JP4635836B2 - シート状電子回路モジュール - Google Patents

シート状電子回路モジュール Download PDF

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Publication number
JP4635836B2
JP4635836B2 JP2005328380A JP2005328380A JP4635836B2 JP 4635836 B2 JP4635836 B2 JP 4635836B2 JP 2005328380 A JP2005328380 A JP 2005328380A JP 2005328380 A JP2005328380 A JP 2005328380A JP 4635836 B2 JP4635836 B2 JP 4635836B2
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JP
Japan
Prior art keywords
insulating resin
sheet
resin layer
wiring board
semiconductor chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005328380A
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English (en)
Japanese (ja)
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JP2007134618A (ja
JP2007134618A5 (https=
Inventor
学 田崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2005328380A priority Critical patent/JP4635836B2/ja
Publication of JP2007134618A publication Critical patent/JP2007134618A/ja
Publication of JP2007134618A5 publication Critical patent/JP2007134618A5/ja
Application granted granted Critical
Publication of JP4635836B2 publication Critical patent/JP4635836B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2005328380A 2005-11-14 2005-11-14 シート状電子回路モジュール Expired - Fee Related JP4635836B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005328380A JP4635836B2 (ja) 2005-11-14 2005-11-14 シート状電子回路モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005328380A JP4635836B2 (ja) 2005-11-14 2005-11-14 シート状電子回路モジュール

Publications (3)

Publication Number Publication Date
JP2007134618A JP2007134618A (ja) 2007-05-31
JP2007134618A5 JP2007134618A5 (https=) 2008-09-25
JP4635836B2 true JP4635836B2 (ja) 2011-02-23

Family

ID=38156003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005328380A Expired - Fee Related JP4635836B2 (ja) 2005-11-14 2005-11-14 シート状電子回路モジュール

Country Status (1)

Country Link
JP (1) JP4635836B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102034798B (zh) * 2009-09-28 2013-09-04 日月光半导体制造股份有限公司 封装结构以及封装制程
KR102403468B1 (ko) * 2016-05-06 2022-05-31 스몰텍 에이비 어셈블리 플랫폼
CN106793707B (zh) * 2017-01-17 2023-03-14 扬州扬杰电子科技股份有限公司 一种二极管模块的框架及其加工方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3714286B2 (ja) * 2002-05-28 2005-11-09 松下電器産業株式会社 回路部品モジュールおよびその製造方法
JP2004363406A (ja) * 2003-06-06 2004-12-24 Honda Motor Co Ltd 樹脂封止電子部品ユニット及びその製造方法

Also Published As

Publication number Publication date
JP2007134618A (ja) 2007-05-31

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