JP4551017B2 - Electronic component mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
According to the present invention, a mounting head movable by a driving source is provided on a beam movable by a driving source, and an electronic component is sucked and mounted on a printed circuit board by a nozzle provided on the mounting head. The present invention relates to an electronic component mounting apparatus.
[0002]
[Prior art]
Such a conventional electronic component mounting apparatus is disclosed in, for example, Japanese Patent Application Laid-Open No. 2000-165096. This Japanese Patent Application Laid-Open No. 2000-165096 includes two linear motor shafts, and each linear motor shaft has a pair. A component mounting head and a component mounting head are provided, and with these four component mounting heads, the electronic component suction operation from the component supply unit, the suction electronic component recognition operation, and the mounting operation to the circuit board are partly performed. A technique to be performed while overlapping is disclosed.
[0003]
[Problems to be solved by the invention]
In the above conventional technique, when a linear motor is used as a drive source for the linear motor shaft (beam), the mover generates heat when the linear motor is driven during the operation of the electronic component mounting apparatus, and the heat of the mover is converted into the beam. It is transmitted to. For this reason, the temperature of the beam rises, and there is a possibility that the beam is thermally deformed and the positioning accuracy is lowered.
[0004]
Therefore, an object of the present invention is to provide an electronic component mounting apparatus that avoids thermal deformation of a beam.
[0005]
[Means for Solving the Problems]
For this reason, the first invention provides a guide provided in parallel with a gap, a beam movable along the guide, and a mounting head provided on the beam and movable in a direction along the guide. An electronic component mounting apparatus provided with the mounting head and provided with a suction nozzle that vacuum-sucks electronic components and mounts them on a printed circuit board has a stator provided on the guide and a mover mounted on the beam. And a linear motor for driving the beam, and a heat insulating member provided between the beam and the mover. A plurality of holes or grooves are formed on the contact surface of the thermal insulation member with the movable element and / or the contact surface with the beam. Features.
[0008]
Also, the second invention is A guide provided in parallel with a gap, a beam movable along the guide, a mounting head provided on the beam and movable in a direction along the beam, and an electron provided on the mounting head In an electronic component mounting apparatus including a suction nozzle for vacuum-sucking a component and mounting the component on a printed circuit board, a linear device that has a stator provided in a guide and a mover attached to the beam and drives the beam A plurality of grooves are formed in a contact surface between the motor and the beam and the mover, the contact surface with the mover and the contact surface with the beam; and The heat insulation member in which the air flow outlet of the said some groove | channel was formed, and the air supply means which sends air to the said some groove | channel were provided.
[0009]
further The third invention is The heat insulating member is formed with a passage that communicates the plurality of grooves formed on the contact surface with the mover and the plurality of grooves formed on the contact surface with the beam. The air is allowed to flow from the groove to a plurality of grooves on the mover side through a passage.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1, and FIG. 2 is a front view of the mounting apparatus 1. Various electronic components are placed on a front portion of a base 2 of the apparatus 1 and a component take-out portion (component adsorption portion). A plurality of component supply units (not shown) that supply one by one to the position) are arranged side by side. In addition, a supply conveyor 3 (omitted in FIGS. 2 and 4), a positioning part (omitted in FIGS. 2 and 6) 4 and a discharge conveyor 5 (omitted in FIG. 2) are provided in the intermediate portion of the mounting device 1. The printed board P is provided so that the conveyance direction is the left-right direction. The supply conveyor 3 conveys the printed circuit board P received from the upstream to the positioning unit 4, and after the electronic components are mounted on the substrate P positioned by the positioning mechanism (not shown) by the positioning unit 4, the conveyance is conveyed to the discharge conveyor 5. Is done.
[0011]
6 is a beam that is long in the X direction, and is supplied with a printed circuit board P and components along a pair of left and right guides 8 and 8 by driving a pair of left and right Y axis motors (hereinafter referred to as Y axis linear motors) 7 and 7 that are linear motors. The unit is moved individually in the Y direction above the component take-out portion (component suction position). The Y-axis linear motors 7 and 7 are positioned inside a pair of stators 12 and 12 provided on a guide 8 having a side wall 10 and a bottom wall 11 and having an upper surface opened, respectively, and the guide 8 and the stators 12 and 12. For example, the movable element 13 mainly composed of iron attached to the beam 6 is provided to drive the beam 6. Then, as shown in FIG. 3 (a cross-sectional view of the upper right side of the mounting device 1), the stators 12, 12 are provided facing each other in the longitudinal direction of the guide 8. 10 is composed of a base 14 fixed to the upper or upper end of 10 and a magnet 15 fixed to the inner surface of the base 14. Here, a slight gap is formed between each magnet 15 and the side wall 10 and the side surface of the movable element 13.
[0012]
Reference numeral 16 denotes a heat conducting member attached to each base 14, and the heat conducting member 16 is divided into the front and rear sides and provided over almost the entire outer surface of the base 14. Each heat conduction member 16 is a heat lane in which heat pipes formed in a plate shape with a metal such as aluminum or copper having higher thermal conductivity than iron constituting the base 14 and the guide 8 are folded and overlapped. For example, it is attached with a high thermal conductive adhesive so as to be in close contact with the surface. Further, a bent portion 17 is formed at the front or rear edge of the heat conducting members 16, 16 so as to be located outside the moving range of the mover 13. Thus, heat conduction can be improved by bending and superimposing the heat conducting member 16. For example, a high thermal conductivity grease is sandwiched between the heat conduction member 16 and the base 14 so that the heat conduction between the heat conduction member 16 and the base 14 is improved, and the heat conduction member 16 is formed on the base with a strip-shaped metal plate (not shown), for example. 14 may be fixed.
[0013]
Further, on the upper surface of the bottom wall 11, a heat conductive member 18 configured in the same manner as the heat conductive member 16 is divided in the front and rear direction over almost the entire surface in the longitudinal direction of the guide 8, and attached by, for example, a high heat conductive adhesive. Yes. As shown in FIGS. 4 and 5, the bent portion 19 is located outside the moving range of the movable element 13 and is formed in the left and right direction at the front edge or rear edge of the heat conducting member 18.
[0014]
Reference numeral 20 denotes a base formed of, for example, aluminum and provided at the lower portions of the left and right ends of the beam 6, and the movable element 13 is fixed to the lower surface of the base 20 via a heat insulating member 21. And the linear expansion coefficient of the base 20 is larger than the linear expansion coefficient of the needle | mover 13 mainly formed with iron. Further, the heat insulating member 21 is made of, for example, a resin mainly composed of glass fiber having a low thermal conductivity. The contact surface of the heat insulating member 21 with the movable element 13 and the contact surface with the base 20 are arranged in the longitudinal direction. A plurality of grooves 22 and 23 are formed. Air passages 24 and 25 are formed between the grooves 22 and 23 and the upper surface of the mover 13 and between the lower surface of the base 20, and these air passages 24 and 25 extend from the front end to the rear end of the heat insulating member 21. As shown in FIG. 5, outlets 24A and 25A for air flowing through the air passages 24 and 25 are formed at the front and rear ends. In addition, a passage 26 that connects the air passage 24 and the air passage 25 is formed substantially at the center of the heat insulating member 21. Reference numeral 27 denotes an air supply path formed in the base 20 for supplying cooling air to the air passage 24 and the air passage 25. The air supply path 27 is provided in the component mounting apparatus main body, for example, not shown. Air is sent from an air supply source (air supply means) such as a blower or a pump through a tube, for example, and supplied to the air passages 24 and 25.
[0015]
Reference numeral 28 denotes a heat radiating member provided on the entire lower surface of the mover 13. The heat radiating member 28 is made of, for example, aluminum having good heat conduction, and the longitudinal direction of the mover 13 (Y is the moving direction of the beam 6). A plurality of fins 29 are integrally provided in the direction).
[0016]
Reference numeral 30 denotes a linear way that supports and guides the beam 6. The linear way 30 is fixed to the upper surface of the side of the guide 8 and extends in the longitudinal direction of the guide 8, and a base 20 corresponding to the rail 31. The slider 32 is fixed to the lower surface of the slider. The guide 8 and the Y-axis linear motor 7 on the upper right side and the upper left side of the base 2 are configured as targets.
[0017]
Hereinafter, the configuration of the beam 6 will be described in detail with reference to FIGS. 4 to 7 in which the mounting head is omitted. Reference numeral 33 denotes a beam main body rail provided in the horizontal direction. The beam main body rail 33 is made of, for example, aluminum having good heat conduction. The beam body rail 33 includes an upper wall 34, a lower wall 35, and a vertical wall 36 that connects the upper wall and the lower wall, and between the front upper wall 37 and the front lower wall 38 in front of the vertical wall 36. A beam side movable element to be described later is located. Further, a plurality of openings 39 serving as air passages are formed at appropriate positions on the vertical wall 36. The left and right ends of the beam body rail 33 are supported by the base 20 via metal support members 40.
[0018]
Reference numeral 41 denotes a beam-side heat conduction member which is configured in the same manner as the heat conduction members 16 and 18 and has high heat conductivity. These heat conducting members 41 are divided into left and right inner faces of the front upper wall 37 and the front lower wall 38, and are attached by, for example, a high heat conductive adhesive. Furthermore, the base 44 of the stator 43 which comprises the X-axis linear motor 42 with the needle | mover which is mentioned later is attached to the inner surface of each heat conductive member 41 facing, for example with a high heat conductive adhesive. Further, a bent portion 71 is formed at the right end or the left end of each heat conducting member 41. Magnets 45, 45 of the stator 43 are provided facing the inner surface of the base 44. The heat conducting member 41, the base 44, and the magnet 45 are provided so as to protrude forward from the front ends of the front upper wall 41 and the front lower wall 38.
[0019]
Reference numeral 46 denotes a head base to which a mounting head, which will be described later, is attached. A mover 47 of an X-axis linear motor 42 is attached to a substantially central portion of the back surface of the head base 46. A slight gap is formed between the upper and lower surfaces of the mover 47 and the magnets 45, 45. Further, a heat radiating member 48 made of, for example, aluminum and having good heat conduction is attached to the back surface of the movable element 47 so as to face the vertical wall 36 and to be spaced over the entire width of the back surface. A plurality of fins 48 are integrally formed in the longitudinal direction (horizontal direction).
[0020]
Reference numerals 49 and 49 denote linear ways for guiding the head base 46 in the horizontal direction. The linear ways 49 and 49 are rails 50 attached to the upper and lower front end surfaces of the beam main body rail 33 and rails 50 on the rear surface of the head base 45. The slider 51 is attached correspondingly.
[0021]
Reference numeral 52 denotes a flat cable. A cable 53 and an air tube 54 for a mounting head, which will be described later, are arranged in a parallel state, and each is fixed with an adhesive so as to have a substantially flat plate shape. Reference numeral 55 denotes a head ceiling wall to which the upper edge of the head base 45 is attached. The upper side of the air tube 54 is supported by the head ceiling wall 55, and the lower side of the air tube 54 is attached to the back surface of the beam body rail 33. It is supported by the support member 56.
[0022]
Hereinafter, the mounting head will be described with reference to FIG.
[0023]
As shown in FIG. 8, a mounting head 57 is provided on the head base 45 so as to be vertically movable along a guide 60 by each vertical shaft motor 58. Six suction nozzles 62 are provided at equal intervals on the nozzle mounting body 61 of the mounting head 57, and the nozzle mounting body 61 can be rotated around the vertical axis by a θ-axis motor 63. The motor 64 selects the suction side end of any of the six suction nozzles 62 to face downward.
[0024]
Accordingly, the mounting head 57 and the suction nozzle 62 can be moved in the X direction and the Y direction by driving the X-axis linear motor 42 and the Y-axis linear motor, and further, the suction nozzle 62 can be rotated around the vertical line and can be moved up and down. It is possible to move. The mounting head 57 is attached to the left and right head bases 45.
[0025]
Reference numerals 65 and 65 denote Y-direction flat cables provided in the Y-direction inside the guides 8 and 8, and the flat cable 65 is supported by a cable bear 66.
[0026]
The operation will be described below with the above configuration. First, the printed circuit board P is conveyed from the upstream device to the positioning unit 4 via the supply conveyor 3 by a conveyor (not shown), and is positioned and fixed by the positioning mechanism.
[0027]
Next, according to the mounting order, the XY coordinate position to be mounted on the printed circuit board P stored in the storage device (not shown), the rotation angle position about the vertical axis, the arrangement number of each component supply unit, and the like are specified. An electronic component to be mounted by each suction nozzle 62 corresponding to the component type of the electronic component is sucked out from a predetermined component supply unit.
[0028]
That is, in the Y direction, the Y axis linear motor 42 is driven to move the beam 6 along the pair of guides 7, and in the X direction, the X axis linear motor 42 is driven to move the mounting head 57 without colliding, It moves so as to be positioned above the component supply unit for storing electronic components to be sequentially mounted.
[0029]
Since the predetermined supply unit is already driven and the component can be taken out at the component suction position, the suction nozzle 62 selected by the nozzle selection motor 64 of one mounting head 57 is lowered by the vertical shaft motor 58. Then, the suction nozzle 62 rises and the suction nozzle 62 of the other mounting head 58 moves above the component supply unit that stores the electronic component to be mounted next. Descends and picks up and picks up electronic components.
[0030]
Further, as described above, the mounting head 57 is moved in the horizontal direction, moved above the printed circuit board P on the positioning unit 4, and the suction nozzle 62 of each mounting head 57 is lowered to place the electronic components on the printed circuit board P, respectively. Wear.
[0031]
In this case, when each mounting head 57 (head base 45) moves in the X direction along the guide 8 by the X-axis linear motor 42, the flat cable 52 can be bent, and the beam 6 can be bent by the Y-axis linear motor 7. When moving along the guide 8 in the Y direction, the cable bear 66 holding the Y-direction flat cable 65 can also be bent, so that the mounting head 57 and the beam 6 can move smoothly.
[0032]
The movable element 13 generates heat by driving the Y-axis linear motor 7, but a thermal insulating member 21 having a low thermal conductivity is provided between the bases 20, 20 at the lower left and right sides of the beam 6 and the movable element 13. Therefore, the structure for preventing the temperature rise of the beam 6 is simplified by the simple configuration of providing the heat insulating member 21, and the movable elements 13, 13 when the beam 6 is driven to the bases 20, 20 of the beam 6. The heat conduction is slightly suppressed by the heat insulating member 21. Further, cooling air flows from an air supply source (not shown) to an air supply path 27 formed in the heat insulating member 21, and further flows into the air path 25 on the base 20 side from the center thereof. Then, heat flows from the surrounding base 20 and the heat insulating member 21 while flowing through the air passage 25 and flowing out from the front and rear outlets 25A. Further, the air flowing in from the air supply path 27 flows into the air passage 24 from the central portion thereof via the central portion of the air passage 25 and the passage 26. Then, while flowing through the air passage 24 and flowing out from the front and rear outlets 24A, heat is taken from the movable part side portion of the surrounding base 20 and the heat insulating member 21 whose temperature is higher than that of the base 20 side and released to the outside.
[0033]
As a result, the temperature rise of the thermal insulating member 21 itself can be suppressed to a small level, the heat conduction from the mover 13 to the base 20 of the beam 6 can be suppressed slightly, and the thermal deformation (linear expansion) of the base 20 of the beam 6 can be suppressed. In addition, by flowing the air from the air supply means from the groove 25 on the base 20 side to the groove 24 on the mover 13 side, the low temperature air first flows into the groove on the base 20 side, The temperature of the base 20 can be further reduced, and the thermal deformation of the base 20 can be suppressed as much as possible. Further, the heat conduction to the beam main body rail 33 supported by the base 20 via the support member 40 can be slightly suppressed, and the thermal deformation of the beam main body rail 33 can be minimized. Furthermore, since the local temperature rise of the base 20 can be prevented and thermal deformation can be avoided, the positioning accuracy when the electronic component is mounted can be improved.
[0034]
Further, since the linear expansion coefficient of each base 20 and the beam main body rail 33 is larger than the linear expansion coefficient of the movable element 13, the linear expansion coefficient is generated due to a temperature difference between the low temperature base 20 and beam main body rail 33 and the high temperature movable element 13. Thus, thermal deformation of each base 20 and the beam main body rail 33 can be suppressed.
[0035]
In addition, by driving the Y-axis linear motor 7 accompanying the component mounting operation, the mover 13 generates heat, and the temperature of the pair of stators 12 and 12 facing each other is increased by this heat. At this time, since the heat conducting members 16 and 16 are provided on the outer surfaces of the stators 12 and 12 over the entire length of the stators 12 and 12, that is, in the front-rear direction, the heat of the stators 12 and 12. Is transmitted to the heat conductive members 16 and 16 and is transmitted to the entire heat conductive members 16 and 16 having high heat conductivity in a short time and is dissipated, so that the local temperature rise of the stators 12 and 12, that is, the operation of the mounting device 1. At this time, the temperature rise in the central part of the stators 12 and 12 corresponding to the central part of the apparatus in which the beam 6 moves frequently can be suppressed, and the entire stators 12 and 12 can be kept at substantially the same temperature. As a result, thermal deformation of the stator 12, particularly the base 14, can be avoided.
[0036]
Further, the heat transmitted to the guide 8 by heat conduction from the stator 14 or radiation from the movable element 13 is transmitted to the heat conducting member 18 provided on the bottom wall 11 of the guide 8, and further, in the vicinity of the movable element 13. The heat conduction member 18 including the open part other than the part located at the center is transmitted to the entire heat conduction member 18 in a short time and radiated. For this reason, the local temperature rise of the guide 8 can be suppressed, and the thermal deformation of the guide 8 can be avoided.
[0037]
Further, the heat generated by the mover 13 is transmitted to the heat radiating member 28 on the lower surface, and is radiated from the heat radiating member 28. At this time, since the heat radiation member 28 is integrally provided with a plurality of fins 29, the heat radiation area can be increased and the heat radiation amount can be increased, and of course, as the beam 6 moves in the Y direction, As a result, heat can be further promoted, and as a result, the temperature rise of the mover 13 can be suppressed as much as possible.
[0038]
Further, when the beam 6 is moved, the mover 47 generates heat by driving the X-axis linear motor 42, and the temperature of the pair of stators 43, 43 facing each other is increased by this heat. At this time, on the outer surfaces of the stators 43, 43, heat conducting members 41, 41 partially sandwiched between the beam body rails 33 are arranged in the longitudinal direction of the stators 43, 43, that is, on the left and right sides of the beam 6 Since it is provided over the entire width in the direction, the heat of the stators 43 and 43 is transmitted to the heat conducting members 41 and 41, and is transmitted to the whole heat conducting members 41 and 41 having high thermal conductivity in a short time and is dissipated. 43, 43 can suppress the temperature rise, and the local temperature rise, that is, the center portion of the stator 43, 43 corresponding to the center portion of the beam 6 where the mounting head 57 frequently moves during the operation of the mounting device 1. Thus, the stators 43 and 43 can be kept at substantially the same temperature. As a result, thermal deformation of the stators 43 and 43, particularly the bases 44 and 44, can be avoided.
[0039]
Further, the heat radiation from the entire heat conducting members 41, 41 can suppress the temperature rise or the local temperature rise of the entire beam main body rail 33, and the thermal deformation of the beam main body rail 33 can be avoided.
[0040]
Further, the heat generated by the mover 47 is transmitted to the heat radiating member 48 on the back surface and is radiated from the heat radiating member 48. At this time, since the heat radiation member 48 is integrally provided with a plurality of fins 48F, the heat radiation area can be increased and the heat radiation amount can be increased, and as the mounting head 57 moves in the X direction, the fin 29 Air can flow around and further promote heat dissipation. As a result, the temperature rise of the mover 13 can be suppressed as much as possible. In addition, since the air around the fin 48F whose temperature has increased flows to the outside through the opening 39, the heat radiation from the fin 48F is promoted, and the heat radiation effect of the fin 48F can be further improved.
[0041]
Other embodiments
In the above embodiment, the grooves 22 and 23 are formed in the heat insulating member 25, the air passages 24 and 25 are formed between the movable element 13 and the base 20, and the air passages 24 and 25 are provided by the air supply means. Although air is flowed, air may be flown into the grooves 22 and 23 as the beam 6 moves without using the air supply means.
[0042]
Moreover, you may form independently the some groove | channel which does not distribute | circulate air in either the contact surface with the needle | mover 13 of the heat insulation member 25, or the contact surface with the base 20. FIG. When formed in this manner, each groove acts as a heat insulating member, and the contact area between the movable element 13 and the heat insulating member 25 or the contact area between the base 20 and the heat insulating member 25 is minimized by the plurality of grooves. The heat transfer from the mover 13 to the base 20 can be suppressed, and the temperature rise of the base 20 can be suppressed.
[0043]
Further, instead of forming the plurality of grooves in the heat insulating member 25, a plurality of holes may be formed on either the contact surface of the heat insulating member with the movable element or the contact surface with the beam. By forming a plurality of holes, the plurality of holes act as a heat insulating member in the same manner as the groove, and the contact area between the mover and the heat insulating member or the base 20 and the heat insulating member 25 is reduced by the plurality of holes. The contact area can be made as small as possible, heat conduction from the mover 13 to the base 20 can be suppressed, and the temperature rise of the base 20 can be suppressed.
[0044]
Even when a plurality of holes or grooves are formed on either the contact surface of the thermal insulating member 25 with the movable element 13 or the contact surface with the base 20, the holes or grooves act as heat insulating members, The contact area between the heat insulating member 25 and the mover 13 or the base 20 can be minimized by the holes or grooves, and as a result, the heat conduction from the mover 13 to the base 20 can be reduced.
[0045]
Further, as indicated by a broken line in FIG. 3, a plate-like heat conduction member 70 such as aluminum, copper, or the above heat lane having a higher heat conductivity than the guide 8 is attached to almost the entire side surface in the longitudinal direction of the guide 8. The heat conductive member 70 has a higher thermal conductivity than iron constituting the guide 8 and is attached by, for example, a high heat conductive adhesive so as to be in close contact with the surface of the guide 8. Further, for example, a high thermal conductivity grease is sandwiched between the heat conductive member 70 and the guide 8, and the heat conductive member is fixed to the guide 8 with, for example, a belt-shaped metal plate in a state in which the heat conduction between them is improved. May be. By providing the heat conducting member 70 on the side surface of the guide 8 in this manner, the heat transmitted to the heat conducting member 70 from the vicinity of the center of the guide 8 whose temperature has been increased by the radiation heat from the movable element 13 or the air whose temperature has been increased. Is transmitted to the entire heat conductive member 70, and in particular, when a heat lane is used for the heat conductive member 70, it is transmitted to the entire heat conductive member 70 and radiated in a very short time. For this reason, the local temperature rise of the guide 8 can be suppressed, and the thermal deformation of the guide 8 can be avoided.
[0046]
Further, as indicated by a broken line in FIG. 7, as in the case of the guide 8, a heat conduction member that is, for example, a heat lane having a higher thermal conductivity than the beam body rail 33 over the entire upper surface of the upper wall 34 of the beam body rail 33. When 74 is attached, the heat transferred from the beam main body rail 33 to the heat conducting member 74 is transferred to the entire heat conducting member 74 in a very short time and is dissipated. For this reason, the local temperature rise of the beam main body rail 33 can be suppressed, and the thermal deformation of the beam main body rail 33 can be avoided more reliably.
[0047]
Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.
[0048]
【The invention's effect】
As described above, according to the invention of the present application, the heat conduction from the mover to the beam at the time of beam driving is slightly suppressed by the heat insulating member, and as a result, the thermal deformation of the beam can be reduced as much as possible. The positioning accuracy at the time of mounting can be improved.
[0050]
In addition, since a plurality of holes or grooves are formed in the contact surface of the thermal insulation member with the movable element and / or the contact surface with the beam, the holes or grooves act as a heat insulating member, and heat is generated by the plurality of holes or grooves. The contact area between the insulating member and the mover or the beam can be made as small as possible. As a result, heat conduction from the mover to the beam can be reduced, and thermal deformation of the beam can be avoided.
[0051]
Further, the air outlets of the plurality of grooves are formed in the heat insulating member, and the air flowing into the groove from the air supply means for sending air to the plurality of grooves takes heat from the heat insulating member and flows out from the air outlet. The temperature rise of the heat insulating member itself can be suppressed to a small level, the heat conduction from the mover to the beam can be suppressed slightly, and the thermal deformation of the beam can be suppressed.
[0052]
Further, the heat insulating member is formed with a passage that connects the plurality of grooves formed on the contact surface with the movable element and the plurality of grooves formed on the contact surface with the beam, and the air supply means is provided on the beam side. Since air flows from the plurality of grooves to the plurality of grooves on the mover side through the passage, air having a lower temperature first flows into the groove on the beam side, so that the temperature of the beam can be further reduced, and the heat of the beam Deformation can be suppressed as much as possible.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus.
2 is a schematic cross-sectional view taken along line AA of the electronic component mounting apparatus shown in FIG.
3 is an enlarged cross-sectional view of a main part of FIG. 2 (a cross-sectional view of the upper right portion of the electronic component mounting apparatus).
4 is a schematic cross-sectional view taken along the line BB of the electronic component mounting apparatus shown in FIG.
5 is an enlarged cross-sectional view of a main part of FIG. 4;
6 is a schematic C-C cross-sectional view of the electronic component mounting apparatus shown in FIG.
7 is an enlarged cross-sectional view of a main part of FIG.
FIG. 8 is a side view of the mounting head.
[Explanation of symbols]
1 Electronic component mounting device
3 Supply conveyor
5 discharge conveyor
6 beam
7 Y-axis linear motor
8 Guide
12 Stator
13 Mover
16 Heat conduction member
18 Heat conduction member
20 base
21 Thermal insulation members
22 groove
23 groove
24 Air passage
25 Air passage
26 Passage

Claims (3)

  A guide provided in parallel with a gap, a beam movable along the guide, a mounting head provided on the beam and movable in a direction along the beam, and an electron provided on the mounting head In an electronic component mounting apparatus including a suction nozzle for vacuum-sucking a component and mounting the component on a printed circuit board, a linear device that has a stator provided in a guide and a mover attached to the beam and drives the beam A motor, and a heat insulating member provided between the beam and the mover, wherein a plurality of holes or grooves are formed in a contact surface of the heat insulation member with the mover and / or a contact surface with the beam. An electronic component mounting apparatus characterized by being formed. A guide provided in parallel with a gap, a beam movable along the guide, a mounting head provided on the beam and movable in a direction along the beam, and an electron provided on the mounting head In an electronic component mounting apparatus including a suction nozzle for vacuum-sucking a component and mounting the component on a printed circuit board, a linear device that has a stator provided in a guide and a mover attached to the beam and drives the beam Thermal insulation provided between a motor and a contact surface with the mover and a contact surface with the beam, wherein a plurality of grooves are formed and an air outlet of the plurality of grooves is formed. An electronic component mounting apparatus comprising: a member; and air supply means for sending air to the plurality of grooves.   The heat insulating member is formed with a passage that communicates a plurality of grooves formed on the contact surface with the mover and a plurality of grooves formed on the contact surface with the beam, and the air supply means The electronic component mounting apparatus according to claim 2, wherein air is caused to flow from the plurality of grooves on the beam side to the plurality of grooves on the movable element side through the passage.

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