JP4571870B2 - Exposure equipment - Google Patents

Description

  The present invention relates to an exposure apparatus that exposes a resist film coated on a back surface or a front surface of a wafer having functional elements formed in regions partitioned by grid-like division lines on the surface along the division lines.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets formed in a lattice shape on the surface of a substantially disc-shaped semiconductor wafer, and functions such as IC and LSI are defined in the partitioned regions. An element is formed. Then, by cutting the semiconductor wafer along the planned dividing line, the region where the functional element is formed is divided to manufacture individual semiconductor chips. In addition, an optical device wafer in which a light emitting element (functional element) such as a gallium nitride compound semiconductor is laminated on the surface of a sapphire substrate is cut along a predetermined division line so that light from each light emitting diode, laser diode, etc. Divided into devices and widely used in electrical equipment.

The cutting along the division lines such as the above-described semiconductor wafer and optical device wafer is usually performed by a cutting device called a dicer. The cutting apparatus is configured to move a chuck table that holds a workpiece, a cutting unit that includes a cutting blade for cutting the workpiece held on the chuck table, and the chuck table and the cutting unit. The wafer is cut along the street by feeding the chuck table holding the workpiece while rotating the cutting blade. (For example, refer to Patent Document 1.)
JP 2001-85365 A

  However, when the wafer is cut by the cutting blade of the above-described cutting apparatus, fine chips are likely to occur on the outer periphery of each divided chip, which causes a reduction in the bending strength of the chip. In order to solve such a problem, a resist film is coated on the back surface of the wafer, and a region corresponding to the planned dividing line of the resist film is developed and removed by exposure. Thereafter, the wafer is removed from the resist film side. There has been proposed a method of dividing a wafer along a planned division line by etching along the planned division line by plasma etching or the like.

  Thus, in the exposure process for exposing the region corresponding to the planned division line of the resist film coated on the back surface of the wafer, it is necessary to prepare a mask member corresponding to the planned division line formed on the wafer. The mask member must be manufactured each time for wafers with different intervals between the lines to be divided, which is not always satisfactory in terms of productivity.

  The present invention has been made in view of the above-mentioned facts, and its main technical problem is to provide an exposure apparatus capable of exposing a wafer having different intervals between division scheduled lines without producing a mask member each time. There is.

In order to solve the above-mentioned main technical problem, according to the present invention, a resist film coated on the back surface or the surface of a wafer in which functional elements are formed in a region partitioned by lattice-like division lines on the surface is divided. An exposure apparatus that performs exposure along a planned line,
A plurality of chuck tables holding wafers;
An alignment means for detecting the dividing lines formed on the wafer held on the plurality of chuck table,
A resist film coated on the rear surface or the surface of each held wafer into said plurality of chuck table, and a line exposure means for simultaneously exposing the line light corresponding to the division lines,
And said plurality of chuck table and the line exposure unit move relative, a plurality of indexing means for positioning the dividing lines formed on the wafer held respectively in said plurality of chuck table to the exposure position of the line light , And
The line exposure unit includes a mask unit including a reticle mask in which a light shielding layer and a line-shaped light transmission portion are formed on a transparent plate, and a light-emitting unit that exposes line light through the line-shaped light transmission portion of the reticle mask. And consists of
The plurality of index means move the plurality of chuck tables in directions orthogonal to the line-shaped light transmission portions of the reticle mask, and are formed in predetermined directions formed on wafers respectively held by the plurality of chuck tables. And an index feeding means for positioning the line to be divided at the exposure position of the line light, and orthogonal to the line to be divided extending in a predetermined direction formed on the wafer held by the chuck table by rotating the plurality of chuck tables. It consists of rotating means that positions the division line in the direction to be parallel to the slit,
An exposure apparatus is provided.

  The mask means includes a plurality of the reticle masks, and includes an interval adjusting means for adjusting the intervals between the plurality of reticle masks.

Oite the exposure apparatus according to the present invention, a plurality of moving a plurality of the chuck table by indexing means, the dividing lines are formed on the wafer held in a plurality of the chuck table, a line-shaped light reticle mask Since it is positioned at the exposure position of the line light to be exposed through the transmission part, it is not necessary to manufacture the mask means each time corresponding to wafers having different intervals between the division lines.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of an exposure apparatus constructed according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view of an exposure apparatus constructed according to the present invention. The exposure apparatus in the illustrated embodiment includes a base 2, a plurality of (two in the illustrated embodiment) chuck tables 3 and 3 that hold wafers, which will be described later, and two bases disposed on the base 2. Two index means 4 and 4 for supporting the chuck table, an alignment means 5 for detecting a division line formed on a wafer to be described later held on the two chuck tables 3 and 3 respectively, and two pieces Line exposure means 6 for exposing line light to the wafer held on the chuck tables 3 and 3 is provided.

The two chuck tables 3, 3 and the two index means 4, 4 will be described with reference to FIG. Since the two chuck tables 3 and 3 and the two index means 4 and 4 have the same configuration, only one symbol will be described below.
Each chuck table 3 includes a suction chuck 31 formed of a porous material, and holds a wafer described later on the suction chuck 31 by suction means (not shown). The chuck table 3 is adapted to be moved in the indexing feed direction indicated by the arrow Y in FIGS. 1 and 2 by the index means 4 and is configured to be rotatable.

  The index means 4 includes a pair of guide rails 41 and 41 arranged in parallel along the indexing feed direction indicated by the arrow Y on the base 2 (see FIG. 1), and the arrow Y on the guide rails 41 and 41. A support base 42 movably disposed in the indexing and feeding direction shown by FIG. 2, a cylindrical member 43 disposed on the support base 42 and rotatably supporting the chuck table 3, and disposed in the cylindrical member 43. And a pulse motor 44 as a rotating means for rotating the chuck table 3 and an index feed means 45 for moving the support base 42 along the pair of guide rails 41, 41 in the index feed direction indicated by the arrow Y. is doing.

  The support base 42 is provided with a pair of guided grooves 421 and 421 that are fitted to the pair of guide rails 41 and 41 on the lower surface thereof, and the guided grooves 421 and 421 are formed into the pair of guide rails 41 and 41. By fitting, it is configured to be movable along the pair of guide rails 41, 41 in the indexing feed direction indicated by the arrow Y. The pulse motor 44 as the rotation means can rotate the chuck table 3 at every predetermined angle. The index feeding means 45 includes a male screw rod 451 disposed in parallel between the pair of guide rails 41 and 41, and a drive source such as a pulse motor 452 for rotating the male screw rod 451. . One end of the male screw rod 451 is rotatably supported by a bearing block 453 fixed to the base 2, and the other end is connected to the output shaft of the pulse motor 452. The male screw rod 451 is screwed into a through female screw hole 423a formed in a female screw block 423 provided to protrude from the lower surface of the center portion of the support base 42. Accordingly, when the male screw rod 451 is driven to rotate forward and reversely by the pulse motor 452, the support base 42 is moved along the guide rails 41 and 41 in the index feed direction indicated by the arrow Y.

  Returning to FIG. 1 and continuing the description, the alignment means 5 is disposed above one end of the pair of guide rails 41, 41 constituting the index means 4. In the illustrated embodiment, the alignment unit 5 includes, in addition to a normal image sensor (CCD) that captures an image with visible light, an infrared illumination unit that irradiates a workpiece with infrared rays, and an infrared ray that is irradiated by the infrared illumination units. And an image pickup means 51 composed of an image pickup device (infrared CCD) that outputs an electrical signal corresponding to the infrared ray captured by the optical system, and the image pickup means 51 captures an image signal Is sent to control means (not shown). The imaging means 51 is supported by a support member 53 mounted on a support column 52 erected on the base 2 via a support arm 54. The support arm 54 to which the imaging means 51 is attached is moved in a direction indicated by an arrow X in FIG. 1, that is, a direction orthogonal to the index feed direction indicated by the arrow Y by a moving means (not shown) disposed in the support member. It is configured to be moved.

  Next, the line exposure means 6 will be described. The line exposure unit 6 in the illustrated embodiment includes a mask unit 61 and a light emitting unit 62. The mask means 61 is formed by an upper wall 611, a left side wall 612, a right side wall 613, and a front end wall 614, and is disposed on the base 2 so as to cover the alignment means 5. A rectangular opening 611a is formed in the upper wall 611 of the mask means 61, and a reticle mask 615 is disposed in the opening 611a. As shown in FIGS. 1 and 3, the reticle mask 615 includes a light shielding layer 615b formed of a metal film such as a chromium film on the surface of a transparent plate 615a made of a transparent synthetic quartz glass plate or soda lime plate material, and the light shielding layer. 615b includes a single line-shaped light transmission portion 615c formed by a technique such as electron beam drawing in a direction orthogonal to the index feed direction indicated by the arrow Y. As a method of forming the reticle mask 615, a light-shielding layer 615b is formed by sticking a linear mask member corresponding to the line-shaped light transmitting portion 615c on the surface of the transparent plate 615a. It may be peeled off to form a line-shaped light transmission portion 615c. The chuck table 3 can move along a pair of guide rails 41 and 41 in the mask means 61 having the reticle mask 615 configured as described above. The light emitting means 62 constituting the line exposure means 6 is supported by a support column 63 erected on the base 2 and is disposed above the reticle mask 615 disposed on the upper wall 611 of the mask means 61. And irradiates predetermined light toward the line-shaped light transmission portion 615c.

The exposure apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
Here, a wafer as a workpiece to be exposed by the exposure apparatus will be described with reference to FIG. A wafer 10 shown in FIG. 7 is made of a silicon wafer, and is formed in a lattice shape on a surface 10a by a plurality of division lines 101 parallel to each other. On the surface 10 a of the wafer 10, circuits 102 as functional elements are formed in a plurality of regions partitioned by a plurality of division lines 101. The wafer 10 configured as described above has a back surface ground and a thickness of, for example, 100 μm. In order to etch the wafer 10 along the planned dividing line 101 and divide it into individual chips, a photosensitive resist film 11 is formed on the back surface 10b of the wafer 10 as shown in FIG. 8 (resist film forming step).

Next, an exposure process is performed in which the photosensitive resist film 11 formed on the back surface 10b of the wafer 10 by the above-described resist film forming process is exposed along the planned division line 101, and an area corresponding to the planned division line 101 is removed. To do.
In the exposure process, first, the surface 10a side of the wafer 10 is placed on the two chuck tables 3 and 3 of the exposure apparatus, respectively, and a suction means (not shown) is operated to place the wafer 10 on the two chuck tables 3 and 3. The wafers 10 and 10 are sucked and held respectively. Accordingly, the photosensitive resist film 11 formed on the back surface 10b of each of the wafers 10 and 10 is on the upper side. In this way, if the wafers 10 and 10 are held on the two chuck tables 3 and 3, respectively, the chuck tables 3 and 3 are operated in the direction indicated by the arrow Y to move the wafers 10 and 10 to the alignment means 5. It is positioned in the imaging area of the imaging means 51 to be configured. When the chuck tables 3 and 3 are positioned in the imaging area of the imaging means 51, an alignment operation for detecting an exposure area in the photosensitive resist film 11 formed on the back surface 10b of the wafers 10 and 10 by the imaging means 51 and a control means (not shown). Execute. That is, first, the image pickup means 51 is positioned immediately above the wafer 10 held on one chuck table 3, and a division line 101 formed in a predetermined direction of the wafer 10 is detected. The division line 101 is the mask means. Alignment is performed so as to be positioned in parallel with the line-shaped light transmission portion 615c of the reticle mask 615 constituting 61. If the division-scheduled line 101 formed in a predetermined direction and the line-shaped light transmission portion 615c are not positioned in parallel, the pulse motor 44 of the index means 4 is operated to operate the chuck table 3 and the wafer 10 accordingly. Is aligned so that the division-scheduled line 101 and the line-shaped light transmission portion 615c are parallel to each other. In addition, alignment is similarly performed on the division line 101 formed in the direction orthogonal to the predetermined direction formed on the wafer 10. At this time, the surface 10a on which the planned dividing line 101 of the wafer 10 is formed is positioned on the lower side. However, as described above, the imaging unit 51 is an infrared illumination unit, an optical system that captures infrared rays, and an electrical system corresponding to infrared rays. Since it is composed of an image sensor (infrared CCD) or the like that outputs a signal, the wafer 10 can be imaged through the resist film 11 formed on the back surface b of the wafer 10. When the alignment operation for detecting the exposure region in the photosensitive resist film 11 formed on the back surface 10b of the wafer 10 held on one chuck table 3 is performed in this way, the imaging means 51 is moved to the arrow in FIG. The wafer is moved in the direction indicated by X and positioned immediately above the wafer 10 held on the other chuck table 3, and the above-described alignment operation is performed on the wafer 10 held on the other chuck table 3.

  As described above, when the division lines 101 formed on the wafers 10 and 10 held on the chuck tables 3 and 3 are detected and the exposure area is aligned, as shown in FIG. The chuck tables 3 and 3 holding the wafers 10 and 10 are moved in the direction indicated by the arrow Y1, that is, in the direction orthogonal to the slit 611a. The division line 101 is positioned immediately below the line-shaped light transmission portion 615c of the reticle mask 615 constituting the mask means 61. Next, the light emitting means 62 is energized to expose the line light to the photosensitive resist film 11 formed on the back surface 10b of the wafers 10 and 10 through the line-shaped light transmission portion 615c (exposure process). This line light exposes a region corresponding to the rightmost division planned line 101 in FIG. 3 in the division planned lines 101 formed on the wafers 10 and 10. By performing the exposure with the line light for about 1 second, the photosensitive resist film 11 is exposed and removed along the division line 101.

  As described above, if the region corresponding to the rightmost division planned line 101 in FIG. 3 in the photosensitive resist film 11 formed on the back surface 10b of the wafers 10 and 10 is removed, the index feeding means of the index means 4 and 4 will be described. By operating the pulse motors 452 and 452 constituting 45 and 45, the chuck tables 3 and 3 are moved in the direction indicated by the arrow Y1 by the interval of the above-mentioned division lines (indexing step). As a result, in the planned division line 101 formed on the wafers 10 and 10 held by the chuck tables 3 and 3, the second division planned line 101 from the rightmost end in FIG. 3 is the line of the reticle mask 615 constituting the mask means 61. It is positioned directly under the light transmitting portion 615c. And the said exposure process is implemented. In this way, by sequentially performing the indexing step and the exposure step, the region corresponding to the predetermined division line 101 in the predetermined direction in the photosensitive resist film 11 formed on the back surface 10b of the wafers 10 and 10 can be removed. it can. Next, the pulse motors 44, 44 of the index means 4, 4 are operated to rotate the chuck tables 3, 3 by 90 degrees. As a result, the wafers 10, 10 held on the chuck tables 3, 3 are line-shaped light transmitting portions of the reticle mask 615 in which the planned dividing line 101 formed perpendicular to the predetermined direction constitutes the mask means 61. It is positioned parallel to 615c. Then, by sequentially performing the indexing step and the exposure step described above, a region corresponding to the division lines formed at right angles to the predetermined direction in the photosensitive resist film 11 formed on the back surface 10b of the wafers 10 and 10 is obtained. Exposed and removed.

  As described above, in the exposure apparatus in the illustrated embodiment, the index motors 4 and 4 of the index means 4 and 4 are operated to move the chuck tables 3 and 3 by the interval of the scheduled division lines formed on the wafer. Since the process and the exposure process of irradiating light to the photosensitive resist film 11 formed on the back surface 10b of the wafers 10 and 10 through the line-shaped light transmitting portion 615c are sequentially performed, the wafers with different intervals between the division lines are different. Correspondingly, it is not necessary to manufacture the mask means 61 each time. In the illustrated embodiment, since the two chuck tables 3 and 3 are provided, the two wafers 10 and 10 can be exposed simultaneously. In the illustrated embodiment, an example in which the two chuck tables 3 and 3 are provided is shown, but three or more chuck tables may be provided.

  If the regions corresponding to all the division lines in the photosensitive resist film 11 formed on the back surface 10b of the wafers 10 and 10 are exposed and removed as described above, the wafers 10 and 10 are the next process. For example, it is transferred to a plasma etching process.

Next, another embodiment of the mask means 61 will be described with reference to FIGS. FIG. 4 shows an exposure apparatus having another embodiment of the mask means 61. FIG. 5 shows a plurality of reticle masks constituting the mask means 61 and a distance adjusting means for adjusting the distance between the plurality of reticle masks. It is shown. 4 is substantially the same as the exposure apparatus shown in FIG. 1 except for the mask means 61, the same members are denoted by the same reference numerals, and the description thereof is omitted.
The mask means 61 shown in FIGS. 4 and 5 has a relatively large rectangular opening 611b formed in the upper wall 611, and the three reticle masks 71a, 71b, 71c can adjust the interval in the opening 611b. It is arranged. The three reticle masks 71a, 71b, 71c are formed on the surface of a transparent plate 711 made of a transparent synthetic quartz glass plate or soda lime plate, respectively, like the reticle mask 615 in the embodiment shown in FIGS. A light shielding layer 712 formed of a metal film such as a film, and a single line-shaped light transmission formed in the light shielding layer 712 by a method such as electron beam drawing in a direction orthogonal to the index feed direction indicated by the arrow Y Part 713. At both ends of the three reticle masks 71a, 71b, 71c configured as described above, mounting members 714 formed in an L shape are mounted. The attachment member 714 includes a mounting portion 714a and a connecting portion 714b. The mounting portion 714a is mounted on both ends of the three reticle masks 71a, 71b, 71c by an adhesive or the like.

The exposure apparatus in the illustrated embodiment includes an interval adjusting means 72 that adjusts the interval between the reticle masks 71a, 71b, 71c, and hence the line-shaped light transmission portion 713. The distance adjusting means 72 includes links 721 and 722 each having one end swingably connected to a connecting portion 714b and 714b of mounting members 714 and 714 attached to both ends of the reticle masks 71a, 71b, and 71c. One end of each of the attachment members 714 714 b and 714 b is pivotally connected to the support shaft 73 by a support shaft 73, and one end of each of the attachment members 714 is connected to the support members 714 b and 714 b to be swingable by a support shaft 73. One end of the link 725, 726 is pivotally connected to the other end of the link 723 by a support shaft 73, and one end of the link 726 is swingably connected to the other end of the link 726 by a support shaft 73. A link mechanism comprising a link 729 is provided. The other end of the link 722 and the other end of the link 725 are swingably connected to each other by a support shaft 73. The link 722 and the link 723 and the link 724 and the link 725 have their intermediate portions swinging by the support shaft 73, respectively. Connected as possible.

  The interval adjusting means 72 in the illustrated embodiment includes a pair of operating means 74 and 74 for operating the link mechanism. The actuating means 74, 74 are arranged in parallel to the outside of the pair of guide rails 41 and 41 of the index feeding means 45 on the base 2 (see FIG. 4). Each of the operating means 74 and 74 includes a drive source such as a male screw rod 741 and a pulse motor 742 for rotationally driving the male screw rod 741. One end of the male screw rod 741 is rotatably supported by a bearing block 743 fixed to the base 2 (see FIG. 4), and the other end is connected to the output shaft of the pulse motor 742. The male screw rod 741 is screwed with a through female screw hole 744 a formed in the female screw block 744. The other ends of the links 721 and 728 are swingably connected to the case of the pulse motor 742 in the operating means 74 configured as described above by the support shaft 73, and the links 726 and 729 are connected to the female screw block 744. The other ends are connected to each other by pivots 73 so as to be swingable. Therefore, when the male screw rod 741 is driven forward or reversely by the pulse motor 742, the male screw rod 741 is moved along the female screw block 744 in the index feed direction indicated by the arrow Y. As a result, the intervals between the three reticle masks 71a, 71b, 71c connected to the link mechanism via the attachment member 714 are enlarged or reduced.

  Returning to FIG. 4, the description is continued. A bellows 751 is disposed between the reticle masks 71a and 71b, and a bellows 752 is disposed between the reticle masks 71b and 71c. Also, a bellows 753 is disposed between the reticle mask 71a and one edge of the opening 611b formed in the upper wall 611 of the mask means 61, and between the reticle mask 71c and the other edge of the opening 611b. A bellows 754 is provided. As described above, the bellows 751, 752, 753, and 754 disposed in the opening 611b portion formed on the upper wall 611 of the mask means 61 block light from the light emitting means 62 and the three reticle masks. It has a function of allowing movement of 71a, 71b, 71c.

The mask means 61 shown in FIGS. 4 and 5 is configured as described above, and exposure work using the mask means 61 will be described below.
First, the interval between the line-shaped light transmitting portions 713 and 713 formed on the reticle masks 71a, 71b, and 71c of the mask means 61 is the integer of the interval between the planned division lines 101 formed on the wafers 10 and 10 described above. The distance is adjusted to be one third of the distance between the outermost scheduled division line 101 on the opposite side and the outermost scheduled division line 101 on the opposite side. This adjustment is performed by driving the pulse motor 742 of the interval adjusting means 72 forward or backward. In this way, if the distance between the line-shaped light transmitting portions 713 and 713 formed on the reticle masks 71a, 71b and 71c of the mask means 61 is adjusted, it is held on the chuck tables 3 and 3 as described above. The division planned lines 101 formed on the wafers 10 and 10 are detected, and alignment of the exposure area is executed. Then, as shown in FIG. 6, the chuck table 3 holding the wafers 10 and 10 is moved below the reticle masks 71a, 71b and 71c, and the wafer is directly under the line-shaped light transmitting portion 713 formed on the reticle mask 71a. The rightmost division planned line 101 in the figure of the division planned line 101 formed in FIG. As a result, the division planned line corresponding to one third from the rightmost end in the drawing of all the division planned lines 101 formed on the wafers 10 and 10 immediately below the line-shaped light transmission portion 713 formed on the reticle mask 71b. 101 is positioned, and the division corresponding to two-thirds from the rightmost end in the figure in the entire division planned line 101 formed on the wafers 10 and 10 just below the line-shaped light transmission portion 713 formed on the reticle mask 71c. A scheduled line 101 is positioned.

  Next, the light emitting means 62 is energized, and line light is applied to the photosensitive resist film 11 formed on the back surface 10b of the wafers 10 and 10 through the line-shaped light transmitting portions 713 formed on the reticle masks 71a, 71b and 71c. Irradiate (exposure process). As a result, the photosensitive resist film 11 is exposed along the three scheduled division lines 101 of the wafers 10 and 10 located immediately below the line-shaped light transmission portions 713 formed on the reticle masks 71a, 71b, and 71c. Removed.

  When the exposure process is performed as described above, the pulse motors 452 and 452 constituting the index feeding means 45 and 45 of the index means 4 and 4 are operated, and the chuck table 3 is spaced by the interval of the scheduled division line 101. 3 is moved in the direction indicated by the arrow Y1 (indexing step), and the above exposure step is performed, so that the wafers 10 and 10 can be exposed simultaneously along the three division lines 101. As described above, in the embodiment shown in FIGS. 4 to 6, the regions corresponding to the plurality of division lines 101 (three in the illustrated embodiment) in the photosensitive resist film 11 are simultaneously exposed and removed. This improves productivity. Further, the interval between the line-shaped light transmitting portions 713 formed on the reticle masks 71a, 71b, 71c can be adjusted by driving the pulse motor 742 of the interval adjusting unit 72 in the normal direction or the reverse direction. It is possible to cope with wafers having different line intervals.

  In the above-described embodiment, the example in which the light shielding layers 615b and 712 are formed on the surfaces (upper surfaces) of the reticle masks 615 and 71a, 71b, and 71c is shown. It may be formed on the back surface (lower surface) of 71b and 71c so as to face the wafer 10. In the above-described embodiment, an example in which two chuck tables are provided has been described. However, one chuck table may be provided. Further, in the above-described embodiment, an example in which the photosensitive resist film 11 is coated on the back surfaces of the wafers 10 and 10 has been described. However, the photosensitive resist film 11 may be coated on the surfaces of the wafers 10 and 10.

The perspective view which shows one Embodiment of the exposure apparatus comprised according to this invention. The perspective view which shows one Embodiment of the chuck table with which the exposure apparatus shown in FIG. 1 is equipped, and an index means. FIG. 2 is an explanatory view showing a state in which a wafer division schedule line held on a chuck table is positioned immediately below a slit of a mask means constituting the exposure apparatus shown in FIG. 1. The perspective view which shows other embodiment of the exposure apparatus comprised according to this invention. FIG. 5 is a perspective view of a slit plate and an interval adjusting unit constituting a mask unit provided in the exposure apparatus shown in FIG. 4. FIG. 5 is an explanatory view showing a state in which a division line of a wafer held on a chuck table is positioned immediately below a slit formed in a slit plate of a mask means constituting the exposure apparatus shown in FIG. 4. The perspective view of the wafer which is a workpiece. The perspective view which shows the state by which the photosensitive resist film was coat | covered on the back surface of the wafer shown in FIG.

Explanation of symbols

2: base 3: chuck table 4: index means 41, 41: guide rail 42: support base 44: pulse motor 45: index feed means 451: male screw rod 452: pulse motor 453: female screw block 5: alignment means 52 : Imaging means 6: line exposure means 61: mask means 615: reticle mask 615a: transparent plate 615b: light shielding layer 615c: light transmission part 62: light emitting means 71a, 71b, 71c: reticle mask 711: transparent plate 712: Light shielding layer 713: Line-shaped light transmitting portion 72: Space adjusting means 74: Actuating means 741: Male screw rod 742: Pulse motor 751, 752, 753, 754: Bellows 10: Wafer 101: Scheduled division line 102: Circuit 11: Photosensitive Resist film

Claims (2)

An exposure apparatus that exposes a resist film coated on a back surface or a surface of a wafer in which a functional element is formed in a region partitioned by a grid-like division line on the surface, along the division line,
A plurality of chuck tables holding wafers;
An alignment means for detecting the dividing lines formed on the wafer held on the plurality of chuck table,
A resist film coated on the rear surface or the surface of each held wafer into said plurality of chuck table, and a line exposure means for simultaneously exposing the line light corresponding to the division lines,
And said plurality of chuck table and the line exposure unit move relative, a plurality of indexing means for positioning the dividing lines formed on the wafer held respectively in said plurality of chuck table to the exposure position of the line light , And
The line exposure unit includes a mask unit including a reticle mask in which a light shielding layer and a line-shaped light transmission portion are formed on a transparent plate, and a light-emitting unit that exposes line light through the line-shaped light transmission portion of the reticle mask. And consists of
The plurality of index means move the plurality of chuck tables in directions orthogonal to the line-shaped light transmission portions of the reticle mask, and are formed in predetermined directions formed on wafers respectively held by the plurality of chuck tables. And an index feeding means for positioning the line to be divided at the exposure position of the line light, and orthogonal to the line to be divided extending in a predetermined direction formed on the wafer held by the chuck table by rotating the plurality of chuck tables. It consists of rotating means that positions the division line in the direction to be parallel to the slit,
An exposure apparatus characterized by that.   2. An exposure apparatus according to claim 1, wherein said mask means comprises a plurality of said reticle masks, and further comprises an interval adjusting means for adjusting an interval between said plurality of reticle masks.

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