JP4620866B2 - 同軸駆動軸を備えた二重アーム装置及びこれを用いた基板搬送方法 - Google Patents

同軸駆動軸を備えた二重アーム装置及びこれを用いた基板搬送方法 Download PDF

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Publication number
JP4620866B2
JP4620866B2 JP2000546922A JP2000546922A JP4620866B2 JP 4620866 B2 JP4620866 B2 JP 4620866B2 JP 2000546922 A JP2000546922 A JP 2000546922A JP 2000546922 A JP2000546922 A JP 2000546922A JP 4620866 B2 JP4620866 B2 JP 4620866B2
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Prior art keywords
arm
drive
drive shaft
assembly
arm assembly
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Expired - Lifetime
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JP2000546922A
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Japanese (ja)
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JP2002514001A5 (US07585860-20090908-C00154.png
JP2002514001A (ja
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デイビッド アール． ビューリュー
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ブルックス オートメーション インコーポレイテッド
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Publication of JP2002514001A5 publication Critical patent/JP2002514001A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/06—Programme-controlled manipulators characterised by multi-articulated arms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
    • B23H9/06—Marking or engraving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm
    • Y10T74/20323—Robotic arm including flaccid drive element

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2000546922A 1998-05-04 1999-04-06 同軸駆動軸を備えた二重アーム装置及びこれを用いた基板搬送方法 Expired - Lifetime JP4620866B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/072,097 US6547510B1 (en) 1998-05-04 1998-05-04 Substrate transport apparatus with coaxial drive shafts and dual independent scara arms
US09/072,097 1998-05-04
PCT/US1999/007526 WO1999056920A1 (en) 1998-05-04 1999-04-06 Dual arm apparatus with co-axial drive shafts

Publications (3)

Publication Number Publication Date
JP2002514001A JP2002514001A (ja) 2002-05-14
JP2002514001A5 JP2002514001A5 (US07585860-20090908-C00154.png) 2009-09-17
JP4620866B2 true JP4620866B2 (ja) 2011-01-26

Family

ID=22105547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000546922A Expired - Lifetime JP4620866B2 (ja) 1998-05-04 1999-04-06 同軸駆動軸を備えた二重アーム装置及びこれを用いた基板搬送方法

Country Status (6)

Country Link
US (1) US6547510B1 (US07585860-20090908-C00154.png)
EP (1) EP1107853A1 (US07585860-20090908-C00154.png)
JP (1) JP4620866B2 (US07585860-20090908-C00154.png)
KR (1) KR20010043252A (US07585860-20090908-C00154.png)
AU (1) AU3384199A (US07585860-20090908-C00154.png)
WO (1) WO1999056920A1 (US07585860-20090908-C00154.png)

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US6350097B1 (en) * 1999-04-19 2002-02-26 Applied Materials, Inc. Method and apparatus for processing wafers
US6663333B2 (en) * 2001-07-13 2003-12-16 Axcelis Technologies, Inc. Wafer transport apparatus
US20030202865A1 (en) * 2002-04-25 2003-10-30 Applied Materials, Inc. Substrate transfer apparatus
US7891935B2 (en) 2002-05-09 2011-02-22 Brooks Automation, Inc. Dual arm robot
US6789793B2 (en) * 2002-05-24 2004-09-14 Heidelberger Druckmaschinen Ag Rotary signature transport device
US7384907B2 (en) * 2002-12-13 2008-06-10 Duke University Method of treating infection with ABl tyrosine kinase inhibitors
US20050113964A1 (en) * 2003-11-10 2005-05-26 Blueshift Technologies, Inc. Sensor methods and systems for semiconductor handling
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20050255953A1 (en) * 2004-05-12 2005-11-17 Timothy Puckett Band Drive System for Telescopes, LIDAR and Other Instruments
US7249992B2 (en) * 2004-07-02 2007-07-31 Strasbaugh Method, apparatus and system for use in processing wafers
US8052030B2 (en) 2005-01-24 2011-11-08 The Boeing Company Apparatus for friction stir welding using spindle-in-spindle
US9517488B2 (en) 2004-12-30 2016-12-13 Plas-Pak Industries, Inc. Component delivery system utilizing film bags
US20100108709A1 (en) 2004-12-30 2010-05-06 Plas-Pak Industries Cartridge delivery system utilizing film bags
US8167522B2 (en) * 2005-03-30 2012-05-01 Brooks Automation, Inc. Substrate transport apparatus with active edge gripper
WO2007061603A2 (en) * 2005-11-21 2007-05-31 Applied Materials, Inc. Methods and apparatus for transferring substrates during electronic device manufacturing
US7946800B2 (en) * 2007-04-06 2011-05-24 Brooks Automation, Inc. Substrate transport apparatus with multiple independently movable articulated arms
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US9623555B2 (en) 2010-11-10 2017-04-18 Brooks Automation, Inc. Dual arm robot
KR102392186B1 (ko) * 2011-03-11 2022-04-28 브룩스 오토메이션 인코퍼레이티드 기판 처리 툴
KR102153608B1 (ko) * 2012-07-05 2020-09-08 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조 시스템들에서 기판들을 운송하기 위한 붐 구동 장치, 멀티-아암 로봇 장치, 전자 디바이스 프로세싱 시스템들, 및 방법들
US9149936B2 (en) 2013-01-18 2015-10-06 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
US10224232B2 (en) 2013-01-18 2019-03-05 Persimmon Technologies Corporation Robot having two arms with unequal link lengths
KR102214943B1 (ko) * 2013-01-18 2021-02-10 퍼시몬 테크놀로지스 코포레이션 상이한 링크 길이를 가지는 아암이 구비되는 로봇
ES2431263B1 (es) * 2013-04-23 2014-09-10 Barnizados Industriales, S.A. Placa para falso techo o pared, procedimiento de fabricación de dicha placa
TWI672191B (zh) * 2013-10-16 2019-09-21 美商應用材料股份有限公司 帶有裝設樞紐手臂之化學機械拋光機的系統及方法
CN104795347B (zh) * 2014-01-22 2018-05-04 北京北方华创微电子装备有限公司 晶圆支撑装置和去气工艺腔室
CN114367970B (zh) 2015-03-12 2024-04-05 柿子技术公司 具有从动末端执行器运动的机器人
CN107534000B (zh) * 2015-04-20 2021-12-17 应用材料公司 缓冲腔室晶片加热机构和支撑机械臂
JP7196101B2 (ja) * 2017-02-15 2022-12-26 パーシモン テクノロジーズ コーポレイション 複数のエンドエフェクタを備えた材料取り扱いロボット
US10629472B2 (en) 2017-08-17 2020-04-21 Persimmon Technologies Corporation Material handling robot
CN107717959B (zh) * 2017-11-07 2020-08-14 大连理工大学 一种部分解耦的scara高速并联机械手
CN110652357B (zh) * 2019-09-19 2020-06-12 中国科学院自动化研究所 双导丝或球囊的血管介入器械操控装置
US11679046B2 (en) 2019-11-04 2023-06-20 GE Precision Healthcare LLC Method and system for providing dual axes motions using a single drive
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TWI767556B (zh) * 2021-02-08 2022-06-11 鴻勁精密股份有限公司 載具機構及其應用之作業設備

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Also Published As

Publication number Publication date
US6547510B1 (en) 2003-04-15
KR20010043252A (ko) 2001-05-25
AU3384199A (en) 1999-11-23
JP2002514001A (ja) 2002-05-14
WO1999056920A1 (en) 1999-11-11
EP1107853A1 (en) 2001-06-20

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