JP4606772B2 - 側方射出型液滴エゼクタ及び側方射出型液滴エゼクタを製造する方法 - Google Patents
側方射出型液滴エゼクタ及び側方射出型液滴エゼクタを製造する方法 Download PDFInfo
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- JP4606772B2 JP4606772B2 JP2004141919A JP2004141919A JP4606772B2 JP 4606772 B2 JP4606772 B2 JP 4606772B2 JP 2004141919 A JP2004141919 A JP 2004141919A JP 2004141919 A JP2004141919 A JP 2004141919A JP 4606772 B2 JP4606772 B2 JP 4606772B2
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- 238000000034 method Methods 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title description 19
- 239000012530 fluid Substances 0.000 claims description 131
- 239000000463 material Substances 0.000 claims description 67
- 239000000758 substrate Substances 0.000 claims description 49
- 238000000059 patterning Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 89
- 229920002120 photoresistant polymer Polymers 0.000 description 14
- 229920000642 polymer Polymers 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 8
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000011109 contamination Methods 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000007736 thin film deposition technique Methods 0.000 description 3
- AHVYPIQETPWLSZ-UHFFFAOYSA-N 1-methyl-2,5-dihydropyrrole Chemical compound CN1CC=CC1 AHVYPIQETPWLSZ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- -1 for example Substances 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000000347 anisotropic wet etching Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- CHKLESDHIQANSR-UHFFFAOYSA-N benzene-1,2-diol;ethene Chemical compound C=C.OC1=CC=CC=C1O CHKLESDHIQANSR-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/1429—Structure of print heads with piezoelectric elements of tubular type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14032—Structure of the pressure chamber
- B41J2/1404—Geometrical characteristics
Description
210:基板
215:第1の永久層
216:第2の永久層
230:ヒータ素子
240:永久層
250:チャネル
255:ノズル開口部
260:流体供給リザーバ
270:流体抵抗層
275:流体入口
278:フィルタ
Claims (2)
- 流体噴射装置のための流路を形成する方法であって、
少なくとも1つのチャネルを基板に形成し、
第1の永久材料層を前記基板及び前記チャネルの上に堆積し、
犠牲材料を前記第1の永久材料層及び前記少なくとも1つのチャネルの上に堆積し、
複数のチャネル構造及び該複数のチャネル構造に接続された少なくとも1つの流体リザーバ構造を形成するように前記犠牲層をパターニングし、
第2の永久材料層を前記パターニングされた犠牲材料及び前記第1の永久材料層の上に堆積し、
流体抵抗層を前記第2の永久材料層の上に堆積し、
前記流体抵抗層において、前記少なくとも1つの流体リザーバ構造の上に配置され且つ前記第2の永久材料層を少なくとも部分的に貫通する、少なくとも1つの流体入口を、形成し、
少なくとも1つの穴を前記第2の永久材料層において、前記少なくとも1つの流体入口の境界内に形成して、
前記犠牲材料を除去して、前記少なくとも1つの流体入口に流体接続された少なくとも1つの流体リザーバ構造と、該少なくとも1つの流体リザーバに流体接続された複数の流体チャネルを形成する、
ことからなる方法。 - 各々が基板の外面で終端する複数のチャネルが形成された基板と、
前記基板及び前記複数のチャネルの上に形成された第1の永久材料層と、
前記第1の永久材料層の上に形成された第2の永久材料層とを包含し、
前記第1及び第2の永久材料層が、前記基板に形成された複数のチャネルに対する複数の流体噴射チャネルと、該複数の流体噴射チャネルに流体接続する少なくとも1つの流体リザーバとを定める形状に形成されており、
前記複数の流体噴射チャネル及び少なくとも1つの流体リザーバを包み込む流体抵抗層が、少なくとも第2の永久材料の上に形成され、
少なくとも1つの流体入口が、前記少なくとも1つの流体リザーバまで下方に延びるように前記流体抵抗層に形成され、
前記少なくとも1つの流体入口が、前記第2の永久層を貫通して前記少なくとも1つの流体入口を前記少なくとも1つの流体リザーバに流体接続する、少なくとも1つの穴を包含する、
ことを特徴とする流体噴射ヘッド。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/440,177 US6805433B1 (en) | 2003-05-19 | 2003-05-19 | Integrated side shooter inkjet architecture with round nozzles |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004344879A JP2004344879A (ja) | 2004-12-09 |
JP4606772B2 true JP4606772B2 (ja) | 2011-01-05 |
Family
ID=33131518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004141919A Expired - Fee Related JP4606772B2 (ja) | 2003-05-19 | 2004-05-12 | 側方射出型液滴エゼクタ及び側方射出型液滴エゼクタを製造する方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US6805433B1 (ja) |
JP (1) | JP4606772B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060054294A (ko) * | 2003-07-16 | 2006-05-22 | 베링거 인겔하임 미크로파르 게엠베하 | 플레이트 형상의 합성 구조로부터 미세유체 배열들을제조하는 방법 |
JP2006297683A (ja) * | 2005-04-19 | 2006-11-02 | Sony Corp | 液体吐出ヘッド及び液体吐出ヘッドの製造方法 |
JP4489637B2 (ja) * | 2005-05-20 | 2010-06-23 | シャープ株式会社 | インクジェットヘッドおよびその製造方法 |
FR2960339B1 (fr) * | 2010-05-18 | 2012-05-18 | Commissariat Energie Atomique | Procede de realisation d'elements a puce munis de rainures d'insertion de fils |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6198557A (ja) * | 1984-10-20 | 1986-05-16 | Ricoh Co Ltd | マルチノズルの製法 |
JPH08258273A (ja) * | 1995-03-20 | 1996-10-08 | Brother Ind Ltd | インク噴射装置の製造方法 |
JPH09216365A (ja) * | 1996-02-14 | 1997-08-19 | Canon Inc | 液体噴射記録ヘッド及びその製造方法 |
JP2002219699A (ja) * | 2000-10-27 | 2002-08-06 | Air Products & Chemicals Inc | シリコン表面の犠牲材料及び金属汚染物除去方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5738799A (en) | 1996-09-12 | 1998-04-14 | Xerox Corporation | Method and materials for fabricating an ink-jet printhead |
-
2003
- 2003-05-19 US US10/440,177 patent/US6805433B1/en not_active Expired - Fee Related
-
2004
- 2004-05-12 JP JP2004141919A patent/JP4606772B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6198557A (ja) * | 1984-10-20 | 1986-05-16 | Ricoh Co Ltd | マルチノズルの製法 |
JPH08258273A (ja) * | 1995-03-20 | 1996-10-08 | Brother Ind Ltd | インク噴射装置の製造方法 |
JPH09216365A (ja) * | 1996-02-14 | 1997-08-19 | Canon Inc | 液体噴射記録ヘッド及びその製造方法 |
JP2002219699A (ja) * | 2000-10-27 | 2002-08-06 | Air Products & Chemicals Inc | シリコン表面の犠牲材料及び金属汚染物除去方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2004344879A (ja) | 2004-12-09 |
US6805433B1 (en) | 2004-10-19 |
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