JP4581540B2 - 半導体発光素子とそれを用いた発光装置 - Google Patents

半導体発光素子とそれを用いた発光装置 Download PDF

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Publication number
JP4581540B2
JP4581540B2 JP2004222629A JP2004222629A JP4581540B2 JP 4581540 B2 JP4581540 B2 JP 4581540B2 JP 2004222629 A JP2004222629 A JP 2004222629A JP 2004222629 A JP2004222629 A JP 2004222629A JP 4581540 B2 JP4581540 B2 JP 4581540B2
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Japan
Prior art keywords
electrode
light emitting
layer
light
conductivity type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2004222629A
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English (en)
Japanese (ja)
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JP2005039284A5 (https=
JP2005039284A (ja
Inventor
大輔 三賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2004222629A priority Critical patent/JP4581540B2/ja
Publication of JP2005039284A publication Critical patent/JP2005039284A/ja
Publication of JP2005039284A5 publication Critical patent/JP2005039284A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2004222629A 2003-06-30 2004-06-30 半導体発光素子とそれを用いた発光装置 Expired - Fee Related JP4581540B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004222629A JP4581540B2 (ja) 2003-06-30 2004-06-30 半導体発光素子とそれを用いた発光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003188121 2003-06-30
JP2004222629A JP4581540B2 (ja) 2003-06-30 2004-06-30 半導体発光素子とそれを用いた発光装置

Publications (3)

Publication Number Publication Date
JP2005039284A JP2005039284A (ja) 2005-02-10
JP2005039284A5 JP2005039284A5 (https=) 2007-08-02
JP4581540B2 true JP4581540B2 (ja) 2010-11-17

Family

ID=34220505

Family Applications (1)

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JP2004222629A Expired - Fee Related JP4581540B2 (ja) 2003-06-30 2004-06-30 半導体発光素子とそれを用いた発光装置

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JP (1) JP4581540B2 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006228855A (ja) * 2005-02-16 2006-08-31 Rohm Co Ltd 半導体発光素子およびその製法
US7803648B2 (en) 2005-03-09 2010-09-28 Showa Denko K.K. Nitride semiconductor light-emitting device and method for fabrication thereof
KR100878433B1 (ko) * 2005-05-18 2009-01-13 삼성전기주식회사 발광소자의 오믹컨택층 제조방법 및 이를 이용한발광소자의 제조방법
JP2007067257A (ja) * 2005-09-01 2007-03-15 Kyocera Corp 発光素子
JP5045001B2 (ja) * 2006-06-22 2012-10-10 日亜化学工業株式会社 半導体発光素子
JP5023691B2 (ja) * 2006-12-26 2012-09-12 日亜化学工業株式会社 半導体発光素子
JP2010165983A (ja) * 2009-01-19 2010-07-29 Sharp Corp 発光チップ集積デバイスおよびその製造方法
JP2010225771A (ja) * 2009-03-23 2010-10-07 Toyoda Gosei Co Ltd 半導体発光素子
KR101021988B1 (ko) * 2010-06-24 2011-03-16 (주)더리즈 반도체 발광 소자
JP6102677B2 (ja) * 2012-12-28 2017-03-29 日亜化学工業株式会社 発光素子
JP2015028984A (ja) 2013-07-30 2015-02-12 日亜化学工業株式会社 半導体発光素子
JP6458463B2 (ja) 2013-12-09 2019-01-30 日亜化学工業株式会社 発光素子
EP3062354B1 (en) 2015-02-26 2020-10-14 Nichia Corporation Light emitting element
JP2019106406A (ja) * 2017-12-08 2019-06-27 Ｄｏｗａエレクトロニクス株式会社 半導体発光素子およびそれを用いた表面実装デバイスならびにそれらの製造方法
US12609057B2 (en) 2020-04-13 2026-04-21 Lg Electronics Inc. Display device and method for manufacturing same, and multi-screen display device using same
US11894489B2 (en) * 2021-03-16 2024-02-06 Epistar Corporation Semiconductor device, semiconductor component and display panel including the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4810746B2 (ja) * 2000-03-31 2011-11-09 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体素子
JP3576963B2 (ja) * 2000-11-24 2004-10-13 三菱電線工業株式会社 半導体発光素子
DE10105800B4 (de) * 2001-02-07 2017-08-31 Osram Gmbh Hocheffizienter Leuchtstoff und dessen Verwendung
JP2002319704A (ja) * 2001-04-23 2002-10-31 Matsushita Electric Works Ltd Ｌｅｄチップ
JP3985486B2 (ja) * 2001-10-01 2007-10-03 松下電器産業株式会社 半導体発光素子とこれを用いた発光装置

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Publication number Publication date
JP2005039284A (ja) 2005-02-10

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