JP2008117967A5 - - Google Patents

Download PDF

Info

Publication number
JP2008117967A5
JP2008117967A5 JP2006300560A JP2006300560A JP2008117967A5 JP 2008117967 A5 JP2008117967 A5 JP 2008117967A5 JP 2006300560 A JP2006300560 A JP 2006300560A JP 2006300560 A JP2006300560 A JP 2006300560A JP 2008117967 A5 JP2008117967 A5 JP 2008117967A5
Authority
JP
Japan
Prior art keywords
copper alloy
atomic
alloy layer
copper
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006300560A
Other languages
English (en)
Japanese (ja)
Other versions
JP4684983B2 (ja
JP2008117967A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006300560A priority Critical patent/JP4684983B2/ja
Priority claimed from JP2006300560A external-priority patent/JP4684983B2/ja
Publication of JP2008117967A publication Critical patent/JP2008117967A/ja
Publication of JP2008117967A5 publication Critical patent/JP2008117967A5/ja
Application granted granted Critical
Publication of JP4684983B2 publication Critical patent/JP4684983B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006300560A 2006-11-06 2006-11-06 フレキシブルプリント配線板用積層体及び銅合金スパッタリングターゲット Expired - Fee Related JP4684983B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006300560A JP4684983B2 (ja) 2006-11-06 2006-11-06 フレキシブルプリント配線板用積層体及び銅合金スパッタリングターゲット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006300560A JP4684983B2 (ja) 2006-11-06 2006-11-06 フレキシブルプリント配線板用積層体及び銅合金スパッタリングターゲット

Publications (3)

Publication Number Publication Date
JP2008117967A JP2008117967A (ja) 2008-05-22
JP2008117967A5 true JP2008117967A5 (https=) 2010-04-15
JP4684983B2 JP4684983B2 (ja) 2011-05-18

Family

ID=39503666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006300560A Expired - Fee Related JP4684983B2 (ja) 2006-11-06 2006-11-06 フレキシブルプリント配線板用積層体及び銅合金スパッタリングターゲット

Country Status (1)

Country Link
JP (1) JP4684983B2 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106645A (en) * 1977-03-01 1978-09-16 Marui Kougiyou Kk Vacuum evaporation method
JP2991794B2 (ja) * 1991-01-21 1999-12-20 住友ベークライト株式会社 フレキシブルプリント基板の製造方法
JP2003011272A (ja) * 2001-07-02 2003-01-15 Mitsubishi Shindoh Co Ltd 金属化ポリイミドフィルム
JP4397702B2 (ja) * 2004-02-04 2010-01-13 三菱伸銅株式会社 金属化ポリイミドフィルムの製造方法
JP4762533B2 (ja) * 2004-12-07 2011-08-31 古河電気工業株式会社 銅メタライズド積層板及びその製造方法

Similar Documents

Publication Publication Date Title
JP2007186782A5 (https=)
JP2003201585A5 (https=)
WO2008133182A1 (ja) 金属－樹脂積層体
JP2010534413A5 (https=)
WO2008149717A1 (ja) 光反射板、その製造方法及び光反射装置
JP2010503205A5 (https=)
JP2004339605A5 (https=)
EP2014787A4 (en) CU-MN ALLOY SPUTTER TARGET AND SEMICONDUCTOR CABLING THEREFOR
GB0905846D0 (en) Ternary aluminum alloy films and targets
WO2009050971A1 (ja) 金属被覆ポリイミド複合体及び同複合体の製造方法並びに電子回路基板の製造方法
TW200606263A (en) Barrier film for flexible copper substrate and sputtering target for forming barrier film
EP1857570A3 (en) Method for forming a nickel-based layered structure on a magnesium alloy substrate, a surface-treated magnesium alloy article made thereform, and a cleaning solution and a surface treatment solution used therefor
JP2006228475A5 (https=)
WO2008010978A3 (en) Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom
TWI561373B (zh) 附載體銅箔、使用其之覆銅積層板、印刷配線板、印刷電路板及印刷配線板之製造方法
JP2007186781A5 (https=)
TW200734472A (en) Flexible metal clad laminate and method for manufacturing the same
MY144558A (en) Copper foil for printed circuit board
JP2006253185A5 (ja) 金属層付き積層フィルム
WO2005091345A8 (ja) カーボンナノチューブ含有金属薄膜
SG135085A1 (en) Ruthenium alloy magnetic media and sputter targets
SG131821A1 (en) Deposition of enhanced seed layer using tantalum alloy based sputter target
JP2007158182A5 (https=)
JP2008117967A5 (https=)
JP2006110626A5 (https=)