention includes the electro-optical device manufactured by the above-described electro-optical device manufacturing method or the electro-optical device described above.

  In this case, examples of the electronic device include a mobile phone and a personal computer equipped with a so-called flat panel display, and various electric products.

Hereinafter, an image processing apparatus, an image processing method, and a drawing apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings. An object of the present invention is to accurately specify a drawing area by metal ink by image processing. Therefore, the case where the image processing apparatus of the present invention is applied to a drawing apparatus that performs drawing processing by an ink jet method, and the shape recognition and barycentric coordinate measurement of an alignment mark formed (drawn) with metal ink is described as an example. To do.

  As shown in FIG. 1, the drawing apparatus 1 is relative to an X-axis table 12 on which a substrate W to be drawn is mounted and a Y-axis table 13 on which a functional liquid droplet discharge head 17 that discharges metal ink as a functional liquid is mounted. A drawing processing unit 2 that performs a drawing process as it moves, and an imaging unit 3 that images the alignment mark AM formed on the substrate W by a pair of imaging devices 31a and 31b (see FIG. 2) facing the X-axis table 12. The image processing unit 4 is configured to perform the image processing based on the imaging result of the imaging unit 3 to recognize the shape of the alignment mark AM and measure the center of gravity coordinates, and the central control unit 100 that performs overall control of each unit. ing. The central control unit 100, the drawing controller 20 that controls the drawing processing unit 2, the imaging controller 30 that controls the imaging unit 3, and the image processing unit 4 are configured by a computer (not shown).

  The drawing processing unit 2 includes an XY movement mechanism 11 including an X-axis table 12 and a Y-axis table 13 orthogonal to the X-axis table 12, a main carriage 14 movably attached to the Y-axis table 13, and a main carriage 14. The head unit 15 includes a functional liquid droplet ejection head 17 that ejects metal ink as a functional liquid. On the other hand, the board | substrate W is mounted in the state positioned by the X-axis table 12 by the alignment using a pair of imaging device 31a, 31b which faces the X-axis table 12. FIG. In the present embodiment, the single functional liquid droplet ejection head 17 is mounted, but the number thereof is arbitrary.

  The X-axis table 12 has a motor-driven X-axis slider 21 that constitutes a drive system in the X-axis direction. The substrate W is mounted on the set table 22 while being movably mounted. The suction table 23 moves the substrate W minutely by driving the motor in the X-axis direction, and the substrate θ table 24 rotates the substrate W forward and backward by a minute amount around the θ axis by driving the motor (one point in the figure). (See chain line).

  Similarly, the Y-axis table 13 has a motor-driven Y-axis slider 26 that constitutes a drive system in the Y-axis direction, and the head unit 15 is movably mounted thereon via the main carriage 14. . The X-axis table 12 is directly supported on a machine base (not shown), while the Y-axis table 13 is supported by left and right support columns 27, 27 standing on the machine base and straddles the X-axis table 12. So as to extend.

  Then, the Y-axis table 13 causes the head unit 15 mounted on the Y-axis table 13 to face the drawing area 91 located immediately above the X-axis table 12 and performs a drawing operation on the substrate W introduced into the X-axis table 12. The functional liquid droplet ejection head 17 is formed with a plurality of nozzle rows in which a plurality of nozzles are arranged at an equal pitch, and functional liquid droplets (metal ink) are selectively ejected from each nozzle.

  The main carriage 14 serves as a position correction mechanism for the head unit 15. A head Z-axis table (not shown) for moving the suspended head unit 15 minutely by motor driving in the Z-axis direction (vertical direction), and the head unit 15. The head θ table 31 (see the alternate long and short dash line in the figure) that rotates the head unit 15 around the Z axis by a motor and a head α table (not shown) that rotates the head unit 15 around the X axis by a motor by a motor. ) And a head β table (not shown) for rotating the head unit 15 forward and backward by a minute amount around the Y axis by a motor drive. Then, by these position correction mechanisms, the head unit 15 is moved slightly in the Z-axis direction using the head Z-axis table, so that the nozzle surface of the functional liquid droplet ejection head 17 mounted thereon and the surface of the substrate W are Fine-tune the distance (work gap). Further, the posture of the functional liquid droplet ejection head 17 with respect to the substrate W is finely adjusted by rotating the head unit 15 by a minute amount using the head θ table 31, the head α table, and the head β table.

  The drawing processing unit 2 configured in this manner moves the substrate W in the X-axis direction (main scanning direction) by the X-axis table 12 based on a command from the drawing controller 20 that performs drawing control under the control of the central control unit 100. At the same time, the functional liquid droplet ejection head 17 is selectively driven in synchronism with this to perform forward drawing on the substrate W. Then, after the head unit 15 is sub-scanned in the Y-axis direction (sub-scanning direction) by the Y-axis table 13, the substrate W is moved back in the X-axis direction, and the functional liquid droplet ejection head 17 is synchronized with this. Reverse drawing is performed by selectively driving. That is, drawing on the substrate W is performed by repeating the reciprocating movement of the substrate W in the X-axis direction and the movement of the head unit 15 in the Y-axis direction a plurality of times. Although not particularly illustrated, the drawing processing unit 2 incorporates a dryer that blows hot air onto a drawing region of metal ink (silver ink) and a UV irradiation device that UV cures the insulating ink.

  On the other hand, the imaging unit 3 images the alignment mark AM by the pair of imaging devices 31a and 31b based on a command from the imaging controller 30 that performs imaging control under the control of the central control unit 100. Each imaging device 31 (31a, 31b) moves along the dotted line portion of FIG. 1 to a position facing the X-axis table 12, and images a pair of alignment marks AM on the substrate W, respectively.

  As shown in FIG. 2, each imaging device 31 (31a, 31b) employs a coaxial epi-illumination system that irradiates irradiation light and captures reflected light in parallel with the lens 32. A half mirror 34 that refracts the irradiation light from the LED light source 33 onto the substrate W and a CCD camera 35 that reads the reflected light from the substrate W are provided.

  In addition, as the imaging device 31, you may employ | adopt a ring illumination system as shown in FIG. The ring illumination imaging device 31 ′ includes an LED light source 37 attached to the tip of a lens 36 and a CCD camera 38 that reads reflected light from the substrate W via the lens 36. In the LED light source 37, a plurality of LEDs 37a for irradiating the imaging object (alignment mark AM) are formed in a ring shape on the concave irradiation surface, and the imaging object can be irradiated from different angles as a whole. ing.

  In this way, by irradiating light on the substrate W (formation surface of the alignment mark AM) from the upper direction or the peripheral direction, the hemispherical alignment mark AM is compared with the case where the side illumination method or the like is used. The contrast between the inside and the outside is emphasized, and the outline of the alignment mark AM can be clearly recognized. The imaging result captured by the CCD camera 34 is sent to the image processing unit 4 (see FIG. 1) via the central control unit 100.

  The image processing unit 4 acquires the imaging result from the imaging unit 3, performs a predetermined image processing, specifies the region of the alignment mark AM, and further obtains the barycentric coordinates of the alignment mark AM from the specifying result (details) Will be described later).

  The central control unit 100 instructs the drawing controller 20 to rotate the head Z-axis table, the head θ table 31, the head α table, and the like based on the barycentric coordinates, and corrects the position of the head unit 15. At the same time, the movement of the set table 22 is instructed to correct the position of the substrate W. That is, the central control unit 100 controls the imaging of the alignment mark AM by the imaging unit 3, the image processing of the imaging result by the image processing unit 4, and the position correction of the head unit 15 and / or the substrate W by the drawing processing unit 2. Thus, alignment processing for maintaining the drawing accuracy is executed.

  Next, a circuit board manufacturing process using the drawing apparatus 1 will be briefly described with reference to FIG. Here, a description will be given assuming that a plurality of head units 15 for discharging different functional liquids are mounted on the drawing apparatus 1.

  FIG. 4A shows a substrate W (a work in which some elements are formed) before drawing processing. As shown in the figure, the substrate W includes a drawing portion Wd for forming a circuit board pattern (metal wiring pattern 51) and a non-drawing portion Wn on the outer edge portion where the alignment mark AM is drawn. Become. First, silver ink (silver nanoparticles) is ejected to the drawing portion Wd by the functional liquid droplet ejection head 17 mounted on the first head unit 15 to form a metal wiring pattern 51 (FIG. 5B). )reference). At this time, a pair of alignment marks AM is also drawn (formed) by discharging silver ink to a predetermined position of the non-drawing portion Wn a plurality of times.

  Subsequently, the organic material covering the silver nanoparticles is removed by baking or the like, and metallized. Further, an insulating ink (ultraviolet curable resin) is discharged onto the metal wiring pattern 51 by the functional liquid droplet discharge head 17 mounted on the second head unit 15 to form an interlayer insulating film except for the through hole portion. (Refer to the shaded portion in FIG. 3C).

  By repeating the above steps, the substrate W is multi-layered. However, in order to keep the relative position between the substrate W and the head unit 15 with high accuracy, when the head unit 15 to be used is replaced (for example, before forming the surface insulating film). In the case where the alignment process is performed (for example, when a part of the metal wiring pattern 51 is used for a connector and the entire surface insulating film does not become a film, the part is not covered with the insulating film). Because it is necessary to control the position accurately.) As described above, the alignment process refers to a series of steps in which the imaging unit 3 images the alignment mark AM and the position correction mechanism corrects the position of the head unit 15 and / or the substrate W based on the imaging result. . Finally, an insulating ink serving as a surface insulating film is ejected onto the metal wiring pattern 51 by the functional liquid droplet ejection head 17 mounted on the second head unit 15 to obtain a finished product.

  Here, the plurality of head units 15 that face the substrate W are changed according to the processing, but the substrate W is transferred between the plurality of devices, and each processing is performed in each device. You may do it. However, also in this case, it is preferable to perform the alignment process after the substrate W is transferred.

  Next, the control configuration of the drawing apparatus 1 will be described with reference to the block diagram of FIG. Note that only the main components of the drawing processing unit 2 and the imaging unit 3 are mentioned. The drawing processing unit 2 includes a drawing unit 210 and a position correction unit 220. The drawing means 210 discharges metal ink from the functional liquid droplet discharge head 17 to form the metal wiring pattern 51 in the drawing portion Wd and the alignment mark AM in the non-drawing portion Wn (FIG. 4). (See (b)). Therefore, the head unit 15 and the XY moving mechanism 11 are the main components. The position correction means 220 corrects the position of the head unit 15 and / or the substrate W at the time of alignment, and has the above-described position correction mechanism as a main component.

  On the other hand, the imaging unit 3 captures a pair of alignment marks AM formed on the substrate W with a pair of imaging devices 31 under coaxial incident illumination, and outputs the imaging result. In addition to the examples shown in FIG. 2 and FIG. 3, the imaging device 31 captures a single alignment mark AM with a plurality of imaging devices (CCD cameras) and combines the plurality of imaging results. It is also possible to use an output device or the like.

  The image processing unit 4 includes a feature part detection unit 410, a first region specifying unit 420, a second region specifying unit 430, a closing processing unit 440, an opening processing unit 450, a drawing region specifying unit 460, and a barycentric coordinate output unit 470.

  The feature portion detection unit 410 acquires image data that is an imaging result output from the imaging unit 3, and sets the brightness of the background of the image region G (see FIG. 8) represented by the image data to a threshold (predetermined first number). 1 threshold), binarization processing is performed, and a portion brighter than the background is detected as a feature portion. Note that the threshold used here is not limited to the brightness of the background, and it is preferable to use an appropriate value within a range in which the black portion PB and the white portion PW do not disappear.

  The first region specifying unit 420 expands the feature portion detected by the feature portion detection unit 410 with a predetermined parameter, and specifies a region surrounding the overlapped (connected) feature portions as the first region.

  The second area specifying unit 430 specifies an area contracted by the same parameter as the first area specifying unit 420 as the second area. That is, the expansion rate of the first region specifying unit 420 and the contraction rate of the second region specifying unit 430 are the same.

  The closing processing unit 440 performs a closing process on the second region specified by the second region specifying unit 430. In addition, the opening processing unit 450 performs the opening process on the second region similarly specified by the two region specifying unit 430. Note that the closing processing means 440 and the opening processing means 450 are not limited to either one but may function both, or both may be omitted. The expansion rate and the contraction rate in the closing processing unit 440 and the opening processing unit 450 are set to values different from the expansion rate and the contraction rate in the first region specifying unit 420 and the second region specifying unit 430. .

  The drawing area specifying means 460 specifies the second area specified by the second area specifying means 430 or the second area after processing by the closing processing means 440 and / or the opening processing means 450 as the drawing area. In order to improve the accuracy of specifying the drawing area here, it is preferable to cause both the closing processing means 440 and the opening processing means 450 to function.

  The barycentric coordinate output means 470 obtains and outputs the barycentric coordinates of the alignment mark AM from the specifying result of the drawing area specifying means 460. Since a known technique can be applied to the calculation method of the barycentric coordinates, detailed description thereof is omitted.

  With the above configuration, the central control unit 100 captures the alignment mark AM drawn by the drawing unit 210 with the imaging device 31 and causes the center of gravity of the alignment mark AM output by causing each unit in the image processing unit 4 to function. From the coordinates, the correction amount of the position correction mechanism is calculated, and the position correction means 220 is controlled.

  Here, the center-of-gravity coordinate measurement processing of the alignment mark AM by the image processing unit 4 will be described in detail with reference to the flowcharts of FIGS. 6 and 7 and supplementary explanatory diagrams of FIGS. FIG. 8 is a binarized image region G based on the imaging result of the imaging device 31. In addition, a circular dotted line M (hereinafter referred to as “mark”) shown in the figure is a so-called drawing region specific candidate region (characteristic portion) surrounding a region where black portions PB or white portions PW in the image region G are densely packed. Detection candidate area). In the following description, it is assumed that the diameter of the mark M is about 2.0 [mm].

  As shown in the flowchart of FIG. 6, first, a bright part in the mark M is detected (extracted) as a characteristic part (S11). That is, the white spot (PW) in the mark M shown in FIG. 8 is detected. FIG. 9 shows the image region G after the extraction. Subsequently, the detected feature is expanded (diffused) by a radius of about 0.1 to 0.2 [mm] (S12 in FIG. 6). The “radius 0.1 to 0.2 [mm]” is based on the degree to which the characteristic portions (here, bright portions PW) inside the mark M overlap. FIG. 10 shows the image area G after the expansion.

  Subsequently, the feature parts overlapped (connected) in S12 are combined into one area, and this is defined as a first candidate area E1a (S13, see FIG. 10). Furthermore, when the cavity P0 exists in the first candidate region E1a (see FIG. 10), it is filled (S14).

Subsequently, it is determined whether or not the first candidate region E1a is included in a predetermined area range (S15). That is, it is determined whether or not the area of the first candidate region E1a is included in a range larger than S−α and smaller than S + α. In this case, it is preferable that S≈3.14 [mm ² ] and α≈1.00 [mm ² ]. If it is determined that the first candidate region E1a is included in the predetermined area range (S15: Yes), the first candidate region E1a is specified as the first region E1 (S16). On the other hand, when it is determined that the first candidate region E1a is not included in the predetermined area range (S15: No), the processing is stopped (S17). When there are a plurality of first candidate areas E1a in the image area G, if any one of them satisfies the condition of S15, the process is continued only for those that satisfy the condition.

  Subsequently, as shown in FIG. 7, the specified first region E1 is contracted (eroded) under the same conditions as S12 (S18), and the region after contraction is specified as the second region E2 (S19). FIG. 11 shows the image area G after the contraction.

  Subsequently, in the case where there is a defect in the specified second region E2 (S19: (a), see FIG. 12A), in order to increase the specifying accuracy, a circle with a radius r1 = 100 [mm] is used. A closing process is performed, and the second area E2c is specified after the closing process (S20). That is, the chipping (deletion part) P1 in the circumferential portion in the second region E2 as shown in FIG. 12A is preserved by the closing process, and the second after the closing process as shown in FIG. Region E2c can be obtained. FIG. 13 is an explanatory diagram of the closing process in S20. Here, first, the second region E2 (mark M) is expanded to a circle R1 having a sufficiently large radius r1 = 100 [mm], and the circle R2 having a radius r2 of about ½ of the circle R1 is the circumference of the circle R1. By moving one round along the part, the chip P1 in the moving region is compensated. Then, the circle R1 is shrunk under the same conditions as when it expanded to the circle R1, and is set as the second region E2c after the closing process (see FIG. 12B).

  On the other hand, when there is a protrusion in the specified second region E2 (S19: (b), see FIG. 14A), in order to increase the specifying accuracy, a circle with a radius r3 = 0.8 [mm] is used. An opening process is performed and specified as the second region E2o after the opening process (S21). That is, as shown in FIG. 14A, the protrusion P2 at the circumferential portion in the second region E2 is deleted by the opening process, and the second region E2o after the opening process as shown in FIG. 14B is obtained. be able to. FIG. 15 is an explanatory diagram of the opening process in S21. Here, a circle R3 having a slightly smaller radius r3 = 0.8 [mm] with respect to the second area E2 (mark M) is first moved freely within the mark M, and an area in which the moving range is integrated is opened. After the processing, the second area E2o is set (see FIG. 14B).

  In this way, the drawing area close to a circle (the second area E2c after the closing process or the second area E2o after the opening process) in which the chipping or protrusion is eliminated by the closing process or the opening process is specified as the drawing area by the metal ink (shape) The center of gravity coordinates of the drawing area is obtained and output (S22), and the process ends.

  As described above, according to the present invention, drawing with metal ink is performed by performing image processing such as expansion and contraction on the characteristic portion detected in the image region G (in the above example, the bright portion PW). Even a region (a drawing region in which unevenness occurs) can be accurately identified. Further, along with this, the shape of the drawing area can be accurately recognized and the position of the center of gravity can be calculated, which can be used for alignment processing.

  Further, only when it is determined that the expanded region (first candidate region E1a, see FIG. 10) is within a predetermined area range, it is subject to image processing. Can be increased.

  In addition, since the missing part of the drawing area can be repaired by the closing process, or the protruding part of the drawing area can be deleted by the opening process, the drawing area by the metal ink can be specified more accurately.

  In the above example, the “bright part PW” is detected as the characteristic part, but the “dark part PB” may be detected (see FIG. 8). In addition, the user may be able to select which one is adopted. In this case, the user may be allowed to set whether to adopt either in advance, may be selected for each image capture.

  Further, it may be configured to automatically determine which one of “bright part PW” and “dark part PB” is detected according to the state in the binarized mark M. In this case, it is preferable to detect and expand the mark M having a high area ratio.

  In the above, the case where the present invention is used for specifying the center-of-gravity coordinates of the alignment mark AM has been exemplified. However, the present invention is also applied to the case where the drawing result of the metal wiring pattern 51 as shown in FIG. Is applicable. Thereby, highly accurate drawing can be performed and, as a result, the quality of a product (circuit board) can be improved.

  Next, as an electro-optical device (flat panel display) manufactured using the drawing device 1 of the present embodiment, a color filter, a liquid crystal display device, an organic EL device, a plasma display (PDP device), an electron emission device (FED device). The structure and the manufacturing method thereof will be described by taking an active matrix substrate and the like formed on these display devices as examples. Note that an active matrix substrate refers to a substrate on which a thin film transistor, a source line electrically connected to the thin film transistor, and a data line are formed.

First, a method for manufacturing a color filter incorporated in a liquid crystal display device, an organic EL device or the like will be described. FIG. 16 is a flowchart showing the manufacturing process of the color filter, and FIG. 17 is a schematic cross-sectional view of the color filter 500 (filter base body 500A) of this embodiment shown in the order of the manufacturing process.
First, in the black matrix forming step (S101), a black matrix 502 is formed on a substrate (W) 501 as shown in FIG. The black matrix 502 is formed of metal chromium, a laminate of metal chromium and chromium oxide, resin black, or the like. A sputtering method, a vapor deposition method, or the like can be used to form the black matrix 502 made of a metal thin film. Further, when forming the black matrix 502 made of a resin thin film, a gravure printing method, a photoresist method, a thermal transfer method, or the like can be used.

Subsequently, in the bank formation step (S102), a bank 503 is formed in a state of being superimposed on the black matrix 502. That is, first, as shown in FIG. 17B, a resist layer 504 made of a negative transparent photosensitive resin is formed so as to cover the substrate 501 and the black matrix 502. Then, an exposure process is performed with the upper surface covered with a mask film 505 formed in a matrix pattern shape.
Further, as shown in FIG. 17C, the resist layer 504 is patterned by etching an unexposed portion of the resist layer 504 to form a bank 503. When the black matrix is formed from resin black, it is possible to use both the black matrix and the bank.
The bank 503 and the black matrix 502 below the partition wall 507b partitioning each pixel region 507a, and in the subsequent colored layer forming step, the colored liquid layers (film forming portions) 508R, 508G, When forming 508B, the landing area of the functional droplet is defined.

The filter substrate 500A is obtained through the above black matrix forming step and bank forming step.
In the present embodiment, as the material for the bank 503, a resin material whose surface is lyophobic (hydrophobic) is used. Since the surface of the substrate (glass substrate) 501 is lyophilic (hydrophilic), the droplets into each pixel region 507a surrounded by the bank 503 (partition wall portion 507b) in the colored layer forming step described later. Variations in landing position can be automatically corrected.

  Next, in the colored layer forming step (S103), as shown in FIG. 17 (d), functional droplets are ejected by the functional droplet ejection head 17 to enter each pixel region 507a surrounded by the partition wall portion 507b. Let it land. In this case, the functional liquid droplet ejection head 17 is used to introduce functional liquids (filter materials) of three colors of R, G, and B to eject functional liquid droplets. Note that the three-color arrangement pattern of R, G, and B includes a stripe arrangement, a mosaic arrangement, and a delta arrangement.

Thereafter, the functional liquid is fixed through a drying process (a process such as heating), and three colored layers 508R, 508G, and 508B are formed. When the colored layers 508R, 508G, and 508B are formed, the process proceeds to the protective film forming step (S104), and as shown in FIG. A protective film 509 is formed so as to cover the upper surface.
That is, after the protective film coating liquid is discharged over the entire surface of the substrate 501 where the colored layers 508R, 508G, and 508B are formed, the protective film 509 is formed through a drying process.
Then, after forming the protective film 509, the color filter 500 moves to a film forming process such as ITO (Indium Tin Oxide) which becomes a transparent electrode in the next process.

  FIG. 18 is a cross-sectional view of a principal part showing a schematic configuration of a passive matrix liquid crystal device (liquid crystal device) as an example of a liquid crystal display device using the color filter 500 described above. By attaching auxiliary elements such as a liquid crystal driving IC, a backlight, and a support to the liquid crystal device 520, a transmissive liquid crystal display device as a final product can be obtained. Since the color filter 500 is the same as that shown in FIG. 17, the corresponding parts are denoted by the same reference numerals and description thereof is omitted.

The liquid crystal device 520 is roughly configured by a color filter 500, a counter substrate 521 made of a glass substrate, and a liquid crystal layer 522 made of an STN (Super Twisted Nematic) liquid crystal composition sandwiched between them, The filter 500 is arranged on the upper side (observer side) in the figure.
Although not shown, polarizing plates are provided on the outer surfaces of the counter substrate 521 and the color filter 500 (surfaces opposite to the liquid crystal layer 522 side), and the polarizing plates located on the counter substrate 521 side are also provided. A backlight is disposed outside.

On the protective film 509 of the color filter 500 (on the liquid crystal layer side), a plurality of strip-shaped first electrodes 523 elongated in the left-right direction in FIG. 18 are formed at predetermined intervals. The color of the first electrode 523 A first alignment film 524 is formed so as to cover the surface opposite to the filter 500 side.
On the other hand, a plurality of strip-shaped second electrodes 526 elongated in a direction orthogonal to the first electrode 523 of the color filter 500 are formed on the surface of the counter substrate 521 facing the color filter 500 at a predetermined interval. A second alignment film 527 is formed so as to cover the surface of the two electrodes 526 on the liquid crystal layer 522 side. The first electrode 523 and the second electrode 526 are made of a transparent conductive material such as ITO.

The spacer 528 provided in the liquid crystal layer 522 is a member for keeping the thickness (cell gap) of the liquid crystal layer 522 constant. The sealing material 529 is a member for preventing the liquid crystal composition in the liquid crystal layer 522 from leaking to the outside. Note that one end of the first electrode 523 extends to the outside of the sealing material 529 as a lead-out wiring 523a.
A portion where the first electrode 523 and the second electrode 526 intersect with each other is a pixel, and the color layers 508R, 508G, and 508B of the color filter 500 are located in the portion that becomes the pixel.

  In a normal manufacturing process, patterning of the first electrode 523 and application of the first alignment film 524 are performed on the color filter 500 to create a portion on the color filter 500 side. Patterning of the electrode 526 and application of the second alignment film 527 are performed to create a portion on the counter substrate 521 side. Thereafter, a spacer 528 and a sealing material 529 are formed in the portion on the counter substrate 521 side, and the portion on the color filter 500 side is bonded in this state. Next, liquid crystal constituting the liquid crystal layer 522 is injected from the inlet of the sealing material 529, and the inlet is closed. Thereafter, both polarizing plates and the backlight are laminated.

  The drawing apparatus 1 of the embodiment applies, for example, the spacer material (functional liquid) that constitutes the cell gap described above, and before the portion on the color filter 500 side is bonded to the portion on the counter substrate 521 side, the sealing material 529 is used. Liquid crystal (functional liquid) can be uniformly applied to the enclosed area. Further, the printing of the sealing material 529 can be performed by the functional liquid droplet ejection head 17. Further, the first and second alignment films 524 and 527 can be applied by the functional liquid droplet ejection head 17.

FIG. 19 is a cross-sectional view of an essential part showing a schematic configuration of a second example of a liquid crystal device using the color filter 500 manufactured in the present embodiment.
The liquid crystal device 530 is significantly different from the liquid crystal device 520 in that the color filter 500 is arranged on the lower side (the side opposite to the observer side) in the figure.
The liquid crystal device 530 is generally configured by sandwiching a liquid crystal layer 532 made of STN liquid crystal between a color filter 500 and a counter substrate 531 made of a glass substrate or the like. Although not shown, polarizing plates and the like are provided on the outer surfaces of the counter substrate 531 and the color filter 500, respectively.

On the protective film 509 of the color filter 500 (on the liquid crystal layer 532 side), a plurality of strip-shaped first electrodes 533 elongated in the depth direction in the figure are formed at predetermined intervals, and the liquid crystal of the first electrodes 533 is formed. A first alignment film 534 is formed so as to cover the surface on the layer 532 side.
A plurality of strip-shaped second electrodes 536 extending in a direction orthogonal to the first electrode 533 on the color filter 500 side are formed on the surface of the counter substrate 531 facing the color filter 500 at a predetermined interval. A second alignment film 537 is formed so as to cover the surface of the second electrode 536 on the liquid crystal layer 532 side.

The liquid crystal layer 532 is provided with a spacer 538 for keeping the thickness of the liquid crystal layer 532 constant and a sealing material 539 for preventing the liquid crystal composition in the liquid crystal layer 532 from leaking to the outside. Yes.
Similarly to the liquid crystal device 520 described above, a portion where the first electrode 533 and the second electrode 536 intersect with each other is a pixel, and the colored layers 508R, 508G, and 508B of the color filter 500 are located at the portion that becomes the pixel. Is configured to do.

FIG. 20 shows a third example in which a liquid crystal device is configured using a color filter 500 to which the present invention is applied, and is an exploded perspective view showing a schematic configuration of a transmissive TFT (Thin Film Transistor) type liquid crystal device. It is.
In the liquid crystal device 550, the color filter 500 is arranged on the upper side (observer side) in the figure.

The liquid crystal device 550 includes a color filter 500, a counter substrate 551 disposed so as to face the color filter 500, a liquid crystal layer (not shown) sandwiched therebetween, and an upper surface side (observer side) of the color filter 500. The polarizing plate 555 and the polarizing plate (not shown) arranged on the lower surface side of the counter substrate 551 are roughly configured.
A liquid crystal driving electrode 556 is formed on the surface of the protective film 509 of the color filter 500 (the surface on the counter substrate 551 side). The electrode 556 is made of a transparent conductive material such as ITO, and is a full surface electrode that covers the entire region where a pixel electrode 560 described later is formed. An alignment film 557 is provided so as to cover the surface of the electrode 556 opposite to the pixel electrode 560.

  An insulating layer 558 is formed on the surface of the counter substrate 551 facing the color filter 500, and the scanning lines 561 and the signal lines 562 are formed on the insulating layer 558 in a state of being orthogonal to each other. A pixel electrode 560 is formed in a region surrounded by the scanning lines 561 and the signal lines 562. In an actual liquid crystal device, an alignment film is provided on the pixel electrode 560, but the illustration is omitted.

  In addition, a thin film transistor 563 including a source electrode, a drain electrode, a semiconductor, and a gate electrode is incorporated in a portion surrounded by the cutout portion of the pixel electrode 560 and the scanning line 561 and the signal line 562. . The thin film transistor 563 is turned on / off by application of signals to the scanning line 561 and the signal line 562 so that energization control to the pixel electrode 560 can be performed.

  Note that the liquid crystal devices 520, 530, and 550 in the above examples are transmissive, but a reflective liquid crystal device or a transflective liquid crystal device is provided by providing a reflective layer or a transflective layer. You can also.

  Next, FIG. 21 is a cross-sectional view of a main part of a display region (hereinafter simply referred to as a display device 600) of the organic EL device.

The display device 600 is schematically configured with a circuit element portion 602, a light emitting element portion 603, and a cathode 604 laminated on a substrate (W) 601.
In the display device 600, light emitted from the light emitting element portion 603 to the substrate 601 side is transmitted through the circuit element portion 602 and the substrate 601 and emitted to the observer side, and the light emitting element portion 603 is opposite to the substrate 601. After the light emitted to the side is reflected by the cathode 604, the light passes through the circuit element portion 602 and the substrate 601 and is emitted to the observer side.

  A base protective film 606 made of a silicon oxide film is formed between the circuit element portion 602 and the substrate 601, and an island-shaped semiconductor film 607 made of polycrystalline silicon is formed on the base protective film 606 (on the light emitting element portion 603 side). Is formed. In the left and right regions of the semiconductor film 607, a source region 607a and a drain region 607b are formed by high concentration cation implantation, respectively. A central portion where no positive ions are implanted is a channel region 607c.

  In the circuit element portion 602, a transparent gate insulating film 608 covering the base protective film 606 and the semiconductor film 607 is formed, and a position corresponding to the channel region 607c of the semiconductor film 607 on the gate insulating film 608 is formed. For example, a gate electrode 609 made of Al, Mo, Ta, Ti, W or the like is formed. On the gate electrode 609 and the gate insulating film 608, a transparent first interlayer insulating film 611a and a second interlayer insulating film 611b are formed. Further, contact holes 612a and 612b are formed through the first and second interlayer insulating films 611a and 611b and communicating with the source region 607a and the drain region 607b of the semiconductor film 607, respectively.

A transparent pixel electrode 613 made of ITO or the like is patterned and formed in a predetermined shape on the second interlayer insulating film 611b, and the pixel electrode 613 is connected to the source region 607a through the contact hole 612a. .
A power supply line 614 is disposed on the first interlayer insulating film 611a, and the power supply line 614 is connected to the drain region 607b through the contact hole 612b.

  Thus, the driving thin film transistors 615 connected to the pixel electrodes 613 are formed in the circuit element portion 602, respectively.

The light emitting element portion 603 includes a functional layer 617 stacked on each of the plurality of pixel electrodes 613, and a bank portion 618 provided between each pixel electrode 613 and the functional layer 617 to partition each functional layer 617. It is roughly structured.
The pixel electrode 613, the functional layer 617, and the cathode 604 provided on the functional layer 617 constitute a light emitting element. Note that the pixel electrode 613 is formed by patterning in a substantially rectangular shape in plan view, and a bank portion 618 is formed between the pixel electrodes 613.

The bank 618 is laminated on the inorganic bank layer 618a (first bank layer) 618a (first bank layer) formed of an inorganic material such as SiO, SiO ₂ or TiO ₂ , and is made of an acrylic resin, a polyimide resin, or the like. It is composed of an organic bank layer 618b (second bank layer) having a trapezoidal cross section formed of a resist having excellent heat resistance and solvent resistance. A part of the bank unit 618 is formed on the peripheral edge of the pixel electrode 613.
An opening 619 that gradually expands upward with respect to the pixel electrode 613 is formed between the bank portions 618.

The functional layer 617 includes a hole injection / transport layer 617a formed in a stacked state on the pixel electrode 613 in the opening 619, and a light emitting layer 617b formed on the hole injection / transport layer 617a. Has been. Note that another functional layer having other functions may be further formed adjacent to the light emitting layer 617b. For example, it is possible to form an electron transport layer.
The hole injection / transport layer 617a has a function of transporting holes from the pixel electrode 613 side and injecting them into the light emitting layer 617b. The hole injection / transport layer 617a is formed by discharging a first composition (functional liquid) containing a hole injection / transport layer forming material. A known material is used as the hole injection / transport layer forming material.

  The light emitting layer 617b emits light in red (R), green (G), or blue (B), and discharges a second composition (functional liquid) containing a light emitting layer forming material (light emitting material). Is formed. As the solvent (nonpolar solvent) of the second composition, a known material that is insoluble in the hole injection / transport layer 617a is preferably used, and such a nonpolar solvent is used as the second composition of the light emitting layer 617b. By using the light emitting layer 617b, the light emitting layer 617b can be formed without re-dissolving the hole injection / transport layer 617a.

  The light emitting layer 617b is configured such that the holes injected from the hole injection / transport layer 617a and the electrons injected from the cathode 604 are recombined in the light emitting layer to emit light.

  The cathode 604 is formed so as to cover the entire surface of the light emitting element portion 603, and plays a role of flowing current to the functional layer 617 in a pair with the pixel electrode 613. Note that a sealing member (not shown) is disposed on the cathode 604.

Next, a manufacturing process of the display device 600 will be described with reference to FIGS.
As shown in FIG. 22, the display device 600 includes a bank part forming step (S111), a surface treatment step (S112), a hole injection / transport layer forming step (S113), a light emitting layer forming step (S114), It is manufactured through an electrode formation step (S115). In addition, a manufacturing process is not restricted to what is illustrated, and when other processes are removed as needed, it may be added.

First, in the bank part forming step (S111), as shown in FIG. 23, an inorganic bank layer 618a is formed on the second interlayer insulating film 611b. The inorganic bank layer 618a is formed by forming an inorganic film at a formation position and then patterning the inorganic film by a photolithography technique or the like. At this time, a part of the inorganic bank layer 618 a is formed so as to overlap with the peripheral edge of the pixel electrode 613.
When the inorganic bank layer 618a is formed, the organic bank layer 618b is formed on the inorganic bank layer 618a as shown in FIG. The organic bank layer 618b is also formed by patterning using a photolithography technique or the like in the same manner as the inorganic bank layer 618a.
In this way, the bank portion 618 is formed. Accordingly, an opening 619 opening upward with respect to the pixel electrode 613 is formed between the bank portions 618. The opening 619 defines a pixel region.

In the surface treatment step (S112), a lyophilic process and a lyophobic process are performed. The region to be subjected to the lyophilic treatment is the first laminated portion 618aa of the inorganic bank layer 618a and the electrode surface 613a of the pixel electrode 613. These regions are made lyophilic by plasma treatment using, for example, oxygen as a treatment gas. Is done. This plasma treatment also serves to clean the ITO that is the pixel electrode 613.
In addition, the lyophobic treatment is performed on the wall surface 618s of the organic bank layer 618b and the upper surface 618t of the organic bank layer 618b. )
By performing this surface treatment process, when forming the functional layer 617 using the functional liquid droplet ejection head 17, the functional liquid droplets can be landed more reliably on the pixel area. It is possible to prevent the functional droplets from overflowing from the opening 619.

  Then, the display device base 600A is obtained through the above steps. The display device base 600A is placed on the set table 22 of the drawing apparatus 1 shown in FIG. 1, and the following hole injection / transport layer forming step (S113) and light emitting layer forming step (S114) are performed.

  As shown in FIG. 25, in the hole injection / transport layer forming step (S113), the first composition containing the hole injection / transport layer forming material is transferred from the functional liquid droplet ejection head 17 to each opening 619 that is a pixel region. Discharge inside. Thereafter, as shown in FIG. 26, a drying treatment and a heat treatment are performed to evaporate the polar solvent contained in the first composition, thereby forming a hole injection / transport layer 617a on the pixel electrode (electrode surface 613a) 613.

Next, the light emitting layer forming step (S114) will be described. In this light emitting layer forming step, as described above, in order to prevent re-dissolution of the hole injection / transport layer 617a, the hole injection / transport layer 617a is used as a solvent for the second composition used in forming the light emitting layer. A non-polar solvent insoluble in.
However, since the hole injection / transport layer 617a has a low affinity for the nonpolar solvent, the hole injection / transport layer 617a has a low affinity even if the second composition containing the nonpolar solvent is discharged onto the hole injection / transport layer 617a. There is a possibility that the injection / transport layer 617a and the light emitting layer 617b cannot be adhered to each other, or the light emitting layer 617b cannot be applied uniformly.
Therefore, in order to increase the surface affinity of the hole injection / transport layer 617a with respect to the nonpolar solvent and the light emitting layer forming material, it is preferable to perform surface treatment (surface modification treatment) before forming the light emitting layer. In this surface treatment, a surface modifying material which is the same solvent as the non-polar solvent of the second composition used in the formation of the light emitting layer or a similar solvent is applied on the hole injection / transport layer 617a, and this is applied. This is done by drying.
By performing such treatment, the surface of the hole injection / transport layer 617a is easily adapted to the nonpolar solvent. In the subsequent step, the second composition containing the light emitting layer forming material is added to the hole injection / transport layer. It can be uniformly applied to 617a.

  Then, as shown in FIG. 27, the pixel composition (second liquid composition containing a light emitting layer forming material corresponding to one of the colors (blue (B) in the example of FIG. 27)) is used as a functional droplet. A predetermined amount is driven into the opening 619). The second composition driven into the pixel region spreads on the hole injection / transport layer 617a and fills the opening 619. Even if the second composition deviates from the pixel region and lands on the upper surface 618t of the bank portion 618, the upper composition 618t is subjected to the liquid repellent treatment as described above. Things are easy to roll into the opening 619.

  Thereafter, by performing a drying process and the like, the second composition after discharge is dried, the nonpolar solvent contained in the second composition is evaporated, and as shown in FIG. 28, a hole injection / transport layer 617a is obtained. A light emitting layer 617b is formed thereon. In the case of this figure, a light emitting layer 617b corresponding to blue (B) is formed.

  Similarly, using the functional liquid droplet ejection head 17, as shown in FIG. 29, the same steps as in the case of the light emitting layer 617b corresponding to the blue (B) described above are sequentially performed, and other colors (red (R) and red (R) and A light emitting layer 617b corresponding to green (G) is formed. Note that the order in which the light-emitting layers 617b are formed is not limited to the illustrated order, and may be formed in any order. For example, the order of formation can be determined according to the light emitting layer forming material. In addition, the arrangement pattern of the three colors R, G, and B includes a stripe arrangement, a mosaic arrangement, a delta arrangement, and the like.

  As described above, the functional layer 617, that is, the hole injection / transport layer 617a and the light emitting layer 617b are formed on the pixel electrode 613. And it transfers to a counter electrode formation process (S115).

In the counter electrode forming step (S115), as shown in FIG. 30, a cathode 604 (counter electrode) is formed on the entire surface of the light emitting layer 617b and the organic bank layer 618b by, for example, vapor deposition, sputtering, CVD, or the like. In the present embodiment, the cathode 604 is configured by, for example, laminating a calcium layer and an aluminum layer.
On top of the cathode 604, an Al film, an Ag film as an electrode, and a protective layer such as SiO ₂ or SiN for preventing oxidation thereof are appropriately provided.

  After forming the cathode 604 in this way, the display device 600 is obtained by performing other processes such as a sealing process for sealing the upper part of the cathode 604 with a sealing member and a wiring process.

Next, FIG. 31 is an exploded perspective view of a main part of a plasma display device (PDP device: hereinafter simply referred to as a display device 700). In the figure, the display device 700 is shown with a part thereof cut away.
The display device 700 is schematically configured to include a first substrate 701, a second substrate 702, and a discharge display portion 703 formed between them, which are disposed to face each other. The discharge display unit 703 includes a plurality of discharge chambers 705. Among the plurality of discharge chambers 705, the three discharge chambers 705 of the red discharge chamber 705R, the green discharge chamber 705G, and the blue discharge chamber 705B are arranged to form one pixel.

Address electrodes 706 are formed in stripes at predetermined intervals on the upper surface of the first substrate 701, and a dielectric layer 707 is formed so as to cover the address electrodes 706 and the upper surface of the first substrate 701. On the dielectric layer 707, partition walls 708 are provided so as to be positioned between the address electrodes 706 and along the address electrodes 706. The partition 708 includes one extending on both sides in the width direction of the address electrode 706 as shown, and one not shown extending in the direction orthogonal to the address electrode 706.
A region partitioned by the partition 708 is a discharge chamber 705.

  A phosphor 709 is disposed in the discharge chamber 705. The phosphor 709 emits red (R), green (G), or blue (B) fluorescence, and the red phosphor 709R is disposed at the bottom of the red discharge chamber 705R, and the green discharge chamber 705G. A green phosphor 709G and a blue phosphor 709B are arranged at the bottom and the blue discharge chamber 705B, respectively.

On the lower surface of the second substrate 702 in the drawing, a plurality of display electrodes 711 are formed in stripes at predetermined intervals in a direction orthogonal to the address electrodes 706. A dielectric layer 712 and a protective film 713 made of MgO or the like are formed so as to cover them.
The first substrate 701 and the second substrate 702 are bonded so that the address electrodes 706 and the display electrodes 711 face each other in a state of being orthogonal to each other. The address electrode 706 and the display electrode 711 are connected to an AC power source (not shown).
When the electrodes 706 and 711 are energized, the phosphor 709 emits light in the discharge display portion 703, and color display is possible.

In the present embodiment, the address electrode 706, the display electrode 711, and the phosphor 709 can be formed using the drawing apparatus 1 shown in FIG. Hereinafter, a process of forming the address electrode 706 on the first substrate 701 will be exemplified.
In this case, the following steps are performed with the first substrate 701 placed on the set table 22 of the drawing apparatus 1.
First, the liquid droplet (metal ink) containing the conductive film wiring forming material is landed on the address electrode formation region as a functional droplet by the functional droplet discharge head 17. This liquid material is obtained by dispersing conductive fine particles such as metal in a dispersion medium as a conductive film wiring forming material. As the conductive fine particles, metal fine particles containing gold, silver, copper, palladium, nickel, or the like, a conductive polymer, or the like is used.

  When the replenishment of the liquid material is completed for all the address electrode formation regions to be replenished, the address material 706 is formed by drying the discharged liquid material and evaporating the dispersion medium contained in the liquid material. .

By the way, although the formation of the address electrode 706 has been exemplified in the above, the display electrode 711 and the phosphor 709 can also be formed through the above steps.
In the case of forming the display electrode 711, as in the case of the address electrode 706, a liquid material (metal ink) containing a conductive film wiring forming material is landed on the display electrode formation region as a functional droplet.
Further, in the case of forming the phosphor 709, a liquid material (functional liquid) containing a fluorescent material corresponding to each color (R, G, B) is ejected as droplets from the functional liquid droplet ejection head 17, and it corresponds. Land in the color discharge chamber 705.

Next, FIG. 32 is a cross-sectional view of an essential part of an electron emission device (also referred to as an FED device or an SED device: hereinafter simply referred to as a display device 800). In the drawing, a part of the display device 800 is shown as a cross section.
The display device 800 is schematically configured to include a first substrate 801, a second substrate 802, and a field emission display portion 803 formed therebetween, which are disposed to face each other. The field emission display unit 803 includes a plurality of electron emission units 805 arranged in a matrix.

  On the upper surface of the first substrate 801, a first element electrode 806a and a second element electrode 806b constituting the cathode electrode 806 are formed so as to be orthogonal to each other. In addition, a conductive film 807 having a gap 808 is formed in a portion partitioned by the first element electrode 806a and the second element electrode 806b. That is, the first element electrode 806a, the second element electrode 806b, and the conductive film 807 constitute a plurality of electron emission portions 805. The conductive film 807 is made of, for example, palladium oxide (PdO), and the gap 808 is formed by forming after forming the conductive film 807.

  An anode electrode 809 that faces the cathode electrode 806 is formed on the lower surface of the second substrate 802. A lattice-shaped bank portion 811 is formed on the lower surface of the anode electrode 809, and a phosphor 813 is disposed in each downward opening 812 surrounded by the bank portion 811 so as to correspond to the electron emission portion 805. Yes. The phosphor 813 emits fluorescence of any one of red (R), green (G), and blue (B), and each opening 812 has a red phosphor 813R, a green phosphor 813G, and a blue color. The phosphors 813B are arranged in the predetermined pattern described above.

  The first substrate 801 and the second substrate 802 configured as described above are bonded together with a minute gap. In this display device 800, electrons that jump out of the first element electrode 806 a or the second element electrode 806 b that are cathodes through the conductive film (gap 808) 807 are formed on the phosphor 813 formed on the anode electrode 809 that is an anode. When excited, it emits light and enables color display.

  Also in this case, similarly to the other embodiments, the first element electrode 806a, the second element electrode 806b, the conductive film 807, and the anode electrode 809 can be formed by using the drawing apparatus 1, and the fluorescence of each color. The bodies 813R, 813G, and 813B can be formed using the drawing apparatus 1.

  The first element electrode 806a, the second element electrode 806b, and the conductive film 807 have the planar shape shown in FIG. 33A, and when these are formed, as shown in FIG. In addition, the bank portion BB is formed (photolithographic method), leaving portions where the first element electrode 806a, the second element electrode 806b, and the conductive film 807 are previously formed. Next, after the first element electrode 806a and the second element electrode 806b are formed in the groove portion constituted by the bank portion BB (inkjet method using the drawing apparatus 1), the solvent is dried, and film formation is performed. A conductive film 807 is formed (an ink jet method using the drawing apparatus 1). Then, after forming the conductive film 807, the bank portion BB is removed (ashing peeling process), and the process proceeds to the above forming process. As in the case of the organic EL device described above, it is preferable to perform a lyophilic process on the first substrate 801 and the second substrate 802 and a lyophobic process on the bank portions 811 and BB.

  As other electro-optical devices, devices such as metal wiring formation, resist formation, and light diffuser formation are conceivable. By using the drawing apparatus 1 described above for manufacturing various electro-optical devices (devices), various electro-optical devices can be efficiently manufactured.

The present invention is also applicable to a metal wiring pattern that connects the various panels described above and a drive circuit.
In the description of the above embodiment, the operation of detecting the position of the center of gravity of the alignment mark drawn with the metal ink is shown. However, the product drawn by measuring the shape and area of the pattern drawn with the metal ink and the connector terminal is shown. It is also possible to utilize the present invention for an inspection for performing pass / fail determination.

It is a plane schematic diagram of the drawing apparatus which concerns on this embodiment. It is a side surface schematic diagram of the imaging device of a coaxial illumination system. It is a side surface schematic diagram of the imaging device of a ring illumination system. It is a schematic diagram which shows the manufacturing process of a circuit board. It is a block diagram of a drawing apparatus. It is a flowchart explaining the gravity center coordinate measurement process of an alignment mark. It is a flowchart following FIG. It is a figure which shows the image area | region after a binarization process. It is a figure which shows the image area | region after a characteristic part detection. It is a figure which shows the image area | region after an expansion process. It is a figure which shows the image area | region after a shrinkage | contraction process. It is a figure which shows the image area | region before and after a closing process. It is explanatory drawing of a closing process. It is a figure which shows the image area | region before and after an opening process. It is explanatory drawing of an opening process. It is a flowchart explaining a color filter manufacturing process. (A)-(e) is a schematic cross section of the color filter shown to the manufacturing process order. It is principal part sectional drawing which shows schematic structure of the liquid crystal device using the color filter to which this invention is applied. It is principal part sectional drawing which shows schematic structure of the liquid crystal device of the 2nd example using the color filter to which this invention is applied. It is principal part sectional drawing which shows schematic structure of the liquid crystal device of the 3rd example using the color filter to which this invention is applied. It is principal part sectional drawing of the display apparatus which is an organic electroluminescent apparatus. It is a flowchart explaining the manufacturing process of the display apparatus which is an organic electroluminescent apparatus. It is process drawing explaining formation of an inorganic bank layer. It is process drawing explaining formation of an organic substance bank layer. It is process drawing explaining the process in which a positive hole injection / transport layer is formed. It is process drawing explaining the state in which the positive hole injection / transport layer was formed. It is process drawing explaining the process in which a blue light emitting layer is formed. It is process drawing explaining the state in which the blue light emitting layer was formed. It is process drawing explaining the state in which the light emitting layer of each color was formed. It is process drawing explaining formation of a cathode. It is a principal part disassembled perspective view of the display apparatus which is a plasma type display apparatus (PDP apparatus). It is principal part sectional drawing of the display apparatus which is an electron emission apparatus (FED apparatus). It is the top view (a) around the electron emission part of a display apparatus, and the top view (b) which shows the formation method.

Explanation of symbols

  1: drawing device, 2: drawing processing unit, 3: imaging unit, 4: image processing unit, 11: XY moving mechanism, 15: head unit, 17: functional liquid droplet ejection head, 22: set table, 31: imaging device , 51: metal wiring pattern, 410: feature part detecting means, 420: first area specifying means, 430: second area specifying means, 440 closing processing means, 450 opening processing means, 460: drawing area specifying means, 470: center of gravity Coordinate output means, AM: alignment mark, M: mark, P0: cavity, P1: defect portion, P2: protrusion, PB: black portion, PW: bright portion, W: substrate

Claims (8)

An image processing apparatus that acquires image data and identifies a drawing area with metal ink from among image areas represented by the image data,
Of the image area, as a characteristic part, a part brighter than a predetermined first threshold value, or a part darker than a predetermined second threshold value (however, the second threshold value is lightness satisfying second threshold value ≦ first threshold value) Feature part setting means for setting which one of
Feature part detecting means for detecting the feature part according to the setting of the feature part setting means;
First region specifying means for expanding the feature portion with a predetermined parameter and specifying a region surrounding the overlapped feature portion as a first region;
A second region specifying means for specifying a region contracted by the predetermined parameter as the second region;
An image processing apparatus comprising: a drawing area specifying unit that specifies the second area as the drawing area.   The image processing according to claim 1, wherein the feature portion setting unit sets which of the bright portion and the dark portion is extracted as the feature portion according to a state in the image region. apparatus.   The image processing apparatus according to claim 2, wherein the feature part setting unit extracts the bright part and the dark part having a higher area ratio in the image region as the feature part.   The first region specifying means determines whether or not the region surrounding the overlapped feature portion after expansion is within a predetermined area range, and only when it is determined that the region is within the predetermined area range, The image processing apparatus according to claim 1, wherein the image processing apparatus is specified as a region. Further comprising a closing processing means for performing a closing process on the second region,
The image processing apparatus according to claim 1, wherein the drawing area specifying unit specifies the second area after the closing process as the drawing area. The image data, the image processing apparatus according to any one of claims 1 to 5, characterized in that an imaging result of the imaging by the imaging device of the coaxial incident illumination type or ring illumination method. An image processing method for acquiring image data and identifying a drawing region with metal ink from among image regions represented by the image data,
Of the image area, as a characteristic part, a part brighter than a predetermined first threshold value, or a part darker than a predetermined second threshold value (however, the second threshold value is lightness satisfying second threshold value ≦ first threshold value) A step of setting which to detect,
Detecting the feature according to the setting;
Inflating the feature portion with a predetermined parameter and identifying a region surrounding the overlapped feature portion as a first region;
Identifying a region in which the first region is contracted by the predetermined parameter as a second region;
And a step of specifying the second area as the drawing area. Each means in the image processing apparatus according to any one of claims 1 to 6 ,
A drawing device comprising: drawing means for drawing with the metal ink.

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