JP4581540B2 - 半導体発光素子とそれを用いた発光装置 - Google Patents

半導体発光素子とそれを用いた発光装置 Download PDF

Info

Publication number
JP4581540B2
JP4581540B2 JP2004222629A JP2004222629A JP4581540B2 JP 4581540 B2 JP4581540 B2 JP 4581540B2 JP 2004222629 A JP2004222629 A JP 2004222629A JP 2004222629 A JP2004222629 A JP 2004222629A JP 4581540 B2 JP4581540 B2 JP 4581540B2
Authority
JP
Japan
Prior art keywords
electrode
light emitting
layer
light
conductivity type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004222629A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005039284A (ja
JP2005039284A5 (enrdf_load_stackoverflow
Inventor
大輔 三賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2004222629A priority Critical patent/JP4581540B2/ja
Publication of JP2005039284A publication Critical patent/JP2005039284A/ja
Publication of JP2005039284A5 publication Critical patent/JP2005039284A5/ja
Application granted granted Critical
Publication of JP4581540B2 publication Critical patent/JP4581540B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Luminescent Compositions (AREA)
JP2004222629A 2003-06-30 2004-06-30 半導体発光素子とそれを用いた発光装置 Expired - Fee Related JP4581540B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004222629A JP4581540B2 (ja) 2003-06-30 2004-06-30 半導体発光素子とそれを用いた発光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003188121 2003-06-30
JP2004222629A JP4581540B2 (ja) 2003-06-30 2004-06-30 半導体発光素子とそれを用いた発光装置

Publications (3)

Publication Number Publication Date
JP2005039284A JP2005039284A (ja) 2005-02-10
JP2005039284A5 JP2005039284A5 (enrdf_load_stackoverflow) 2007-08-02
JP4581540B2 true JP4581540B2 (ja) 2010-11-17

Family

ID=34220505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004222629A Expired - Fee Related JP4581540B2 (ja) 2003-06-30 2004-06-30 半導体発光素子とそれを用いた発光装置

Country Status (1)

Country Link
JP (1) JP4581540B2 (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006228855A (ja) * 2005-02-16 2006-08-31 Rohm Co Ltd 半導体発光素子およびその製法
CN100573938C (zh) * 2005-03-09 2009-12-23 昭和电工株式会社 氮化物半导体发光器件及其制造方法
KR100878433B1 (ko) 2005-05-18 2009-01-13 삼성전기주식회사 발광소자의 오믹컨택층 제조방법 및 이를 이용한발광소자의 제조방법
JP2007067257A (ja) * 2005-09-01 2007-03-15 Kyocera Corp 発光素子
JP5045001B2 (ja) * 2006-06-22 2012-10-10 日亜化学工業株式会社 半導体発光素子
JP5023691B2 (ja) * 2006-12-26 2012-09-12 日亜化学工業株式会社 半導体発光素子
JP2010165983A (ja) * 2009-01-19 2010-07-29 Sharp Corp 発光チップ集積デバイスおよびその製造方法
JP2010225771A (ja) * 2009-03-23 2010-10-07 Toyoda Gosei Co Ltd 半導体発光素子
KR101021988B1 (ko) * 2010-06-24 2011-03-16 (주)더리즈 반도체 발광 소자
JP6102677B2 (ja) * 2012-12-28 2017-03-29 日亜化学工業株式会社 発光素子
JP2015028984A (ja) 2013-07-30 2015-02-12 日亜化学工業株式会社 半導体発光素子
JP6458463B2 (ja) 2013-12-09 2019-01-30 日亜化学工業株式会社 発光素子
EP3062354B1 (en) 2015-02-26 2020-10-14 Nichia Corporation Light emitting element
JP2019106406A (ja) * 2017-12-08 2019-06-27 Ｄｏｗａエレクトロニクス株式会社 半導体発光素子およびそれを用いた表面実装デバイスならびにそれらの製造方法
US20230207739A1 (en) * 2020-04-13 2023-06-29 Lg Electronics Inc. Display device and method for manufacturing same, and multi-screen display device using same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4810746B2 (ja) * 2000-03-31 2011-11-09 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体素子
JP3576963B2 (ja) * 2000-11-24 2004-10-13 三菱電線工業株式会社 半導体発光素子
DE10105800B4 (de) * 2001-02-07 2017-08-31 Osram Gmbh Hocheffizienter Leuchtstoff und dessen Verwendung
JP2002319704A (ja) * 2001-04-23 2002-10-31 Matsushita Electric Works Ltd Ｌｅｄチップ
JP3985486B2 (ja) * 2001-10-01 2007-10-03 松下電器産業株式会社 半導体発光素子とこれを用いた発光装置

Also Published As

Publication number Publication date
JP2005039284A (ja) 2005-02-10

Similar Documents

Publication Publication Date Title
JP4572604B2 (ja) 半導体発光素子及びそれを用いた発光装置
JP4053926B2 (ja) 窒化物半導体発光素子とそれを用いた発光装置
USRE49298E1 (en) Semiconductor light emitting element
JP4415575B2 (ja) 半導体発光素子及びそれを用いた発光装置
US8742438B2 (en) Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same
JP5040355B2 (ja) 半導体発光素子及びこれを備えた発光装置
JP4899825B2 (ja) 半導体発光素子、発光装置
US7947996B2 (en) Semiconductor light emitting element
JP5634003B2 (ja) 発光装置
US8217568B2 (en) Light emitting element and light emitting device using the light emitting element
JP4765632B2 (ja) 半導体発光素子
JP4882792B2 (ja) 半導体発光素子
JP3772801B2 (ja) 発光ダイオード
JP2008135789A (ja) 窒化物半導体発光素子、発光素子、素子積層体、並びにそれらを用いた発光装置
KR20170031289A (ko) 반도체 발광 소자
JP4581540B2 (ja) 半導体発光素子とそれを用いた発光装置
JP2007300134A (ja) 窒化物半導体発光素子、発光素子、素子積層体、並びにそれらを用いた発光装置
JP4069936B2 (ja) 窒化物半導体発光素子、発光素子、素子積層体、並びにそれらを用いた発光装置
KR101746002B1 (ko) 발광소자

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070618

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070618

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100122

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100511

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100709

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100803

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100816

R150 Certificate of patent or registration of utility model

Ref document number: 4581540

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130910

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130910

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees