JP4648122B2 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP4648122B2
JP4648122B2 JP2005217937A JP2005217937A JP4648122B2 JP 4648122 B2 JP4648122 B2 JP 4648122B2 JP 2005217937 A JP2005217937 A JP 2005217937A JP 2005217937 A JP2005217937 A JP 2005217937A JP 4648122 B2 JP4648122 B2 JP 4648122B2
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Japan
Prior art keywords
layer
wiring
wiring board
adhesion layer
group
Prior art date
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Expired - Fee Related
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JP2005217937A
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English (en)
Japanese (ja)
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JP2007035972A (ja
JP2007035972A5 (https=
Inventor
伸也 佐々木
元昭 谷
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Fujitsu Ltd
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Fujitsu Ltd
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Priority to JP2005217937A priority Critical patent/JP4648122B2/ja
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Publication of JP2007035972A5 publication Critical patent/JP2007035972A5/ja
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Publication of JP4648122B2 publication Critical patent/JP4648122B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
JP2005217937A 2005-07-27 2005-07-27 配線基板及びその製造方法 Expired - Fee Related JP4648122B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005217937A JP4648122B2 (ja) 2005-07-27 2005-07-27 配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005217937A JP4648122B2 (ja) 2005-07-27 2005-07-27 配線基板及びその製造方法

Publications (3)

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JP2007035972A JP2007035972A (ja) 2007-02-08
JP2007035972A5 JP2007035972A5 (https=) 2008-07-10
JP4648122B2 true JP4648122B2 (ja) 2011-03-09

Family

ID=37794849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005217937A Expired - Fee Related JP4648122B2 (ja) 2005-07-27 2005-07-27 配線基板及びその製造方法

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JP (1) JP4648122B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4843538B2 (ja) * 2007-03-22 2011-12-21 富士通株式会社 回路基板及びその製造方法
JP5891814B2 (ja) * 2012-01-25 2016-03-23 大日本印刷株式会社 パターン構造体の製造方法とこれに使用するパターン形成用基材
JP6582850B2 (ja) * 2015-10-09 2019-10-02 富士通株式会社 密着性向上材料、配線構造、及びその製造方法、並びに半導体装置、及びその製造方法
JP2023104750A (ja) * 2022-01-18 2023-07-28 凸版印刷株式会社 多層配線基板およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4016078B2 (ja) * 2000-01-18 2007-12-05 株式会社東亜電化 プリント配線板の製造方法および多層プリント配線板
DE10066028C2 (de) * 2000-07-07 2003-04-24 Atotech Deutschland Gmbh Kupfersubstrat mit aufgerauhten Oberflächen

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Publication number Publication date
JP2007035972A (ja) 2007-02-08

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