JP4571918B2 - NbTi超電導多層板の製造方法及びNbTi超電導多層板 - Google Patents
NbTi超電導多層板の製造方法及びNbTi超電導多層板 Download PDFInfo
- Publication number
- JP4571918B2 JP4571918B2 JP2006049793A JP2006049793A JP4571918B2 JP 4571918 B2 JP4571918 B2 JP 4571918B2 JP 2006049793 A JP2006049793 A JP 2006049793A JP 2006049793 A JP2006049793 A JP 2006049793A JP 4571918 B2 JP4571918 B2 JP 4571918B2
- Authority
- JP
- Japan
- Prior art keywords
- nbti
- heat treatment
- plate
- hours
- rolling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Landscapes
- Laminated Bodies (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Description
1nm≦t≦100nm、
1nm≦d≦500nm、
NbTi層中の常電導析出物の体積分率をvとすると、
3%≦v≦50%
とするものである。ここで、常電導析出物の幅wと長さLについては特に制限はなく任意の大きさで良い。
このように構成すると、印加磁場がBまたはB′の方向で、電流をIまたはI′の方向に流す場合、常電導析出物2はローレンツ力FまたはF′の力に打ち勝って量子磁束を有効にピン止めし、臨界電流密度が高くなる。
2 常電導Ti析出物
3 粒界
Claims (2)
- 少なくとも1層のNbTi合金と高導電率金属が交互に積層され、前記NbTi合金と前記高導電率金属の間にNbまたはTaのバリヤー層が存在する多層板を、温度500〜1000℃で加工率30〜98%の熱間圧延を施した後、加工率30〜98%で冷間圧延し、300〜450℃の温度で1回当たりの保持時間が1〜168時間の熱処理と1回当たりの加工率が30〜98%の冷間圧延を6回以下交互に繰り返し施して板状または、箔状とした後、300〜450℃の温度で保持時間が168〜1000時間の熱処理を施した後、50〜90%の冷間圧延を施し、該50〜90%の冷間圧延の後、さらに300〜450℃の温度で1秒〜5時間熱処理を施すことを特徴とするNbTi超電導多層板の製造方法。
- CuまたはCu合金基材中に板状NbTi合金層がNb層を介して配置されているNbTi超電導多層板において、NbTi超電導多層板のNbTi層中に、板面に平行に板状に析出し、かつ厚さが1nm以上、100nm以下、板厚方向の間隔が1nm以上、500nm以下、NbTi合金層全体に対する体積分率が3%以上、50%以下の常電導析出物が存在することを特徴とする、NbTi超電導多層板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006049793A JP4571918B2 (ja) | 1996-03-19 | 2006-02-27 | NbTi超電導多層板の製造方法及びNbTi超電導多層板 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6227796 | 1996-03-19 | ||
JP2006049793A JP4571918B2 (ja) | 1996-03-19 | 2006-02-27 | NbTi超電導多層板の製造方法及びNbTi超電導多層板 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP02863697A Division JP3788839B2 (ja) | 1996-03-19 | 1997-02-13 | NbTi超電導多層板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006185925A JP2006185925A (ja) | 2006-07-13 |
JP4571918B2 true JP4571918B2 (ja) | 2010-10-27 |
Family
ID=36738846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006049793A Expired - Fee Related JP4571918B2 (ja) | 1996-03-19 | 2006-02-27 | NbTi超電導多層板の製造方法及びNbTi超電導多層板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4571918B2 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0294498A (ja) * | 1988-09-30 | 1990-04-05 | Nippon Steel Corp | Nb−Ti系超電導磁気シールド材及びその製造方法 |
JPH0736479B2 (ja) * | 1989-10-23 | 1995-04-19 | 新日本製鐵株式会社 | Nb―Ti系超電導磁気シールド材の製造方法 |
JPH0682949B2 (ja) * | 1990-03-23 | 1994-10-19 | 新日本製鐵株式会社 | 超電導磁気シールド体およびその製造方法 |
JP3788839B2 (ja) * | 1996-03-19 | 2006-06-21 | 新日本製鐵株式会社 | NbTi超電導多層板の製造方法 |
JP3544781B2 (ja) * | 1996-04-11 | 2004-07-21 | 新日本製鐵株式会社 | Nb−Ti系超電導多層板の製造方法 |
-
2006
- 2006-02-27 JP JP2006049793A patent/JP4571918B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006185925A (ja) | 2006-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Collings | Applied Superconductivity, Metallurgy, and Physics of Titanium Alloys: Fundamentals Alloy Superconductors: Their Metallurgical, Physical, and Magnetic-Mixed-State Properties | |
Sakai et al. | Development of a high strength, high conductivity copper-silver alloy for pulsed magnets | |
JPS5840286B2 (ja) | 高抗張力アルミニウム安定化超電導線の製造方法 | |
Lee et al. | Niobium-titanium superconducting wires: Nanostructures by extrusion and wiredrawing | |
Tsuei | Superconducting composite of copper and niobium—a metallurgical approach | |
JP6247813B2 (ja) | NbTi系超電導線材 | |
Cooley et al. | Processing of Low T c Conductors: The Alloy Nb–Ti | |
JP3788839B2 (ja) | NbTi超電導多層板の製造方法 | |
Suenaga et al. | The fabrication and properties of Nb 3 Sn superconductors by the solid diffusion process | |
JP4571918B2 (ja) | NbTi超電導多層板の製造方法及びNbTi超電導多層板 | |
Heussner et al. | Properties of niobium–titanium superconducting wires with Nb artificial pinning centers | |
JP4033375B2 (ja) | MgB2系超伝導体及びその製造方法 | |
Tsuei | Ductile superconducting Cu-rich alloys containing A-15 filaments | |
Takeuchi et al. | Effect of flat-roll forming on critical current density characteristics and microstructure of Nb/sub 3/Al multifilamentary conductors | |
JP3920606B2 (ja) | 粉末法Nb▲3▼Sn超電導線材の製造方法 | |
Witcomb et al. | Effect of microstructure on superconducting properties of Mo/34 at.% Re alloy | |
JP4516639B2 (ja) | NbTi超電導多層板及びその製造方法 | |
Kreilick | Niobium-titanium superconductors | |
JPS62110207A (ja) | ニオブ・チタン極細多芯超電導線 | |
JPH0714442A (ja) | パルス又は交流用NbTi超電導線 | |
Heussner | Flux pinning in superconducting Nb-Ti wires with Nb artificial pinning centers | |
JPH0636331B2 (ja) | Nb▲下3▼A1化合物超電導線材の製造法 | |
Pramono | The potential development of nano-structured Cu-Nb3Sn superconductor wire for the application of medical device in Indonesia | |
Chawla et al. | Multifilamentary Superconducting Composites | |
JPH09147635A (ja) | A15型超電導線材およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090224 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090423 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100511 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100709 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100803 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100813 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130820 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130820 Year of fee payment: 3 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130820 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |