JP4679547B2 - Electronic component cooling structure - Google Patents

Description

  The present invention relates to a cooling structure for electronic components, and more particularly to a cooling structure using a heat sink.

  A conventional electronic component cooling structure is disclosed, for example, in Patent Document 1 as an electronic component cooling device. In the electronic component cooling device of Patent Document 1, a heat sink is attached to an electronic component electrically connected to a substrate. The surface opposite to the surface on which the electronic component is mounted is provided with fins, and heat from the electronic component is efficiently radiated by the wind hitting the fins.

  Patent Document 2 discloses a cooling structure for electronic components as a liquid cooling system. According to the cooling structure, it is disclosed that a refrigerant is supplied to a pipe by a circulation pump, and heat from a heating element is radiated by a heat receiving portion connected to the pipe.

Patent Document 3 discloses a conventional electronic component cooling structure as a cooling device for an electronic device. The electronic apparatus cooling device of Patent Document 3 arranges a printed circuit board or a power device as a heat source on one surface of the heat sink, receives the air blown from the fan on the fins on the opposite surface, and The received wind is supplied to one surface side of the heat sink by the air guide, and heat generated from the power device or the printed circuit board can be dissipated.
JP 2002-111262 A JP 2006-316906 A JP-A-8-186388 (FIG. 3)

  However, in the cooling structure of Patent Document 1, the heat generated from the electronic component can be efficiently radiated only on the surface side where the electronic component is disposed on the heat sink, and the problem is that the cooling efficiency is poor. It was.

  Further, in the structure of Patent Document 3, the wind received by one surface of the heat sink is supplied to the other surface of the heat sink by the air guide, so that the heat is radiated from the back surface of the power device by the heat sink. Although the heat supplied from the surface of the power device is sought by the wind supplied by the guide, the wind supplied to the surface of the power device is supplied with the air warmed by the heat sink, which reduces the cooling efficiency. It was a problem.

  Furthermore, the structure of Patent Document 2 requires a pump for circulating the refrigerant, and further requires electrical wiring for operating the pump, which complicates the configuration and reduces manufacturing efficiency. It was a problem.

  Therefore, the present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a cooling structure for an electronic component that can improve the cooling efficiency and the manufacturing efficiency.

  The present invention was devised in order to achieve the above object, and an electronic component that radiates heat from the electronic component by a heat sink that receives wind on one surface and the electronic component is disposed on the other surface. The cooling structure includes a pipe having a wind receiving portion for receiving wind for cooling the heat sink, and a ventilation portion for supplying the received wind to the surface of the electronic component. It is slidably arranged in a through hole provided in the electronic device, and is fixed on the surface of the electronic component with the wind receiving portion protruding from the through hole.

The heat sink has a plurality of fins on one surface, and the pipe is arranged such that the wind receiving portion protrudes between the fins.
The electronic component and the ventilation portion of the pipe are fastened together with the heat sink using screws.
The electronic component and the ventilation portion of the pipe are fixed using an adhesive medium.

  According to the cooling structure of the electronic component of the present invention, the bottom surface of the electronic component is cooled by the heat sink, the wind supplied to the heat sink is received by the wind receiving portion, and the ventilation portion is disposed on the surface of the electronic component. Supply. Thereby, while cooling the bottom face of an electronic component, the surface can also be cooled locally and the cooling efficiency can be improved.

  Furthermore, according to the cooling structure for an electronic component of the present invention, the pipe slides detachably in the through hole provided in the heat sink. That is, the cooling structure for an electronic component according to the present invention includes a pipe and a heat sink that are individually formed and a combination thereof. Thereby, an electronic component can be arrange | positioned on a heat sink, a pipe can be easily arrange | positioned on this electronic component, and the improvement of manufacturing efficiency can be aimed at.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, the same components are denoted by the same reference numerals in the drawings used in the embodiments, and overlapping descriptions are possible. Omitted as much as possible.

  As shown in FIG. 1, an electronic component cooling structure (hereinafter, abbreviated as a cooling structure) 10 according to the present invention is disposed under an electronic component 2 that is electrically connected to a substrate 1. The heat radiation insulating sheet 3, the heat sink 4 disposed under the heat radiation insulating sheet 3, the hollow pipe 5 for cooling the electronic component 2, and the fixing screw for fixing the pipe 4 on the electronic component 2 6 and a cover 7 covering the heat sink 4.

  The electronic component 2 is a heating element that generates heat when energized. Specifically, the electronic component 2 is a semiconductor element such as a transistor or a diode, and further includes a capacitor or a transformer (inductor). FIG. 1 shows a state in which a three-terminal transistor is electrically connected to a substrate by solder.

  The heat sink 4 has fins 8 arranged at predetermined intervals on one surface, and the electronic component 2 is disposed on the other surface side facing the one surface via a mounting table (die-cast base plate) 14. . The fins 8 to be arranged are provided with through holes 9 between the fins. The diameter of the through hole 9 provided in the heat sink 4 is substantially the same as the diameter of the pipe 5. Specifically, the diameter of the pipe 5 is slightly larger than the diameter of the through hole 9 so that the pipe 5 can slide in the through hole 9. It is formed to be smaller.

  Further, by forming the pipe 5 so that the diameter of the pipe 5 is slightly smaller than the diameter of the through hole 9, the pipe 5 can be slid in the through hole 9, and the inside covered with the cover 7 on the heat sink 4. The foreign matter is prevented from entering through the through hole 9.

  The pipe 5 is hollow in a U-shape, and an air inlet 11 as a wind receiving portion is provided at one end thereof, and an air outlet 12 is provided at the other end. A ventilation portion 13 is provided between the exhaust ports 12.

  The pipe 5 is arranged so that the intake port 11 and the exhaust port 12 are inserted into the respective through holes 9 provided in the heat sink 4. Specifically, the ventilation portion 13 of the pipe 5 is arranged on the electronic component 2 so as to straddle the electronic component 2 arranged via the heat radiation insulating sheet 3 on the other surface of the heat sink. The intake port 11 and the exhaust port 12 are inserted into the respective through holes 9 provided in the heat sink 4.

  In the pipe 5 inserted into the through hole 9, the intake port 11 protrudes between the fins 8 from the through hole 9 provided in the heat sink 4, and the protruding intake port 11 receives wind flowing between the fins 8. A notch is provided on the wind receiving side, and the air blown by the notch is easy to take in air.

  The wind sucked from the intake port 11 passes through the pipe and is discharged from the exhaust port 12. The wind sucked at this time is used as a refrigerant, and heat of the electronic component 2 that generates heat is exchanged by the refrigerant. The heat generated from the electronic component 2 is locally dissipated.

  By the way, in the heat radiation by the pipe 5 of the present invention, the air is directly received by the intake port 11 protruding between the fins 8 of the heat sink 4 and is exhausted to the exhaust port 12 through the ventilation part 13. Thereby, the electronic component 2 can be locally cooled with the wind directly received.

  In order to perform the above-described local cooling more effectively, it is preferable that the through hole 9 is formed so that the air inlet 11 is positioned on the windward side when the air is blown to the fin 8 of the heat sink 4. Thereby, the low-temperature wind can be taken into the pipe 5 without heat exchange of the blown wind by the fins 8 and warming.

  The fixing screw 6 passes through holes formed in the ventilation portion 13 of the pipe 5, the electronic component 2, and the heat radiation insulating sheet 3, and is screwed into a screw hole provided in the heat sink 4. As a result, the pipe 5 together with the electronic component 2 is fixed on the heat sink 4 (fastened together).

  In addition, since the cooling structure 10 comprised by the screwing using the fixing screw 6 employ | adopts a simple structure and does not require a complicated structure, it improves the manufacturing efficiency.

Next, the operation of the cooling structure 10 of the present invention will be described.
The heat generated from the electronic component 2 is transmitted from the back surface to the heat sink 4 through the heat dissipation insulating sheet 3. The transmitted heat is dissipated by the wind received by the fins 8 provided on one surface of the heat sink 4. The air blow to the fins 8 may be artificial air using a fan or natural air.

  By the way, the wind received by the fins is sent into the pipe from the intake port 11 protruding between the fins. By the air blowing into the pipe, heat generated from the electronic component 2 that is fastened together with the pipe on the heat sink 4 is heat-exchanged, so that the heat generated from the electronic component 2 is radiated.

  As described above, according to the cooling structure 10 of the present invention, the heat generated from the electronic component 2 is radiated from the fins 8 of the heat sink 4 and also radiated from the pipe 5 disposed on the electronic component 2. The electronic component 2 can be directly cooled by the pipe 5, and the electronic component 2 can be efficiently cooled by double cooling.

  Furthermore, according to the electronic component cooling structure 10 of the present invention, the pipe 5 and the heat sink 4 are formed separately, and these are combined and fastened together with the electronic component 2 with the fixing screw 6. Thereby, the pipe 5 can be easily arrange | positioned on the electronic component 2, the improvement of manufacturing efficiency can be aimed at, and the reduction of manufacturing cost can be aimed at.

  In the above-described embodiment, when the pipe 5 and the electronic component 2 are fastened together with the fixing screw 6, the fixing screw 6 penetrates the hole formed in the ventilation portion 13 of the pipe 5 and is provided in the heat sink 4. However, the present invention need not be limited to this.

  For example, a heat receiving plate protruding from the side wall of the ventilation portion 13 of the pipe 5 is provided, a hole is provided in the heat receiving plate, a fixing screw 6 is inserted into the hole, and the electronic component 2 is fastened together with the heat receiving plate. Good. In this case, it is preferable to appropriately set the positional relationship and dimensions so that the heat received by the heat receiving plate can be efficiently exchanged by the ventilation section 13.

  In the above-described embodiment, the structure in which the cover 7 is covered with the heat sink 4 so as to cover the heat sink 4 has been described as an example, but the structure of the heat sink 4 and the cover 7 is not necessarily limited to the embodiment. For example, the present invention can also be applied to a structure in which the heat sink 4 is formed in a concave shape, and an electronic component, 2 or a substrate is placed in the recess and then these are covered.

  In the above-described embodiment, the description has been made with reference to the drawing in which the intake port 11 is positioned substantially perpendicular to the blowing direction. However, the present invention is not limited to this, and the positional relationship of the intake port 11 with respect to the blowing direction is appropriately It may be changed. Moreover, you may change the opening dimension of the inlet port 11 according to the air volume which blows.

  Further, in the above-described embodiment, the description has been given by taking the intake port 11 having a notched shape as an example, but the shape of the intake port 11 is not limited to this, and the shape may be changed as appropriate.

  In the embodiment described above, the example in which the fixing screw 6 is used when the pipe 5 and the electronic component 2 are fastened together has been described. However, the pipe 5 is positioned by the through hole 9 provided in the heat sink 4, and the through hole If the adjustment of the diameter of the pipe 5 and the diameter of the through hole 9 is made to such an extent that the pipe 5 is inserted into the inside 9 and sliding is suppressed, the fixing screw 6 is unnecessary.

  Further, instead of the fixing screw 6, the pipe 5 arranged on the electronic component 2 may be fixed using an adhesive medium such as an adhesive or heat dissipating grease.

It is sectional drawing (a) and the side view (b) which show the cooling structure of the electronic component of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Electronic component 3 Radiation insulation sheet 4 Heat sink 5 Pipe 6 Fixing screw 7 Cover 8 Fin 9 Through-hole 10 Cooling structure 11 Intake port 12 Exhaust port 13 Ventilation part 14 Mounting base

Claims (4)

In the cooling structure of the electronic component that radiates heat from the electronic component by the heat sink that receives the wind on one surface and the electronic component is disposed on the other surface,
A pipe having a wind receiving portion for receiving wind to be used for cooling the heat sink, and a ventilation portion for supplying the received wind to the surface of the electronic component;
The pipe is slidably disposed in a through hole provided in the heat sink, and is fixed on the surface of the electronic component in a state where the wind receiving portion protrudes from the through hole. Cooling structure. The heat sink has a plurality of fins on the one surface;
The electronic pipe cooling structure according to claim 1, wherein the pipe is disposed so that the wind receiving portion protrudes between the fins. The electronic component cooling structure according to claim 1, wherein the electronic component and the ventilation portion of the pipe are fastened together with a heat sink using a screw. The electronic component cooling structure according to claim 1, wherein the electronic component and the ventilation portion of the pipe are fixed using an adhesive medium.

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