JP4687345B2 - 薄膜バルク音響共振器 - Google Patents
薄膜バルク音響共振器 Download PDFInfo
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- JP4687345B2 JP4687345B2 JP2005261573A JP2005261573A JP4687345B2 JP 4687345 B2 JP4687345 B2 JP 4687345B2 JP 2005261573 A JP2005261573 A JP 2005261573A JP 2005261573 A JP2005261573 A JP 2005261573A JP 4687345 B2 JP4687345 B2 JP 4687345B2
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- Prior art keywords
- electrode
- thin film
- bulk acoustic
- ellipse
- acoustic resonator
- Prior art date
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- 239000010409 thin film Substances 0.000 title claims description 68
- 239000000758 substrate Substances 0.000 claims description 14
- 239000010408 film Substances 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
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- 238000005530 etching Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000005380 borophosphosilicate glass Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02118—Means for compensation or elimination of undesirable effects of lateral leakage between adjacent resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02133—Means for compensation or elimination of undesirable effects of stress
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
前記共振部は、前記第1電極と前記第2電極との間に印加される交流電圧の特定の共振周波数でインピーダンスが低下し、前記第1電極と前記第2電極が圧電体膜を介して対向する電極部分は、当該第1電極と第2電極の対向方向からみた平面視形状が、楕円の一部を切り欠いた形状を有する。
図1(a)は、第1実施形態の薄膜バルク音響共振器の平面図であり、説明のために圧電体層3の一部を切り欠いて図示している。図1(b)はこの平面図におけるV−V’断面図、図1(c)はこの平面図におけるI−I’断面図である。尚、図1においては、技術背景の説明で用いた図7に対応する部分には同一符号を付している。
図6(a)は、第2実施形態の薄膜バルク音響共振器の平面図であり、図6(b)はこの平面図におけるV−V’断面図、図6(c)はこの平面図におけるI−I’断面図である。
Claims (8)
- 第1電極と第2電極との間に圧電体膜を狭持してなる共振部が、前記第1電極と基板との間に空気層が形成されるように、前記基板に支持された構造を有し、
前記共振部は、前記第1電極と前記第2電極との間に印加される交流電圧の特定の共振周波数でインピーダンスが低下し、前記第1電極と前記第2電極が圧電体膜を介して対向する電極部分は、当該第1電極と第2電極の対向方向からみた平面視形状が、楕円の一部を切り欠いた形状を有する
薄膜バルク音響共振器。 - 請求項1記載の薄膜バルク音響共振器において、
前記共振部は、楕円の一部を直線で切り欠いた平面形状で構成されている
薄膜バルク音響共振器。 - 請求項2記載の薄膜バルク音響共振器において、
前記楕円を切り欠く直線は、当該楕円の短軸および長軸の少なくとも一方と交差する
薄膜バルク音響共振器。 - 請求項3記載の薄膜バルク音響共振器において、
前記楕円を切り欠く直線は、当該楕円の短軸および長軸と交差する
薄膜バルク音響共振器。 - 請求項3記載の薄膜バルク音響共振器において、
前記楕円を切り欠く直線は、当該楕円の短軸または長軸の一方と交差し、
前記直線によって楕円の一部を切り欠いた前記平面視形状に、当該楕円の中心が内包されない
薄膜バルク音響共振器。 - 請求項2記載の薄膜バルク音響共振器において、
前記楕円を切り欠く直線は、当該楕円の中心を通る
薄膜バルク音響共振器。 - 請求項1記載の薄膜バルク音響共振器において、
前記共振部の前記第1電極および前記第2電極の少なくとも一方には、前記圧電体層の一部を開口する孔部が設けられている
薄膜バルク音響共振器。 - 請求項7記載の薄膜バルク音響共振器において、
前記孔部は、前記楕円を切り欠く直線に対して設けられる法線のうち、当該直線と平行をなす当該楕円の接線における接点を通る法線上に設けられている
薄膜バルク音響共振器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005261573A JP4687345B2 (ja) | 2005-09-09 | 2005-09-09 | 薄膜バルク音響共振器 |
US12/066,317 US7889027B2 (en) | 2005-09-09 | 2006-07-05 | Film bulk acoustic resonator shaped as an ellipse with a part cut off |
PCT/JP2006/313403 WO2007029409A1 (ja) | 2005-09-09 | 2006-07-05 | 薄膜バルク音響共振器 |
TW095126420A TW200733555A (en) | 2005-09-09 | 2006-07-19 | Film bulk acoustic resonator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005261573A JP4687345B2 (ja) | 2005-09-09 | 2005-09-09 | 薄膜バルク音響共振器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007074609A JP2007074609A (ja) | 2007-03-22 |
JP4687345B2 true JP4687345B2 (ja) | 2011-05-25 |
Family
ID=37835538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005261573A Expired - Fee Related JP4687345B2 (ja) | 2005-09-09 | 2005-09-09 | 薄膜バルク音響共振器 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4687345B2 (ja) |
TW (1) | TW200733555A (ja) |
WO (1) | WO2007029409A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20200031541A (ko) * | 2018-09-14 | 2020-03-24 | 스카이워크스 솔루션즈, 인코포레이티드 | 희생 층 에칭을 위한 릴리스 포트들의 위치들 |
CN113556100B (zh) * | 2021-07-30 | 2022-06-21 | 武汉衍熙微器件有限公司 | 体声波谐振器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003273693A (ja) * | 2002-01-08 | 2003-09-26 | Murata Mfg Co Ltd | 圧電共振子及びそれを用いた圧電フィルタ・デュプレクサ・通信装置 |
WO2005060091A1 (ja) * | 2003-12-19 | 2005-06-30 | Ube Industries, Ltd. | 圧電薄膜デバイスの製造方法および圧電薄膜デバイス |
JP2005184303A (ja) * | 2003-12-18 | 2005-07-07 | Tdk Corp | 圧電薄膜共振器およびそれを用いたフィルタ |
JP2005236518A (ja) * | 2004-02-18 | 2005-09-02 | Sony Corp | 薄膜バルク音響共振子およびその製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005348357A (ja) * | 2004-06-07 | 2005-12-15 | Sony Corp | 薄膜バルク音響共振器 |
-
2005
- 2005-09-09 JP JP2005261573A patent/JP4687345B2/ja not_active Expired - Fee Related
-
2006
- 2006-07-05 WO PCT/JP2006/313403 patent/WO2007029409A1/ja active Application Filing
- 2006-07-19 TW TW095126420A patent/TW200733555A/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003273693A (ja) * | 2002-01-08 | 2003-09-26 | Murata Mfg Co Ltd | 圧電共振子及びそれを用いた圧電フィルタ・デュプレクサ・通信装置 |
JP2005184303A (ja) * | 2003-12-18 | 2005-07-07 | Tdk Corp | 圧電薄膜共振器およびそれを用いたフィルタ |
WO2005060091A1 (ja) * | 2003-12-19 | 2005-06-30 | Ube Industries, Ltd. | 圧電薄膜デバイスの製造方法および圧電薄膜デバイス |
JP2005236518A (ja) * | 2004-02-18 | 2005-09-02 | Sony Corp | 薄膜バルク音響共振子およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI328346B (ja) | 2010-08-01 |
TW200733555A (en) | 2007-09-01 |
JP2007074609A (ja) | 2007-03-22 |
WO2007029409A1 (ja) | 2007-03-15 |
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