JP2006248655A - Work transferring method, work transferring system, manufacturing method of electro-optical device, electro-optical device, manufacturing method of circuit board, circuit board, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a work transferring system capable of transferring a work before a drawing process to a pallet of an eliminated material stocker in the positioning condition without detecting position again. <P>SOLUTION: This work transferring system 1 is provided with a supplied material stocker 202 and the eliminated material stocker 203 housing pallets P in parallel with each other to perform positioning of the work W, a drawing device 11 for drawing the work W and the work transferring device 13 for transferring the work W. The drawing device 11 has a position recognizing means 105 for recognizing loading position of the work W transferred to a set table 122 before drawing, a position correcting means 102 for correcting loading position of the work W before drawing on the set table 122, and a control means 16 for controlling the position recognizing means 105 and the position correcting means 102. The control means 16 returns the work W to the original loading position with the position correcting means 102 on the basis of a result of the recognition after drawing. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a workpiece transfer method, a workpiece transfer system, a method of manufacturing an electro-optical device, a method of manufacturing an electro-optical device, a method of manufacturing a circuit board, and the like. The present invention relates to a method, a circuit board, and an electronic device.

Conventionally, a set table of a drawing apparatus (drawing unit) from a supply stocker to a workpiece before drawing processing using a feeding stocker (feeding unit) and a removal material stocker (removing unit) each accommodating a workpiece (substrate). There is known a workpiece transfer system (droplet discharge device) that transfers a workpiece horizontally after being drawn onto a (stage) from a set table to a material removal stocker (for example, Patent Document 1). reference).
JP 2004-341114 A

  In this case, in the material supply stocker and the material removal stocker, the pallets on which the workpieces are placed in a positioned state are respectively stored in parallel with each other, and the workpieces are transferred to the pallets respectively stored in both stockers. Can be considered. However, the material supply stocker, the material removal stocker, and the drawing apparatus are configured separately, and it is difficult to accurately position both stockers with respect to the drawing apparatus. Due to the positional accuracy between the drawing device and both stockers or the positioning accuracy of the workpiece on the pallet, the workpiece position must be corrected on the set table when it is transferred from the material stocker to the set table. In addition, there is a problem in that some positional correction is necessary when the work is transferred from the set table to the material removal stocker.

  The present invention relates to a workpiece transfer method, a workpiece transfer system, a method of manufacturing an electro-optical device, and a workpiece transfer method that can transfer a workpiece after drawing processing to a pallet of a material removal stocker in a positioning state without performing position detection again. It is an object to provide an electro-optical device, a circuit board manufacturing method, a circuit board, and an electronic apparatus.

  The workpiece transfer method of the present invention uses a feed stocker and a material removal stocker that respectively accommodate pallets placed horizontally in a positioning state and are parallel to each other. A workpiece transfer method for horizontally transferring from a pallet housed in a material stocker to a set table of a drawing apparatus and horizontally transferring a workpiece after drawing processing from a set table to a pallet housed in a material removal stocker Prior to the drawing process, the position recognition step for recognizing the placement position of the work transferred to the set table in the horizontal plane and the drawing table before the drawing process based on the recognition result in the position recognition step. Based on the recognition result on the set table and the position correction process for correcting the placement position of the workpiece, the workpiece after drawing processing is returned to the original placement position. A position return process, characterized by comprising a.

  According to this configuration, the work can be set on the set table with high positional accuracy by correcting the placement position of the work on the set table before the drawing process. For this reason, the drawing apparatus can perform drawing processing with high drawing accuracy (position accuracy). Furthermore, the material removal is performed in parallel with the pallet of the material stocker by returning the work to the original placement position on the set table based on the recognition result performed after the drawing process and before the position correction. The workpiece can be transferred to the pallet accommodated in the stocker in a positioning state. In other words, the work can be transferred with high accuracy without detecting the position of the material removal stocker or its pallet only by storing the original position of the work.

  The workpiece transfer system according to the present invention includes a feed stocker and a material removal stocker for respectively accommodating pallets on which workpieces are horizontally placed in a positioned state so as to be parallel to each other, and a set table for setting the workpieces. The drawing apparatus that performs the drawing process on the set work and the work before the drawing process are horizontally transferred from the pallet accommodated in the material stocker to the set table of the drawing apparatus, and after the drawing process. A workpiece transfer system comprising: a workpiece transfer device that horizontally transfers a workpiece from a set table to a pallet housed in a material removal stocker, wherein the drawing device is placed on the set table prior to drawing processing. Based on the position recognition means for recognizing the placement position of the transferred work in the horizontal plane and the recognition result by the position recognition means on the set table The position correction means for correcting the placement position of the workpiece before the drawing process, and the control means for controlling the position recognition means and the position correction means, the control means, after the drawing process, based on the recognition result, The work is returned to the original placement position by the position correcting means.

According to this configuration, the work can be set on the set table with high positional accuracy by correcting the placement position of the work on the set table by the position correcting means before the drawing process. For this reason, the drawing apparatus can perform drawing processing with high drawing accuracy (position accuracy). Further, after the drawing process, based on the recognition result performed before the position correction, the work is returned to the original placement position on the set table by the position correction means so as to be parallel to the pallet of the material stocker. Thus, the workpiece can be transferred to the pallet accommodated in the material removal stocker in a positioned state. In other words, the work can be transferred with high accuracy without detecting the position of the material removal stocker or its pallet only by storing the original position of the work.
In this case, the position correction means is preferably incorporated in the set table, and according to this, the position of the work on the set table can be easily corrected and easily returned to the original placement position. Can be returned.

  Another workpiece transfer method of the present invention uses a material stocker and a material removal stocker that respectively accommodate pallets on which workpieces are horizontally placed in a positioned state so as to be parallel to each other. The workpiece before the drawing process is transferred horizontally from the pallet accommodated in the material stocker to the set table of the drawing apparatus, and the workpiece after the drawing process is horizontally transferred from the set table to the pallet accommodated in the material removal stocker. A position recognizing step for recognizing a placement position in a horizontal plane of a work placed on a pallet of a feed stocker prior to transfer to a set table; During transfer from the stocker to the set table, based on the recognition result in the position recognition process, the horizontal plane of the workpiece before drawing processing set in the workpiece transfer device During the position correction process for correcting the set position in the transfer and the transfer from the set table to the material removal stocker, the workpiece after the drawing process set in the workpiece transfer device is returned to the original set position based on the recognition result. And a position return step.

According to this configuration, during the transfer from the material supply stocker to the set table, the workpiece is set on the set table with high positional accuracy by correcting the set position of the workpiece before the drawing process set in the workpiece transfer device. can do. For this reason, a drawing process with high drawing accuracy can be performed. Furthermore, during the transfer from the set table to the material removal stocker, based on the recognition result performed before position correction, by returning the workpiece after drawing processing set in the workpiece transfer device to the original set position, The workpiece can be transferred to the pallet accommodated in the material removal stocker so as to be parallel to the pallet of the material supply stocker. In other words, the work can be transferred with high accuracy without detecting the position of the material removal stocker or its pallet only by storing the original position of the work.
In this case, the main alignment may be further performed on the set table by correcting the set position of the work before the drawing process set in the work transfer device as pre-alignment.

  Another workpiece transfer system according to the present invention includes a feed stocker and a material removal stocker that respectively accommodate pallets on which workpieces are horizontally placed in a positioned state so as to be parallel to each other, and a set table for setting the workpieces A drawing apparatus that performs a drawing process on the set work, and a work before the drawing process is horizontally transferred from the pallet housed in the material stocker to the set table of the drawing apparatus, and the drawing process A workpiece transfer system comprising: a workpiece transfer device that horizontally transfers a subsequent workpiece from a set table to a pallet housed in a material removal stocker, wherein the workpiece transfer device includes a material stocker, a set The workpiece transfer means for transferring the set work in the order of the table and material removal stocker, and the pallet of the material stocker prior to the transfer to the set table. Position recognition means for recognizing the placement position of the work placed on the horizontal plane, and set on the work transfer means based on the recognition result by the position recognition means during the transfer from the material stocker to the set table. And a control means for controlling the position recognition means and the position correction means, the control means from the set table to the material removal stocker. Based on the recognition result, the workpiece after the drawing process set in the workpiece transfer means by the position correction means is returned to the original set position based on the recognition result.

According to this configuration, during the transfer from the material supply stocker to the set table, the workpiece is placed with high positional accuracy by correcting the set position of the workpiece before the drawing process set in the workpiece transfer device by the position correction means. Can be set on the set table. For this reason, a drawing process with high drawing accuracy can be performed. Further, during the transfer from the set table to the material removal stocker, based on the recognition result performed before the position correction, the workpiece after the drawing process set in the workpiece transfer device by the position correction means is returned to the original set position. By returning, the workpiece can be transferred in a positioning state on the pallet accommodated in the material removal stocker so as to be parallel to the pallet of the material stocker. In other words, the work can be transferred with high accuracy without detecting the position of the material removal stocker or its pallet only by storing the original position of the work.
In this case, the position correction means is preferably incorporated in the workpiece transfer means. According to this, the position of the workpiece set on the workpiece transfer means can be easily corrected, and the original Can be returned to the set position.

  The method of manufacturing an electro-optical device according to the present invention is characterized in that the film transfer unit is formed on the workpiece by the drawing device using the workpiece transfer system described above.

  In addition, an electro-optical device according to the present invention is characterized in that a film forming unit made of a functional liquid is formed on a work by a drawing apparatus using the work transfer system described above.

  According to these configurations, the position of the workpiece can be corrected before the drawing processing, and the workpiece after the drawing processing can be transferred to the pallet of the material removal stocker in a positioned state without performing position detection again. Therefore, it is possible to efficiently manufacture a high-quality electro-optical device. As an electro-optical device (flat panel display: FPD), a color filter, a liquid crystal display device, an organic EL device, a PDP device, an electron emission device, and the like are conceivable. The electron emission device is a concept including a so-called FED (Field Emission Display) or SED (Surface-conduction Electron-Emitter Display) device. Furthermore, as the electro-optical device, a device including metal wiring formation, lens formation, resist formation, light diffuser formation, and the like, for example, a circuit board can be considered. Further, as the drawing apparatus, for example, an ink jet method or a dispenser method can be considered.

  An electronic apparatus according to an aspect of the invention includes the electro-optical device manufactured by the above-described method for manufacturing the electro-optical device or the above-described electro-optical device.

  In this case, examples of the electronic device include a mobile phone and a personal computer equipped with a so-called flat panel display, and various electric products.

  Hereinafter, a substrate processing system to which the present invention is applied will be described with reference to the accompanying drawings. The substrate processing system of this embodiment is for producing a circuit board by a so-called ink jet printing technique. A silver ink (silver nanoparticles) is produced by an ink jet method on an introduced substrate (a work in which some elements are made). ) Or insulating ink (ultraviolet curable resin) or the like is ejected (drawn) to form a metal wiring and an insulating film (film forming portion) with functional droplets on the substrate. First, a circuit board manufactured by an ink jet technique and its manufacturing process will be briefly described.

  A substrate W in FIG. 1 is a sheet-like polyimide base material having a thickness of about 40 μm, and is cut into a plurality of circuit boards after the drawing process. In this embodiment, for example, two types of substrates W are prepared: a large substrate W of 410 mm × 510 mm and a small substrate W of 165 mm × 165 mm. Further, a portion having a width of 10 mm in the outer edge portion of the substrate W is a non-drawing margin Wn (non-drawing region) where drawing processing is not performed, and a portion surrounded by the non-drawing margin Wn is a drawing region where drawing processing is performed. Wd.

  The substrate W is formed with a pair of alignment marks (not shown) that are image-recognized by an image recognition means 105 (see FIG. 5) of the drawing apparatus 11 described later. In FIG. 1, the functional liquid droplet ejection head 141 is schematically shown as a single one. However, as will be described later, the drawing apparatus 11 includes 48 functional liquid droplet ejection heads 141. Yes.

  In the manufacturing process, first, silver ink is discharged by a later-described functional liquid droplet discharge head 141 to form a wiring pattern on the substrate W (see FIG. 5B). Subsequently, the organic material covering the silver nanoparticles is removed by baking or the like, and electrical coupling between the particles is ensured to form a metal wiring. Further, an insulating ink is discharged onto the formed metal wiring, and an interlayer insulating film is formed except for the through-hole portion (see FIG. 5C). By repeating this process, the drawing process is completed by ejecting insulating ink that finally becomes a multilayer and finally becomes a surface insulating film.

  Next, a substrate processing system according to the present invention will be described with reference to FIGS. The substrate processing system 1 accommodates a drawing device 11 that performs drawing processing on the substrate W, a substrate stocker 12 that carries in and out the drawing processing before and after the drawing processing, and drawing from the substrate stocker 12. And a substrate transfer device 13 for transferring the substrate W before processing to the drawing device 11 and transferring the substrate W after drawing processing from the drawing device 11 to the substrate stocker 12. The substrate processing system 1 includes an air supply device 14 that supplies compressed air for driving and controlling each component, a vacuum pump, and the like, and performs air suction to adsorb the substrate W. A suction device 15 and a personal computer or the like are included, and a control device 16 and the like for controlling each device are incorporated (see FIG. 5).

  The drawing apparatus 11 includes two carriage units 101 each mounting 24 functional liquid droplet ejection heads 141 and an X-axis table 102 that moves a substrate W placed on a set table 122 (described later) in the X-axis direction. And a Y-axis table 103 which is arranged so as to straddle the X-axis table 102 and moves the two carriage units 101 individually in the Y-axis direction, and is arranged on the movement path of the carriage unit 101 by the Y-axis table 103. And a maintenance unit 104 for maintaining the functional liquid droplet ejection head 141, and an image recognition unit 105 for recognizing an image of an alignment mark provided on the substrate W and a functional liquid droplet landed on the substrate W.

  Further, the drawing apparatus 11 includes functional liquid supply means (not shown) for supplying functional liquid to the functional liquid droplet ejection heads 141 mounted on the two carriage units 101, and silver ink ejected on the substrate W. A dryer (not shown) for drying by blowing dry air, a UV irradiation device 106 for UV curing the insulator ink discharged onto the substrate W, and the like are incorporated.

  In the drawing apparatus 11, the functional liquid droplet ejection head 141 is driven in synchronization with the driving of the X-axis table 102, thereby ejecting and landing functional liquid droplets on the substrate W, and performing drawing processing on the substrate W. At the same time, during non-drawing processing such as substrate replacement, the Y-axis table 103 is driven so that the carriage unit 101 faces the maintenance means 104, and the maintenance means 104 performs maintenance processing of the functional liquid droplet ejection head 141. Yes.

  An area where the movement locus of the substrate W by the X-axis table 102 and the movement locus of the carriage unit 101 by the Y-axis table 103 intersect is a drawing area 111 for performing drawing processing. A region outside the X-axis table 102 on the movement trajectory 101 is a maintenance area 112 in which maintenance processing by the maintenance unit 104 and replacement of the functional liquid droplet ejection head 141 are performed. Further, one end of the X-axis table 102 is a substrate transfer area 113 for transferring the substrate W between the substrate stocker 12 and the drawing apparatus 11 (see FIG. 3).

  The X-axis table 102 is provided on a stone surface plate 121 installed on the floor, and a set table 122 including a suction table 123 and a substrate θ-axis table 124 and the set table 122 are slidable in the X-axis direction. An X-axis slider 125 to be supported and a pair of left and right X-axis linear motors 126 and 126 for moving the substrate W in the X-axis direction via the set table 122 are provided.

  The suction table 123 is for sucking and setting the substrate W placed on the upper surface thereof by air suction from the air suction device 15 and is formed in a substantially square shape in plan view. The length of one side is set according to the length of the long side of the large substrate W, and the substrate W is placed vertically (the long side of the substrate W is parallel to the X-axis direction) and placed horizontally ( The long side of the substrate W is parallel to the Y-axis direction) and can be set at the center center. The substrate θ-axis table 124 finely adjusts (θ correction) the θ position in the horizontal plane of the substrate W via the suction table 123 by driving the θ-axis motor 128.

  On the other hand, the Y-axis table 103 spans between the drawing area 111 and the maintenance area 112, and between the drawing area 111 and the upper part of each unit of the maintenance means 104, two carriage units 101 and will be described later. Each of the camera carriages 151 is individually moved and has three sets of motor-driven Y-axis air sliders (not shown) constituting a drive system in the Y-axis direction. The two carriage units 101 and the camera carriage 151 are movably mounted.

  The Y-axis table 103 is supported on a pair of front and rear support stands 136 and 136 extending in the Y-axis direction. Each support stand 136 includes two short columns 137 provided on the stone surface plate 121. , And one long support 138 provided on the floor. Reference numeral 139 in the figure denotes a carrier cover. Various wirings and pipes that reach the respective functional liquid droplet ejection heads 141 along the Y-axis table 103 are arranged in the carrier cover 139. A cable carrier (not shown) like a cable bear (registered trademark) to be carried is accommodated.

  Each carriage unit 101 includes a sub-carriage (not shown) and 24 functional liquid droplet ejection heads 141 (see FIG. 1) mounted on the sub-carriage. Twenty-four functional liquid droplet ejection heads 141 are arranged in groups of two so that each of the two functional liquid droplet ejection heads 141 is shifted from each other by a half nozzle pitch and one continuous drawing line is formed as a whole. , 12 sets of functional liquid droplet ejection heads 141 are arranged stepwise. In other words, the drawing apparatus 11 of the present embodiment is of a so-called full line type, and can perform drawing processing over the entire area of the substrate W by one ejection scan.

  Although not shown, each functional liquid droplet ejection head 141 ejects the functional liquid introduced from the functional liquid pack of the functional liquid supply means by an inkjet method, and includes a plurality of nozzles arranged in a row and each nozzle. The liquid droplets are ejected from each nozzle by applying a drive waveform to the pump unit.

  Each functional liquid droplet ejection head 141 is connected to a functional liquid pack storing functional liquid via a functional liquid supply tube (not shown). Each functional fluid pack is attached to a corresponding bridge plate 132 so as to move in the Y-axis direction as the carriage unit 101 is moved by the Y-axis table 103.

  In the present embodiment, two drawing apparatuses 11 are prepared in the circuit board production line, and silver ink is stored in the functional liquid pack provided in one drawing apparatus 11. Insulating ink is stored in the provided functional liquid pack. That is, one drawing device 11 is used for drawing silver ink, and the other drawing device 11 is used for drawing insulating ink. Of course, one carriage unit 101 may be used for silver ink drawing and the other carriage unit 101 may be used for insulator ink drawing by one drawing apparatus 11.

  The maintenance unit 104 is disposed in the maintenance area 112, and includes two suction units 146 that perform suction for removing the functional liquid thickened in the functional liquid droplet ejection head 141, and nozzles of the functional liquid droplet ejection head 141. A wiping unit 147 for wiping the surface (not shown), a flight observation unit (not shown) for imaging the flight state of the functional droplets ejected from the functional droplet ejection head 141, and the weight of the ejected functional droplets Two weight measuring units (not shown) for measurement are provided. Reference numeral 148 in FIG. 3 denotes an X-axis movement table, on which a flight observation unit and two weight measurement units arranged so as to be sandwiched in the Y-axis direction are mounted. It is possible to face the unit 101 as appropriate.

  In addition, although not shown, a pair of flushing boxes are provided on both the front and rear sides of the suction table 123, and the functional liquid droplets to the substrate W of the functional liquid droplet ejection head 141 are disposed in the respective flushing boxes. Flushing (discarding discharge) is performed immediately before and after the discharge.

  The image recognition means 105 is mounted on the camera carriage 151 described above, and the pre-alignment camera 152 and the alignment camera 153 that perform alignment of the substrate W transferred to the set table 122 and the drawing accuracy and the like are checked. And a drawing confirmation camera 154 that images the functional liquid droplets discharged onto the substrate W. The pre-alignment camera 152 is configured with a wide viewing angle (low resolution), and the alignment camera 153 is configured with a high resolution (narrow viewing angle).

  The alignment of the substrate W transferred to the set table 122 is performed in two stages of pre-alignment and subsequent main alignment. That is, first, the set table 122 on which the substrate W is placed by the X-axis table 102 is positioned at the initial position on the data in the drawing area 111, and the camera carriage 151 is initially set on the data in the drawing area 111 by the Y-axis table 103. Keep it in position. Then, the pre-alignment camera 152 images each of the pair of alignment marks on the substrate W, and performs pre-alignment based on the imaging result. That is, in pre-alignment, the suction table 123 is moved in the X-axis direction and the θ-axis direction by the X-axis table 102 and the substrate θ-axis table 124 so that the alignment mark is positioned in the field of view of the alignment camera 153, and the camera The carriage 151 is moved in the Y-axis direction.

  Subsequently, the alignment camera 153 images each of the pair of alignment marks. Finally, based on the imaging result of the pair of alignment marks by the alignment camera 153, the position data in the X-axis direction and the Y-axis direction are corrected, and the suction table 123 is slightly moved in the θ-axis direction by the substrate θ-axis table 124. Thus, the main alignment of the substrate W is completed. By this pre-alignment and main alignment, the drawing apparatus 11 can perform drawing processing with high drawing accuracy (position accuracy). As described above, the alignment of the substrate W is performed by correcting the placement position of the substrate W by moving the suction table 123 (position correction processing) and data correction. This position correction processing will be described in detail later. .

  In this embodiment, these cameras can be moved in the Y-axis direction so as to correspond to two types of substrates W (large substrate W and small substrate W), but one type of substrate W is targeted. When doing so, these cameras may be fixedly provided.

  Here, a series of ejection operations (drawing process) onto the substrate W by the drawing apparatus 11 will be briefly described. First, as a preparation before ejecting the functional liquid droplets, alignment of the substrate W sucked and set on the set table 122 is performed as described above. Subsequently, the drawing apparatus 11 moves the substrate W in the X-axis direction by the X-axis table 102 and selectively drives the functional liquid droplet ejection head 141 in synchronism with this to thereby function the substrate W. A droplet is ejected. Finally, when the silver ink is drawn, air is blown by a dryer to be semi-dried, and when the insulator ink is drawn, the UV ink is irradiated by the UV irradiation device 106 to cure the insulator ink. In this way, the drawing of the silver ink or the insulator ink on the substrate W is completed.

  Next, the substrate stocker 12 and the substrate transfer device 13 which are main parts of the present invention will be described in detail. As shown in FIGS. 5 to 9, the substrate stocker 12 places the material stocker 202 for placing and storing the substrate W before the drawing process on the pallet P and the substrate W after the drawing process on the pallet P. The substrate transfer device 13 transfers the substrate W before drawing processing from the pallet P of the material stocker 202 to the set table 122 of the drawing device 11 described above. Subsequently, the pallet P on which the substrate W has been placed is transferred from the material supply stocker 202 to the material removal stocker 203, and the substrate W after the drawing processing is further transferred from the set table 122 to the material removal stocker 203. The pallet P is transferred.

  The substrate stocker 12 includes a rectangular base 201 installed on the floor, and a material stocker 202 and a material removal stocker 203 arranged side by side on the top surface of the base 201. The gantry 201 is configured by assembling an angle material or the like into a square shape, and includes four support legs 211 arranged at the lower four corners. Although not shown, four casters capable of appearing in the vertical direction are attached adjacent to each support leg 211. For this reason, when carrying the board | substrate W accommodated in the board | substrate stocker 12, while being able to move the mount frame 201, the mount frame 201 can be installed in a stable state.

  The gantry 201 is installed with the material supply stocker 202 and the material removal stocker 203 aligned in the Y-axis direction with respect to the set table 122 positioned in the substrate transfer area 113 (see FIG. 3). At this time, the carried-in substrate stocker 12 (the gantry 201) is placed in a positioned state via some reference.

  The set table 122, the material supply stocker 202, and the material removal stocker 203 in the substrate transfer area 113 are arranged in this order in the Y-axis direction. In this order, that is, where the material supply stocker 202 and the material removal stocker 203 are installed It is optional and can be changed in consideration of the space efficiency of the entire substrate processing system 1 and the like. For example, the material supply stocker 202 and the material removal stocker 203 may be arranged on separate platforms, and the material supply stocker 202 and the material removal stocker 203 may be positioned and disposed so as to sandwich the set table 122 in the Y-axis direction.

  The material supply stocker 202 and the material removal stocker 203 can each accommodate up to 15 pallets P (to be described later) on which substrates W are placed. The material supply stocker 202 stores the substrate W before drawing processing and the substrate W. The placed pallet P is accommodated, and the material removal stocker 203 accommodates the substrate W after the drawing process and the pallet P on which the substrate W is placed.

  The material supply stocker 202 stacks and accommodates a plurality of pallets P on which substrates W before drawing processing are horizontally placed in a positioning state, and is fixed to the upper surface of the gantry 201 and extends in the long side direction. A substantially rectangular pallet mounting plate 221 having two ridges formed thereon, five positioning pins 222 for positioning the pallets P stacked on the pallet mounting plate 221, and the stacked pallets P Pallet number sensors 223 and 233 (see FIG. 5) for detecting the number (height).

  The pallet mounting plate 221 is formed with ten pin holes 224 for inserting the positioning pins 222 in a freely detachable manner. That is, the pallet P is vertically placed (the long side of the pallet P is parallel to the X-axis direction) and the five pin holes 224 for positioning by the five positioning pins 222 and the pallet P are placed horizontally (the pallet P The five pin holes 224 for positioning with the five positioning pins 222 are formed in a distributed manner on each of the four sides. Thereby, the material supply stocker 202 can accommodate the pallet P on which the substrate W is placed vertically and horizontally in order to transfer the substrate W vertically and horizontally to the set table 122 described above. In the figure, the material supply stocker 202 positions and accommodates the pallet P in a horizontal position (the same applies to the material removal stocker 203).

  Each positioning pin 222 is formed to be slightly longer than the height (75 mm) of the 15 stacked pallets P (maximum accommodation number) while being inserted into the pin hole 224. The pallet number sensor 223 is composed of a pair of left and right fiber sensors facing each other in the Y-axis direction with the pallet placing plate 221 interposed therebetween, and these are provided at two front and rear positions.

  The material removal stocker 203 stacks and accommodates a plurality of pallets P on which the substrates W after drawing processing are horizontally placed in a positioned state. Although details will be given to the description of the material supply stocker 202, the pallet P is constituted by five positioning pins 232 inserted into pin holes 234 formed in the pallet placement plate 231. And a pallet number sensor 233 is provided. The material supply stocker 202 and the material removal stocker 203 are configured such that the pallets P accommodated therein are parallel to each other.

  As shown in FIG. 10, the pallet P is used to place the substrate W in a positioning state, and is formed in a substantially rectangular plate shape (5 mm thick) that is slightly larger than the large substrate W and chamfered at the corners. ing. When the large substrate W is placed, the front surface of the pallet P is used, and when the small substrate W is placed, the back surface of the pallet P is used. That is, a large shallow groove portion Pb is formed on the surface of the pallet P so as to place the large substrate W in a positioned state, and a small shallow groove portion Ps is formed on the back surface so as to place the small substrate W in a positioned state. The large shallow groove portion Pb and the small shallow groove portion Ps are formed concentrically. However, the large shallow groove portion Pb and the small shallow groove portion Ps are formed slightly larger than the large substrate W and the small substrate W with a dimensional tolerance that allows slight backlash of the large substrate W and the small substrate W placed thereon, respectively. Therefore, the large substrate W and the small substrate W are roughly positioned.

  The large shallow groove portion Pb and the small shallow groove portion Ps each have a depth of 0.5 mm, which is deeper than the thickness of the substrate W described above of 40 μm. Therefore, the surface of the substrate W placed on the large shallow groove portion Pb or the small shallow groove portion Ps of the pallet P does not come into contact with the lower surface of the pallet P stacked thereon.

  Note that the pallet P may be appropriately formed with cutout openings at a plurality of locations in order to reduce the weight. In this case, however, a portion where a pallet suction pad 381 of the pallet suction mechanism 313 described later is sucked is not cut out.

  As shown in FIGS. 5 to 9, the substrate transfer device 13 includes a substrate suction mechanism 312 that sucks and holds a substrate W from above by a substrate suction plate 341, and a pallet P from above by a pair of pallet suction pads 381 and 381. A suction head 301 having a pallet suction mechanism 313 for sucking and holding, a suction head lifting mechanism 302 that lifts and lowers the substrate suction plate 341 and the pallet suction pad 381 integrally through a bracket 311, and the substrate transfer area 113 (set table) described above. 122) and a suction head moving mechanism 303 stretched between the material removal stocker 203.

  The suction head moving mechanism 303 moves the substrate W sucked by the substrate suction mechanism 312 in the Y-axis direction and moves the pallet P sucked by the pallet suction mechanism 313 in the Y-axis direction. The suction head moving mechanism 303 extends horizontally in the Y-axis direction, and a Y-axis slider (not shown) that suspends and supports the suction head lifting mechanism 302 and the suction head 301 via the transfer carriage 331. And a Y-axis ball screw (not shown) that moves the transfer carriage 331 in the Y-axis direction using the Y-axis slider as a guide, and a Y-axis motor 332 that rotates the Y-axis ball screw forward and backward.

  Although not shown, a cable bear box is provided along the back side of the Y-axis slider, and carries a suction tube 354, a vacuum tube 386 (see FIG. 5), etc. connected to an air suction device 15 described later. A Y-axis cable bear is housed inside. The suction head moving mechanism 303 is fixed to the lower side of the carrier cover 139 (cover angle) of the drawing apparatus 11 by a plurality of fixing brackets attached to the back surface of the cable bear box.

  The suction head lifting / lowering mechanism 302 is a so-called motor folding drive system that is held on the front surface of the transfer carriage 331 and has a power transmission mechanism 321 disposed on the top thereof, and is a female screw member (not shown) provided on the bracket 311 side. ), A lead screw (not shown) that is screwed to the lead screw, a lifting motor 322 as a power source, a timing belt, and the like, and a power transmission mechanism 321 that transmits the driving force of the lifting motor 322 to the lead screw. Has been. Then, the substrate suction plate 341 and the pallet suction pad 381 are moved up and down through the bracket 311 by forward and reverse rotation of the lifting motor 322 so that the substrate W and the pallet P sucked by these can be moved up and down.

  The lifting / lowering stroke width of the suction head lifting / lowering mechanism 302 is 100 mm, and the stacked uppermost (15th) pallet P faces from a height of 25 mm. Based on the number of stacked pallets P (height) detected by the pallet number sensors 223 and 233, the descending distance with respect to the material stocker 202 and the material removal stocker 203 is determined. Although not shown, a Z-axis cable bear carrying the suction tube 354 and the vacuum tube 386 is disposed on the side of the suction head lifting mechanism 302.

  As shown in FIG. 11 to FIG. 14, the suction head 301 includes a bracket 311 formed in a substantially rectangular plate shape, a substrate suction mechanism 312 suspended from a substantially right and left middle portion of the bracket 311, and a left side of the bracket 311. And a pallet suction mechanism 313 extending downward from the lower end of the right side. The substrate suction mechanism 312 and the pallet suction mechanism 313 are attached to the front surface of the bracket 311, and the bracket 311 is attached to the suction head lifting mechanism 302 on the rear surface (see FIG. 9). As described above, the substrate suction mechanism 312 is attached to the suction head lifting mechanism 302 via the bracket 311 and the pallet suction mechanism 313 is attached to the suction head lifting mechanism 302 via the bracket 311, thereby There is no need to separately provide a moving means for W and a moving means for pallet P.

  5 is a substrate pressure sensor that detects the suction force (pressure) of the substrate suction mechanism 312, and 387 is a pallet pressure sensor that detects the suction force (pressure) of the pallet suction mechanism 313. Actually, both sensors are attached to the front surface of the bracket 311.

  The substrate adsorption mechanism 312 is attached to the substrate adsorption plate 341 that adsorbs the substrate W from above, the attitude control module 342 that controls the attitude of the substrate adsorption plate 341, and the attitude control module 342. And a sub elevating mechanism 343 that elevates and lowers the substrate suction plate 341 via the attitude control module 342.

  The substrate suction plate 341 is made of an aluminum plate, and an annular convex portion 351 that contacts the non-drawing margin Wn (outer edge portion) of the substrate W protrudes from the lower surface thereof (see FIG. 14). An adsorption groove 352 for sucking the substrate W is continuously (annularly) formed on the lower surface of the annular protrusion 351. In addition, suction holes 353 are formed in the suction groove portion 352 at eight corners and at the middle portions of the four sides, to which the upstream ends of the suction tubes 354 connected to the air suction device 15 are connected. ing.

  Since the lower surface of the annular convex portion 351 is processed smoothly (for example, anodized), when the suction is performed from the suction groove portion 352 in a state where the upper surface of the non-drawing margin Wn of the substrate W is in contact with the lower surface of the annular convex portion 351 A sufficient suction force can be applied to the substrate W without air leaking from between the upper surface of the non-drawing margin Wn and the lower surface of the annular convex portion 351.

  Further, a three-way valve (not shown) is interposed in the suction tube 354 so that air suction and compressed air supply can be switched with respect to the suction hole 353. Further, the substrate tube pressure sensor 355 is interposed in the suction tube 354, and when the pressure is reduced to a predetermined pressure, the air suction is stopped (see FIG. 5).

  When air suction is performed from the suction hole 353, a suction force can be applied substantially uniformly to the non-drawing margin Wn of the substrate W from the suction groove 352, and the substrate suction is performed while maintaining the flatness of the substrate W. The substrate W can be fixed to the plate 341 by suction. On the other hand, when the three-way valve is switched and compressed air is supplied to the suction hole 353, the vacuum on the substrate W in the suction groove 352 is broken, and the substrate W is separated from the substrate suction plate 341 by its own weight. Thus, the substrate suction plate 341 can suck and hold the substrate W without contacting the drawing region Wd of the substrate W to be drawn.

  In addition, by adsorbing the non-drawing margin Wn of the substrate W by the continuously formed adsorption groove 352, the substrate W can be appropriately adsorbed and held without drooping corners or the like of the substrate W. Furthermore, compared with a suction pad or the like, the width of the portion that sucks the substrate W can be made as narrow as possible, and the drawing region of the substrate W can be provided wider.

  Further, a plurality of screw holes (not shown) for screwing and fixing to the posture control module 342 are formed at the center of the substrate suction plate 341, and the substrate suction plate 341 is oriented vertically (substrate). The suction plate 341 can be mounted in the long side (parallel to the X-axis direction) and laterally (the long side of the substrate suction plate 341 is parallel to the Y-axis direction), that is, in a state rotated by 90 ° in the horizontal plane. It is configured to be replaceable. Accordingly, the substrate suction plate 341 can be attached in accordance with the direction (vertical direction or horizontal direction) of the substrate W placed on the set table 122. In the figure, the substrate suction plate 341 is attached sideways.

  In addition, four circular openings 356 are formed in the substrate suction plate 341 at positions having the same distance in all directions from the center. Of the four circular openings 356, two of them arranged in the long side direction are for causing a pallet suction pad 381 (described later) to appear and disappear downward when the substrate suction plate 341 is mounted sideways. There are two ones arranged in the short side direction for causing the pallet suction pad 381 to be projected and lowered downward when the substrate suction plate 341 is mounted vertically. In this manner, the pallet suction pad 381 can be disposed in the projection surface of the substrate suction plate 341 by causing the pallet suction pad 381 to protrude downwards and downwards through the circular opening 356. . That is, the substrate suction plate 341 and the pallet suction pad 381 do not need to be exchanged and moved in a horizontal plane, can be disposed compactly, and space efficiency can be improved. Two types of substrate suction plates 341 are prepared which are formed in substantially the same shape and the same size as the large substrate W and the small substrate W, respectively.

  The attitude control module 342 is interposed between the substrate suction plate 341 and the sub-lifting mechanism 343, and has a substantially rectangular parallelepiped device body 361 and a tilt plate 362 attached to the lower surface of the device body 361. The substrate suction plate 341 is screwed to the lower surface of the tilting plate 362.

  Although not shown, the apparatus main body 361 is connected to the tilting plate 362 in parallel with the tilting plate 362 and can be moved minutely in the X-axis, Y-axis, θ-axis, and α-axis directions (can be tilted three-dimensionally). ) Inner plate, a fastening mechanism for fastening the inner plate, and a positioning mechanism for positioning the inner plate with respect to the apparatus main body 361 (mutual centers coincide).

  The fastening mechanism and the positioning mechanism are each composed of an air cylinder or the like, and can be switched ON / OFF by controlling the air supply from the air supply device 14 described above. That is, when the fastening mechanism is turned on, the inner plate is fastened and the tilting plate 362 connected to the inner plate is in a fixed state. When the fastening mechanism is turned off, the fastening of the inner plate is released and the tilting plate 362 is slightly movable. It becomes a state.

  Further, when the positioning mechanism is turned on in the state where the fastening mechanism is turned off and the fastening of the inner plate is released, the center of the tilting plate 362 and the center of the apparatus main body 361 coincide with each other. By turning ON, the tilting plate 362 positioned with respect to the apparatus main body 361 can be fixed.

  That is, since the fastening mechanism and the positioning mechanism can be switched ON / OFF, the tilting plate 362 can be fixed in the tilted state by turning the fastening mechanism ON while the positioning mechanism is OFF, and the positioning mechanism. By turning on the fastening mechanism after turning on, the tilting plate 362 can be fixed in a positioned state. However, in the present embodiment, it is sufficient if the tilting plate 362 can be fixed in the positioning state, and therefore, only the fastening mechanism may be switched ON / OFF.

  The posture control module 342 of the present embodiment is adjusted so that the tilting plate 362 positioned with respect to the apparatus main body 361 is parallel to the upper surface of the suction table 123. Therefore, the substrate suction plate 341 is in a free tilting state in which the tilting plate 362 is tilted three-dimensionally to follow the pressed substrate W by setting the tilting plate 362 in a minute movable state, and the tilting plate 362 is moved with respect to the apparatus main body 361. By positioning and fixing, the reference posture with respect to the upper surface of the suction table 123 is obtained.

  In other words, the posture control module 342 can switch the posture of the substrate suction plate 341 between a non-moving state in which the substrate suction plate 341 is fixed in the reference posture and a free tilting state in which the substrate suction plate 341 is tilted three-dimensionally by controlling the air supply. Accordingly, even when the placement surface of the substrate W in the material stocker 202 (the upper surface of the pallet P) is not parallel to the upper surface of the set table 122, the removal of the substrate W from the material stocker 202 and the set table are performed. The substrate W can be appropriately placed on 122 (details will be described later).

  The sub elevating mechanism 343 is composed of a double-acting air cylinder (single rod) erected on the upper surface of the attitude control module 342 (see FIG. 5), and the substrate suction plate 341 is moved to the pallet via the attitude control module 342. It is moved up and down between a position slightly lowered from the lower edge of the suction pad 381 and a position slightly raised from the lower edge of the pallet suction pad 381.

  That is, when adsorbing the substrate W by the substrate adsorbing plate 341, the substrate adsorbing plate 341 is slightly lowered from the lower edge of the pallet adsorbing pad 381, and when adsorbing the pallet P by the pallet adsorbing pad 381, The plate 341 is raised slightly from the lower edge (rubber pad 382 described later) of the pallet suction pad 381. Therefore, the substrate suction plate 341 and the pallet suction pad 381 can stably suck the substrate W and the pallet P, respectively, without interfering with each other. In the figure, the substrate suction plate 341 is positioned higher than the pallet suction pad 381.

  Further, the double acting air cylinder constituting the sub elevating mechanism 343 controls the flow rate of the compressed air supplied to the forward chamber 371 and the backward chamber 372, so that the forward chamber 371 and the backward chamber 372 The pressure balance can be adjusted. The forward chamber 371 and the backward chamber 372 are chambers in the cylinder 374 divided by the piston 373. When compressed air is supplied to the forward chamber 371, the piston 373 is moved to the backward chamber 372 side. When the piston rod 375 moves forward and the compressed air is supplied to the return chamber 372, the piston 373 is pushed toward the forward chamber 371 and the piston rod 375 moves backward (see FIG. 5). .

  The pallet suction mechanism 313 includes a pair of pallet suction pads 381 and 381 each having a rubber pad 382 and a cylindrical suction rod 383 with a rubber pad 382 attached to the lower end thereof, and an L-shaped bracket 384 for fixing each pallet suction pad 381 to the bracket 311. And a coil spring (not shown) for absorbing an impact when the rubber pad 382 is pressed against the pallet P. Further, a vacuum joint 385 to which an upstream end of a vacuum tube 386 connected to the air suction device 15 is connected is attached to a substantially middle portion of each suction rod 383, and a rubber pad 382 and a vacuum joint 385 are attached to the suction rod 383. And a vacuum channel (not shown) that communicates with each other.

  Similarly to the substrate suction mechanism 312, a three-way valve (not shown) is interposed in the vacuum tube 386 so that air suction and compressed air supply can be switched with respect to the vacuum joint 385. Further, the pallet pressure sensor 387 is interposed, and air suction is stopped when the pressure is reduced to a predetermined pressure (see FIG. 5).

  When air suction is performed while pressing the pair of pallet suction pads 381 and 381 against the pallet P, the inside of the rubber pad 382 is in a vacuum state, and the pallet suction pad 381 and the pallet P are strongly suctioned. On the other hand, when the compressed air is supplied to the pallet suction pad 381 by switching the three-way valve, the inside of the rubber pad 382 is broken in vacuum, and the pallet P is separated from the pallet suction pad 381 by its own weight.

  Here, a series of operations for transferring the substrate W in the order of the material supply stocker 202, the set table 122, and the material removal stocker 203 using the substrate processing system 1 will be described. As a preparation before the transfer process, the set table 122 is moved to the substrate transfer area 113 in the drawing apparatus 11. The material stocker 202 accommodates the pallet P on which the substrate W is placed in a positioned state.

  First, the suction head 301 in which the substrate suction plate 341 is lowered with respect to the pallet suction pad 381 is caused to face directly above the material stocker 202 by the suction head moving mechanism 303, and the substrate suction plate 341 is moved to the substrate W ( The suction head 301 is lowered by the suction head lifting mechanism 302 to a position where it abuts against the non-drawing margin Wn). At this time, the attitude control module 342 keeps the substrate suction plate 341 in a freely tilting state. Thereby, in a state where the substrate suction plate 341 follows the upper surface of the substrate W, the suction of the substrate W can be started while preventing the displacement of the substrate W due to an unbalanced leak.

  Then, air suction of the substrate suction plate 341 is started in a state where the suction head lifting mechanism 302 presses the substrate suction plate 341 against the substrate W on the pallet P. According to this, the substrate W can be stably adsorbed to the substrate adsorbing plate 341 without being displaced from the position where the substrate W is placed on the pallet P due to a shock at the time of adsorption. At this time, since the substrate suction plate 341 is in a freely tilted state by the attitude control module 342, the substrate suction plate 341 escapes upward during pressing, and absorbs the impact during pressing. Note that the impact at the time of pressing the substrate W may be absorbed by adjusting the pressure balance between the forward chamber 371 and the backward chamber 372 of the sub lifting mechanism 343 (double-acting air cylinder 374).

  Subsequently, the substrate suction plate 341 that has attracted the substrate W is raised by the suction head lifting mechanism 302, and is placed on the set table 122 by the suction head moving mechanism 303. Further, the substrate suction plate 341 is moved by the suction head lifting mechanism 302. The substrate W is lowered and placed on the set table 122. At this time, the posture control module 342 keeps the substrate suction plate 341 in an immobile state. Accordingly, the substrate W can be placed on the set table 122 in a state where the substrate W is in the reference posture with the upper surface of the set table 122 as a reference.

  When the substrate W is placed on the set table 122, the suction of the substrate suction plate 341 is released by the suction head lifting mechanism 302 so that the substrate suction plate 341 is pressed against the substrate W. According to this, the substrate W can be stably separated from the substrate suction plate 341 without the substrate W being displaced with respect to the set table 122 due to a shock at the time of suction release.

  When the transfer of the substrate W from the material supply stocker 202 to the set table 122 is completed in this way, the drawing process on the substrate W is performed by the drawing apparatus 11 as described above. Although details will be described later, before and after the drawing process, a position correction process for the substrate W before the drawing process and a return process for returning the position of the substrate W after the drawing process are performed on the set table 122. Is called.

  During this drawing process, the pallet P on which the substrate W to be drawn is placed is transferred from the material supply stocker 202 to the material removal stocker 203. That is, after the substrate W is transferred to the set table 122, the suction head 301 in which the substrate suction plate 341 is lifted with respect to the pallet suction pad 381 is caused to face directly above the material stocker 202 by the suction head moving mechanism 303. At the same time, the suction head 301 is lowered by the suction head lifting mechanism 302 so that the pair of pallet suction pads 381 and 381 are pressed against the upper surface of the pallet P. Then, air suction of the pallet suction pad 381 is started and the pallet P is sucked by the pallet suction pad 381.

  Next, the pallet suction pad 381 that has attracted the pallet P is raised by the suction head lifting mechanism 302 and is made to face the material removal stocker 203 by the suction head moving mechanism 303. Further, the pallet suction pad 381 is lowered by the suction head lifting mechanism 302 with respect to the uppermost pallet P collected in a stacked state on the material removal stocker 203, and the pallet suction pad 381 is vacuum-breaked to suck the pallet. P is placed. In this way, the transfer of the pallet P from the material supply stocker 202 to the material removal stocker 203 is completed.

  Further, after the drawing process is completed, the substrate W is transferred from the set table 122 to the pallet P transferred to the material removal stocker 203. The transfer of the substrate W is performed in the same manner as the transfer of the substrate W before the drawing process from the material supply stocker 202 to the set table 122.

  That is, the posture control module 342 places the substrate suction plate 341 in a stationary posture, and sucks the substrate W after the drawing process onto the substrate suction plate 341 while pressing the substrate suction plate 341 against the substrate W on the set table 122. To do. Then, the adsorbed substrate W is moved to the material removal stocker 203, and the substrate adsorbing plate 341 is freely tilted by the attitude control module 342 and pressed against the substrate W by the substrate adsorbing plate 341. The substrate 341 is placed on the pallet P by breaking the vacuum 341.

  As described above, a series of transfer operations is completed. Then, this transfer operation is sequentially performed on the 15 pallets P accommodated in the material stocker 202 and the substrate W before drawing processing placed thereon. According to this, since the substrate suction plate 341 can suck and hold the substrate W without contacting the drawing region Wd of the substrate W to be drawn, a special region for suction is provided on the substrate W. The adsorbed substrate W can be transferred without any problem.

  In addition, by transferring the pallet P on which the substrate W before the drawing process is placed from the material supply stocker 202 to the material removal stocker 203 and placing the substrate W after the drawing process on the pallet P, Using the same pallet P, the substrate W before the drawing process and the substrate W after the drawing process can be accommodated in the material supply stocker 202 and the material removal stocker 203, respectively.

  Incidentally, as described above, the gantry 201 on which the material supply stocker 202 and the material removal stocker 203 are placed and the drawing apparatus 11 are configured separately, and the stockers 202 and 203 are connected to the drawing apparatus 11. It is difficult to align with high accuracy. Further, the pallet P simply positions the substrate W with the large shallow groove portion Pb or the small shallow groove portion Ps. Due to the positional accuracy between the drawing apparatus 11 and both stockers 202 and 203, the positioning accuracy of the substrate W on the pallet P, etc., the substrate W transferred from the pallet P of the material stocker 202 to the set table 122 is Thus, the position is shifted from the design standard of the drawing apparatus 11 and is sucked and set on the set table 122.

  Therefore, a position correction process and a position return process for the substrate W are performed before and after the drawing process. That is, after the substrate W before the drawing process is transferred from the material stocker 202 to the set table 122 (S11 in FIG. 15), the alignment mark is imaged by the pre-alignment camera 152 on the set table 122 as described above. Recognize (S12) and store the initial position data of the substrate W. Based on the recognition result (initial position data), the suction table 123 is moved in the X-axis direction and the θ-axis direction, and a position correction process for correcting the placement position of the substrate W on the suction table 123 in the horizontal plane is performed ( S13). For example, here, it is assumed that the suction table 123 is moved 2 mm in the X-axis direction and 0.5 ° in the θ-axis direction.

  Subsequently, based on the image recognition result of the alignment camera 153, along with the data correction, the suction table 123 is slightly moved in the θ-axis direction to further perform the position correction process for the substrate W (S14). Here, it is assumed that the suction table 123 is further moved by 0.1 ° in the θ-axis direction. By the position correction processing of the substrate W through the pre-alignment and the main alignment, the placement position of the substrate W matches the design standard of the drawing apparatus 11, but on the other hand, with respect to the material removal stocker 203, the X-axis direction The position is shifted by 0.6 mm in the direction of 2 mm and θ axis.

  When the alignment of the substrate W is completed, a drawing process is performed on the substrate W (S15). Thereafter, when the substrate W after the drawing process is transferred from the placement position as it is to the material removal stocker 203, the placement position of the substrate W is displaced with respect to the material removal stocker 203. It cannot be placed in the large shallow groove portion Pb or the small shallow groove portion Ps of the pallet P accommodated in the stocker 203.

  Therefore, after the drawing process, based on the recognition result of the pre-alignment camera 152 in S12, a position return process for returning the placement position of the substrate W on the suction table 123 is performed (S17). That is, based on the stored initial position data, the suction table 123 is returned by 2 mm in the X-axis direction and returned by 0.6 ° in the θ-axis direction. By this position return processing, the positional deviation of the substrate W with respect to the material removal stocker 203 is eliminated.

  After the position return process, the substrate W is transferred from the set table 122 to the pallet P of the material removal stocker 203 (S18). By performing a series of transfer processes as described above, the position of the substrate W can be corrected before the drawing process, and the substrate W after the drawing process is positioned on the pallet P of the material removal stocker 203. Can be transferred. That is, it is possible to transfer the substrate W with high accuracy without detecting the position of the material removal stocker 203 or its pallet P only by storing the original position of the substrate W.

  In the present embodiment, the position correction processing and position return processing of the substrate W are performed by moving the suction table 123 slightly. However, the suction table 123 is fixed and the substrate W is moved slightly relative to the suction table 123. It may be configured (in this case, suction of the suction table 123 is released).

  Further, in the present embodiment, the placement position of the substrate W before the drawing process is corrected on the set table 122 and the substrate W after the drawing process is returned to the original placement position. In the state of being sucked and set, the set position of the substrate W before the drawing process may be corrected and the substrate W after the drawing process may be returned to the original set position.

  That is, in order to move the substrate suction plate 341 in the X-axis direction and the θ-axis direction via the camera (wide viewing angle) for recognizing the alignment mark and the posture control module 342 to the suction head 301 of the substrate transfer device 13. The suction head X-axis table and the suction head θ-axis table are further provided. Then, the camera captures an alignment mark of the substrate W placed on the pallet P of the material stocker 202, and based on the image recognition result, during the transfer from the material stocker 202 to the set table 122, The set position of the substrate W before the drawing process sucked on the substrate suction plate 341 is corrected by the suction head X-axis table and the suction head θ-axis table. After the drawing processing, drawing drawn on the substrate suction plate 341 by the suction head X-axis table and suction head θ-axis table during transfer from the set table 122 to the material removal stocker 203 based on the previous image recognition result. The set position of the substrate W after processing is returned to the original position. In this case as well, the substrate W can be transferred with high accuracy without detecting the position of the material removal stocker 203 or its pallet P only by storing the original position of the substrate W.

  In this case, it is possible to omit performing position correction processing (pre-alignment) on the substrate W transferred to the set table 122 based on the image recognition result by the pre-alignment camera 152.

  Next, as an electro-optical device (flat panel display) manufactured using the drawing device 11 of the present embodiment, a color filter, a liquid crystal display device, an organic EL device, a plasma display (PDP device), an electron emission device (FED device). The structure and the manufacturing method thereof will be described by taking an active matrix substrate and the like formed on these display devices as examples. Note that an active matrix substrate refers to a substrate on which a thin film transistor, a source line electrically connected to the thin film transistor, and a data line are formed.

First, a method for manufacturing a color filter incorporated in a liquid crystal display device, an organic EL device or the like will be described. FIG. 16 is a flowchart showing the manufacturing process of the color filter, and FIG. 17 is a schematic cross-sectional view of the color filter 500 (filter base body 500A) of this embodiment shown in the order of the manufacturing process.
First, in the black matrix forming step (S101), a black matrix 502 is formed on a substrate (W) 501 as shown in FIG. The black matrix 502 is formed of metal chromium, a laminate of metal chromium and chromium oxide, resin black, or the like. A sputtering method, a vapor deposition method, or the like can be used to form the black matrix 502 made of a metal thin film. Further, when forming the black matrix 502 made of a resin thin film, a gravure printing method, a photoresist method, a thermal transfer method, or the like can be used.

Subsequently, in a bank formation step (S102), a bank 503 is formed in a state of being superimposed on the black matrix 502. That is, first, as shown in FIG. 17B, a resist layer 504 made of a negative transparent photosensitive resin is formed so as to cover the substrate 501 and the black matrix 502. Then, an exposure process is performed with the upper surface covered with a mask film 505 formed in a matrix pattern shape.
Further, as shown in FIG. 17C, the resist layer 504 is patterned by etching an unexposed portion of the resist layer 504 to form a bank 503. When the black matrix is formed from resin black, it is possible to use both the black matrix and the bank.
The bank 503 and the black matrix 502 below the partition wall 507b partitioning each pixel region 507a, and in the subsequent colored layer forming step, the colored liquid layers (film forming portions) 508R, 508G, When forming 508B, the landing area of the functional droplet is defined.

The filter substrate 500A is obtained through the above black matrix forming step and bank forming step.
In the present embodiment, as the material for the bank 503, a resin material whose surface is lyophobic (hydrophobic) is used. Since the surface of the substrate (glass substrate) 501 is lyophilic (hydrophilic), the droplets into each pixel region 507a surrounded by the bank 503 (partition wall portion 507b) in the colored layer forming step described later. Variations in landing position can be automatically corrected.

  Next, in the colored layer forming step (S103), as shown in FIG. 17 (d), functional droplets are ejected by the functional droplet ejection head 141 to enter each pixel region 507a surrounded by the partition wall portion 507b. Let it land. In this case, the functional liquid droplet ejection head 141 is used to introduce functional liquids (filter materials) of three colors of R, G, and B to eject functional liquid droplets. Note that the three-color arrangement pattern of R, G, and B includes a stripe arrangement, a mosaic arrangement, and a delta arrangement.

Thereafter, the functional liquid is fixed through a drying process (a process such as heating), and three colored layers 508R, 508G, and 508B are formed. When the colored layers 508R, 508G, and 508B are formed, the process proceeds to the protective film forming step (S104), and as shown in FIG. 17E, the substrate 501, the partition wall portion 507b, and the colored layers 508R, 508G, and 508B are moved. A protective film 509 is formed so as to cover the upper surface.
That is, after the protective film coating liquid is discharged over the entire surface of the substrate 501 where the colored layers 508R, 508G, and 508B are formed, the protective film 509 is formed through a drying process.
Then, after forming the protective film 509, the color filter 500 moves to a film forming process such as ITO (Indium Tin Oxide) which becomes a transparent electrode in the next process.

  FIG. 18 is a cross-sectional view of a principal part showing a schematic configuration of a passive matrix liquid crystal device (liquid crystal device) as an example of a liquid crystal display device using the color filter 500 described above. By attaching auxiliary elements such as a liquid crystal driving IC, a backlight, and a support to the liquid crystal device 520, a transmissive liquid crystal display device as a final product can be obtained. Since the color filter 500 is the same as that shown in FIG. 17, the corresponding parts are denoted by the same reference numerals and description thereof is omitted.

The liquid crystal device 520 is roughly configured by a color filter 500, a counter substrate 521 made of a glass substrate, and a liquid crystal layer 522 made of an STN (Super Twisted Nematic) liquid crystal composition sandwiched between them, The filter 500 is arranged on the upper side (observer side) in the figure.
Although not shown, polarizing plates are provided on the outer surfaces of the counter substrate 521 and the color filter 500 (surfaces opposite to the liquid crystal layer 522 side), and the polarizing plates located on the counter substrate 521 side are also provided. A backlight is disposed outside.

On the protective film 509 of the color filter 500 (on the liquid crystal layer side), a plurality of strip-shaped first electrodes 523 elongated in the left-right direction in FIG. 18 are formed at predetermined intervals. The color of the first electrode 523 A first alignment film 524 is formed so as to cover the surface opposite to the filter 500 side.
On the other hand, a plurality of strip-shaped second electrodes 526 elongated in a direction orthogonal to the first electrode 523 of the color filter 500 are formed on the surface of the counter substrate 521 facing the color filter 500 at a predetermined interval. A second alignment film 527 is formed so as to cover the surface of the two electrodes 526 on the liquid crystal layer 522 side. The first electrode 523 and the second electrode 526 are made of a transparent conductive material such as ITO.

The spacer 528 provided in the liquid crystal layer 522 is a member for keeping the thickness (cell gap) of the liquid crystal layer 522 constant. The sealing material 529 is a member for preventing the liquid crystal composition in the liquid crystal layer 522 from leaking to the outside. Note that one end of the first electrode 523 extends to the outside of the sealing material 529 as a lead-out wiring 523a.
A portion where the first electrode 523 and the second electrode 526 intersect with each other is a pixel, and the color layers 508R, 508G, and 508B of the color filter 500 are located in the portion that becomes the pixel.

  In a normal manufacturing process, patterning of the first electrode 523 and application of the first alignment film 524 are performed on the color filter 500 to create a portion on the color filter 500 side. Patterning of the electrode 526 and application of the second alignment film 527 are performed to create a portion on the counter substrate 521 side. Thereafter, a spacer 528 and a sealing material 529 are formed in the portion on the counter substrate 521 side, and the portion on the color filter 500 side is bonded in this state. Next, liquid crystal constituting the liquid crystal layer 522 is injected from the inlet of the sealing material 529, and the inlet is closed. Thereafter, both polarizing plates and the backlight are laminated.

  The drawing apparatus 11 according to the embodiment applies, for example, the spacer material (functional liquid) that constitutes the cell gap described above, and before the portion on the color filter 500 side is bonded to the portion on the counter substrate 521 side, the sealing material 529 is used. Liquid crystal (functional liquid) can be uniformly applied to the enclosed area. In addition, the above-described sealing material 529 can be printed by the functional liquid droplet ejection head 141. Further, the first and second alignment films 524 and 527 can be applied by the functional liquid droplet ejection head 141.

FIG. 19 is a cross-sectional view of an essential part showing a schematic configuration of a second example of a liquid crystal device using the color filter 500 manufactured in the present embodiment.
The liquid crystal device 530 is significantly different from the liquid crystal device 520 in that the color filter 500 is arranged on the lower side (the side opposite to the observer side) in the figure.
The liquid crystal device 530 is generally configured by sandwiching a liquid crystal layer 532 made of STN liquid crystal between a color filter 500 and a counter substrate 531 made of a glass substrate or the like. Although not shown, polarizing plates and the like are provided on the outer surfaces of the counter substrate 531 and the color filter 500, respectively.

On the protective film 509 of the color filter 500 (on the liquid crystal layer 532 side), a plurality of strip-shaped first electrodes 533 elongated in the depth direction in the figure are formed at predetermined intervals, and the liquid crystal of the first electrodes 533 is formed. A first alignment film 534 is formed so as to cover the surface on the layer 532 side.
A plurality of strip-shaped second electrodes 536 extending in a direction orthogonal to the first electrode 533 on the color filter 500 side are formed on the surface of the counter substrate 531 facing the color filter 500 at a predetermined interval. A second alignment film 537 is formed so as to cover the surface of the second electrode 536 on the liquid crystal layer 532 side.

The liquid crystal layer 532 is provided with a spacer 538 for keeping the thickness of the liquid crystal layer 532 constant and a sealing material 539 for preventing the liquid crystal composition in the liquid crystal layer 532 from leaking to the outside. Yes.
Similarly to the liquid crystal device 520 described above, a portion where the first electrode 533 and the second electrode 536 intersect with each other is a pixel, and the colored layers 508R, 508G, and 508B of the color filter 500 are located at the portion that becomes the pixel. Is configured to do.

FIG. 20 shows a third example in which a liquid crystal device is configured using a color filter 500 to which the present invention is applied, and is an exploded perspective view showing a schematic configuration of a transmissive TFT (Thin Film Transistor) type liquid crystal device. It is.
In the liquid crystal device 550, the color filter 500 is arranged on the upper side (observer side) in the figure.

The liquid crystal device 550 includes a color filter 500, a counter substrate 551 disposed so as to face the color filter 500, a liquid crystal layer (not shown) sandwiched therebetween, and an upper surface side (observer side) of the color filter 500. The polarizing plate 555 and the polarizing plate (not shown) arranged on the lower surface side of the counter substrate 551 are roughly configured.
A liquid crystal driving electrode 556 is formed on the surface of the protective film 509 of the color filter 500 (the surface on the counter substrate 551 side). The electrode 556 is made of a transparent conductive material such as ITO, and is a full surface electrode that covers the entire region where a pixel electrode 560 described later is formed. An alignment film 557 is provided so as to cover the surface of the electrode 556 opposite to the pixel electrode 560.

  An insulating layer 558 is formed on the surface of the counter substrate 551 facing the color filter 500, and the scanning lines 561 and the signal lines 562 are formed on the insulating layer 558 in a state of being orthogonal to each other. A pixel electrode 560 is formed in a region surrounded by the scanning lines 561 and the signal lines 562. In an actual liquid crystal device, an alignment film is provided on the pixel electrode 560, but the illustration is omitted.

  In addition, a thin film transistor 563 including a source electrode, a drain electrode, a semiconductor, and a gate electrode is incorporated in a portion surrounded by the cutout portion of the pixel electrode 560 and the scanning line 561 and the signal line 562. . The thin film transistor 563 is turned on / off by application of signals to the scanning line 561 and the signal line 562 so that energization control to the pixel electrode 560 can be performed.

  Note that the liquid crystal devices 520, 530, and 550 in the above examples are transmissive, but a reflective liquid crystal device or a transflective liquid crystal device is provided by providing a reflective layer or a transflective layer. You can also

  Next, FIG. 21 is a cross-sectional view of a main part of a display region (hereinafter simply referred to as a display device 600) of the organic EL device.

The display device 600 is schematically configured with a circuit element portion 602, a light emitting element portion 603, and a cathode 604 laminated on a substrate (W) 601.
In the display device 600, light emitted from the light emitting element portion 603 to the substrate 601 side is transmitted through the circuit element portion 602 and the substrate 601 and emitted to the observer side, and the light emitting element portion 603 is opposite to the substrate 601. After the light emitted to the side is reflected by the cathode 604, the light passes through the circuit element portion 602 and the substrate 601 and is emitted to the observer side.

  A base protective film 606 made of a silicon oxide film is formed between the circuit element portion 602 and the substrate 601, and an island-shaped semiconductor film 607 made of polycrystalline silicon is formed on the base protective film 606 (on the light emitting element portion 603 side). Is formed. In the left and right regions of the semiconductor film 607, a source region 607a and a drain region 607b are formed by high concentration cation implantation, respectively. A central portion where no positive ions are implanted is a channel region 607c.

  In the circuit element portion 602, a transparent gate insulating film 608 covering the base protective film 606 and the semiconductor film 607 is formed, and a position corresponding to the channel region 607c of the semiconductor film 607 on the gate insulating film 608 is formed. For example, a gate electrode 609 made of Al, Mo, Ta, Ti, W or the like is formed. On the gate electrode 609 and the gate insulating film 608, a transparent first interlayer insulating film 611a and a second interlayer insulating film 611b are formed. Further, contact holes 612a and 612b are formed through the first and second interlayer insulating films 611a and 611b and communicating with the source region 607a and the drain region 607b of the semiconductor film 607, respectively.

A transparent pixel electrode 613 made of ITO or the like is patterned and formed in a predetermined shape on the second interlayer insulating film 611b, and the pixel electrode 613 is connected to the source region 607a through the contact hole 612a. .
A power supply line 614 is disposed on the first interlayer insulating film 611a, and the power supply line 614 is connected to the drain region 607b through the contact hole 612b.

  Thus, the driving thin film transistors 615 connected to the pixel electrodes 613 are formed in the circuit element portion 602, respectively.

The light emitting element portion 603 includes a functional layer 617 stacked on each of the plurality of pixel electrodes 613, and a bank portion 618 provided between each pixel electrode 613 and the functional layer 617 to partition each functional layer 617. It is roughly structured.
The pixel electrode 613, the functional layer 617, and the cathode 604 provided on the functional layer 617 constitute a light emitting element. Note that the pixel electrode 613 is formed by patterning in a substantially rectangular shape in plan view, and a bank portion 618 is formed between the pixel electrodes 613.

The bank unit 618 is laminated on the inorganic bank layer 618a (first bank layer) 618a formed of an inorganic material such as SiO, SiO ₂ , TiO _{2, and the} like, and is made of an acrylic resin, a polyimide resin, or the like. It is composed of an organic bank layer 618b (second bank layer) having a trapezoidal cross section formed of a resist having excellent heat resistance and solvent resistance. A part of the bank unit 618 is formed on the peripheral edge of the pixel electrode 613.
An opening 619 that gradually expands upward with respect to the pixel electrode 613 is formed between the bank portions 618.

The functional layer 617 includes a hole injection / transport layer 617a formed in a stacked state on the pixel electrode 613 in the opening 619, and a light emitting layer 617b formed on the hole injection / transport layer 617a. Has been. Note that another functional layer having other functions may be further formed adjacent to the light emitting layer 617b. For example, it is possible to form an electron transport layer.
The hole injection / transport layer 617a has a function of transporting holes from the pixel electrode 613 side and injecting them into the light emitting layer 617b. The hole injection / transport layer 617a is formed by discharging a first composition (functional liquid) containing a hole injection / transport layer forming material. A known material is used as the hole injection / transport layer forming material.

  The light emitting layer 617b emits light in red (R), green (G), or blue (B), and discharges a second composition (functional liquid) containing a light emitting layer forming material (light emitting material). Is formed. As the solvent (nonpolar solvent) of the second composition, a known material that is insoluble in the hole injection / transport layer 617a is preferably used, and such a nonpolar solvent is used as the second composition of the light emitting layer 617b. By using the light emitting layer 617b, the light emitting layer 617b can be formed without re-dissolving the hole injection / transport layer 617a.

  The light emitting layer 617b is configured such that the holes injected from the hole injection / transport layer 617a and the electrons injected from the cathode 604 are recombined in the light emitting layer to emit light.

  The cathode 604 is formed so as to cover the entire surface of the light emitting element portion 603, and plays a role of flowing current to the functional layer 617 in a pair with the pixel electrode 613. Note that a sealing member (not shown) is disposed on the cathode 604.

Next, a manufacturing process of the display device 600 will be described with reference to FIGS.
As shown in FIG. 22, the display device 600 includes a bank part forming step (S111), a surface treatment step (S112), a hole injection / transport layer forming step (S113), a light emitting layer forming step (S114), It is manufactured through an electrode formation step (S115). In addition, a manufacturing process is not restricted to what is illustrated, and when other processes are removed as needed, it may be added.

First, in the bank part forming step (S111), as shown in FIG. 23, an inorganic bank layer 618a is formed on the second interlayer insulating film 611b. The inorganic bank layer 618a is formed by forming an inorganic film at a formation position and then patterning the inorganic film by a photolithography technique or the like. At this time, a part of the inorganic bank layer 618 a is formed so as to overlap with the peripheral edge of the pixel electrode 613.
When the inorganic bank layer 618a is formed, the organic bank layer 618b is formed on the inorganic bank layer 618a as shown in FIG. The organic bank layer 618b is also formed by patterning using a photolithography technique or the like in the same manner as the inorganic bank layer 618a.
In this way, the bank portion 618 is formed. Accordingly, an opening 619 opening upward with respect to the pixel electrode 613 is formed between the bank portions 618. The opening 619 defines a pixel region.

In the surface treatment step (S112), a lyophilic process and a lyophobic process are performed. The region to be subjected to the lyophilic treatment is the first laminated portion 618aa of the inorganic bank layer 618a and the electrode surface 613a of the pixel electrode 613. These regions are made lyophilic by plasma treatment using, for example, oxygen as a treatment gas. Is done. This plasma treatment also serves to clean the ITO that is the pixel electrode 613.
In addition, the lyophobic treatment is performed on the wall surface 618s of the organic bank layer 618b and the upper surface 618t of the organic bank layer 618b, and the surface is fluorinated (treated to be liquid repellent) by plasma treatment using, for example, tetrafluoromethane. )
By performing this surface treatment process, when the functional layer 617 is formed using the functional liquid droplet ejection head 141, the functional liquid droplets can be landed more reliably on the pixel area. It is possible to prevent the functional droplets from overflowing from the opening 619.

  Then, the display device base 600A is obtained through the above steps. The display device base 600A is placed on the set table 122 of the drawing device 11 shown in FIG. 5, and the following hole injection / transport layer forming step (S113) and light emitting layer forming step (S114) are performed.

  As shown in FIG. 25, in the hole injection / transport layer forming step (S113), the first composition containing the hole injection / transport layer forming material is removed from the functional droplet discharge head 141 into each opening 619 that is a pixel region. Discharge inside. Thereafter, as shown in FIG. 26, a drying treatment and a heat treatment are performed to evaporate the polar solvent contained in the first composition, thereby forming a hole injection / transport layer 617a on the pixel electrode (electrode surface 613a) 613.

Next, the light emitting layer forming step (S114) will be described. In this light emitting layer forming step, as described above, in order to prevent re-dissolution of the hole injection / transport layer 617a, the hole injection / transport layer 617a is used as a solvent for the second composition used in forming the light emitting layer. A non-polar solvent insoluble in.
However, since the hole injection / transport layer 617a has a low affinity for the nonpolar solvent, the hole injection / transport layer 617a has a low affinity even if the second composition containing the nonpolar solvent is discharged onto the hole injection / transport layer 617a. There is a possibility that the injection / transport layer 617a and the light emitting layer 617b cannot be adhered to each other, or the light emitting layer 617b cannot be applied uniformly.
Therefore, in order to increase the surface affinity of the hole injection / transport layer 617a with respect to the nonpolar solvent and the light emitting layer forming material, it is preferable to perform surface treatment (surface modification treatment) before forming the light emitting layer. In this surface treatment, a surface modifying material which is the same solvent as the non-polar solvent of the second composition used in the formation of the light emitting layer or a similar solvent is applied on the hole injection / transport layer 617a, and this is applied. This is done by drying.
By performing such treatment, the surface of the hole injection / transport layer 617a is easily adapted to the nonpolar solvent. In the subsequent step, the second composition containing the light emitting layer forming material is added to the hole injection / transport layer. It can be uniformly applied to 617a.

  Then, as shown in FIG. 27, the pixel composition (second liquid composition containing a light emitting layer forming material corresponding to one of the colors (blue (B) in the example of FIG. 27)) is used as a functional droplet. A predetermined amount is driven into the opening 619). The second composition driven into the pixel region spreads on the hole injection / transport layer 617a and fills the opening 619. Even if the second composition deviates from the pixel region and lands on the upper surface 618t of the bank portion 618, the upper composition 618t is subjected to the liquid repellent treatment as described above. Things are easy to roll into the opening 619.

  Thereafter, by performing a drying process and the like, the second composition after discharge is dried, the nonpolar solvent contained in the second composition is evaporated, and as shown in FIG. 28, a hole injection / transport layer 617a is obtained. A light emitting layer 617b is formed thereon. In the case of this figure, a light emitting layer 617b corresponding to blue (B) is formed.

  Similarly, using the functional liquid droplet ejection head 141, as shown in FIG. 29, the same steps as in the case of the light emitting layer 617b corresponding to the blue (B) described above are sequentially performed, and other colors (red (R) and red (R) and A light emitting layer 617b corresponding to green (G) is formed. Note that the order in which the light-emitting layers 617b are formed is not limited to the illustrated order, and may be formed in any order. For example, the order of formation can be determined according to the light emitting layer forming material. In addition, the arrangement pattern of the three colors R, G, and B includes a stripe arrangement, a mosaic arrangement, a delta arrangement, and the like.

  As described above, the functional layer 617, that is, the hole injection / transport layer 617a and the light emitting layer 617b are formed on the pixel electrode 613. And it transfers to a counter electrode formation process (S115).

In the counter electrode forming step (S115), as shown in FIG. 30, a cathode 604 (counter electrode) is formed on the entire surface of the light emitting layer 617b and the organic bank layer 618b by, for example, vapor deposition, sputtering, CVD, or the like. In the present embodiment, the cathode 604 is configured by, for example, laminating a calcium layer and an aluminum layer.
On top of the cathode 604, an Al film, an Ag film as an electrode, and a protective layer such as SiO ₂ or SiN for preventing oxidation thereof are appropriately provided.

  After forming the cathode 604 in this way, the display device 600 is obtained by performing other processes such as a sealing process for sealing the upper part of the cathode 604 with a sealing member and a wiring process.

Next, FIG. 31 is an exploded perspective view of a main part of a plasma display device (PDP device: hereinafter simply referred to as a display device 700). In the figure, the display device 700 is shown with a part thereof cut away.
The display device 700 is schematically configured to include a first substrate 701, a second substrate 702, and a discharge display portion 703 formed between them, which are disposed to face each other. The discharge display unit 703 includes a plurality of discharge chambers 705. Among the plurality of discharge chambers 705, the three discharge chambers 705 of the red discharge chamber 705R, the green discharge chamber 705G, and the blue discharge chamber 705B are arranged to form one pixel.

Address electrodes 706 are formed in stripes at predetermined intervals on the upper surface of the first substrate 701, and a dielectric layer 707 is formed so as to cover the address electrodes 706 and the upper surface of the first substrate 701. On the dielectric layer 707, partition walls 708 are provided so as to be positioned between the address electrodes 706 and along the address electrodes 706. The partition 708 includes one extending on both sides in the width direction of the address electrode 706 as shown, and one not shown extending in the direction orthogonal to the address electrode 706.
A region partitioned by the partition 708 is a discharge chamber 705.

  A phosphor 709 is disposed in the discharge chamber 705. The phosphor 709 emits red (R), green (G), or blue (B) fluorescence, and the red phosphor 709R is disposed at the bottom of the red discharge chamber 705R, and the green discharge chamber 705G. A green phosphor 709G and a blue phosphor 709B are arranged at the bottom and the blue discharge chamber 705B, respectively.

On the lower surface of the second substrate 702 in the drawing, a plurality of display electrodes 711 are formed in stripes at predetermined intervals in a direction orthogonal to the address electrodes 706. A dielectric layer 712 and a protective film 713 made of MgO or the like are formed so as to cover them.
The first substrate 701 and the second substrate 702 are bonded so that the address electrodes 706 and the display electrodes 711 face each other in a state of being orthogonal to each other. The address electrode 706 and the display electrode 711 are connected to an AC power source (not shown).
When the electrodes 706 and 711 are energized, the phosphor 709 emits light in the discharge display portion 703, and color display is possible.

In the present embodiment, the address electrode 706, the display electrode 711, and the phosphor 709 can be formed using the drawing apparatus 11 shown in FIG. Hereinafter, a process of forming the address electrode 706 on the first substrate 701 will be exemplified.
In this case, the following steps are performed with the first substrate 701 placed on the set table 122 of the drawing apparatus 11.
First, the liquid material (functional liquid) containing the conductive film wiring forming material is landed on the address electrode formation region as a functional liquid droplet by the functional liquid droplet ejection head 141. This liquid material is obtained by dispersing conductive fine particles such as metal in a dispersion medium as a conductive film wiring forming material. As the conductive fine particles, metal fine particles containing gold, silver, copper, palladium, nickel, or the like, a conductive polymer, or the like is used.

  When the replenishment of the liquid material is completed for all the address electrode formation regions to be replenished, the address material 706 is formed by drying the discharged liquid material and evaporating the dispersion medium contained in the liquid material. .

By the way, although the formation of the address electrode 706 has been exemplified in the above, the display electrode 711 and the phosphor 709 can also be formed through the above steps.
In the case of forming the display electrode 711, as in the case of the address electrode 706, a liquid material (functional liquid) containing a conductive film wiring forming material is landed on the display electrode formation region as a functional droplet.
Further, in the case of forming the phosphor 709, a liquid material (functional liquid) containing a fluorescent material corresponding to each color (R, G, B) is ejected as droplets from the functional liquid droplet ejection head 141, so that it corresponds. Land in the color discharge chamber 705.

Next, FIG. 32 is a cross-sectional view of an essential part of an electron emission device (also referred to as an FED device or an SED device: hereinafter simply referred to as a display device 800). In the drawing, a part of the display device 800 is shown as a cross section.
The display device 800 is schematically configured to include a first substrate 801, a second substrate 802, and a field emission display portion 803 formed therebetween, which are disposed to face each other. The field emission display unit 803 includes a plurality of electron emission units 805 arranged in a matrix.

  On the upper surface of the first substrate 801, a first element electrode 806a and a second element electrode 806b constituting the cathode electrode 806 are formed so as to be orthogonal to each other. In addition, a conductive film 807 having a gap 808 is formed in a portion partitioned by the first element electrode 806a and the second element electrode 806b. That is, the first element electrode 806a, the second element electrode 806b, and the conductive film 807 constitute a plurality of electron emission portions 805. The conductive film 807 is made of, for example, palladium oxide (PdO), and the gap 808 is formed by forming after forming the conductive film 807.

  An anode electrode 809 that faces the cathode electrode 806 is formed on the lower surface of the second substrate 802. A grid-like bank portion 811 is formed on the lower surface of the anode electrode 809, and a phosphor 813 is disposed in each downward opening 812 surrounded by the bank portion 811 so as to correspond to the electron emission portion 805. Yes. The phosphor 813 emits fluorescence of any one of red (R), green (G), and blue (B), and each opening 812 has a red phosphor 813R, a green phosphor 813G, and a blue color. The phosphors 813B are arranged in the predetermined pattern described above.

  The first substrate 801 and the second substrate 802 configured as described above are bonded together with a minute gap. In this display device 800, electrons that jump out of the first element electrode 806 a or the second element electrode 806 b that are cathodes through the conductive film (gap 808) 807 are formed on the phosphor 813 formed on the anode electrode 809 that is an anode. When excited, it emits light and enables color display.

  Also in this case, similarly to the other embodiments, the first element electrode 806a, the second element electrode 806b, the conductive film 807, and the anode electrode 809 can be formed by using the drawing device 11, and the fluorescence of each color. The bodies 813R, 813G, and 813B can be formed using the drawing device 11.

  The first element electrode 806a, the second element electrode 806b, and the conductive film 807 have the planar shape shown in FIG. 33A, and when these are formed, as shown in FIG. In addition, the bank portion BB is formed (photolithographic method), leaving portions where the first element electrode 806a, the second element electrode 806b, and the conductive film 807 are previously formed. Next, after the first element electrode 806a and the second element electrode 806b are formed in the groove portion constituted by the bank portion BB (inkjet method using the drawing apparatus 11), and the solvent is dried to form a film, A conductive film 807 is formed (an ink jet method using the drawing apparatus 11). Then, after forming the conductive film 807, the bank portion BB is removed (ashing peeling process), and the process proceeds to the above forming process. As in the case of the organic EL device described above, it is preferable to perform a lyophilic process on the first substrate 801 and the second substrate 802 and a lyophobic process on the bank portions 811 and BB.

  As other electro-optical devices, devices such as metal wiring formation, lens formation, resist formation, and light diffuser formation are conceivable. By using the drawing apparatus 11 described above for manufacturing various electro-optical devices (devices), various electro-optical devices can be efficiently manufactured.

It is a schematic diagram which shows the manufacturing process of the circuit board by the inkjet printing technique. It is an external appearance perspective view of a substrate transfer system. It is an external appearance top view of a substrate transfer system. It is an external appearance front view of a substrate transfer system. It is a conceptual diagram of a substrate transfer system. It is an external appearance perspective view of a board | substrate transfer apparatus. It is an external appearance front view of a substrate transfer device. It is an external appearance top view of a board | substrate transfer apparatus. It is an external appearance side view of a substrate transfer device. It is a top view of the pallet which mounts a board | substrate. It is a perspective view of the adsorption head of a substrate transfer device. It is a front view of the adsorption head of a substrate transfer device. It is a side view of the adsorption head of a substrate transfer device. (A) is a bottom view of the substrate suction plate of the suction head, and (b) is an enlarged bottom view of a part of the substrate suction plate of the suction head. It is a flowchart which shows the position correction process and position return process of a board | substrate. It is a flowchart explaining a color filter manufacturing process. (A)-(e) is a schematic cross section of the color filter shown to the manufacturing process order. It is principal part sectional drawing which shows schematic structure of the liquid crystal device using the color filter to which this invention is applied. It is principal part sectional drawing which shows schematic structure of the liquid crystal device of the 2nd example using the color filter to which this invention is applied. It is principal part sectional drawing which shows schematic structure of the liquid crystal device of the 3rd example using the color filter to which this invention is applied. It is principal part sectional drawing of the display apparatus which is an organic electroluminescent apparatus. It is a flowchart explaining the manufacturing process of the display apparatus which is an organic electroluminescent apparatus. It is process drawing explaining formation of an inorganic bank layer. It is process drawing explaining formation of an organic substance bank layer. It is process drawing explaining the process in which a positive hole injection / transport layer is formed. It is process drawing explaining the state in which the positive hole injection / transport layer was formed. It is process drawing explaining the process in which a blue light emitting layer is formed. It is process drawing explaining the state in which the blue light emitting layer was formed. It is process drawing explaining the state in which the light emitting layer of each color was formed. It is process drawing explaining formation of a cathode. It is a principal part disassembled perspective view of the display apparatus which is a plasma type display apparatus (PDP apparatus). It is principal part sectional drawing of the display apparatus which is an electron emission apparatus (FED apparatus). It is the top view (a) around the electron emission part of a display apparatus, and the top view (b) which shows the formation method.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Substrate processing system 11 ... Drawing apparatus 13 ... Substrate transfer apparatus 16 ... Control apparatus 105 ... Image recognition means 102 ... X-axis table 202 ... Material supply stocker 203 ... Material removal stocker P ... Pallet W ... Substrate

Claims (12)

Using the feed stocker and material removal stocker that house the pallets placed horizontally in the positioning state so that they are parallel to each other,
The work before drawing processing is horizontally transferred from the pallet housed in the material supply stocker to the set table of the drawing apparatus, and the work after drawing processing is housed in the material removal stocker from the set table. A workpiece transfer method for transferring horizontally to the pallet,
Prior to the drawing process, a position recognition step for recognizing a placement position in a horizontal plane of the workpiece transferred to the set table;
On the set table, based on the recognition result in the position recognition step, a position correction step of correcting the placement position of the work before the drawing process,
On the set table, based on the recognition result, a position return step for returning the workpiece after the drawing process to the original placement position;
A workpiece transfer method characterized by comprising: A pallet on which workpieces are horizontally placed in a positioning state is arranged so as to be parallel to each other,
A drawing device having a set table for setting the workpiece, and performing a drawing process on the set workpiece;
The workpiece before drawing processing is horizontally transferred from the pallet accommodated in the material supply stocker to the set table of the drawing device, and the workpiece after drawing processing is transferred from the set table to the material removal stocker. A workpiece transfer device that transfers horizontally to the accommodated pallet;
A workpiece transfer system comprising:
The drawing device includes:
Prior to the drawing process, position recognition means for recognizing the placement position of the work in the horizontal plane transferred to the set table;
Based on the recognition result by the position recognition means, on the set table, position correction means for correcting the placement position of the work before drawing processing;
Control means for controlling the position recognition means and the position correction means,
The workpiece transfer system, wherein the control unit returns the workpiece to the original placement position by the position correction unit based on the recognition result after the drawing process.   The workpiece transfer system according to claim 2, wherein the position correction unit is incorporated in the set table. Using the feed stocker and material removal stocker that house the pallets placed horizontally in the positioning state so that they are parallel to each other,
The workpiece transfer device horizontally transfers the workpiece before drawing processing from the pallet accommodated in the material stocker to the set table of the drawing device, and the workpiece after drawing processing is transferred from the set table. A workpiece transfer method for transferring horizontally to the pallet housed in the material removal stocker,
Prior to transfer to the set table, a position recognition step for recognizing a placement position in a horizontal plane of the work placed on the pallet of the material stocker;
During the transfer from the material stocker to the set table, based on the recognition result in the position recognition step, the set position in the horizontal plane of the workpiece before the drawing process set in the workpiece transfer device is corrected. A position correction process;
During the transfer from the set table to the material removal stocker, based on the recognition result, a position return step for returning the workpiece after the drawing process set in the workpiece transfer device to the original set position;
A workpiece transfer method characterized by comprising: A pallet on which workpieces are horizontally placed in a positioning state is arranged so as to be parallel to each other,
A drawing device having a set table for setting the workpiece, and performing a drawing process on the set workpiece;
The workpiece before drawing processing is horizontally transferred from the pallet accommodated in the material supply stocker to the set table of the drawing device, and the workpiece after drawing processing is transferred from the set table to the material removal stocker. A workpiece transfer device that transfers horizontally to the accommodated pallet;
A workpiece transfer system comprising:
The workpiece transfer device includes:
A workpiece transfer means for transferring the set workpiece in the order of the material supply stocker, the set table, and the material removal stocker;
Prior to transfer to the set table, position recognition means for recognizing a placement position in a horizontal plane of the work placed on the pallet of the material stocker;
During the transfer from the material supply stocker to the set table, the set position in the horizontal plane of the workpiece before the drawing process set in the workpiece transfer means is corrected based on the recognition result by the position recognition means. Position correction means;
Control means for controlling the position recognition means and the position correction means,
The control means, based on the recognition result during the transfer from the set table to the material removal stocker, restores the original work after the drawing process set by the position correction means to the work transfer means. A workpiece transfer system characterized by returning to the set position.   The workpiece transfer system according to claim 5, wherein the position correction unit is incorporated in the workpiece transfer unit.   7. A method of manufacturing an electro-optical device, wherein the work transfer system according to claim 2 is used, and a film-forming portion made of a functional liquid is formed on the work by the drawing device. .   An electro-optical device using the workpiece transfer system according to claim 2, wherein a film forming unit made of a functional liquid is formed on the workpiece by the drawing device.   An electronic apparatus comprising the electro-optical device manufactured by the method for manufacturing the electro-optical device according to claim 7 or the electro-optical device according to claim 8.   A method for manufacturing a circuit board, comprising: using the workpiece transfer system according to claim 2, and forming a film-forming portion with a functional liquid on the workpiece by the drawing apparatus.   A circuit board using the work transfer system according to claim 2, wherein a film forming unit made of a functional liquid is formed on the work by the drawing apparatus.   An electronic device comprising the circuit board manufactured by the method for manufacturing a circuit board according to claim 10 or the circuit board according to claim 11.

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