JP4684983B2 - フレキシブルプリント配線板用積層体及び銅合金スパッタリングターゲット - Google Patents

フレキシブルプリント配線板用積層体及び銅合金スパッタリングターゲット Download PDF

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JP4684983B2
JP4684983B2 JP2006300560A JP2006300560A JP4684983B2 JP 4684983 B2 JP4684983 B2 JP 4684983B2 JP 2006300560 A JP2006300560 A JP 2006300560A JP 2006300560 A JP2006300560 A JP 2006300560A JP 4684983 B2 JP4684983 B2 JP 4684983B2
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layer
copper
adhesion
copper alloy
flexible printed
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JP2008117967A5 (https=
JP2008117967A (ja
Inventor
貴之 平野
博行 奥野
雅夫 水野
岳穂 川中
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Kobe Steel Ltd
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Kobe Steel Ltd
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JP2006300560A 2006-11-06 2006-11-06 フレキシブルプリント配線板用積層体及び銅合金スパッタリングターゲット Expired - Fee Related JP4684983B2 (ja)

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JP2006300560A JP4684983B2 (ja) 2006-11-06 2006-11-06 フレキシブルプリント配線板用積層体及び銅合金スパッタリングターゲット

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JP2006300560A JP4684983B2 (ja) 2006-11-06 2006-11-06 フレキシブルプリント配線板用積層体及び銅合金スパッタリングターゲット

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JP2008117967A JP2008117967A (ja) 2008-05-22
JP2008117967A5 JP2008117967A5 (https=) 2010-04-15
JP4684983B2 true JP4684983B2 (ja) 2011-05-18

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JP2006300560A Expired - Fee Related JP4684983B2 (ja) 2006-11-06 2006-11-06 フレキシブルプリント配線板用積層体及び銅合金スパッタリングターゲット

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Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106645A (en) * 1977-03-01 1978-09-16 Marui Kougiyou Kk Vacuum evaporation method
JP2991794B2 (ja) * 1991-01-21 1999-12-20 住友ベークライト株式会社 フレキシブルプリント基板の製造方法
JP2003011272A (ja) * 2001-07-02 2003-01-15 Mitsubishi Shindoh Co Ltd 金属化ポリイミドフィルム
JP4397702B2 (ja) * 2004-02-04 2010-01-13 三菱伸銅株式会社 金属化ポリイミドフィルムの製造方法
JP4762533B2 (ja) * 2004-12-07 2011-08-31 古河電気工業株式会社 銅メタライズド積層板及びその製造方法

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