TW402631B - An adhhesive for connecting circuit members, a circuit board and a method of manufacturing the circuit board - Google Patents

Abstract

The present invention provides an adhesive for connecting circuit members, a circuit board in which the adhesive is used for adhering the circuit members to each other, and a method of manufacturing the circuit board. The adhesive adheres and fixes a semiconductor chip to a substrate ad electrically connects electrodes of the semiconductor chip and the substrate, The adhesive comprises an adhesive layer containing an adhesive resin composition and 10-200 parts by weight of an inorganic filler with respect to 100 parts by weight of the adhesive resin compound.

Description

Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Λ7 Η 7 V. Description of the Invention (,) [Technical Field] The present invention relates to, for example, a semiconductor chip and a substrate which are simultaneously conductively connected while being fixed by a flip chip interposer method Adhesives for connecting circuit members using the same electrodes, circuit boards connected to the same circuit members, and manufacturing methods thereof. [Background Technology] In the field of semiconductor interposers, a flip-chip type in which an IC (Intergrated Circuit) chip is directly mounted on a printed circuit board or a flexible wiring board in a new interposer form corresponding to cost reduction and high precision. Instrumentation has been noticed. As a flip-chip insertion method, a method of providing a solder bump on a terminal of a wafer, performing a soldering method, or a method of conducting a conductive connection through a conductive adhesive is known. In these methods, when exposed to various environments, there is a problem that stress is generated at the connection interface according to the difference in thermal expansion coefficient between the connected wafer and the substrate, and the connection reliability is reduced. Therefore, generally, a method for injecting an epoxy-based underfill material into a gap between a wafer and a substrate has been reviewed for the purpose of reducing stress on the connection interface. However, this unfilled injection process will complicate the process and cause disadvantages in terms of productivity and cost. In order to solve such problems, recently, flip-chip mounting using an anisotropic conductive adhesive having an anisotropic conductivity and a sealing function has attracted attention from the viewpoint of so-called process simplicity. However, the wafer is directly mounted on the substrate through an anisotropic conductive adhesive. The paper size applies the Chinese National Standard (CNS) A4 specification (2ΙΟ × 297 mm) (Please read the precautions on the back before filling this page)

-4-—mmzi _ ^ _____________________________________ 5. The description of the invention (2) is a temperature cycle test. Because stress is generated at the connection part based on the difference in thermal expansion coefficient between the wafer and the substrate, a thermal shock test and a PCT (Pressure Cooker Test) test are performed. Reliability tests such as solder bath dipping tests may cause problems such as an increase in connection resistance or peeling of the adhesive. In addition, when a bump electrode is formed on a connection terminal of a wafer, a reliability test is performed. According to the difference in thermal expansion coefficient between the wafer and the substrate, the stress is concentrated at the interface between the bump electrode and the wafer. Problem. [Invention of Invention] The present invention is to provide a connecting agent for connecting circuit members that does not increase the connection resistance or disengagement agent at the connection portion, which greatly improves connection reliability, a circuit board for connecting the same circuit members, and a method for manufacturing the same. The first adhesive for connecting circuit components of the present invention is an adhesive for connecting circuit components that is interposed between opposing circuit electrodes, presses the opposing circuit electrodes, and electrically connects the electrodes in a pressure direction; Features are as follows: Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, which contains an adhesive resin composition and an inorganic filler. The weight ratio of the adhesive resin composition is 100, and the weight ratio of an inorganic filler is 10 to 2 0. . In addition, the second bonding agent for connecting circuit members of the present invention is a bonding agent for connecting circuit members that is not interposed between opposed circuit electrodes, presses the opposed circuit electrodes, and conducts conductive connection between the electrodes in the direction of pressure. Agent; with adhesive resin composition and inorganic filler material, -5- for the adhesive resin composition with a weight ratio of 100 to 2-0, containing inorganic filler material -5- (Please read the precautions on the back before filling (This page) This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210X 297 mm) 402631 B7 V. Description of the invention (3) The first adhesive layer with weight ratio and the first adhesive layer with adhesive resin composition as the main component 2 A multi-layer structure of an adhesive. (Please read the precautions on the back side before filling out this page) In addition, the third circuit member connection adhesive of the present invention is interposed between opposing circuit electrodes and pressurizes between opposing circuit electrodes. Adhesive for connecting circuit members between electrodes in a conductive connection pressure direction; it is characterized by containing an adhesive resin composition and an inorganic filler material. The average thermal expansion coefficient of the adhesive after hardening at 110 ° C to 130 ° C is Below 20 ppm / ° C. Ideally, the average thermal expansion coefficient of 1 1 0 to 1 30 ° C after the adhesive hardens is 30 to 200 ppm / ° C. In addition, the fourth bonding agent for connecting circuit members of the present invention is a bonding agent for connecting circuit members between electrodes that are opposed to each other, presses the opposed circuit electrodes, and electrically connects the electrodes in a pressing direction. It has a multilayer structure of a third adhesive layer and a fourth adhesive layer which have mutually different physical properties. The elastic modulus of the adhesive after hardening is the first adhesive layer > the fourth adhesive layer; the elastic modulus at 40 ° C after the fourth adhesive layer is cured is preferably 100 to 2000 MPa. Printed by the Employees' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. The expansion coefficient of the above-mentioned adhesive is the third adhesive layer < the fourth adhesive agent; the expansion up to 3 ° ~ 100 ° C of the third adhesive layer. The coefficient is ideally 20 to 70 p pm. The glass transition temperature of the adhesive is the third adhesive layer > the fourth adhesive layer; the glass transition temperature of the third adhesive layer is preferably 120 ° C or higher. The adhesive layer of at least one of the above 3 and 4 can be used for -6-this paper size is applicable to China National Standard (CNS) A4 specification (210 × 297 mm) immt ai B? 5. Description of the invention (4) A weight ratio of 100% by weight of the resin composition is contained, and a weight ratio of 100 ~ 200 inorganic filler is included. The above-mentioned adhesive agent 'may contain a volume ratio of 1 to 30 conductive particles with respect to a 100 volume ratio of the adhesive resin composition. In the above-mentioned adhesive, it is preferable that the elastic modulus at 40 ° C after curing of the adhesive resin composition is 30 to 2000 MPa. The adhesive composition contains an epoxy resin, an acrylic rubber, and a latent hardener. It is desirable that the acrylic rubber contains a glycidyl ether group in its molecule. The said adhesive may have a sheet shape. The circuit board of the present invention is configured such that a first circuit member having a first connection terminal and a second circuit member having a second connection terminal are arranged so that the first connection terminal and the second connection terminal face each other, and An adhesive is interposed between the first connection terminal and the second connection terminal which are arranged opposite to each other. After being heated and pressurized, it is conductively connected to the circuit boards of the first connection terminal and the second connection terminal arranged opposite to each other; the above-mentioned adhesive is an adhesive for connecting circuit members of the present invention. The first circuit member having the first connection terminal is an inorganic insulating substrate having the first connection terminal. When the second circuit member having the second connection terminal is an organic insulating substrate having the second connection terminal. The first adhesive layer or the third adhesive layer is used to be adhered to the first circuit member side. The adhesive for the connection of circuit components of the present invention is to be applied at a standard size (CNS) A4 ^ (210X297 ^ t) in order to isolate it at the same size (please read the precautions on the back before filling this page). Ar A7 iSl. V. Description of the Invention (5) Adhesive for connecting circuit members between opposing circuit electrodes, which presses the opposing circuit electrodes and electrically connects the electrodes in the pressing direction; contains an adhesive resin The composition and the non-defective filling material contain a weight ratio of 100 to the resin composition, a weight ratio of 10 to 2 0 for an adhesive for connecting circuit components, or a weight ratio of 100 to the resin composition. A multilayer adhesive composed of a first adhesive layer containing a weight ratio of 10 to 2000 inorganic filler and a second adhesive layer including a resin composition as a main component, and an adhesive for connecting circuit members. The adhesive for circuit member connection invented in this sample is a resin composition for a circuit member connection adhesive containing 100 to 200 weight ratio of resin components and a weight ratio of 10 to 200 inorganic fillers. The elasticity at 40 ° C is preferably 30 ~ 2 0 MPa. At this time, the elasticity of the adhesive at 40 ° C can be 100 ~ 5000 MPa, exceeding 2000 MPa. ideal. After the resin composition is hardened, the elasticity at 40 ° C is 30 ~ 2 0 OMP a. Because it contains an inorganic filler, the elasticity at 40 ° C of the adhesive exceeds 2 0 0 Μ P a, It can reduce the stress caused by bonding the resin composition with a low elastic modulus, reduce the coefficient of thermal expansion with an inorganic filler, and provide an adhesive for connecting circuit components with excellent connection reliability. It is desirable that the second adhesive layer containing the adhesive resin composition as a main component does not contain an inorganic filler, but in order to adjust the characteristics, it may contain a smaller amount than the inorganic filler in the first adhesive layer. For example, the content is less than 50% by weight, and the content is preferably less than 20% by weight. (Please read the precautions on the back before filling out this page) Packing. -6 The paper size printed by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) _ 〇_ 462631_______in … -— ____________ V. Description of the invention (6) In addition, the second adhesive layer mainly composed of an adhesive resin composition may be an elastic modulus of 40 ° C after hardening of 1 0 0 to 2 0 0 0 Adhesive layer of MPa. The adhesive used in the multilayer structure of the present invention is desirably arranged in accordance with the elastic modulus or the thermal expansion coefficient of the connected circuit members. That is, it is desirable to arrange the adhesive so that it is relatively on the side of the circuit component with a relatively large elastic modulus or a small thermal expansion coefficient, and then relatively large elastic modulus or a small thermal expansion coefficient or a high glass transition temperature. The third adhesive layer side is relatively on the side of the circuit member having a small elastic modulus or a large thermal expansion coefficient, and then the fourth elastic layer has a relatively small elastic modulus or a large thermal expansion coefficient or a low glass transition temperature. side. Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. For the adhesive used in the multilayer structure of the present invention, for example, when connecting a semiconductor wafer to an organic insulating substrate, alleviate the difference caused by the thermal expansion coefficient between the wafer and the organic insulating substrate. The purpose of the stress is to 'the elasticity of the 4 ° C adhesive layer constituting the surface on the side of the organic insulating substrate after hardening is preferably 100 to 200 OMP a. The elasticity at 40 ° C of the third adhesive layer constituting the semiconductor wafer-side surface is higher than that of the fourth adhesive layer, and 500 to 500 OMP a is used. In addition, for the purpose of easing the stress caused by the difference in thermal expansion coefficient between the semiconductor wafer and the organic insulating substrate, the thermal expansion coefficient up to 30 ° to 100 ° C of the second adhesive layer constituting the surface on the side of the semiconductor wafer is 2 0 to 7 0 p P m / ° C is preferable; the thermal expansion coefficient up to 30 to 100 ° C of the fourth adhesive layer constituting the surface on the side of the organic insulating substrate is lower than that of the third adhesive layer Big 'is 3 0 ~ 1 0 0 p pm / ° C. Reasonable -9-This paper size is applicable to Chinese National Standard (CNS) Ad specifications (210X297 mm). 5. Description of the invention (7). (Please read the precautions on the back before filling this page.) In addition, for the purpose of easing the stress caused by the difference in thermal expansion coefficient between the semiconductor wafer and the organic insulating substrate, the glass constituting the third adhesive layer on the side of the semiconductor wafer is intended The mobility is preferably 120 ° C or higher, and more preferably 180 ° C or lower; the glass transition temperature of the fourth adhesive layer constituting the surface on the side of the organic insulating substrate is lower than that of the third adhesive layer ideal. The adhesive layer of at least one of the third and the fourth may contain an inorganic filler. The thermal expansion coefficient and glass transition temperature of the hardened material of the adhesive film at the stage after the adhesive agent are adhered. For example, a vacuum mechanical test machine TM-7000 (tensile mode, machine weight 5gf, at 5 ° C / minute) can be used. Temperature rise). However, the subsequent hardening of the diaphragm is performed under the same conditions as the heating temperature and time during the subsequent process; the hard & This type of adhesive film hardening is measured by DSC (Different Scanning Calorimeter) Λ, and completes 90% or more of the heat generated by the full hardening. Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs of the adhesive resin composition used in the present invention, epoxy resin, and imidazoline-based, hydrazide-based, boron trifluoride monoamine complex, sulfo aluminum salt, A mixture of latent hardeners such as amines, polymeric amine salts, and cyanocyanine; In order to reduce the stress caused by the difference in thermal expansion coefficient of circuit components, the subsequent elasticity at 40 ° C is 3 0 to 2 0 0 0 The resin composition of M Pa is preferable. For example, as an adhesive resin composition that obtains good fluidity or high connection reliability at the time of connection, the Chinese national standard (CNS) A4 standard (210) is applied to epoxy resin, and imidazoline-based, hydrazide-based, and three paper standards (210 '乂 297 mm) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs --- 412Μί ________ ?? ____________________________________________________________________________________________________________________________________________ 5. Description of the Invention (8) Boron fluoride-amine complex, sulfoaluminum salt, imine, polyamine cyanide A mixture of latent hardeners such as acid amines, and acrylic rubber is preferably used so that the subsequent 40 ° C elasticity is 30 ~ 2 0 0 〇 Μ Pa. The elastic modulus of the cured resin composition corresponding to the stage after the resin composition is adhered can be, for example, a spectrum analyzer DVE-4 manufactured by Leo Rocky Corporation (tensile mode, frequency 10 Hz, temperature rise at 5 ° C / min.) —4 0 ° C ~ 2 50 t), and the DVE method is used for measurement. However, the subsequent hardening of the resin composition is performed under the same conditions as the heating temperature and time during the bonding process; the hardening can be performed by immersing the film of the subsequent resin composition in an oil bath. Such a cured film of the resin composition is a case where DSC is used for measurement to complete the full-hardening calorific value of 90% or more. The epoxy resins are bisphenol-type epoxy resins derived from chloromethyloxypropane and bisphenol A or F ′, AD, and the like, and methyl epoxy propanes and phenolic or cresol novolacs. Derived phenolic epoxy resin, or naphthalene-based epoxy resin having a skeleton containing a naphthalene ring, having two or more epoxy resins in one molecule such as epoxypropylamine, glycidyl ether, biphenyl, and alicyclic Various epoxy compounds such as propyl may be used alone or in combination of two or more. These epoxy resins are high-purity products that reduce impurities (N a +, C 1 — etc.) or hydrolyzable chlorine to less than 300 p p m, and are ideal for preventing electron migration. The epoxy resin is preferably a trifunctional or more polyfunctional epoxy resin and / or a naphthalene epoxy resin because of lowering the coefficient of thermal expansion and increasing the glass transition temperature. Polyfunctional epoxy resin with 3 or more functions, with phenolic ring (Please read the precautions on the back before filling this page)

This paper size is applicable to Chinese National Standard (CNS) A4 specifications (ΉΟ × 297 公 Fj -11-printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Λ 7 _4§lS3i _____________ ^ — ____ —_ — __ 5. Description of the invention (9) Oxygen resin , Cresol-type epoxy resin, trihydroxyphenol methane-type epoxy resin, tetraphenylethane-type epoxy resin, bicyclic divinylphenol-type epoxy resin, etc. In addition, the naphthalene-based epoxy resin has at least 1 molecule. It has a skeleton containing one or more naphthalene rings, and includes naphthol and naphthalene glycol. As acrylic rubber, at least one of acrylic acid, acrylate, methacrylate, and acrylonitrile is used as a monomer component. Polymers or copolymers, which also use glycidyl acrylate containing glycidyl ether groups or acrylic acid copolymers containing copolymers of epoxy acrylates. The molecular weight of these acrylic rubbers increases from the resin composition The point of cohesive force is more than 200,000. The compounding amount of the acrylic resin adhesive resin composition is 15% by weight or less, and the elastic modulus after the subsequent 40t When it exceeds 200 OMP a, if it is formed to 40% by weight or more, the elasticity will be reduced. However, the melt viscosity at the time of adhesion will be increased, and the melting adhesive at the interface between the electrodes or the interface between the electrodes and the conductive particles will be reduced. It is impossible to ensure electrical conduction between the connecting electrodes or between the connecting electrodes and the conductive particles. Therefore, the mixing amount of propylene is preferably 15 to 40% by weight. These acrylic rubbers compounded with the resin composition cause rubber The peak temperature of the induction tangent of the components is around 40 ° C ~ 60 ° C, so that the low elasticity of the adhesive composition can be achieved. After the resin composition is cured, the elasticity of 40 ° C is 30 ~ 2 〇 0 0 Μ P a is ideal; the elastic modulus at 40 ° C of the adhesive can be 100 ~ 5000MPa, and can exceed 2000. In addition, in order to make the film easier to form with the adhesive, so (please first Read the notes on the reverse side and fill out this page)-Binding. Order. # This paper size applies to the Chinese National Standard (CNS) A4 (210X 297) -12- Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Λ7 Following £ .3: ί _______ Β7 ____________________________________________________________________________________ 5. Description of the Invention (ίο) Thermoplastic resins such as phenoxy resins can be blended. Especially phenoxy resins are similar to epoxy resins in structure, so they have compatibility with epoxy resins. It has excellent properties. The film formation system connects these at least with epoxy resin, acrylic rubber, phenoxy resin, and latent hardener. The composition and conductive particles are dissolved or separated in an organic solution to form a liquid state. It is formed by coating on the surface of a peelable substrate and removing the solvent at a temperature lower than the active temperature of the hardener. The solvent used at this time is a mixed solvent of an aromatic hydrocarbon-based solvent and an oxygen-containing solvent, and it is preferable to increase the solubility of the material. There are no particular restrictions on the inorganic filler material to be thrown away in the present invention, and examples thereof include powders of melted silica, crystalline silica, calcium silicate, alumina, and calcium carbonate. The blending amount of the inorganic filler is 100 to 200 weight ratio for the resin composition. The blending amount has a considerable effect on reducing the thermal expansion coefficient. However, a large amount of the blending material will produce The conductivity is poor due to the decrease of the adhesiveness of the adhesive at the connection part or the reduction of the adhesive. The reduction of the blending amount cannot sufficiently reduce the thermal expansion coefficient. Therefore, a weight ratio of 20 to 90 is preferable. The average particle diameter is preferably 3 V m for the purpose of preventing poor conduction at the connection portion. In addition, for the purpose of preventing the decrease in resin fluidity during contact and the destruction of the passivation film of the wafer, it is preferable to use a spherical filler. The adhesive of the present invention mixes and disperses electrical conductivity for the purpose of absorbing the unevenness in the height of the bumps of the wafer or the substrate electrodes, and actively disperses the electrical conductivity. Particles may be used. According to the present invention, the conductive particles are, for example, Au,

Metal particles such as Ag, Cu, or solder; in polymers such as polystyrene (please read the precautions on the back before filling this page)

This paper size applies to China National Standard (CNS) A4 (210X 297 mm) -13- Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs Λ7 B? V. Description of the invention (11) Spherical nuclear material Ni, Cu , Au, solder and other conductive layers are more ideal. Furthermore, a surface layer such as Su, Au, or solder may be formed on the surface of the conductive particles. The particle size must be smaller than the minimum interval between the substrate electrodes, and there is an imbalance in the electrode height. It is more desirable than the height imbalance, and 1 to 10 μm is more desirable. In addition, the amount of conductive particles dispersed in the adhesive is 0.1 to 30 volume ratio with respect to 100 volume ratio of the adhesive resin composition; ideally, 0.2 to 15 volume ratio. The adhesive of the present invention, Can be used as a film-like adhesive. The film-shaped adhesive is formed by dissolving or dispersing an adhesive composition formed of an epoxy resin, an acrylic rubber, a latent hardener, or the like in an organic solvent to liquefy it. It is applied to a peelable substrate and cured. It can be obtained by removing the solvent below the temperature of the agent. The multi-layered film-shaped adhesive includes, for example, a first or third film-shaped adhesive and a second or fourth film-shaped adhesive, each of which is formed by coating with polyethylene terephthalate After the surface of the release film (peelable substrate) made of fluorinated resin, etc., the first or third film-shaped adhesive and the second or fourth film are heated under pressure or simultaneously with pressure. Method of laminating adhesives and laminating them to obtain a film-shaped adhesive formed by the first or third film-shaped adhesive and the second or fourth film-shaped adhesive, or the above-mentioned release film The first or third film-like adhesive (or the second or fourth film-like adhesive) is formed on the surface of the sheet, and the second or fourth film-like adhesive (or the first or fourth film) is superimposed. It is the 3rd sheet-like adhesive) and then applied to form 'the 1st or 3rd sheet-like adhesive and the 2nd or 4th paper size are applicable to the Chinese National Standard (CNS) A4 specification (2) 0X297 (Public note) (Please read the precautions on the back before filling this page), ιτ shed ES3: i V. Description of the invention (12) The film-shaped adhesive formed by the film-shaped adhesive method. The total thickness of the film-shaped adhesive formed by laminating the first or third film-shaped adhesive and the second or fourth film-shaped adhesive is preferably 20 to 1 2 0; the first or the first The thickness ratio of each of the 3 film-shaped adhesives and the second or 4 film-shaped adhesives; the first or third film ^ dog adhesive: the 2 or 4 film-shaped adhesives = 1 The range of: 9 to 9: 1 is preferable. Especially for the connection between the semiconductor wafer and the organic insulating substrate, the first or third film-like adhesive: the second or fourth film-like adhesive. The range of the adhesive = 3: 7 to 7: 3 is preferable. The film thickness of the film-shaped adhesive is preferably thicker than the gap between the first and second circuit members, and is generally ideal for a thickness of 5 v m or more. For the circuit member of the present invention, it refers to wafer parts using semiconductor wafers, capacitor wafers, etc .; printed circuit boards; substrates such as flexible wiring boards based on polyimide or polyester. The printed chip components of the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs are formed of a plurality of connection terminals on non-metallic inorganic insulating substrates such as silicon, glass, ceramics, and compound semiconductor substrates; printed circuit boards, polyimide, or polyester A substrate such as a flexible wiring board of a base material has a plurality of connection terminals formed on an organic insulating substrate. An organic insulating substrate formed with electrodes (connection terminals) corresponding to the terminals of a semiconductor wafer is used as a substrate for inserting wafer components. Organic insulating substrates are used in synthetic resin films such as polyimide resins and polyester resins; or glass substrates such as interlaced glass and glass nonwoven fabrics impregnated and hardened with polyimide resin, epoxy resin, phenol Resin 15- This paper size is applicable to China National Standard (CNS) Λ4 specification (2 丨 0X 297 mm) Λ7 Λ7 Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Printed by Consumers Cooperatives 5. Inventory of resin (13), etc. board. It is possible to use an electrode for connection with a wafer terminal, a surface insulating layer forming the electrode, a predetermined number of insulating layers, a predetermined number of wiring layers arranged between the insulating layers, and a conductive connection. A multilayer wiring board having a hole or the like to be conductive between the electrode and the wiring layer. A multilayer multilayer substrate in which an insulating layer and a conductor circuit layer are alternately formed on the surface of a substrate having an insulating layer made of staggered glass or a conductor circuit having one or more conductor circuits. ideal. A resin film can be used for the surface insulation layer; this resin film is made of epoxy resin, polyimide resin, polyamide imine resin, p-polyphenylene ether resin, phenoxy resin, amide epoxy resin, and phenolic resin. Films of resins, or mixtures of these, copolymers, etc .; Heat-resistant thermoplastic engineering plastic films such as polycode, polyether, polyether ketone ether, fully aromatic liquid crystal polyester, fluororesin, etc. sheet. Films containing organic or inorganic filler materials in the resin film can also be used. The insulating layer formed of a resin reinforced by a glass substrate can be used for a polyester film of a glass substrate impregnated with a glass substrate, a glass nonwoven fabric, or the like, impregnated with a resin such as an epoxy resin or a phenol resin. In circuit components, there are usually a plurality of connection terminals (may be singular), and at least one set of the above-mentioned circuit components is provided in at least a part of the connection terminals of the circuit components. The spacer adhesive is conductively connected to the same connection terminal after being heated and pressurized as a circuit board. Because at least one set of circuit components are heated and pressurized, the opposite configuration -------- @ ^ 1 ----- t ----- d (Please read the precautions on the back before filling in this Page ”This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 male) -16- 4❹ 2631: V. The same connection terminal of the invention description (14), in direct contact or through an isotropic conductive adhesive The conductive particles on the semiconductor wafer or substrate are conductively connected. The bumps or metal wires formed by electroplating are melted on the electrode guide of the semiconductor wafer or substrate to form a sphere, and the sphere is pressed against the electrode guide. A protruding electrode such as a wire bump obtained by cutting the wire can be used as a connection terminal. A first circuit member formed of an inorganic insulating substrate and a first circuit member formed of an organic insulating substrate are connected with a film-shaped adhesive. 2 circuit members, for example, a method for manufacturing a circuit board. / A first circuit member formed by an organic insulating substrate having a first connection terminal and a first connection terminal and a second connection terminal facing each other, and Organic matter of the second connection terminal The second circuit member formed on the edge substrate; the adhesive for connecting circuit members of the present invention is arranged so that the first or third adhesive layer is formed on the first circuit member side so as to be interposed therebetween. The circuit board of the present invention can be manufactured by applying pressure between the first connection terminal and the second connection terminal arranged to the conductive connection between the first connection terminal and the second connection terminal arranged opposite to each other by conduction. Printed by the Bureau of Standards and Consumer Cooperatives (please read the precautions on the back before filling this page) 4 Specifically, for example, first contact the second circuit member with the surface of the film-like second or fourth connecting agent layer, The film-shaped adhesive is temporarily fixed to the second circuit member. Further, the electrodes of the first circuit member and the electrodes of the second circuit member are positioned, and each electrode is added from the first circuit member side to each of the electrodes 2 to 1 With a load of 50 gf, the film-shaped adhesive is heated to 10 to 20 seconds to make the film-shaped adhesive harden. The film-shaped adhesive is hardened. Therefore, the first circuit member is conductively connected. Electrode and 2nd circuit This paper is applicable to Chinese national standard (C NS) Λ4 specification (210 × 297 mm) -17- B?

B? Printed by the Central Standards Bureau of the Ministry of Economic Affairs and Consumer Cooperatives II. V. Description of the invention (15) At the same time as the electrode of the component, the connection between the first circuit component and the second circuit component is maintained by the hardening of the film-shaped adhesive. status. An example of connecting a semiconductor wafer to a plug-in board will be described with reference to FIGS. 1 and 2. The first figure shows the connection between a semiconductor wafer and a substrate with an adhesive containing no conductive particles. Fig. 2 shows the case shown in Fig. 1. A semiconductor wafer and an interposer substrate 0 are connected with an adhesive containing conductive particles. The electronic component device shown in Fig. 1 is an interposer substrate 20,. A semiconductor wafer 10 or the like inserted into the substrate 20 is configured. However, Fig. 1 shows a part of the electronic component device. In fact, other components such as other semiconductor wafers are mounted on the interposer substrate 20. The semiconductor wafer 10 is a bump electrode (Bump) formed on one surface thereof so as to be connected to the electrode '11'. The electrode 1 1 is connected via this, and is electrically connected to the interposer substrate. The interposer substrate 20 includes a plurality of insulating layers 21 and 22, and a plurality of wiring layers 3 2, 3 3 arranged between the insulating layers 2 1 and 2 2 and connected to the semiconductor wafer 10. Among the connection electrode terminals 3 1 to which the electrode 11 is connected, and the wiring layers 3 2 and 3 3, a conductor 34 is provided which penetrates the insulating layers 2 1 and 22 to conduct a specific wiring layer connection. In order to penetrate the conductors 3 to 4, the insulating layers 2 1 and 2 2 are provided with holes 25 as through holes in necessary places. That is, this plug-in board is a resin composite multilayer wiring board. Here, the wiring layer 3 2 is provided as an inner layer circuit; the wiring layer 3 3 and the connection electrode terminal 31 are provided as a multilayer circuit (please read the precautions on the back before filling this page)

This paper size applies to Chinese National Standard (CNS) A4 specification (210X297g t) -18- Tong 631 A7 B7 V. Description of invention (16). The connection electrode terminal 31 has a function of mounting a conductor circuit of a chip thereon. Bumps of the connection electrodes 11 provided on the semiconductor wafer 10 are positioned so as to be connected to the electrode terminals 31 provided on the surface of the interposer substrate 20. Between the semiconductor wafer 10 and the interposer substrate 20, a film-like adhesive 40 for bonding is arranged. In this state, the semiconductor wafer 10 is heated under pressure, and the adhesive flows and hardens. The connection electrode 11 provided on the semiconductor wafer 10 and the connection electrode terminal 3 1 provided on the surface of the interposer substrate 20 are directly mechanical. Conductive connection after sexual connection. In the case of using an anisotropic conductive adhesive in which conductive particles 41 are dispersed. In the case of an adhesive 40, as shown in FIG. 2, the electrode 11 and the connection terminal 31 are connected between these electrodes. The conductive particles 41 are connected while being fixed in the state. In the case of the anisotropic conductive adhesive 40, in a state in which the electrode surfaces which are to be connected and opposed to each other are crimped, the opposing electrodes are electrically connected through the conductive particles existing between them. In addition, since the adhesive contained conductive particles between adjacent electrodes, the density of the conductive particles was low, and thus the conductivity was not shown. The interposer substrate 20 includes a first insulating layer 21 having at least one layer of resin reinforced with a glass substrate, and a second insulating layer 22 constituting at least one layer on which the above-mentioned electronic component is fixed. However, in the example of Fig. 1, a second insulating layer 22 is also provided on a side different from the side where the electron zero side is fixed. According to the adhesive of the present invention, the stress on the surface of the adhesive for connecting semiconductor wafers and circuit components can be relieved, and others are used as adhesive resin compositions. (Please read the precautions on the back before filling this page)

Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Consumer Cooperatives. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297). -19- Printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the invention (17) , When the elasticity rate at 40 ° C is 3 0 ~ 2 〇 〇 〇 Μ Pa, and then the resin composition can be absorbed and can be absorbed by the reliability test such as thermal shock, PCT or solder bath dipping test. The stress, even after the reliability test, will not increase the connection resistance and the peeling adhesive at the connection part, which will greatly improve the connection signal. According to the present invention, since the slope of physical properties can be provided in the thickness direction of the adhesive for connection of circuit members, it is possible to absorb internal stress generated by reliability tests such as thermal shock, P c T or solder bath dipping tests, and rely on trust. After the property test, the connection resistance at the connection portion or the peeling adhesive is not increased, and the connection reliability is improved. In addition, a film-shaped adhesive is convenient for usability. Therefore, the adhesive of the present invention only faces the direction of pressure during connection. The LCD (Liquid Crystal Display) panel and TAB (Tape Automated Bonding), TAB and flexible circuit board, LCD panel and IC chip, IC are conductively connected. Wafers and printed circuit boards are suitable for use. The circuit board of the present invention can absorb the stress generated by the reliability test 'and does not increase the connection resistance or the peeling adhesive at the connection portion after the reliability test, thereby greatly improving the connection reliability. In addition, in the circuit board of the present invention, a bonding film with a small thermal expansion coefficient on the wafer side can alleviate the stress at the interface between the wafer and the adhesive. Therefore, when a protruding electrode is provided on the electrode guide of the wafer, the temperature can be greatly reduced. It was peeled from the electrode guide of the protruding electrode under the cycle test. [Simplified description of the drawing] (Please read the precautions on the back before filling this page)

, 1T Wei This paper scale is applicable to Chinese National Standard (CNS) A4 specification (210X297g t) -20- 31 Λ7 B7 V. Description of the invention (18) The first series is a sectional view showing a configuration example of the electronic component device of the present invention Fig. 2 is a cross-sectional view showing an example of a connection state between an electronic component and a plug-in board. Main green component comparison table 1 0 Semiconductor wafer 1 1 Connection electrode 2 0 Insertion substrate 2 1,22 Insulation layer 2 5 Hole 3 1 Connection electrode terminal 3 2, 3 3 Wiring layer 3 4 Conductor 4 0 Adhesive 4 1 Conduction Particles (please read the precautions on the reverse side and fill in this page). Binding and ordering Λ Employees 'Cooperative Consumers' Association of the Ministry of Economic Affairs [Embodiment] Example 1 50 g of phenoxy resin and copolymerized butyl acrylate ( 40 ratio), ethyl acrylate (30 ratio), acrylonitrile (30 ratio), epoxy acrylate (30 ratio) acrylic rubber (molecular weight: 850,000) 12 5g, dissolved in tetraethyl lead acetate 40 0g to obtain a 30% solution. This paper size applies the Chinese National Standard (CNS) Λ4 specification (21 × 297 mm) -21-Printed by the Consumers 'Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Λ7 B7 Five' Invention Note (19) Then, it will contain the potential of microcapsule type A liquid epoxy resin (epoxy content: 1 8 5) of 3 2 5 g of a hardener is added to the solution, and after stirring, the molten silicon dioxide is bonded to the resin composition at a weight ratio of 100 to 40 by weight. (Average particle diameter: 0.5 μm), and further disperse nickel particles (diameter: 3 #m) by 2% by volume to obtain a film coating solution. Apply this film coating solution to the barrier with a roller brush. Sheet (silicon-treated polyethylene terephthalate film, thickness: 40 # m), dried at 100 ° C for 10 minutes to form an adhesive film A having a thickness of 4 5. However, the elasticity at 40 ° C of the resin composition after removing the molten silicon dioxide and nickel particles from this adhesive film a was measured by a dynamic viscoelasticity measuring device. The elasticity was 80 MPa. Next, using the obtained adhesive sheet a ', a wafer with gold bumps (area: 80 // mx80; am, space 30 # m, height: 15em' bump number: 288) was performed as shown below ( lOmmx 10mm, thickness: 0.5mm) and Ni / Au plated Cu circuit printed circuit board connection. First, the diaphragm a (12 mm x 12 mm) was bonded to a Ni / Au plated Cu circuit printed circuit board (electrode height: 20 // m, thickness: 0 · 8mm) at 80Ό and 10kgf / cm2. , Peeling off the spacer, and positioning the bumps of the wafer and the N i / A u electric cu circuit printed circuit board (thickness: 0.8 mm). Then ‘heated from above the wafer at 180 ° C, 30 g / bulk for 20 seconds,’ and connected after pressing. -·--1-1 ί 1. 1 ^ 1 i-I o (Please read the notes on the back before filling out this page) --5 This paper size is applicable to the Chinese National Standard (CNS) Λ4 specification (210X297 mm) -22- Printed by the Consumer Cooperative of the Central Standards Bureau, Ministry of Economic Affairs, Printed by Na 631 V. Invention Description (20). The connection impedance after connection is up to 6πΩ for each bump, and the average is 2ηΩ; the insulation resistance is 1 08Ω; these are —5 5 ~ 1 2 5 ° C thermal shock test 1 000 cycle treatment, p CT test (1 21 ° C, 2 atmospheres) for 200 hours, 2 60 ° C solder bath dipping for 10 seconds It does not change afterwards, indicating good connection reliability. Example 2 50 g of phenoxy resin was copolymerized with butyl acrylate (40 ratio), ethyl acrylate (30 ratio), acrylonitrile (30 ratio), and epoxy acrylate (30 ratio). 17 5 g of acrylic rubber (molecular weight: 850,000) was dissolved in 5 2 5 g of tetraethyl lead gallate to obtain a 30% solution. Next, a liquid epoxy resin (epoxy content: 1 8 5) containing 2 5 5 g containing a microcapsule-type latent hardener was added to this solution, and after stirring, the weight ratio of the resin composition to 100 was 60% by weight of melted silicon dioxide (average particle diameter: 0.5 // m), and 2% by volume of nickel particles (diameter: 5 / zm) were dispersed to obtain a solution for film coating work. Roller brush This film coating solution was applied to a separator (silicon-treated polyethylene terephthalate film, thickness: 40 # m), and dried at 100 ° C for 10 minutes to form Adhesive film b with a thickness of 4 5 # m. Using a dynamic viscoelasticity measuring device, the elasticity at 40 ° C of the resin composition adhering to the molten silicon dioxide and nickel particles from which the adhesive film b was removed was 400 MPa. (Please read the precautions on the back before filling out this page)

M f paper size: Chinese national standard (~? NS) Λ4 specification (210x797) t _ 〇3-Λ7 ____4 Ι 2M1 _____________ r ..._____——_________ Second, use the obtained adhesive film b, Connect the chip (10mm x 10 mm) with gold bumps (area: 80ymX80; am, space 30 / zm, height: 15 // m, number of bumps: 288) as shown below, and N i / A u Electroplating C u Connection of printed circuit board (electrode height: 20 # m, thickness: 0.8 # m). First, attach the film b (1 2mmx 1 2mm) at 80 ° C, 10kgf / cm2 After the Ni / Au plated Cu circuit printed circuit board, the release sheet was peeled off, and the bumps of the wafer were positioned with the Ni / Au plated Cu circuit printed circuit board. Then, at 170 t, 30 g / The bumps are heated and pressed from above the chip under the condition of 20 seconds to connect. The connection impedance after connection is up to 1 8πΩ for each bump, and the average resistance is 8πΩ. The insulation resistance is above 1 08Ω; 5 to 125 t thermal shock test 1000 cycles of treatment, PCT test (1 2 1 ° C, 2 atmospheres) for 200 hours, solder at 2 60 ° C The groove does not change even after 10 seconds of immersion, indicating a good connection reliability. Printed by the Central Consumers Bureau of the Ministry of Economic Affairs, Printed by the Consumers' Cooperatives] 11 · Installation I. (Please read the precautions on the back before filling this page) Example 3 50 g of phenoxy resin and copolymerized butyl acrylate (4 ◦ ratio), ethyl acrylate (30 ration), acrylonitrile (30 ration), epoxy acrylate (30 ration) 100 g of acrylic rubber (molecular weight: 850,000) was dissolved in 3,500 g of tetraethyl lead acetate to obtain a 30% solution. Then, a liquid epoxy resin containing a microcapsule-type latent hardener was used. National Standards (CNS) / \ 4 specifications (2 × 〇297297.f) -24- Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs -25- Λ7 ________ ^ _____ _____ 5. Description of the invention (22) (epoxy content : 185) 350 g, added to this solution, and stirred, and then melted silica (average particle diameter: 0.5 / zin) with a weight ratio of 60 weight ratio to the resin composition of 100 weight ratio, and then in polybenzene Au layer formed on the surface of B-type nuclear body (diameter · 5 // m) The conductive particles were dispersed at 5 vol% to obtain a film coating solution. This film coating solution was applied to a separator (silicon-treated polyethylene terephthalate film with a roller brush, Thickness: 4 O / zm), dried at 100 ° C. for 10 minutes to form an adhesive film C having a thickness of 4 5 // m. The elastic modulus at 40 ° C of the adhesive resin composition after removing the melted silica and nickel particles from the adhesive film c was measured with a dynamic viscoelasticity measuring device at 100 MPa. Next, using the obtained adhesive film C, a gold bump (area: 80 # mx80 # m, space 30 # m, height: 15 # m, number of bumps: 288) was performed as shown below. The wafer (10 mm x 10 mm, thickness: 0.5 #m) was connected to a Ni / Au mineral gold Cu circuit printed circuit board (electrode height: 20 / zm, thickness: 0.8 mm). First, at 80 ° C, 10 kg f / cm2, a bonding film C (12 mm X 12 mm) was bonded to a Ni / Au-plated Cu circuit printed circuit board, and then the separator was peeled off to carry out the protrusions and N of the wafer. i / A ι Plating Cu PCB positioning. Then, it was heated at 170 ° C ′ 30 g / bulk for 20 seconds from the top of the wafer and pressed, and then connected. The connection impedance after the connection is 'maximum 5 ιηΩ per bump' applies to Chinese paper standard (CNS> Α4 specification (2! 〇 > < 297 public capital) on average for the paper size. (Please read the precautions on the back first) (Fill in this page)

Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs_ b-7 V. Description of the Invention (23) 1.5mΩ, the insulation resistance is above Γ〇8ω; these are —5 5 ~ 1 2 5 ° c thermal shock test 1 〇〇〇 Cycle processing, p CT test (121 ° C, 2 atmospheres) for 200 hours, 260 t: solder bath does not change after 10 seconds, indicating good connection reliability. Example 4 50 g of phenoxy resin and copolymerized butyl acrylate (40 ratio), ethyl acrylate (30 ratio), acrylonitrile (30 ratio), epoxy 0 propyl acrylate (3. ratio ) 100 g of acrylic rubber (molecular weight: 850,000) was dissolved in 350 g of tetraethyl lead acetate to obtain a 30% solution. Next, 350 g of a liquid epoxy resin (epoxy content: 185) containing a microcapsule-type latent hardener was added to this solution, and after stirring, a resin composition with a weight ratio of 100 weight ratio to 40 weight ratio was added. Silicon dioxide (average particle diameter: 0.5 / zm) was melted, and conductive particles forming an Au layer on the surface of the polystyrene core (diameter: 5 #m) were dispersed at 5% by volume to obtain Film coating solution. This film coating solution was applied to a separator using a roller brush (silicon-treated polyethylene terephthalate film, thickness: 40 / zm), and dried at 1000 ° C for 10 minutes. To form a bonding film d with a thickness of 4 5. The elastic modulus at 40 ° C of the resin composition after removing the molten silicon dioxide and nickel particles from the subsequent film d was measured with this dynamic viscoelasticity measuring device to be 1000 MPa. The average thermal expansion coefficient at 1 0 to 130 ° C measured by TMA following the diaphragm d was 1 1 1 p pm. Standards applicable. Chinese National Standard (CNS_) specifications (2; 0 > < 297 public welfare Dingyi _ 26-· &&; (Please read the precautions on the back before filling this page)

Printed by the Central Bureau of Standards, Ministry of Economic Affairs, Bei Gong Xiao Cooperative Co., Ltd. 5. Description of Invention (24) Next, using the obtained adhesive film d, attach a gold bump (area: 50ymx50 # m '362 protrusion) as shown below. One 'space: 20 / am, height: 15 # m) of a wafer (1.7mX 17mm, thickness: 0.5mm)' and a glass substrate (thickness: 1.1mm) with ITO (Ytt rium Tin Oxide) circuit connection. First, at 80 ° C, 10 kgf / cm2, the adhesive film C was attached to a glass substrate with an IT 0 circuit, and then the separator was peeled off to position the bumps of the wafer and the glass substrate with an I TO circuit. . Then, under the conditions of 180 ° C, 40 g / bump, 20 seconds, it was heated from above the wafer, and connected after pressing. The connection impedance after connection is up to 1 50Π1Ω per bump, with an average of 8 〇γπΩ; the insulation resistance is more than 10 Ω; these lie in the thermal shock test of -40 to 100 ° C 1 000 cycle processing , PCT test (105 ° C, 1.2 atmospheres) does not change for 100 hours, indicating good connection reliability. Example 5 50 g of phenoxy resin and copolymerized butyl acrylate (40 ratio), ethyl acrylate (30 ratio), acrylonitrile (30 ratio), epoxy acrylate (3 ratio) 125 g of acrylic rubber (molecular weight: 850,000) was dissolved in 400 g of tetraethyl lead acetate to obtain a 30% solution. Then, 'The liquid epoxy resin containing the microcapsule-type latent hardener will be applied to China (CNS) A ^ ~ l'j〇x297 ^^ ...) ----------- ------------------------------- (Please read the notes on the back before filling this page)

«Ϊ02631 η 7 V. Description of the invention (25) (epoxy content: 185) 325g is added to this solution, and after stirring, the molten silicon dioxide (average ratio of 60% by weight to the resin composition of 100% by weight) Particle diameter: 0.5 # m), and nickel particles (diameter: 5 # m) were further dispersed at 2% by volume to obtain a film coating solution. This film coating solution was applied to a separator with a roller brush (untreated polyethylene terephthalate film, thickness: 40 / zm), and dried at 1000 ° C for 10 minutes. Then, a bonding film e having a thickness of 4 5 // m was formed, and the elasticity of the bonding resin composition at 40 ° C was measured by using a dynamic viscoelasticity measuring device to remove the molten silicon dioxide and nickel particles of the bonding film e. 8 Ο Ο Μ Pa. Next, using the obtained adhesive film e, a bumpless wafer (10mm × 10mm, thickness: 0.5mm, guide electrode: A1, guide diameter: 120 // m) was performed as shown below, and on the circuit Ni / Au plated Cu bumps (diameter: 100βιη, space 50 #m, height: 15ym, number of bumps: 200) were formed to connect the Ni / Au plated Cu circuit printed circuit boards. Printed by the Central Bureau of Standards, Ministry of Economic Affairs, Bei X Consumer Cooperative (please read the precautions on the back, and then write this page). First, stick the film e (1 2mmX 1 2mm) at 80 ° C '10kgf / cm2 After bonding to a Ni / Au electric ore Cu circuit printed circuit board (electrode height: 20 # m, thickness: 0.8mm), the separator was peeled off, and the A1 bump of the wafer and the Cu bump with Ni / Au plating were attached. Positioning of the Ni / Au plated Cu circuit printed circuit board (thickness: 0.8mm) of the block. Then, under conditions of 180 ° C, 30g / bump, 20 seconds, heating from above the wafer, Connected after pressurization. This paper size applies Chinese National Standard (CNS) Λ4 specification (210X 297 mm.). _ ~ —— Λ7 H? — ^: ≫ uw631 5. Description of the invention (26) Connection impedance after connection , The maximum of each bump is 8πίΩ, the average is 4ηιΩ; the insulation resistance is more than 1.08Ω; these are in the thermal shock test of _5 5 ~ 1 2 5 ° C, 1000 cycles of treatment, p CT test (1 2 1 ° C, 2 atmospheres) For 200 hours, the solder bath at 26 0 ° C will not change after 10 seconds, indicating good connection reliability. Example 6 Oxidation of benzene Resin 50 g, copolymerized acrylic rubber with butyl acrylate (40 ratio), ethyl acrylate (30 ratio), acrylonitrile (30 ratio), epoxy acrylate (3 ratio) (molecular weight: 850,000) ) 125 g, dissolved in 400 g of tetraethyl lead acetate to obtain a 30% solution. Next, a liquid epoxy resin (epoxy content: 1 8 5) 3 2 5 g containing a microcapsule-type latent hardener was added to This solution was stirred to dissolve the molten silicon dioxide (average particle diameter: 0.5 // m) of the resin composition at a weight ratio of 100 to a weight ratio of 40 to obtain a solution for film coating. This film coating solution was applied to a separator (silicon-treated polyethylene terephthalate film, thickness: 40 μm), and dried at 100 ° C. for 10 minutes to form a first film. 1 Adhesive layer of the adhesive film (thickness: 2 5 / zm). However, the elasticity of the resin composition of 40 ° C of the molten silicon dioxide adhesive resin removed from this adhesive film f was measured with a dynamic viscoelasticity measuring device. 800MPa. I In addition, instead of dispersing and dissolving sand dioxide, except for dispersing L __—__ at 2% by volume ____'----------------- This paper size is applicable to China National Standard (CNS) A4 (210X297g t)-29-Printed by Masonry Consumer Cooperatives, Central Bureau of Standards, Ministry of Economic Affairs . • ❾ A 7 ---_____________ B7 _______________ V. Description of the invention (27) Except for nickel particles (diameter: 3; am), the same as the formation of the adhesive film f 'forms the adhesive film g (thickness of the second adhesive layer) : 25 / zm). The elasticity of the obtained adhesive film g at 40 ° C was 8 〇 Μ Μ P a ο Next, the obtained adhesive film f and the adhesive film g were laminated to obtain a laminated film as a composite film状 贴剂 h。 The adhesive h. Using this laminated film sheet adhesive h, a wafer with gold bumps (area: 80 / zmx80; tzm, space 30 " m, height: 15 // m, number of bumps: 288) was performed as shown below. (10 mm x 0 mm, thickness: 0.5 mm), and connection to a Ni / Au electric mine Cu circuit printed circuit board. First, at 80 ° C, 10 kgf / Cm2, the adhesive film g (second adhesive layer) of this laminated film sheet adhesive h (12mmxl2mm) was bonded to Ni / Au plating Cu circuit printing. After the circuit board (electrode height: 20 # m, thickness: 0.8mm), the separator is peeled off, and the wafer is faced on the f (first adhesive layer) side of the adhesive film so that the wafer bumps and Ni / A u plated Cu u circuit printed circuit board (thickness: 0.8mm) positioning. Then, "at 180 ° C, 50 g / bulk, 20 seconds", the wafer was heated from above the wafer and connected under pressure. After connection, the maximum connection impedance per bump is 6 ′ and the average is 2ιηΩ; the insulation resistance is more than 108Ω; these lie in -55 ~ 125. (: Thermal shock test 1000 cycles, p CT test (121 ° C, 2 atmospheres) 2000 hours' 2660 ° C solder bath dipping (please read the precautions on the back before filling (This page)

This paper size applies to China National Standard (CNS) A4 (210x297 public welfare) -30-Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Λ7 4012631 b7,! M | · |||| ιι · ι · III ·,- -.-. ___ | m | _. · · «. — · —. ..--.. IM |. _ __ V. Description of the invention (28) It will not change after 10 seconds, indicating a good connection Reliability. Example 7 50 g of phenoxy resin and copolymerized acrylic acid with butyl acrylate (40 ratio), ethyl acrylate (30 ratio), acrylonitrile (30 ratio), and epoxy acrylate (3 ratio) acrylic acid 175 g of rubber (molecular weight: 850,000) was dissolved in 40 g of tetraethyl lead acetate to obtain a 30 96 solution. Then, 2 7 5 g of a liquid epoxy resin (epoxy content: 1 8 5) containing a microcapsule-type latent hardener was added to this solution, and the resin composition was dispersed in a weight ratio of 1 0 0 by stirring. It was 60% by weight of molten silicon dioxide (average particle diameter: 1 V m) to obtain a film coating solution. This roller coating solution was applied to a separator with a roller brush (silicon-treated polyethylene terephthalate film, thickness: 40 / zm), and dried at 100 ° C for 10 minutes. To form an adhesive film i (thickness: 20 #m) of the first adhesive layer. Dynamic viscoelasticity was measured to determine the elasticity of the resin composition, which was removed from this film i, and then the resin composition at 400 ° C was 400 MPa. In addition, instead of dispersing the melted silicon dioxide, except that nickel particles (diameter: 5 # m) were dispersed at 2 volume%, the film was formed in the same manner as that of the film “i” to form the second film “thickness” of the second adhesive layer (thickness). : 20 wm) 'The elastic modulus at 40 t of the obtained adhesive film j was 400 MPa. This paper size applies the Chinese national standard ([>}: 5) / \ 4 regulations (: 210 > < 297 mm) — (Please read the precautions on the back before filling out this page) J Pack > \ s ° Λ Printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economy 482631 b? ——— ............. State_-Μ. .......... .. ... 5. Description of the invention (29) Secondly, the adhesive film i and the adhesive film j obtained by lamination are laminated to obtain a laminated film sheet-shaped adhesive k that is a composite film. With this laminated film adhesive k, a gold bump (area: 80 / zmx 80 to 111, space 30 to 111 'height: 15 // 111, number of bumps: 288) was performed as shown below. Wafer (10mmx10mm, thickness: 0.5 mm), connection with Ni / Au plated Cu circuit printed circuit board. First, at 80 ° C, 10kgf / cm2, this laminated film-like adhesive (12111111 \ 12111111) was attached to the film: | (the second adhesive layer) was bonded to a Ni / Au plated Cu circuit printed circuit board (electrode Height: 20ym, thickness: 0.8mm), peel off the spacer, face the wafer on the side of the film i (first adhesion layer), and carry out the bumps of the wafer and Ni / Au plating Cu circuit printed circuit Positioning of the plate (thickness: 0.8 mm). Then, at 180 ° C, 50g / bump, 20 seconds, heat and press from above the wafer and connect. After connection, the connection impedance is up to 18 μmΩ for each bump, with an average of 8 μmΩ; the insulation resistance is more than 1.08Ω; these are in a thermal shock test at 5 5 to 125 ° C for 1000 cycles, and the PCT test (1 2 1 ° C, 2 atmospheres) For 200 hours, the solder bath at 26 ° C will not change even after immersing for 10 seconds, indicating good continuous reliability. Example 8 50 g of phenoxy resin and copolymerized acrylic acid with butyl acrylate (40 ratio), ethyl acrylate (30 ratio), acrylonitrile (30 ratio), and epoxy acrylate (3 ratio) acrylic acid Rubber (Molecular weight: (Please read the precautions on the back before filling out this page). Packing. This paper size applies to Chinese national standards (CNS> A4 specifications (210X297K. #) -32- Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Λ7 --- Cancer you ❼H ----------------, ------------------------- ---------------------------------- V. Description of the invention (30) 850,000) lOOg 'dissolved At 40 g of tetraethyl lead acetate, a 30% solution was obtained. Next, 350 g of a liquid cyclic resin (epoxy content: 185) containing a microcapsule-type latent hardener was added to this solution 'with stirring, for Next, a molten silicon dioxide (average particle diameter: 0.5 # m) in which a resin composition was dispersed in a weight ratio of 100 to 60 was obtained to obtain a solution for film coating. This film was coated with a roller brush. Solution applied to a separator (silicon-treated polyethylene terephthalate film, thickness 40 / zm), dried at 100 ° C. for 10 minutes to form a first adhesive film m (thickness: 2 5 # m). The dynamic viscoelasticity measuring device was used to remove this adhesive film m. The elasticity of the molten silicon dioxide adhering resin composition at 40 ° C is 1,000 MPa. In addition, instead of dispersing the molten silicon dioxide, it is dispersed in a polystyrene-based core at 5% by volume ( A diameter of 5 // m) is formed on the surface except for the conductive particles of the Au layer, and a bonding film η (thickness: 25 # m) of the second bonding layer is formed in the same manner as the preparation of the bonding film m. The obtained bonding The elastic modulus of the film η at 40 ° C. is 1000 MPa. Next, the adhesive film m and the adhesive film η obtained by lamination are laminated to obtain a laminated film-like adhesive P as a composite film. This laminated film sheet adhesive P ′ is provided with gold bumps as shown below (area: 80 / zm X 80 # m 'space 3〇 # m, height: 15 / zm, number of bumps: 288) Chip (10mm × 10mm, thickness: 0 · 5 mm), and the connection with Ni / Au plated Cu circuit printed circuit board. (Please read the precautions for the back-H 'trivial page first)

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* 1T fm Bm -fKJB nd _ This paper is in the form of the New York City Finance Department. County (CNS) / ΰϊΰeach (2! 〇χϋ " ΐ -33- Printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 31) First, at 80 ° C, 10 kgf / cm2, this laminated film sheet adhesive P (12mmx12mm) is used to attach the film n (second adhesion layer) to the Ni / Au plating Cu circuit. After the printed circuit board (electrode height: 20 # m 'thickness: 0.8mm), the release sheet was peeled to face the wafer on the film m (first adhesion layer) side, and the wafer bumps and Ni / A were performed. u Plating C u Positioning of printed circuit board (thickness: 0.8mm). Then, at 180 ° C, 50g / bump '20 seconds, heat from above the wafer, connect after pressurizing. After connection The maximum connection resistance of each bump is 5 ιηΩ, the average is 1.5 m Ω, and the insulation resistance is more than 10 Ώ; suitable 値 lies in the thermal shock test at -5 5 to 12 5 ° C 100 cycles. Treatment, PCT test (121 ° C, 2 atmospheres) for 200 hours, the solder bath at 260 ° C does not change even after immersion for 10 seconds, which shows good connection reliability. Example 9 Benzene 50 g of resin and copolymerized acrylic rubber with butyl acrylate (40 ratio), ethyl acrylate (30 ratio), acrylonitrile (30 ratio), epoxy acrylate (3 ratio) (molecular weight: 85 10,000) 125 g, dissolved in 40 g of tetraethyl lead acetate to obtain a 30% solution. Next, 325 g of a liquid epoxy resin (epoxy content: 185) containing a microcapsule-type latent hardener was added to this solution and stirred For the following, the resin composition is dispersed in a weight ratio of 100 to 60 weight ratio im (please read the precautions on the back before filling in this page); install.; Chinese paper standards for travel papers (CNS> Λ4 regulations) ( 2iOX29? 公 #.) -34- Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs _________ V. Inventory (32) of the melted silica (average particle diameter: 0.5 # m) to obtain the film coating workers Apply the solution. Apply this solution for film coater to a separator (silicon-treated polyethylene terephthalate film, thickness: 2 5 #m) with a dropper brush at 100 ° C After 10 minutes of drying, the first adhesive layer Q (thickness: 2 5 # m) was formed. The dynamic viscoelasticity measuring device measured the elasticity of the resin composition at 40 ° C of the molten silicon dioxide adhering to the diaphragm Q to be 800 MPa. Instead of dispersing the molten silicon dioxide, the nickel particles were dispersed at 2% by volume ( Except for diameter: 3 // m), the adhesive film r (thickness: 25 # m) of the second adhesive layer is formed in the same manner as in the production of the adhesive film q. The elasticity of the obtained adhesive film r at 40 ° C was 800 MPa. Next, the obtained adhesive film q and the adhesive film layer r are superimposed to obtain a laminated film-like adhesive s which is a laminated film. Using this laminated film sheet adhesive S, a bumpless wafer (10mm × 10mm, thickness: 0.5mm, lead electrode: Al, 120 # m), and Ni / Au plating Cu formed on the circuit were performed as shown below. Connection of Ni / Au plated Cu circuit printed circuit boards with bumps (diameter: 100; zm, space 50 // m, height: 15 / zm, number of bumps: 200). First, at 80 ° C and 10 kg f / cm2, this laminated film sheet adhesive s (12mmxl2mm) was attached to the film r (second adhesive layer) to form Ni / Au plated Cu bumps (diameter: 1 〇〇111, space 5〇 # ^ 1, height: 15; «111, number of protrusions: 1 paper size applies Chinese National Standard (CNS) (2 ί Ο X 297 公 #.) &Quot; T 〇5-" (Please read the back notice " " write this page)

——________ w " Sun ι · _ · ι 1 丨 _ _ _.................... 5 'Explanation of invention (33) 200) Ni / Au electroplated Cu circuit printed circuit board (circuit height: 2 0 / zm, thickness: 0.8 mm), the release sheet is peeled off, and the film Q (the first adhesive layer is adhered) ) Side, the wafer was opposed, and the bumps of the wafer and the Ni / Au plated Cu circuit printed circuit board (thickness: 0.8 mm) were positioned. Then, under the condition of 180 ° C, 50g / bump, 20 seconds, it was heated and pressed from above the wafer and connected. The connection impedance after connection is up to 8πΩ for each bump, with an average of 4ιηΩ; the insulation resistance is more than 108Ω; these are in the thermal shock test of -55 ~ 125 ° C for 1000 cycles, p C The T test (1 2 1 ° C, 2 atmospheres) for 200 hours and 2 60 ° C solder bath does not change after 10 seconds, indicating a good connection signal. Example 10 195 g of a phenoxy resin and 130 g of a polyfunctional epoxy resin (epoxy content: 212) were dissolved in 3 g of tetraethyl lead acetate to obtain a 30% solution. Next, 3 2 5 g of a liquid epoxy resin (epoxy content: 1 8 5) containing a microcapsule-type latent hardener was added to this solution, and the nickel particles were dispersed at 2% by volume with stirring. (Diameter: 5 / zm) to obtain a solution for film coating. This roller coating solution was applied to a separator using a roller brush (silicon-treated polyethylene terephthalate film, thickness: 40 Am), and dried at 100 ° C for 10 minutes. To form a bonding film t (thickness: 25 / zm) of the third bonding layer. The hardened adhesive film t to 30 ~ This paper size is applicable to I7 national standard (CNS) / \ 4 standard broadcast (210X297 public 犮) -36-'Λ7 H? Carry 2.431 V. Description of the invention (34) 1 0 0 The thermal expansion coefficient up to ° C is 4 5 p pm; the glass transition temperature is 150 ° C; the elastic modulus at 40 ° C is 2600MPa. In addition, 50 g of oxidized resin and copolymerized butyl acrylate (40 ratio), ethyl acrylate (20 ratio), acrylonitrile (30 ratio), and epoxy acrylate (3 ratio) acrylic rubber (molecular weight) : 850,000) 100g, dissolved in 500g of tetraethyl lead acetate to obtain a 30% solution. Next, a liquid epoxy resin (epoxy content: 1 8 5) 3 50 g containing a microcapsule-type latent hardener was added to this solution, and the nickel particles were dispersed at 2% by volume after stirring ( Diameter: 5 // m) to obtain a solution for film coating. Use a roller brush to apply this film coating solution to a separator (silicon-treated polyethylene terephthalate film, thickness: 40em), dry at 100 ° C for 10 minutes, and The adhesive film U of the fourth adhesive layer was formed. (Dried at 100 ° C for 10 minutes to form the adhesive film u of the fourth adhesive layer (thickness: 25 // m). The cured adhesive film u to 3 0 ~ 1 0 Ot: the expansion coefficient up to 70 p pm; the glass transition temperature is 125 ° C; the elastic modulus at 40 ° C is 1000 MPa. Next, the laminating film t and the laminating film u are laminated, Then, a laminated film sheet-shaped adhesive v (thickness: 50 μm) formed into a composite film was used. Next, using the obtained laminated film sheet-shaped adhesive v, a gold bump (height: 30 / zm) was attached as shown below. , Number of protrusions: 184) of the chip (size: lOxlOmm, thickness: 0.55mm), and Ni / Au plating Cu circuit printed circuit board (electrode height: (Please read the precautions on the back first and then write down the book) page)

'1T Printed by the Zhengong Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs This paper is printed in accordance with the Chinese National Standard (CNS) Λ4 Specification (210 > < 297 Gong 犮 ^ -37- Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economics __ ίΙ2β, 31 Β, > ________________________ V. Description of the invention (35) 20 # m, substrate thickness: 0.8mm) connection. First, the surface of the adhesive film u (fourth connection layer) of the laminated film-shaped adhesive v (size: 1 2 X 1 2 mm) is used as the printed circuit board side, and the Cu circuit is printed on Ni / Au After the circuit board 'at a temperature of 60 ° C' and 0.5MP a, it is falsely connected to the laminated film-like adhesive v °. After the false connection process, the bumps of the wafer are printed with the Ni / Au electric mine C II circuit. After the circuit board is positioned, the wafer is placed on the laminated film sheet adhesive v; then at 180 ° C, 50g / bump, under the condition of 20 seconds, the wafer is heated from the top of the wafer and connected after pressing. The connection impedance after connection is up to 1 ΟπιΩ per bump. The average is 2 ηΩ; the insulation resistance is above 10 Ω; these lies in a thermal shock test of 55 to 125 ° C for 1000 cycles and 1 10 ° C 85% RH. 'Continuous (in situ) resistance measurement during 500 hours of PCT test showed good connection reliability. Example 11 1 195 g of a phenoxy resin and 130 g of a polyfunctional epoxy resin (epoxy content: 212) were dissolved in 1,083 g of tetraethyl lead acetate to obtain a 30% solution. Next, a liquid epoxy resin (epoxy content: 1 8 5) 3 2 5 g containing a microcapsule-type latent hardener was added to this solution, and after stirring, the resin composition was dispersed in a weight ratio of 100 to 100. 20 weight ratio of molten silicon dioxide (average particle diameter: 0.5 / zm), and further dispersing nickel particles (diameter: 5 # m) at 2% by volume, to obtain a film coater (first read the back (Notes again " write this page)

This paper size applies the Chinese National Standard (CNS) Λ4 Regulation, 掊 (2ί〇Χ 297 公 澄> -38- 4f3631 a ---- 'rn, nu ...- n-.i ---- V. Invention Instructions (36) Use a solution. Apply this film coating solution to a separator (silicon-treated polyethylene terephthalate film, thickness: 4 0 / zm) with a roller brush, using 1 0 After drying at 0 ° C for 10 minutes, the adhesive film W (thickness: 2 5 // m) forming the third adhesive layer is formed. The thermal expansion coefficient of the cured adhesive film w to 30 to 100 ° C is 3 8 p pm; glass transition temperature is 153 ° C; elastic modulus at 40 ° C is 3000 MPa. In addition, 50 g of phenoxy resin and copolymerized butyl acrylate (40 ratio) and ethyl acrylate (20 ratio ), Acrylonitrile (30 ratio), epoxy acrylate (3 ratio) acrylic rubber (molecular weight: 850,000) 10Qg 'dissolved in 500g of tetraethyl lead acetate to obtain 30% liquid. Then, it will contain microcapsules 350 g of liquid epoxy resin (epoxy content: 185) of a latent hardener, added to this solution, and stirred to disperse the resin composition to a weight ratio of 20 to 100 by weight. The amount of molten silicon dioxide (average particle: 0.5 / zm) was further dispersed into nickel particles (diameter: 5 // 111) at 2% by volume to obtain a film coating solution. This was applied with a roller brush. The film coating solution is applied to a separator (silicon-treated polyethylene terephthalate film, thickness: 40 #m), and dried at 100 ° C. for 10 minutes to form a film. 4 Adhesive film X (thickness: 25 / zm) of the adhesive layer. The thermal expansion coefficient of the cured film X to 30 to 1 ◦ 0 is 60 p pm; the glass transition temperature is 1 2 7 ° C; The elasticity rate at 40 ° C is 14 00 MPa. This paper is based on the Chinese National Standard (CNS) Mim (2i0X297 // Vt) -39-Printed by Qin, a consumer standard of the Central Standards Bureau of the Ministry of Economic Affairs ¢ 2 & ___ η- < ____ _______________ V. Description of the Invention (37) Secondly, the adhesive film W and the adhesive film X are laminated to form a laminated film-like adhesive y (thickness: 50MΠ0.) Second, Using the obtained laminated film sheet-shaped adhesive y, a wafer (size: lOxl) with gold bumps (height; 30 # m, number of bumps: 184) was performed as shown below. Omm, thickness: 0 · 55mm), connected to Ni / Au plated Cu circuit printed circuit board (electrode height: 20 / zm, substrate thickness: 0.8mm) ... The laminated film sheet adhesive y (Size: 12X1 2mm) The surface of the film X (fourth adhesive layer) is used as the printed circuit board side, and the Cu printed circuit board is plated with Ni / Au at 60 ° C, 0.5 MP a Under the conditions, the laminated film sheet adhesive y is pseudo-connected. After the false connection process, the bumps of the wafer were positioned with a Ni / Au plated Cu circuit printed circuit board, and the wafer was placed on the laminated film-like adhesive y 'and then' at 180 ° C, 50 g / Bumps, connected under the condition of 20 seconds' heating and pressing above the wafer. The connection impedance after connection is up to 1 〇ιηΩ per bump, with an average of 2 ιηΩ; the insulation resistance is above 108Ω; these are in a thermal shock test at 55 ~ 125 ° C 1 ◦ 0 0 cycles and 1 1 〇 ° C 8 5% R Η, the resistance measurement of the connection (in situ) during the test of 500 hours in the PCT test, indicating good connection reliability. Comparative Example 1 The laminated film sheet adhesive V obtained in Example 10 was used in the same manner as in Example 10, with gold bumps (height: 30 vm, the paper size of the project was applicable to the Chinese national standard). Rate (CNS) Λ Small Specifications (: 210X 297 mm.) -40-(Please read the precautions on the back before filling out this page)

____ Place ¢ 26.31 ______________________________________ V. Description of the invention (38) Number of wafers: 184) Wafer (size: 10x10mm, thickness: 0 · 55mm), Cu circuit printed circuit board (electrode height: 20em, substrate thickness) plated with Ni / Au : 0. 8mm) connection. However, in this comparative example, the surface of the adhesive film t (third adhesive layer) of the laminated film adhesive v (size: 12 × 12 mm) was used as a printed circuit board. The connection impedance after this connection is up to 1 〇γπΩ per bump, with an average of 12 m Ω; the insulation resistance is more than 10 Ω, but these 値 thermal shock tests at a temperature of 5 5 to 125 ° C 5 0 0 cycles, and 85% RH at 110 ° C, PCT test for 300 hours, electrical continuity was poor. Comparative Example 2 195 g of a phenoxy resin and 130 g of a polyfunctional epoxy resin (epoxy content: 212) were dissolved in 1083 g of tetraethyl lead acetate to obtain a 30% solution. Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. Then, 325 g of liquid epoxy resin (epoxy content: 185) containing microcapsule-type latent hardener was added to this solution, stirred, and then integrated into 2 volumes. % To disperse nickel particles (diameter: 5 to obtain a film coating solution. Apply this film coating solution to a separator (silicon-treated polyethylene terephthalate film with a roller brush) , Thickness: 40 # m), dried at 100 ° C for 10 minutes to form a film 2 with a thickness of 50 "111". The film 2 after hardening is 2 to 3 0 ~ 100 ° C The thermal expansion coefficient is 45 ρρώ, the glass migration temperature is 1 50 ° C, 40 -41-This paper size is applicable to the Chinese National Standard (CNS) Λ4 specification (210X297 ^^ 4.2631 ^ One, one and five, description of the invention (39 ) ° C elasticity is 260 OMP a. Secondly, using only the obtained adhesive film 2, as shown in the figure, a wafer with a gold bump (height: 3Qym, the number of bumps: 184) was used ( Size .: 10x10mm, thickness: 0. 55mm), Cu circuit printed circuit board electroplated with Ni / Au (electrode height: 20 ym, substrate thickness : 0. 8mm) connection. First, connect the diaphragm 2 to a Ni / Au Cu-Cu printed circuit board at 60 ° C and 0.5 MPa. After the false connection process, After positioning of the bump Ni / Au plating Cu circuit printed circuit board, the wafer was placed on the next diaphragm 2. Then, at 180 ° C, 50 g / bump, 20 seconds, from The top of the chip is heated and connected after pressure. The connection resistance after connection is up to 10 ΩΩ per bump, with an average of 3 πΩ; the insulation resistance is above 108 Ω, but these lie in a thermal shock test of 55 ~ 12 2 0 0 cycles and 260 ° C solder bath dipping for 10 seconds, electrical continuity was poor. As a result of cross-sectional observation of the connection part, peeling at the interface of the diaphragm was observed in a part of the poor continuity part. Comparative Example 3 Benzene 50 g of oxidized resin and acrylic rubber (molecular weight: 8 5) copolymerized with butyl acrylate (40 ratio), ethyl acrylate (20 ratio), acrylonitrile (30 ratio), and epoxy acrylate (3 ratio) Thousands) 1 ◦ 0 g, dissolved in 50 g of tetraethyl lead acetate, yielding -42- The Zhang scale is applicable to the Chinese national standard (2; ο X Μ) 402631 A7 B7 V. Description of the invention (40) 30% solution. Then, the liquid epoxy resin (epoxy content containing microcapsule-type latent hardener) : 185) 350 g, was added to this solution, and after stirring, nickel particles (diameter: 5 #m) were dispersed at 2% by volume to obtain a film coating solution. Use a roller brush to apply this film coating solution to a separator (silicon-treated polyethylene terephthalate film, thickness: 40 vm), dry at 100 ° C for 10 minutes, and An adhesive film α having a film thickness of 2 5 was formed. The thermal expansion coefficient of the adhesive film α after curing to 30 ~ 100 ° C is 60 p pm; the glass transition temperature is 125 ° C; and the elastic modulus at 40 ° C is 100 °. M Pa. Next, a wafer (size: 10x10mm, thickness: 0.55) with a gold bump (height: 30 μm, number of bumps: 184) with a gold bump (height: 30 μm, number of bumps: 184) using only the obtained adhesive film α ′ as shown below, and N i / A u plated Cu circuit circuit printed circuit board (electrode height: 20 " m, substrate thickness: 0.8mm) connection. Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs First, the diaphragm α will be connected to the Ni / Au plated c u circuit printed circuit board under the condition of δ 0, 0.5 MPa. After the false connection process, after positioning the bumps of the wafer with the Ni / Au electric Cu PCB printed circuit board, the wafer was then placed 'next' at 180 ° C, 50 g / burst at 180 ° C. Blocks, connected under conditions of 20 seconds' after heating and pressing from above the wafer. The maximum height of each bump is 10 mQ 'on average 0 8 Ω or more, but the connection resistance of these 値 after 5 5 _ connection is 2 m Ω; the insulation resistance is -43- This paper standard applies Chinese National Standard (CNS) Α4 Specifications (2! 〇) < 297 公 #) Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs a 7 B7 V. Description of the invention (41) Thermal shock test of 1 2 30 cycles, high temperature test when thermal shock test At this time, a phenomenon of poor electrical continuity occurs. [Industrial use] As described above, according to the present invention, it is possible to manufacture a circuit board that does not increase the connection resistance or the release agent at the connection portion and greatly improves the reliability of the connection. -44-This paper size applies to China National Standard (CNS) Α4 specification (2 丨 〇 > < 297 public knock)

Claims (1)

i i k.? A8 B8 C8 D8 VI. Annex 2 to the scope of patent application a: Patent Application No. 8 7 1 1 3 3 3 0 Chinese Application for Patent Scope Amendment The Republic of China 1988 1 February Amendment 1. A circuit component connection Adhesive is an adhesive for connecting circuit members between the opposing circuit electrodes, and presses the opposing circuit electrodes to conductively connect the electrodes in the pressing direction; it contains an adhesive resin composition and an inorganic substance. Filling material: The 1% weight ratio of the adhesive resin composition described above contains the inorganic filling material in a weight ratio of 10 to 2000. 2 · A multi-layer adhesive for connecting circuit components, which is used to connect between circuit electrodes facing each other, press the circuit electrodes facing each other, and electrically connect the circuit components between the electrodes in the pressing direction. Adhesive: It includes: a bonding resin composition and an inorganic filler material, and a weight ratio of 100 to the adhesive resin composition, a first adhesive containing the inorganic filler material in a weight ratio of 10 to 2 Q 〇 Agent layer 'and a second adhesive layer mainly comprising an adhesive resin composition. 3. A kind of multi-layered circuit member connection adhesive is used to electrically connect circuit members connected in a pressing direction so as to “pressurize the circuit electrodes facing each other” between the circuit electrodes facing each other. Adhesives; equipped with: Contains an adhesive resin composition and an inorganic filler material '100 weight ratio of the adhesive resin composition' Contains 10 to 2 weight ratio of this paper The Chinese national standard (CNS) A4 is applied Specifications (210 X 297 mm) — — — — — — IK——0 Zhuang Yi -------- IT ---- I ---- Fist (Please read the precautions on the back before filling in this Page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ii k.? A8 B8 C8 D8 VI. Annex 2 to the scope of patent application a: Patent Application No. 8 7 1 1 3 3 3 0 Chinese Application for Patent Scope Amendment The Republic of China 1988 1 February Amendment 1. A circuit component connection Adhesive is an adhesive for connecting circuit members between the opposing circuit electrodes, and presses the opposing circuit electrodes to conductively connect the electrodes in the pressing direction; it contains an adhesive resin composition and an inorganic substance. Filling material: The 1% weight ratio of the adhesive resin composition described above contains the inorganic filling material in a weight ratio of 10 to 2000. 2 · A multi-layer adhesive for connecting circuit components, which is used to connect between circuit electrodes facing each other, press the circuit electrodes facing each other, and electrically connect the circuit components between the electrodes in the pressing direction. Adhesive: It includes: a bonding resin composition and an inorganic filler material, and a weight ratio of 100 to the adhesive resin composition, a first adhesive containing the inorganic filler material in a weight ratio of 10 to 2 Q 〇 Agent layer 'and a second adhesive layer mainly comprising an adhesive resin composition. 3. A kind of multi-layered circuit member connection adhesive is used to electrically connect circuit members connected in a pressing direction so as to “pressurize the circuit electrodes facing each other” between the circuit electrodes facing each other. Adhesives; equipped with: Contains an adhesive resin composition and an inorganic filler material '100 weight ratio of the adhesive resin composition' Contains 10 to 2 weight ratio of this paper The Chinese national standard (CNS) A4 is applied Specifications (210 X 297 mm) — — — — — — IK——0 Zhuang Yi -------- IT ---- I ---- Fist (Please read the precautions on the back before filling in this Page) Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 6. Scope of patent application. The first adhesive layer of the inorganic filler and the adhesive resin composition containing the resin, the elasticity after curing at 40 ° C is 1. 0 0 ~ 2 0 0 ◦ 2nd adhesive layer of M Pa. 4. An adhesive for connecting circuit components, which is used to connect the circuit components between opposing circuit electrodes, press the opposing circuit electrodes, and electrically connect the circuit component connecting adhesives between the electrodes in a pressing direction; Containing an adhesive resin 'composition and an inorganic filler, the average thermal expansion coefficient at 110 to 130 ° C after curing is 200 ppm / t: or less. 5. The adhesive for circuit component connection according to item 4 of the scope of patent application, wherein the average thermal expansion coefficient of 1 1 to 1 3 0 after the adhesive is hardened is 3 Cl · ~ 2 0 P P m / ° C. 6 · —A multi-layer adhesive for connecting circuit members is used for connecting circuit members which are interposed between opposing circuit electrodes, press the opposing circuit electrodes, and conduct conductive connection between the electrodes in a pressing direction. Adhesive agent: A third adhesive agent layer and a fourth adhesive agent layer having different physical properties. 7. If the adhesive for circuit component connection according to item 6 of the patent application, the elastic modulus of the third adhesive layer after curing is greater than the elastic modulus of the fourth adhesive layer after curing. '8. The adhesive for connecting circuit members according to item 7 of the scope of patent application, wherein the adhesive layer of at least one of the third and the fourth contains: an adhesive resin composition, and ^ for the above adhesive resin composition 100 weight ratio It is 1 〇 ~ Li 丨 ~ — l · —— © equipment ·! (Please read the notes on the back of tf before filling out this page) · The paper size printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -2-Ministry of Economic Affairs Printed by the Consumer Cooperative of the Property Bureau 4112631 | D8 VI. Application scope of patent 2 ◦ 〇 Inorganic charge and weight material in weight ratio. 9 · The adhesive for circuit component connection according to item 7 of the patent application, wherein the elasticity at 40 ° C after the fourth adhesive layer is hardened is 100 to 200 MPa. 10 · If the adhesive for the connection of road members is used in item 6 of the scope of the patent application, the thermal expansion coefficient of the third adhesive is smaller than that of the fourth adhesive layer. 1 1. The adhesive for circuit component connection according to item 10 of the patent application scope, wherein at least one of the third and fourth adhesive layers contains: a resin composition, and a weight ratio of 1,000 to the resin composition It is an inorganic filler with a weight ratio of 10 to 2000. 1 2. If the adhesive for circuit component connection of item 10 in the scope of patent application, the thermal expansion coefficient of the third adhesive layer to 30 to 100 t: up to 20 to 70 p pm / ° C . 1 3. The adhesive for circuit component connection according to item 6 of the patent application, wherein the glass transition temperature of the third adhesive layer is higher than the glass transition temperature of the fourth adhesive layer. 14. If the adhesive for circuit member connection according to item 13 of the patent application scope, wherein at least one of the third and fourth adhesive layers contains: a resin composition, and a weight ratio of 100 to the above resin composition It is an inorganic filler with a weight ratio of 10 to 2000. 1 5. If the circuit paper connection for item 13 of the scope of the patent application is for the connection of this paper, the size of the paper applies to China National Standard (CNS) A4 (210 X 297). -3-Γ ---------- -------- Order · --------. (Please read the notes on the back before filling out this page) Printed by A8 B8 C8 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ------ ---- 6. The patent application range, where the glass transition temperature of the third adhesive layer is 1 2 0 t or more 0 1 6 · If the patent application range is 1, 2, 3, 4, 8, 1 1 or Item 14 Adhesives for connection of circuit components, wherein the average particle diameter of the inorganic filler is 3 " m or less. '1 7. If the patent application scope No. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10', 11, 12, 13, 14 or 15 of the circuit component connection adhesive, the above The adhesive contains the conductive particles in an amount of 0.1 to 30 vol. 1 8 If the adhesive for circuit component connection according to item 1, 2, 3, 4, 8, 11, or 14 of the scope of patent application, the above-mentioned adhesive contains 100% by volume of the above-mentioned adhesive resin composition and contains The conductive particles having a larger volume ratio than the average particle diameter of the inorganic filler material and the larger average particle diameter are 0.1 to 30. 1 9 · If the patent application scope of the scope of 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14 or 15 is used as an adhesive for connecting circuit members, wherein the above-mentioned adhesive resin The elasticity of the composition at 40 ° C after hardening is 30 to 2000 MPa. 2．If the patent application scope is 1, 2, 3, 4, 5, 6'7, 8, 9, 10, 11, 12, 13, 14 or 15 Contains epoxy resin and latent hardener. This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 cm) • 4-I ^ ----------------------- Order ----- ---- AW. (Please read the precautions on the back before filling this page) A8 B8 C8 ______ D8 VI. Patent Application Scope 2 1 · If the scope of patent application is No. 1, 2, 3 4, 5 6, 7 '8 '9' Film-shaped adhesive for circuit connection according to item 10, 11, 12, 13, 14 or 15, wherein the adhesive resin composition contains epoxy resin, acrylic rubber and latent hardener. 2 2. If the patent application scope No. 1, 2, · 3, 4, 5, 6, 7 '8' 9 'industrial 0, 11, 12, 13, 14 or 15 adhesives for circuit component connection, wherein the above acrylic acid Rubber contains glycidyl groups in the molecule. 2 3. If the scope of application for patent No. 1, 2, '3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14 or 15 is used as an adhesive for connecting circuit components, it is formed as Membrane-like. 2 4. A circuit board is a first circuit member having a first connection terminal and a second circuit member having a second connection terminal are arranged to face the first connection terminal and the second connection terminal. Between the first connection terminal and the second connection terminal arranged to be separated by an adhesive, pressurize it to zero. Connect the circuit board of the first connection terminal and the second connection terminal arranged in the opposite direction. ; Ο Install -------- Order -------- (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5 1 with the second, or 2 and 4 4 of the first set,, 1 and the structural agent 3 sub-paths towards 3, the terminal is connected 2 1 to 1 separated by, and even the first 1 2 1 above the first The first son is in the encirclement, and will end-, Fan 1. For the connection .: Jianli 1 agent is a joint structure of the book, the first way, please ο connect to the first electrical end of the board to apply for 1. The road has 2 to connect to, connect to the power. A piece of gamete is connected to the 8th structure. The end is connected to the road and the 5-way connector is connected. The 7th connection is connected to the 2nd connection and the son is connected to the 6th connection. The paper size is applicable to the Chinese national standard (CNS> A4 specification (210 X 297 mm) -5- A8 DO mmzt gs8 6. The scope of the patent application is pressurized to make it conductively connect the circuit board of the first connection terminal and the second connection terminal in the opposite configuration; (Please read the back Please fill in this page again for the matters needing attention) The first circuit component is an inorganic insulating substrate, and the second circuit component is an organic insulating substrate: The above-mentioned adhesive is an adhesive for connection of circuit components in the scope of patent application No. 2 or '3; 1 At least one of the adhesive layers is adhered to the above-mentioned first circuit member side. 2 6. A type of circuit board in which a first connection terminal and a second connection terminal are arranged to face each other. 1 circuit component and second circuit structure having a second connection terminal Between the first connection terminal and the second connection terminal arranged opposite to each other through an adhesive, and pressurized to electrically connect the first connection terminal and the second connection arranged opposite to each other. The circuit board of the terminal; the first circuit member is an inorganic insulating substrate, and the second circuit member is an organic insulating base; the adhesive is the patent application scope of 7, 8, 9, 10 "咋; ± ^ -Ji 1 Adhesives for connecting circuit components of 1, 1, 2, 1, 3, 14 or 15; at least one of the third adhesive layers is adhered to the first circuit component 2 7 · A circuit board in which a first circuit member having a first connection terminal and a second circuit member having a second connection terminal are arranged so as to face the first connection terminal and the second connection terminal. The number of the opposite configuration} This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) _ 6 _ C8 D8 This 631 VI. The scope of patent application between the connection terminal and the second connection terminal Separator, (Please read the back Please fill in this page for further information.) Pressurize it to conductively connect the circuit board of the first connection terminal and the second connection terminal arranged in the opposite direction; the first circuit member is a semiconductor wafer, and the second circuit member is organic. Insulating substrate; 'The above-mentioned adhesive is an adhesive for connection of circuit members according to item 2 or 3 of the scope of patent application; at least one of the above-mentioned first adhesive layers is adhered to the above-mentioned first circuit member side. 2 8. The circuit board is a first circuit member having a first connection terminal and a second circuit member having a second connection terminal arranged to face the first connection terminal and the second connection terminal. The connection terminal and the second connection terminal are separated by an adhesive, and are pressurized to electrically conduct the circuit board + of the first connection terminal and the second connection terminal arranged opposite to each other; the above-mentioned first circuit structure仵 is a semiconductor wafer, and the above-mentioned second circuit member is an organic insulating substrate; the clothing printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and the above-mentioned adhesive is the scope of patent applications 7, 8, 9, 10, 1 1, 1 Adhesives for connection of circuit components according to item 2, 1, 3, 14, or 15; and at least one of the third adhesive layers is adhered to the first circuit component side. 2 9. — A kind of circuit board manufacturing method, in order to have the first connection terminal and the second connection terminal facing each other, and the first connection terminal is configured to have no -7- This paper standard applies Chinese National Standard (CNS) A4 specification (2) 0 X 297 mm 40 ^ 631 Εί .- D8 VI. Patent application scope The first circuit member formed of an organic insulating substrate and the first circuit member formed of an organic insulating substrate with a second connection terminal 2 Circuit components: Dispose the adhesive for connecting circuit components according to item 2 or 3 of the patent application, so that the first adhesive layer is formed on the first circuit component side, and the first adhesive layer is interposed between the first components in the opposite arrangement. The connection between the connection terminal and the second connection terminal; a process in which the first connection terminal and the second connection terminal arranged in the opposite arrangement are electrically conductively connected under pressure. 3 0. — A method for manufacturing a circuit board, comprising a first circuit member with an inorganic insulating substrate having a first connection terminal and a second connection terminal arranged so that the first connection terminal and the second connection terminal face each other. The second circuit component formed by an organic insulating substrate: The adhesive for connecting circuit components of the items No. 7, 8, 9, 10, 1 1, 12, 13, 14, 4 or 15 in the scope of the patent application is arranged, so that The third adhesive layer is formed on the first circuit structure side; it is interposed between the first flail terminal and the second connection terminal arranged opposite to each other; and it is conductively connected to the above-mentioned circuit by being pressed. The process of the first connection terminal and the second connection terminal arranged opposite to each other. (Please read the precautions on the back before filling out this page) ilri ----------- @ 装 .. • ϋ. ·. ······ ---- &#; '-'ικ'. ΠΓ- · 1 Cooperative consumption of employees of the Intellectual Property Bureau of the Ministry of Economic Affairs; This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) _ g-