JP4663351B2 - Electronic equipment - Google Patents

Description

  The present invention converts a high-frequency line such as a coplanar line forming a high-frequency circuit or a coplanar line with a ground, which is used in a microwave or millimeter wave region, into a waveguide, and connects the high-frequency circuit and the antenna or the high-frequency circuit. The present invention relates to a high-frequency line-waveguide converter that can easily mount and evaluate a system by performing the above-described process using a waveguide.

  In recent years, high-frequency signals used for information transmission have been studied to utilize frequencies from the microwave region to the millimeter wave region. For example, an inter-vehicle radar has been proposed as an application system using millimeter-wave high-frequency signals. In such a high-frequency system, there is a problem that the high-frequency signal is attenuated by a high-frequency line such as a microstrip line structure constituting the circuit due to the high frequency of the high-frequency signal.

  It is known that a transmission loss of a high-frequency signal is small in a waveguide as compared with a high-frequency line such as a microstrip line structure. For example, compared to the impedance (50Ω) of a normal high-frequency line such as a microstrip line, the impedance of the waveguide (which varies depending on the frequency but is designed on the order of about 500Ω) is large. The contribution of the electric field transmitted through the dielectric to the generated signal is large, whereas the waveguide uses air having a dielectric loss tangent of almost zero as its dielectric, The current flowing through the waveguide tube wall can be small, and since the current flows in a relatively large area of the waveguide tube wall, the electrical resistance is reduced and the conductor loss is reduced. Is due to being.

  The waveguides are usually connected with screws. Therefore, since it can be easily attached and detached, if a waveguide is used for the connection between the high-frequency circuit module and the antenna, each inspection is performed using each waveguide port before assembly, and non-defective products are combined. A high-frequency front end can be assembled, and the manufacturing yield can be increased. For these reasons, a front end using a waveguide for transmission between a high-frequency circuit module and an antenna, which often has a long transmission distance, has been conventionally used.

  Such a high-frequency front end functions as a dielectric layer, a coplanar line composed of a line conductor formed on the surface of the dielectric layer, and a coplanar ground conductor layer disposed on both sides of the dielectric layer, and an antenna formed on the tip of the coplanar line. And a waveguide connected to a position facing the slot on the back surface of the dielectric layer, and a shield conductor portion formed so as to connect the waveguide and the same-surface grounded conductor layer inside the dielectric layer. A high-frequency line-waveguide converter is proposed (see Patent Document 1 below).

  According to this converter, the distance from the slot to the interface between the dielectric layer and the inside of the waveguide is set to 1/4 of the wavelength of the electromagnetic wave transmitted through the dielectric layer. The path difference between the reflected wave reflected at the interface between the layer and the inside of the waveguide, reflected again from the ground conductor layer on the same plane and reaching the interface, and the electromagnetic wave transmitted directly from the slot to the interface (direct wave) Since the phase is inverted when the reflected wave magnetic field is reflected at the interface between the dielectric layer and the inside of the waveguide, the direct wave and the reflected wave are in phase at the interface. Will propagate to the waveguide.

That is, the dielectric layer interposed between the slot and the waveguide and having a thickness set to ¼ of the wavelength of the electromagnetic wave functions as a matching unit between the slot and the waveguide having different impedances. Become.
JP 2004-32321 A

  However, the conventional high-frequency line-waveguide converter has an electronic element such as a semiconductor element mounted on another circuit board, and the electronic element and the line conductor of the high-frequency line-waveguide converter are electrically connected by a wire or the like. When the electronic device is connected to the ground, a potential difference is easily generated between the electronic element and the ground conductor layer of the high-frequency line-waveguide converter, and the electrical characteristics are deteriorated so that the high-frequency line and the waveguide There is a problem in that the signal conversion efficiency is low and the conversion characteristics vary.

  The present invention has been devised in view of the above problems, and an object thereof is to provide a high-frequency line-waveguide converter having high conversion efficiency and small variation in conversion characteristics.

An electronic device according to the present invention includes a high-frequency line including a line conductor formed on an upper surface of a dielectric layer and a coplanar ground conductor layer formed so as to surround one end portion of the line conductor on the upper surface of the dielectric layer; A slot formed on the same-surface grounded conductor layer so as to be orthogonal to the one end of the line conductor and electromagnetically coupled to the line conductor; and the one end and the slot of the line conductor as seen through a plane. a substrate that having a said dielectric layer shield conductor portions disposed side or inside of the surround, a metal base member having a through hole is formed and having a mounting portion of the electronic device, wherein the mounting portion An electronic device mounted on the base material, and a waveguide connected to the bottom surface of the base material so as to communicate with the through-hole, and the substrate closes the through-hole on the top surface of the base material . On the through hole Serial brazed as the one end and the slot is located in the line conductor, the and the electrode and the line conductor of the electronic device are electrically connected via a wire, the upper surface of the base material, the An inclined portion formed in a direction parallel to the side surface of the substrate in a plan view is provided at a position corresponding to the wire and away from the side surface of the substrate toward the upper side. .

According to the electronic device of the present invention, a high-frequency line including a line conductor formed on the upper surface of the dielectric layer and a coplanar ground conductor layer formed so as to surround one end of the line conductor on the upper surface of the dielectric layer ; A slot formed on the same grounded conductor layer so as to be orthogonal to one end of the line conductor and electromagnetically coupled to the line conductor, and a dielectric layer so as to surround the one end of the line conductor and the slot in a plan view . a substrate that have a a shield conductor portion disposed sides or inside a metallic base member having a through hole is formed and having a mounting portion of the electronic device, and an electronic device mounted on the mounting portion, the base and a connected waveguide so as to communicate with the through holes on the lower surface of the timber, the substrate, the upper surface of the base material, closing the through-hole, one end and the slot position if one through-hole on a line conductor to be brazed to And the electrode and the line conductor of the electronic element is electrically connected via a wire, the upper surface of the base member, a position corresponding to the wire, and away from the side surface of the substrate upward, viewed Since the inclined portion formed in the direction parallel to the side surface of the substrate is provided , the electronic element mounted on the mounting portion and the high-frequency line-waveguide converter share a base material as a ground conductor. Therefore, the potential difference between the electronic element and the ground conductor of the high-frequency line-waveguide converter can be the same or very small, and the electrical characteristics deteriorate between the electronic element and the high-frequency line-waveguide converter. Can be effectively suppressed. As a result, the signal conversion efficiency between the high-frequency line and the waveguide can be increased, and variations in conversion characteristics can be greatly reduced. In addition, by gradually changing the stray capacitance between the wire that electrically connects the electronic device and the high-frequency line-waveguide converter and the base material, a sudden change in impedance can be effectively prevented, and the wire is guided. By reducing the component, reflection loss can be effectively prevented. As a result, the electrical characteristics can be further improved. In addition, the electronic device has high conversion efficiency and small variation in conversion characteristics.

  Next, the invention of the present invention will be described in detail based on the attached material. FIG. 1 is a plan view showing an example of an embodiment of a high-frequency line-waveguide converter according to the present invention, and FIG. 2 is a cross-sectional view of the high-frequency line-waveguide converter of FIG. is there. 1 and 2, 1 is a high-frequency line, 2 is a dielectric layer, 3 is a line conductor, 4 is a ground plane conductor layer, 5 is a slot formed in the ground plane conductor layer 4, 6 is a waveguide, 7 is a shield conductor part, 13 is a base material. A substrate is mainly composed of the high-frequency line 1, the dielectric layer 2, the line conductor 3, the coplanar ground conductor layer 4, the slot 5, and the shield conductor portion 7. By connecting this substrate to the base material 13, A line-waveguide converter is formed.

  The high-frequency line 1 is formed in a coplanar line shape by a line conductor 3 formed on the upper surface of the dielectric layer 2 and a coplanar ground conductor layer 4 formed so as to surround the line conductor 3. Further, a slot 5 is provided in the same grounded conductor layer 4 on the upper surface of the dielectric layer 2 and is electromagnetically coupled to one end of the line conductor 3. Thereby, the high frequency signal transmitted to the high frequency line 1 is radiated from the slot 5 as an electromagnetic wave into the waveguide 6 arranged to extend downward.

  Further, the dielectric layer 2 is shielded by a shield conductor portion 7 formed of a side conductor formed on the side surface or a through conductor disposed inside the dielectric layer 2 as shown in FIG. The electromagnetic wave radiated into the body layer 2 and the electromagnetic wave reflected at the interface between the lower surface of the dielectric layer 2 and the inside of the waveguide 6 are prevented from leaking, and the conversion efficiency is prevented from being lowered. The shield conductor portion 7 is formed with a constant interval (not more than 1/4 times the wavelength of the signal transmitted through the high-frequency line 1) so as to surround the slot 5 when seen in a plan view.

  In addition, a frame-like internal ground conductor layer 8 is disposed on the inner layer of the dielectric layer 2 so as to surround the slot 5 when seen in a plan view. The shield conductor 7 may be connected.

  By adopting such a multilayer structure, the lower dielectric layer 2 in contact with the inside of the waveguide 6 having the strongest magnetic field of the TM mode, which is a resonance mode generated in the dielectric layer 2, and the high-frequency line 1 Can be separated from the upper dielectric layer 2 by the internal ground conductor layer 8, so that the TE mode and the TM mode, which are the electromagnetic field modes that transmit the high-frequency line 1, are combined to form the high-frequency line 1. It is possible to effectively prevent the signal energy to be transmitted from shifting to the TM mode. As a result, it is possible to effectively prevent signal reflection due to resonance and perform good signal conversion from the high-frequency line 1 to the waveguide 6.

  Further, a lower ground conductor layer 11 for joining the waveguide 6 to the lower surface of the dielectric layer 2 may be formed. The lower ground conductor layer 11 is preferably a frame formed so as to surround the slot 5 in a plan view.

  Examples of the dielectric material for forming the dielectric layer 2 include ceramic materials mainly composed of aluminum oxide, aluminum nitride, silicon nitride, mullite, and the like, and glass ceramic formed by firing a mixture of glass and glass and ceramic filler. Materials, organic resin materials such as epoxy resins, polyimide resins, fluororesins such as tetrafluoroethylene resin, and organic resin-ceramic (including glass) composite materials are used.

  The conductor material for forming the line conductor 3, the same-surface ground conductor layer 4, the shield conductor portion 7 such as the through conductor, the lower ground conductor layer 11, and the internal ground conductor layer 8 includes tungsten, molybdenum, gold, silver, copper, and the like. Or metal foils mainly containing gold, silver, copper, aluminum or the like.

  In particular, when the high-frequency line-waveguide converter is built in a wiring board on which high-frequency components are mounted, the dielectric material for forming the dielectric layer 2 has a small dielectric loss tangent and can be hermetically sealed. It is desirable. Examples of such a dielectric material include ceramics and glass ceramic materials such as an aluminum oxide sintered body and an aluminum nitride sintered body. Such a hard material is preferable in terms of improving the reliability of the mounted high-frequency component because the dielectric loss tangent is small and the mounted high-frequency component can be hermetically sealed. In this case, it is desirable to use a metallized conductor capable of co-firing with a dielectric material as the conductor material in order to improve hermetic sealing and productivity.

  The high-frequency line-waveguide converter of the present invention is manufactured as follows. For example, when an aluminum oxide sintered body is used as a dielectric material, first, an appropriate organic solvent or solvent is added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry. This is formed into a sheet shape by a known doctor blade method or calendar roll method to produce a ceramic green sheet. Further, a metallized paste is prepared by adding and mixing an appropriate solvent and solvent to a raw material powder such as refractory metal such as tungsten or molybdenum, aluminum oxide, silicon oxide, magnesium oxide, calcium oxide or the like.

  Next, a through hole for forming the shield conductor portion 7 that is a through conductor is formed in the ceramic green sheet to be the dielectric layer 2 by, for example, a punching method, and a metallized paste is embedded in the through hole by, for example, a printing method, Subsequently, a metallized paste is printed in the shape of the line conductor 3, the same-surface ground conductor layer 4, and the internal ground conductor layer 8. Further, when the dielectric layer 2 has a laminated structure of a plurality of dielectric layers, similarly, a ceramic green sheet having a metallized paste printed on the surface and embedded in the through-holes is laminated, and pressed and pressure-bonded. May be.

  And the ceramic green sheet used as these dielectric material layers 2 is baked at high temperature (about 1600 degreeC). Furthermore, if necessary, for example, nickel plating and gold plating are applied to the surface of the conductor exposed on the upper and lower surfaces such as the line conductor 3, the same-surface ground conductor layer 4, the lower ground conductor layer 11, and the like. The ground conductor layer 11 is connected to the base material 13 and the waveguide 6 is connected to the lower surface of the base material 13 to complete the high-frequency line-waveguide converter.

  The shield conductor portion 7 of the present invention is disposed on the side surface or inside of the dielectric layer 2 so as to surround the slot 5, and electrically connects the same-surface ground conductor layer 4, internal ground conductor layer 8, and lower ground conductor layer 11. is doing.

  The shield conductor 7 only needs to be able to electrically connect the same-surface ground conductor layer 4, the internal ground conductor layer 8, and the lower ground conductor layer 11, and various means such as side conductors and through conductors are used. For example, a conductor deposited on the side surface of the dielectric layer 2, a so-called castellation conductor in which a conductor layer is deposited on the inner wall of the notch on the side surface of the dielectric layer 2, or a conductor layer is coated on the inner wall of the through hole. Examples include so-called through-hole conductors that are attached, and so-called via conductors in which the insides of the through-holes are filled with a conductor.

  The base material 13 is electrically conductive, and is electrically connected to the electronic element 14 mounted on the mounting portion and the ground conductor of the substrate, and has a function of reinforcing the ground potential, and also supports the electronic element 14 and the substrate. It also functions as a member.

  The base material 13 is preferably made of a material having a thermal expansion coefficient close to that of the dielectric layer 2 in order to reduce the difference in thermal expansion coefficient between the dielectric layer 2 and the substrate. When these differences in thermal expansion coefficient are large, cracks are likely to occur in the dielectric layer 2.

  The base material 13 is electrically connected to the shield conductor portion 7 directly or to the lower ground conductor layer 11 electrically connected to the shield conductor portion 7 via a conductive bonding material such as a brazing material.

  The through hole of the base material 13 is formed so as to surround the slot 5 and the opening of the internal ground conductor layer 8 as seen through the plane. Preferably, as shown in FIG. 2, a conductive wall 13 a surrounding the substrate is formed on the upper surface of the base material 13. Thereby, the shielding property inside a board | substrate can be strengthened more.

  Such a wall portion 13 a may be integrated with the base material 13, and another member may be joined to the upper surface of the base material 13.

In addition, the electronic device 14 and the high-frequency line - the inner peripheral surface of the wall portion 13a which corresponds to the wire 15 for electrically connecting the waveguide converter that inclined. That is, an inclined portion 13b formed in a direction parallel to the side surface of the substrate in a plan view is provided on the upper surface of the base material 13 so as to be away from the side surface of the substrate toward the upper side. is not that. Thus, Wa ear 15 and can effectively prevent an abrupt change in impedance by making gradually changes the stray capacitance between the base member 13, to effectively prevent the reflection loss by reducing the inductive component of the wire 15 Can do. As a result, the electrical characteristics can be further improved.

  Such an inclined portion 13b may have a vertical cross-sectional shape that is linear or curved. Further, the inclined portion 13b may be formed over the entire thickness direction of the substrate, or may be formed only in a part in the thickness direction such as only the upper side portion or only the lower side portion as shown in FIG.

  The shape of the waveguide 6 is not particularly limited. For example, when a WR series standardized as a rectangular waveguide is used, a variety of measurement calibration kits are available, so that various characteristics can be easily evaluated. In order to reduce the size and weight of the system in accordance with the frequency of the high-frequency signal, a rectangular waveguide that is miniaturized within a range in which the waveguide 6 is not cut off may be used. A circular waveguide may be used.

  The waveguide 6 can be composed of a metal or a dielectric having a metal layer formed on the inner surface. For example, the waveguide 6 can be formed into a tubular shape or a dielectric such as ceramics or resin is required. In this case, the inner surface is coated with a metal after being molded. The inner surface of the waveguide 6 may be covered with a noble metal such as gold or silver in order to reduce conductor loss due to current or prevent corrosion. The waveguide 6 is attached to the base material 13 by joining with a brazing material, tightening with screws, or the like, and the waveguide 6 and the base material 13 are electrically connected.

  The length of the slot 5 in the direction orthogonal to the line conductor 3 is preferably equal to or shorter than the wavelength of the signal transmitted through the high-frequency line 1. Further, the width of the slot 5 in the direction parallel to the line conductor 3 is preferably not more than ½ times the wavelength of the signal transmitted through the high-frequency line 1. Thereby, electromagnetic waves can be radiated from the high-frequency line 1 to the waveguide 6 satisfactorily.

  When the internal ground conductor layer 8 is not present inside the dielectric layer 2, the thickness of the dielectric layer 2, that is, the distance between the high frequency line 1 and the lower ground conductor layer 11 is a signal transmitted through the high frequency line 1. It is good that it is 1/2 times or less of the wavelength. When there is one internal ground conductor layer 8 inside the dielectric layer 2, the thickness of the lower dielectric layer 2, that is, the distance between the internal ground conductor layer 8 and the lower ground conductor layer 11 is high frequency. It is preferable that it is not more than ½ times the wavelength of the signal transmitted through the line 1. As a result, the light is radiated from the slot 5, reflected at the interface between the lower surface of the dielectric layer 2 and the inside of the waveguide 6, reflected again by the upper surface of the dielectric layer 2 and the internal ground conductor layer 8, and again dielectric layer 2. The reflected wave returning to the interface between the lower surface of the waveguide and the inside of the waveguide 6 and the direct wave transmitted directly from the slot 5 to the interface between the lower surface of the dielectric layer 2 and the inside of the waveguide 6 are in phase. In addition, since the reflected wave and the direct wave strengthen each other, the conversion efficiency from the high-frequency line 1 to the waveguide 6 can be further increased.

  The opening shape of the internal ground conductor layer 8 is preferably similar to that of the slot 5, and the opening area of the internal ground conductor layer 8 is preferably 5 to 30 times the opening area of the slot 5. Thereby, the rapid change of the impedance from the high frequency line 1 to the waveguide 6 can be relieved, and electromagnetic waves can be transmitted satisfactorily.

  Then, an electronic element 14 such as a semiconductor element is mounted on the mounting portion of the base material 13 of the high-frequency line-waveguide converter of the present invention, and a conductive bonding material is provided so that the ground electrode is electrically connected to the base material 13. And the electrode of the electronic element 14 and the line conductor 3 are electrically connected by a wire 15 or the like to provide the electronic device of the present invention.

  It should be noted that the present invention is not limited to the embodiments described above, and various modifications may be made without departing from the spirit of the present invention.

  For example, FIGS. 1 and 2 show an example in which the high-frequency line 1 has a coplanar line structure. For example, a dielectric layer is further laminated on the dielectric layer 2, and the line conductor 3 is formed on the upper surface of the dielectric layer. A grounded coplanar line structure having a ground conductor layer so as to cover the dielectric layer 2, the line conductor 3, the coplanar ground conductor layer 4, the slot 5, the waveguide 6, the shield conductor portion 7, and the internal ground The same effect can be obtained by making the positional relationship between the conductor layer 8 and the lower ground conductor layer 11 the same as in the examples shown in FIGS.

It is a top view which shows the example of embodiment of the high frequency line-waveguide converter of this invention. It is sectional drawing in the A-A 'line | wire of the high frequency line-waveguide converter of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... High frequency line 2 ... Dielectric layer 3 ... Line conductor 4 ... Same surface grounding conductor layer 5 ... Slot 6 ... Conduction Wave tube 7... Shield conductor 13... Base material 13 b.

Claims (1)

A line conductor formed on the upper surface of the dielectric layer, a high-frequency line including a coplanar ground conductor layer formed so as to surround one end portion of the line conductor on the upper surface of the dielectric layer, and the coplanar ground conductor layer A slot formed orthogonal to the one end portion of the line conductor and electromagnetically coupled to the line conductor; and the dielectric layer surrounding the one end portion and the slot of the line conductor in a plan view A substrate having a shield conductor portion disposed on a side surface or inside thereof,
A metal base material having a mounting portion for an electronic element and a through-hole formed therein;
An electronic element mounted on the mounting portion;
A waveguide connected to the lower surface of the base material so as to communicate with the through hole;
The substrate is brazed to the upper surface of the base material so as to close the through hole, and the one end of the line conductor and the slot are positioned on the through hole,
The electrode of the electronic element and the line conductor are electrically connected via a wire,
An inclined portion formed in a direction parallel to the side surface of the substrate in plan view is provided on the upper surface of the base material so as to be away from the side surface of the substrate at a position corresponding to the wire and upward. An electronic device characterized by the above .

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