JP4631984B2 - 回路部材接続用接着剤、回路板、及びその製造方法 - Google Patents

回路部材接続用接着剤、回路板、及びその製造方法 Download PDF

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Publication number
JP4631984B2
JP4631984B2 JP2009158970A JP2009158970A JP4631984B2 JP 4631984 B2 JP4631984 B2 JP 4631984B2 JP 2009158970 A JP2009158970 A JP 2009158970A JP 2009158970 A JP2009158970 A JP 2009158970A JP 4631984 B2 JP4631984 B2 JP 4631984B2
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JP
Japan
Prior art keywords
adhesive
circuit member
connection terminal
connection
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009158970A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010016383A (ja
JP2010016383A5 (enrdf_load_stackoverflow
Inventor
伊津夫 渡辺
賢三 竹村
朗 永井
和博 井坂
治 渡辺
和良 小島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2009158970A priority Critical patent/JP4631984B2/ja
Publication of JP2010016383A publication Critical patent/JP2010016383A/ja
Publication of JP2010016383A5 publication Critical patent/JP2010016383A5/ja
Application granted granted Critical
Publication of JP4631984B2 publication Critical patent/JP4631984B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers

Landscapes

  • Liquid Crystal (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP2009158970A 2009-07-03 2009-07-03 回路部材接続用接着剤、回路板、及びその製造方法 Expired - Fee Related JP4631984B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009158970A JP4631984B2 (ja) 2009-07-03 2009-07-03 回路部材接続用接着剤、回路板、及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009158970A JP4631984B2 (ja) 2009-07-03 2009-07-03 回路部材接続用接着剤、回路板、及びその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2009032626A Division JP4631979B2 (ja) 2009-02-16 2009-02-16 回路部材接続用接着剤並びに回路板及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010210835A Division JP4631998B1 (ja) 2010-09-21 2010-09-21 回路部材接続用接着剤、回路板、及びその製造方法

Publications (3)

Publication Number Publication Date
JP2010016383A JP2010016383A (ja) 2010-01-21
JP2010016383A5 JP2010016383A5 (enrdf_load_stackoverflow) 2010-03-04
JP4631984B2 true JP4631984B2 (ja) 2011-02-16

Family

ID=41702125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009158970A Expired - Fee Related JP4631984B2 (ja) 2009-07-03 2009-07-03 回路部材接続用接着剤、回路板、及びその製造方法

Country Status (1)

Country Link
JP (1) JP4631984B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69830623T2 (de) 1998-08-13 2006-05-04 Hitachi Chemical Co., Ltd. Klebstoff zum verbinden von schaltelementen, leiterplatte und verfahren zur herstellung derselben
JP4928378B2 (ja) * 2007-08-06 2012-05-09 日立化成工業株式会社 回路部材接続用接着剤
JP4631979B2 (ja) * 2009-02-16 2011-02-16 日立化成工業株式会社 回路部材接続用接着剤並びに回路板及びその製造方法
WO2011126018A1 (ja) * 2010-04-09 2011-10-13 オリンパスメディカルシステムズ株式会社 接着剤組成物および内視鏡装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6015596A (en) * 1995-06-13 1997-01-09 Hitachi Chemical Company, Ltd. Semiconductor device, wiring board for mounting semiconducto r and method of production of semiconductor device
EP0914027B1 (en) * 1996-07-15 2002-10-09 Hitachi Chemical Company, Ltd. Film-like adhesive for connecting circuit and circuit board
JP4440352B2 (ja) * 1997-02-17 2010-03-24 日立化成工業株式会社 回路部材接続用接着剤
JP2007113012A (ja) * 2006-11-13 2007-05-10 Hitachi Chem Co Ltd 回路部材接続用接着剤
JP4928378B2 (ja) * 2007-08-06 2012-05-09 日立化成工業株式会社 回路部材接続用接着剤
JP4631979B2 (ja) * 2009-02-16 2011-02-16 日立化成工業株式会社 回路部材接続用接着剤並びに回路板及びその製造方法

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Publication number Publication date
JP2010016383A (ja) 2010-01-21

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