JP4672984B2 - 基板上に構造物を形成して音響接続するプロセス - Google Patents
基板上に構造物を形成して音響接続するプロセス Download PDFInfo
- Publication number
- JP4672984B2 JP4672984B2 JP2004015101A JP2004015101A JP4672984B2 JP 4672984 B2 JP4672984 B2 JP 4672984B2 JP 2004015101 A JP2004015101 A JP 2004015101A JP 2004015101 A JP2004015101 A JP 2004015101A JP 4672984 B2 JP4672984 B2 JP 4672984B2
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- JP
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- Prior art keywords
- mesh
- substrate
- forming
- etching
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00158—Diaphragms, membranes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K8/00—Cosmetics or similar toiletry preparations
- A61K8/02—Cosmetics or similar toiletry preparations characterised by special physical form
- A61K8/0208—Tissues; Wipes; Patches
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K2800/00—Properties of cosmetic compositions or active ingredients thereof or formulation aids used therein and process related aspects
- A61K2800/20—Chemical, physico-chemical or functional or structural properties of the composition as a whole
- A61K2800/30—Characterized by the absence of a particular group of ingredients
- A61K2800/33—Free of surfactant
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K2800/00—Properties of cosmetic compositions or active ingredients thereof or formulation aids used therein and process related aspects
- A61K2800/40—Chemical, physico-chemical or functional or structural properties of particular ingredients
- A61K2800/58—Metal complex; Coordination compounds
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K2800/00—Properties of cosmetic compositions or active ingredients thereof or formulation aids used therein and process related aspects
- A61K2800/70—Biological properties of the composition as a whole
- A61K2800/72—Hypo-allergenic
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K2800/00—Properties of cosmetic compositions or active ingredients thereof or formulation aids used therein and process related aspects
- A61K2800/74—Biological properties of particular ingredients
- A61K2800/75—Anti-irritant
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K2800/00—Properties of cosmetic compositions or active ingredients thereof or formulation aids used therein and process related aspects
- A61K2800/80—Process related aspects concerning the preparation of the cosmetic composition or the storage or application thereof
- A61K2800/94—Involves covalent bonding to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Animal Behavior & Ethology (AREA)
- Biomedical Technology (AREA)
- Birds (AREA)
- Epidemiology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Micromachines (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Description
(12) 基板
(14) 第1誘電体層
(16) 第1金属層
(18) メッシュ
(20) 第2誘電体層
(22) 第2金属層
(24) 開口
(26) 第3誘電体層
(28) 第3金属層
(30) 開口
(32) 最上層の誘電体層
Claims (18)
- 基板の通気開口が形成されるべき領域の裏面の厚さを薄くする工程と、
エッチマスクとしてメッシュを用い、薄肉化された領域の基板に案内開口を形成する工程と、
基板の上面からメッシュをリリースする工程と、
リリースされたメッシュと薄肉化された領域に連通する通気開口を形成する工程と、
を有するプロセス。 - リリース工程は、メッシュの下にある基板部分を除去する工程を含み、
通気開口の形成工程は、メッシュの下にある基板部分の前記除去と同時に行なわれる、請求項1に記載のプロセス。 - エッチマスクとして作用するようにメッシュの所定部分を選択し、レジスト層を形成しパターニングする工程をさらに有している、請求項1に記載のプロセス。
- 異方性エッチングは、案内開口を形成するために用いられ、等方性エッチングは、メッシュリリース工程及び通気開口形成工程に用いられる、請求項1に記載のプロセス。
- 案内開口の形成工程は、リリース工程の前に行なわれる、請求項1に記載のプロセス。
- 案内開口の形成工程は、エッチマスクとしてメッシュを用いることを含んでいる、請求項5に記載のプロセス。
- 等方性エッチングは、メッシュリリース工程に用いられ、異方性エッチングは、案内開口の形成工程に用いられる、請求項6に記載のプロセス。
- 厚さを薄くする工程は、音響キャビティを形成し、
メッシュの下にチャンバーを形成する工程により、メッシュをリリースし、
チャンバーが音響キャビティに音響的に接続されている、請求項1に記載のプロセス。 - チャンバー形成工程は、メッシュの下にある基板部分を除去する工程を含み、
接続工程は、案内開口を用いて、チャンバーの形成と同時に通気開口を形成する工程を含んでいる、請求項8に記載のプロセス。 - エッチマスクとして作用するようにメッシュの所定部分を選択し、レジスト層を使用しパターニングする工程をさらに有している、請求項9に記載のプロセス。
- 異方性エッチングは、案内開口を形成するために用いられ、等方性エッチングは、チャンバー形成工程及び通気開口を形成するために用いられる、請求項9に記載のプロセス。
- チャンバーとキャビティを接続するために、基板の上面からエッチングする工程を含む、請求項8に記載のプロセス。
- エッチング工程は、エッチマスクとしてマイクロ加工メッシュを用いることにより、基板のキャビティの領域に通気開口を形成する工程を含んでいる、請求項12に記載のプロセス。
- エッチング工程は、通気開口を拡大する工程を含んでいる、請求項1に記載のプロセス。
- 通気開口を拡大するために、等方性エッチングが用いられる、請求項14に記載のプロセス。
- リリースされたメッシュと薄肉化された領域を接続するために、基板の上面からエッチングする工程をさらに含む、請求項1に記載のプロセス。
- エッチング工程は、エッチマスクとしてマイクロ加工メッシュを用いることにより、基板のキャビティの領域に通気開口を形成する工程を含んでいる、請求項16に記載のプロセス。
- 通気開口を形成する工程が、リリースする工程のエッチングと同じエッチング工程によって行われる、請求項1に記載のプロセス。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/349,618 US7049051B2 (en) | 2003-01-23 | 2003-01-23 | Process for forming and acoustically connecting structures on a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004223710A JP2004223710A (ja) | 2004-08-12 |
JP4672984B2 true JP4672984B2 (ja) | 2011-04-20 |
Family
ID=32594932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004015101A Expired - Fee Related JP4672984B2 (ja) | 2003-01-23 | 2004-01-23 | 基板上に構造物を形成して音響接続するプロセス |
Country Status (4)
Country | Link |
---|---|
US (1) | US7049051B2 (ja) |
EP (1) | EP1441561B1 (ja) |
JP (1) | JP4672984B2 (ja) |
AT (1) | ATE511320T1 (ja) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050095814A1 (en) * | 2003-11-05 | 2005-05-05 | Xu Zhu | Ultrathin form factor MEMS microphones and microspeakers |
US7358151B2 (en) | 2004-12-21 | 2008-04-15 | Sony Corporation | Microelectromechanical system microphone fabrication including signal processing circuitry on common substrate |
DE102005007540A1 (de) | 2005-02-18 | 2006-08-31 | Robert Bosch Gmbh | Mikromechanischer Membransensor mit Doppelmembran |
US7439093B2 (en) | 2005-09-16 | 2008-10-21 | Dalsa Semiconductor Inc. | Method of making a MEMS device containing a cavity with isotropic etch followed by anisotropic etch |
US8043950B2 (en) | 2005-10-26 | 2011-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
DE102006002106B4 (de) * | 2006-01-17 | 2016-03-03 | Robert Bosch Gmbh | Mikromechanischer Sensor mit perforationsoptimierter Membran sowie ein geeignetes Hestellungsverfahren |
DE102006022378A1 (de) | 2006-05-12 | 2007-11-22 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikromechanischen Bauelements und mikromechanisches Bauelement |
KR20080005854A (ko) * | 2006-07-10 | 2008-01-15 | 야마하 가부시키가이샤 | 압력 센서 및 그의 제조 방법 |
DE102007019647A1 (de) | 2007-04-26 | 2008-10-30 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikromechanischen Bauelements mit Auffüllschicht und Maskenschicht |
TW200919593A (en) * | 2007-10-18 | 2009-05-01 | Asia Pacific Microsystems Inc | Elements and modules with micro caps and wafer level packaging method thereof |
US8429808B2 (en) * | 2007-12-03 | 2013-04-30 | Kolo Technologies, Inc. | Method for fabrication an electrical transducer |
JP5611830B2 (ja) * | 2007-12-03 | 2014-10-22 | コロ テクノロジーズ インコーポレイテッド | 静電型変換器アレイのパッケージングおよび接続 |
US7795063B2 (en) * | 2007-12-31 | 2010-09-14 | Solid State System Co., Ltd. | Micro-electro-mechanical systems (MEMS) device and process for fabricating the same |
US8258591B2 (en) * | 2008-01-16 | 2012-09-04 | Solid State System Co., Ltd. | Micro-electro-mechanical systems (MEMS) device |
US8173471B2 (en) * | 2008-04-29 | 2012-05-08 | Solid State System Co., Ltd. | Method for fabricating micro-electro-mechanical system (MEMS) device |
TWI380456B (en) * | 2008-04-30 | 2012-12-21 | Pixart Imaging Inc | Micro-electro-mechanical device and method for making same |
CN101580222B (zh) * | 2008-05-15 | 2011-11-16 | 原相科技股份有限公司 | 微机电元件与制作方法 |
US8144906B2 (en) * | 2008-05-21 | 2012-03-27 | Akustica, Inc. | Wind immune microphone |
US8345895B2 (en) | 2008-07-25 | 2013-01-01 | United Microelectronics Corp. | Diaphragm of MEMS electroacoustic transducer |
US8280097B2 (en) * | 2008-08-21 | 2012-10-02 | United Microelectronics Corp. | Microelectromechanical system diaphragm and fabricating method thereof |
US7951636B2 (en) * | 2008-09-22 | 2011-05-31 | Solid State System Co. Ltd. | Method for fabricating micro-electro-mechanical system (MEMS) device |
US20100173437A1 (en) * | 2008-10-21 | 2010-07-08 | Wygant Ira O | Method of fabricating CMUTs that generate low-frequency and high-intensity ultrasound |
TWI484594B (zh) * | 2009-10-07 | 2015-05-11 | United Microelectronics Corp | 具有微機電系統元件之積體電路及其製造方法 |
US8445324B2 (en) * | 2009-12-16 | 2013-05-21 | Oakland University | Method of wafer-level fabrication of MEMS devices |
US8030112B2 (en) * | 2010-01-22 | 2011-10-04 | Solid State System Co., Ltd. | Method for fabricating MEMS device |
US8865500B2 (en) * | 2010-02-03 | 2014-10-21 | United Microelectronics Corp. | Method of fabricating a MEMS microphone with trenches serving as vent pattern |
TWI430424B (zh) * | 2011-03-18 | 2014-03-11 | Pixart Imaging Inc | 微機電系統聲壓感測元件及其製作方法 |
CN102752699B (zh) * | 2011-04-19 | 2014-09-17 | 原相科技股份有限公司 | 微机电系统麦克风装置及其制作方法 |
US8643140B2 (en) | 2011-07-11 | 2014-02-04 | United Microelectronics Corp. | Suspended beam for use in MEMS device |
US8525354B2 (en) | 2011-10-13 | 2013-09-03 | United Microelectronics Corporation | Bond pad structure and fabricating method thereof |
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US9402138B2 (en) | 2012-10-12 | 2016-07-26 | Infineon Technologies Ag | MEMS device and method of manufacturing a MEMS device |
WO2014092541A1 (en) * | 2012-12-10 | 2014-06-19 | Mimos Berhad | A method for releasing mems device |
US8981501B2 (en) | 2013-04-25 | 2015-03-17 | United Microelectronics Corp. | Semiconductor device and method of forming the same |
KR102126714B1 (ko) * | 2013-09-03 | 2020-06-26 | 삼성디스플레이 주식회사 | 표시 패널 및 이를 포함하는 유기 발광 표시 장치 |
US9219185B2 (en) | 2013-12-19 | 2015-12-22 | Excelitas Technologies Singapore Pte. Ltd | CMOS integrated method for the fabrication of thermopile pixel with umbrella absorber on semiconductor substrate |
US9373772B2 (en) * | 2014-01-15 | 2016-06-21 | Excelitas Technologies Singapore Pte. Ltd. | CMOS integrated method for the release of thermopile pixel on a substrate by using anisotropic and isotropic etching |
CN106865485B (zh) | 2015-12-10 | 2021-09-21 | 联华电子股份有限公司 | 微机电结构及其制作方法 |
CN111741423B (zh) * | 2020-08-21 | 2020-11-20 | 中芯集成电路制造(绍兴)有限公司 | Mems麦克风的制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05187947A (ja) * | 1991-08-22 | 1993-07-27 | Yamatake Honeywell Co Ltd | 静電容量式圧力センサ |
JPH09508777A (ja) * | 1994-08-12 | 1997-09-02 | ザ チャールズ スターク ドレイパー ラボラトリー インク | 改良された低周波応答性を備えた音響トランスデューサ |
JP2001508949A (ja) * | 1997-01-16 | 2001-07-03 | フォード、グローバル、テクノロジーズ、インコーポレーテッド | 表面取付チップ用最適ロウ接合 |
JP2001518246A (ja) * | 1997-02-25 | 2001-10-09 | ノウルズ エレクトロニクス,インコーポレイティド | 小型シリコンコンデンサマイクロフォン |
JP2002223499A (ja) * | 2001-01-29 | 2002-08-09 | Seiko Epson Corp | コンデンサマイクロホンおよびその製造方法および音声入力装置 |
JP2004223708A (ja) * | 2003-01-23 | 2004-08-12 | Akustica Inc | マルチメタルレイヤmems構造及びこれを作製するプロセス |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8303185A (nl) | 1983-09-15 | 1985-04-01 | Philips Nv | Hybried luidsprekersysteem eventueel met een of meer korrektieketens. |
GB9205711D0 (en) | 1992-03-16 | 1992-04-29 | Lynxvale Ltd | Micromechanical sensor |
AU6953994A (en) | 1993-06-04 | 1995-01-03 | Regents Of The University Of California, The | Microfabricated acoustic source and receiver |
US5393647A (en) | 1993-07-16 | 1995-02-28 | Armand P. Neukermans | Method of making superhard tips for micro-probe microscopy and field emission |
US5774252A (en) | 1994-01-07 | 1998-06-30 | Texas Instruments Incorporated | Membrane device with recessed electrodes and method of making |
US5876187A (en) | 1995-03-09 | 1999-03-02 | University Of Washington | Micropumps with fixed valves |
US5717631A (en) | 1995-07-21 | 1998-02-10 | Carnegie Mellon University | Microelectromechanical structure and process of making same |
US5949892A (en) | 1995-12-07 | 1999-09-07 | Advanced Micro Devices, Inc. | Method of and apparatus for dynamically controlling operating characteristics of a microphone |
IL116536A0 (en) | 1995-12-24 | 1996-03-31 | Harunian Dan | Direct integration of sensing mechanisms with single crystal based micro-electric-mechanics systems |
US5751469A (en) | 1996-02-01 | 1998-05-12 | Lucent Technologies Inc. | Method and apparatus for an improved micromechanical modulator |
DE69731604D1 (de) | 1997-01-31 | 2004-12-23 | St Microelectronics Srl | Herstellungsverfahren für integrierte Halbleitervorrichtung mit einem chemoresistiven Gasmikrosensor |
US5867302A (en) | 1997-08-07 | 1999-02-02 | Sandia Corporation | Bistable microelectromechanical actuator |
US6181050B1 (en) | 1997-10-27 | 2001-01-30 | Hewlett Packard Company | Electrostatic micromotor with large in-plane force and no out-of-plane force |
WO2000009440A1 (de) * | 1998-08-11 | 2000-02-24 | Infineon Technologies Ag | Mikromechanischer sensor und verfahren zu seiner herstellung |
US6255757B1 (en) | 1999-09-01 | 2001-07-03 | Jds Uniphase Inc. | Microactuators including a metal layer on distal portions of an arched beam |
US6829131B1 (en) * | 1999-09-13 | 2004-12-07 | Carnegie Mellon University | MEMS digital-to-acoustic transducer with error cancellation |
US6262946B1 (en) | 1999-09-29 | 2001-07-17 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer arrays with reduced cross-coupling |
US6753638B2 (en) * | 2000-02-03 | 2004-06-22 | Calient Networks, Inc. | Electrostatic actuator for micromechanical systems |
-
2003
- 2003-01-23 US US10/349,618 patent/US7049051B2/en not_active Expired - Lifetime
-
2004
- 2004-01-22 AT AT04380017T patent/ATE511320T1/de not_active IP Right Cessation
- 2004-01-22 EP EP04380017A patent/EP1441561B1/en not_active Expired - Lifetime
- 2004-01-23 JP JP2004015101A patent/JP4672984B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05187947A (ja) * | 1991-08-22 | 1993-07-27 | Yamatake Honeywell Co Ltd | 静電容量式圧力センサ |
JPH09508777A (ja) * | 1994-08-12 | 1997-09-02 | ザ チャールズ スターク ドレイパー ラボラトリー インク | 改良された低周波応答性を備えた音響トランスデューサ |
JP2001508949A (ja) * | 1997-01-16 | 2001-07-03 | フォード、グローバル、テクノロジーズ、インコーポレーテッド | 表面取付チップ用最適ロウ接合 |
JP2001518246A (ja) * | 1997-02-25 | 2001-10-09 | ノウルズ エレクトロニクス,インコーポレイティド | 小型シリコンコンデンサマイクロフォン |
JP2002223499A (ja) * | 2001-01-29 | 2002-08-09 | Seiko Epson Corp | コンデンサマイクロホンおよびその製造方法および音声入力装置 |
JP2004223708A (ja) * | 2003-01-23 | 2004-08-12 | Akustica Inc | マルチメタルレイヤmems構造及びこれを作製するプロセス |
Also Published As
Publication number | Publication date |
---|---|
EP1441561B1 (en) | 2011-05-25 |
EP1441561A3 (en) | 2009-06-03 |
ATE511320T1 (de) | 2011-06-15 |
US20040146810A1 (en) | 2004-07-29 |
JP2004223710A (ja) | 2004-08-12 |
EP1441561A2 (en) | 2004-07-28 |
US7049051B2 (en) | 2006-05-23 |
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