JP4553868B2 - 平面加工装置 - Google Patents

平面加工装置 Download PDF

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Publication number
JP4553868B2
JP4553868B2 JP2006145755A JP2006145755A JP4553868B2 JP 4553868 B2 JP4553868 B2 JP 4553868B2 JP 2006145755 A JP2006145755 A JP 2006145755A JP 2006145755 A JP2006145755 A JP 2006145755A JP 4553868 B2 JP4553868 B2 JP 4553868B2
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JP
Japan
Prior art keywords
polishing
wafer
grinding
processing apparatus
thickness
Prior art date
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Expired - Fee Related
Application number
JP2006145755A
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English (en)
Japanese (ja)
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JP2006222467A (ja
JP2006222467A5 (enExample
Inventor
俊彦 石川
恭 片桐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
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Tokyo Seimitsu Co Ltd
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Priority to JP2006145755A priority Critical patent/JP4553868B2/ja
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Publication of JP2006222467A5 publication Critical patent/JP2006222467A5/ja
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JP2006145755A 1999-01-06 2006-05-25 平面加工装置 Expired - Fee Related JP4553868B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006145755A JP4553868B2 (ja) 1999-01-06 2006-05-25 平面加工装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP131799 1999-01-06
JP2006145755A JP4553868B2 (ja) 1999-01-06 2006-05-25 平面加工装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002140537A Division JP2003007661A (ja) 1999-01-06 2002-05-15 平面加工装置及び平面加工方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010053477A Division JP4808278B2 (ja) 1999-01-06 2010-03-10 平面加工装置及び方法

Publications (3)

Publication Number Publication Date
JP2006222467A JP2006222467A (ja) 2006-08-24
JP2006222467A5 JP2006222467A5 (enExample) 2007-12-20
JP4553868B2 true JP4553868B2 (ja) 2010-09-29

Family

ID=36984517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006145755A Expired - Fee Related JP4553868B2 (ja) 1999-01-06 2006-05-25 平面加工装置

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JP (1) JP4553868B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5311858B2 (ja) * 2008-03-27 2013-10-09 株式会社東京精密 ウェーハの研削方法並びにウェーハ研削装置
JP6230921B2 (ja) * 2014-01-16 2017-11-15 株式会社ディスコ 研磨装置
JP6271339B2 (ja) * 2014-05-26 2018-01-31 株式会社ディスコ 研削研磨装置
CN117260408B (zh) * 2023-11-21 2024-02-02 江苏京创先进电子科技有限公司 磨轮修整方法、磨轮修整与否识别方法、系统及减薄设备
CN118372149B (zh) * 2024-06-24 2024-09-27 成都市鸿侠科技有限责任公司 一种钛合金薄壁零件加工装置及方法
CN119734177A (zh) * 2024-12-02 2025-04-01 江苏京创先进电子科技有限公司 半导体器件加工方法、系统及加工设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61219570A (ja) * 1985-03-26 1986-09-29 Fujitsu Ltd 半導体装置の製造方法
JPH0525796Y2 (enExample) * 1987-06-23 1993-06-29
JPH04122513A (ja) * 1990-09-10 1992-04-23 Mitsubishi Heavy Ind Ltd 端面切削機の切粉回収装置
JPH05226308A (ja) * 1992-02-18 1993-09-03 Sony Corp 半導体ウエハの裏面処理方法及びその装置
JPH06246602A (ja) * 1993-02-26 1994-09-06 Japan Energy Corp 研磨加工方法
JPH0740239A (ja) * 1993-08-02 1995-02-10 Sony Corp 研削研磨装置及び方法
JP3534207B2 (ja) * 1995-05-16 2004-06-07 コマツ電子金属株式会社 半導体ウェーハの製造方法
JPH10166264A (ja) * 1996-12-12 1998-06-23 Okamoto Kosaku Kikai Seisakusho:Kk 研磨装置
JP3231659B2 (ja) * 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置

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Publication number Publication date
JP2006222467A (ja) 2006-08-24

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