JPH11238986A - Cooling device for heat generating component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize a device, to make the device light, and to freely lay out the device by reducing the space for the device for cooling the surface side of a mounting board. SOLUTION: A hole 2a is formed on a mounting board 2 such as a board or a wiring board, while being placed around heat generating components 1 such as electronic components or electronic equipment modules, and a gas 4 for cooling such as air for cooling or an inactive gas for cooling the flows between the front and back of the mounting dotard 2 for achieving heat exchange between the gas 4 for cooling and the heat generating components 1. Also, a heat sink 3 is provided at the heat generating components 1 at the front side of the mounting substrate 2, so that the circulation of the gas 4 for cooling in the hole 2a is allowed and at the same time heat conduction can be made, thus realizing heat exchange between the heat sink 3 where heat is transferred from the heat generating components 1 and the gas 4 for cooling.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling apparatus for forcibly air-cooling a heat-generating component such as an electronic component or an electronic device module mounted on a mounting board such as a board or a wiring board. This forced air cooling is a broad term “forced cooling” in physical terms that physically expresses the phenomenon of heat exchange between a cooling gas and a heat sink or a heat-generating component. It is not just a narrow sense of producing and cooling.

[0002]

2. Description of the Related Art FIG. 12 is a perspective view showing a conventional cooling device for a heat-generating component. In FIG. 12, reference numeral 20 denotes a cooling fan, 21 denotes an air chamber, 22 denotes cooling air as a cooling gas, and 23 denotes a cooling air. A nozzle provided in the air chamber 21, a heating component 24 such as an electronic component or an electronic device module, a mounting substrate 25 such as a board or a wiring board on which the heating component 24 is mounted, and a discharge port 26.

Next, the operation will be described. Cooling fan 2
The cooling air 22 is sent from 0 to the air chamber 21, the cooling air 22 is blown from the nozzle 23 to the heat generating component 24, and the used cooling air 22 is exhausted from the outlet 26.

[0004]

Since the conventional cooling device for the heat-generating component is constructed as described above,
A space for cooling is required on the front side on which the heat generating component 24 is mounted, and there are problems such as a reduction in size and weight and a limitation in the layout design of the entire device.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is possible to reduce the space required for cooling the front side of the mounting board to realize a reduction in size and weight, and to realize a layout of the entire apparatus. It is an object of the present invention to obtain a cooling device for a heat-generating component which can have a degree of freedom.

[0006]

According to a first aspect of the present invention, there is provided an apparatus for cooling a heat-generating component, which cools a heat-generating component such as an electronic component or an electronic device module mounted on a mounting board such as a board or a wiring board. In a cooling device for a heat-generating component that uses a cooling gas such as cooling air or a cooling inert gas, a hole is provided around the heat-generating component so that the cooling gas flows between the front and back of the mounting substrate. It is characterized by having been formed so that.

According to a second aspect of the present invention, in the cooling device for a heat generating component, a heat sink is provided to the heat generating component on the front side of the mounting board so as to allow cooling gas to flow through the hole and to conduct heat. It is characterized by.

According to a third aspect of the invention, there is provided a cooling device for a heat-generating component, wherein the heat sink according to the second aspect is integrated.

According to a fourth aspect of the present invention, there is provided a cooling device for a heat-generating component, wherein the flow of the cooling gas through the hole is a flow from the front side to the back side of the mounting board.

According to a fifth aspect of the present invention, there is provided a cooling device for a heat-generating component, wherein a flow of a cooling gas through a hole from the front side to the back side of the mounting board is generated by a high-pressure closed space arranged on the front side of the mounting board. Features.

According to a sixth aspect of the present invention, there is provided a cooling device for a heat-generating component, wherein a flow of a cooling gas through a hole from the front side to the back side of the mounting board is generated by a low-pressure closed space arranged on the back side of the mounting board. Features.

According to a seventh aspect of the present invention, there is provided a cooling device for a heat-generating component, wherein the flow of the cooling gas through the hole is a flow from the back side to the front side of the mounting board.

The cooling device for the heat-generating component according to claim 8 is characterized in that the flow of the cooling gas through the hole from the back side to the front side of the mounting board is created by the high-pressure closed space arranged on the back side of the mounting board. Features.

According to a ninth aspect of the present invention, there is provided an apparatus for cooling a heat generating component, wherein a flow of a cooling gas through a hole from the back side to the front side of the mounting board is generated by a low-pressure closed space arranged on the front side of the mounting board. Features.

According to a tenth aspect of the present invention, there is provided a cooling device for a heat-generating component.
A heat-generating component that cools a heat-generating component such as an electronic component or an electronic device module mounted on a mounting board such as a substrate or a wiring board using a cooling gas such as cooling air or a cooling inert gas. In the cooling device, a hole is formed in the mounting board at a position corresponding to the abdomen of the heat-generating component,
The cooling gas is blown to the abdomen of the heat-generating component by this hole.

A cooling device for a heat-generating component according to claim 11 is
A heat-generating component that cools a heat-generating component such as an electronic component or an electronic device module mounted on a mounting board such as a board or a wiring board using a cooling board such as cooling air or a cooling inert gas. In the cooling device, a hole is formed in the mounting board at a position corresponding to the abdomen of the heat-generating component,
A heat sink is attached to the abdomen of the heat generating component through the hole, and the heat sink is cooled by a flow of a cooling gas on the back side of the mounting board.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 of the Invention FIG. 1 shows a cooling device for a heat-generating component according to Embodiment 1 of the present invention. FIG. 1A is a top view, and FIG. 1B is an end view along line AA in FIG. FIG. 2 is a perspective view showing a part of FIG. 1 and 2, reference numeral 1 denotes a plurality of heating components such as electronic components or electronic device modules, and 2 denotes a plurality of heating components 1.
Mounting board such as a board or a wiring board on which is mounted,
Reference numeral 2a denotes a plurality of holes formed in the substrate 2 so as to be positioned around the heat-generating component 1, 3 denotes a plurality of heat sinks provided for each heat-generating component 1, and 4 denotes a cooling air or a cooling inert gas or the like. It is a gas. In the case of Embodiment 1 of the present invention, a plurality of heat generating components 1 are arranged in a row at predetermined intervals in the horizontal direction. The plurality of holes 2a are located between the plurality of heat-generating components 1 arranged in the horizontal direction, and have substantially the same vertical width as the heat-generating component 1 when viewed from above (the width in the direction orthogonal to the horizontal width in FIG. 1A). It has a rectangular shape. As shown in FIG. 2, the heat sink 3 includes a base portion 3 a overlapped over the entire upper surface of the heat-generating component 1, a plurality of fins 3 b protruding above the base portion 3 a and toward the hole 2 a, and a base portion 3 a And leg portions 3c provided on both sides in the vertical direction. The plurality of fins 3b are separated at a predetermined interval in the vertical direction. That is, the plurality of fins 3b are spaced apart from each other in the vertical direction, and have the gap 5 between the fins 3b and the leg 3c on both sides in the vertical direction. Fin 3b protruding from base portion 3a toward hole 2a
Is located directly above the hole 2a. The leg 3c
It is in contact with the vertical side surface of the heat generating component 1 and is mounted on the mounting board 2. The end of the leg 3c on the side of the hole 2a extends along the edge of the hole 2a facing the heat component 1 in the vertical direction. The direction of the arrow in FIG. 1B and FIG. 2 indicates the direction in which the cooling gas 4 flows.

In the cooling device for the heat-generating component 1 configured as described above, the heat of the heat-generating component 1 is transmitted to the mounting board 2 and the heat sink 3 by conduction. By passing the cooling gas 4 from the back side of the mounting substrate 2 to the front side (the side on which the heat generating component 1 is mounted) from the hole 2a of the mounting substrate, the mounting substrate 2 and the heat generating component 1 are formed.
The heat sink 3 is cooled by the forced convection of the cooling gas 4, and the heat generating component 1 is appropriately cooled as a whole. In the first embodiment of the present invention, a small space in which the flow of the cooling gas 4 is generated on the back side of the mounting board 2 and the upper part of the heat sink 3 is sufficient, and a small and lightweight cooling device can be realized.

Embodiment 2 of the Invention FIG. 3 shows a cooling device for the heat-generating component 1 according to Embodiment 2 of the present invention. FIG. 3A is a top view, and FIG. 3B is an end view along line BB in FIG.
In the first embodiment of the present invention, the heat sink 3 is independent for each heat-generating component 1, but in the second embodiment of the present invention,
As shown in FIG. 3, by integrating the heat sink 3 </ b> A, the heat sink 3 </ b> A acts as a wide heat sink with respect to the heat-generating component 1, resulting in a more effective cooling device as a whole. The heat sink 3A is integrated by being formed so as to be continuous with the plurality of fins 3b and the leg portions 3c in the lateral direction in the first embodiment of the present invention. That is, the holes 2a formed in the mounting board 1
Directly above the heat sink 3A, a plurality of fins 3b
There are gaps 5 between each other and between the fins 3b and the legs 3c on both sides in the vertical direction.

Embodiment 3 of the Invention 4 shows a cooling device for the heat-generating component 1 according to Embodiment 3 of the present invention. FIG. 4A is a top view, and FIG. 4B is an end view along line CC in FIG.
In the first embodiment of the present invention, the heat sink 3 is independent for each heat-generating component 1, and the cooling gas 4 flows from the back side of the mounting board 2 to the hole 2a. However, in the third embodiment of the present invention, As shown in FIG. 4, the heat sink 3A is integrated in the same manner as in the second embodiment of the present invention, and the cooling gas 4 flows from the front side of the mounting board 2 to the hole 2a, thus providing an effective cooling device. . The direction of the arrow in FIG. 4B indicates the direction in which the cooling gas 4 flows.

Embodiment 4 of the Invention FIG. 5 is an end view showing a cooling device for heat-generating component 1 according to Embodiment 4 of the present invention. In the first to third embodiments of the present invention, the periphery of the mounting board 2 is an open space. However, in the fourth embodiment of the present invention,
As shown in FIG. 5, a heat sink 3A is integrated in the same manner as in the second embodiment of the present invention,
Has a high-pressure chamber 6 as a high-pressure closed space for guiding the cooling gas 4 from the front side of the mounting substrate 2. From the high-pressure chamber 6 on the front side of the mounting substrate 2, the cooling gas 4 passes through the gaps 5 (see FIG. 4) of the heat sink 3 A (see FIG. 4) in order through the mutual spacing of the heat-generating components 1 and the holes 2 a.
An effective cooling device that flows easily from the front side to the back side. The direction of the arrow in FIG. 5 indicates the direction in which the cooling gas 4 flows.

Embodiment 5 of the Invention FIG. 6 shows a cooling device for the heat-generating component 1 according to Embodiment 5 of the present invention. FIG. 6A is a top view, and FIG. 6B is an end view along line DD in FIG.
In the first embodiment of the present invention, the heat sink 3 is independent for each heat-generating component 1, but in the fifth embodiment of the present invention,
As shown in FIG. 6, the heat sink 3A is integrated in the same manner as in the second embodiment of the present invention, and an effective cooling device in which the cooling gas 4 flows from the back side of the mounting board to the hole 2a. The direction of the arrow in FIG. 6B indicates the direction in which the cooling gas 4 flows.

Embodiment 6 of the Invention FIG. 7 is an end view showing a cooling device for heat-generating component 1 according to Embodiment 6 of the present invention. In Embodiment 4 of the present invention, the heat sink 3A with the high-pressure chamber 6 is used. However, in Embodiment 6 of the present invention, as shown in FIG. A low-pressure chamber 7 as a closed space for guiding is integrally provided. The low-pressure chamber 7 on the front side of the mounting board 2 allows the cooling gas 4 to pass through the mutual space between the heat-generating components 1 from the hole 2a of the mounting board 2 and the gap 5 of the heat sink 3A in order (see FIG. 4).
An effective cooling device that easily flows from the back side to the front side. The direction of the arrow in FIG. 7 indicates the direction in which the cooling gas 4 flows.

Embodiment 7 of the Invention FIG. 8 is an end view showing a cooling device for heat-generating component 1 according to Embodiment 7 of the present invention. Embodiment 4 of the above invention or Embodiment 6 of the invention
In the embodiment, the heat sink 3A with the high-pressure chamber 6 or the heat sink 3A with the low-pressure chamber 7 is used. However, in the seventh embodiment of the present invention, as shown in FIG. A high-pressure chamber 8 as a closed space for guiding the cooling gas 4 from the back side of the mounting substrate 2
It has. The high-pressure chamber 8 on the back side of the mounting board 2 allows the cooling gas 4 to pass through the hole 2a of the mounting board 2 and the gap between the heat-generating components 1 and the gap 5 of the heat sink 3A in order (see FIG. 4). 2 is an effective cooling device that easily flows from the back side to the front side. The direction of the arrow in FIG. 8 indicates the direction in which the cooling gas 4 flows.

Embodiment 8 of the Invention FIG. 9 is an end view showing a cooling device for heat-generating component 1 according to Embodiment 8 of the present invention. In the seventh embodiment of the present invention, the high-pressure chamber 8 is provided on the back side of the mounting board 2.
Then, as shown in FIG. 9, the heat sink 3A is integrated in the same form as the second embodiment of the present invention,
Is provided with a low-pressure chamber 9 as a closed space for guiding the cooling gas 4 from the front side of the mounting substrate 2. The low-pressure chamber 9 on the back side of the mounting board 2 allows the cooling gas 4 to flow from the gap 5 (see FIG. 4) of the heat sink 3A through the mutual interval of the heat-generating components 1 and the hole 2a in order from the front side to the back side of the mounting board 2. It is an effective cooling device that flows easily to The direction of the arrow in FIG. 9 indicates the direction in which the cooling gas 4 flows.

Embodiment 9 of the Invention FIG. 10 is an end view showing a cooling device for heat-generating component 1 according to a ninth embodiment of the present invention. In FIG. 10, mounting board 2 has holes 2b corresponding to the abdomen of heat-generating component 1 mounted on mounting board 2. It is formed in the position where it does. Reference numeral 10 denotes a high-pressure chamber disposed on the back side of the mounting substrate 2, and has a nozzle 10 a at a position corresponding to the hole 2 b of the mounting substrate 2. By using the nozzle 10a of the high-pressure chamber 10 in which the pressure is increased with the back side of the mounting substrate 2 as a closed space, the cooling gas 4
An effective cooling device that cools the heat-generating component 1 by being directly blown as a collision jet to the abdomen of the heat-generating component 1 via the b. The direction of the arrow in FIG. 10 indicates the direction in which the cooling gas 4 flows.

Embodiment 10 of the Invention FIG. 11 is an end view showing a cooling device for heat-generating component 1 according to Embodiment 10 of the present invention. In the ninth embodiment of the present invention, the cooling gas 4 is directly blown to the abdomen of the heat-generating component 1 through the hole 2b of the mounting board 2, but in the tenth embodiment of the present invention, FIG.
As shown in FIG. 2, a heat sink 3B is directly attached to the abdomen of the heat generating component 1 mounted on the mounting board 2 via the hole 2b, and the heat sink 3B is cooled by the cooling gas 4 flowing along the back side of the mounting board 2. And an effective cooling device. The heat sink 3B according to the tenth embodiment of the present invention
A plurality of fins 3e protrude from the central support 3d in multiple stages at predetermined intervals in the vertical direction. Therefore, the cooling gas 4 can smoothly pass through the vertical intervals between the plurality of fins 3d. The direction of the arrow in FIG. 11 indicates the direction in which the cooling gas 4 flows.

[0028]

As described above, according to the present invention, a hole formed in a mounting board such as a wiring board or a board on which a heat-generating component such as an electronic component or an electronic device module is mounted is provided. This has the effect of reducing the size of the device space for cooling the front side, realizing miniaturization and weight reduction, and giving the layout of the entire device flexibility.

[Brief description of the drawings]

FIG. 1 shows a cooling device for a heat-generating component according to a first embodiment of the present invention, wherein FIG. 1A is a top view and FIG. 1B is an end view taken along line AA of FIG.

FIG. 2 is a perspective view showing a part of FIG. 1;

3 shows a cooling device for a heat-generating component according to a second embodiment of the present invention, wherein FIG. 3A is a top view and FIG. 3B is an end view taken along line BB of FIG. 3A.

FIG. 4 shows a cooling device for a heat-generating component according to Embodiment 3 of the present invention, wherein FIG. 4A is a top view and FIG. 4B is an end view taken along line CC of FIG.

FIG. 5 is an end view showing a cooling device for a heat-generating component according to Embodiment 4 of the present invention.

FIG. 6 shows a cooling device for a heat-generating component according to Embodiment 5 of the present invention. FIG. 6A is a top view, and FIG. 6B is an end view taken along line DD of FIG.

FIG. 7 is an end view showing a cooling device for a heat-generating component according to Embodiment 6 of the present invention.

FIG. 8 is an end view showing a cooling device for a heat-generating component according to a seventh embodiment of the present invention.

FIG. 9 is an end view showing a cooling device for a heat-generating component according to an eighth embodiment of the present invention.

FIG. 10 is an end view showing a cooling device for a heat-generating component according to Embodiment 9 of the present invention.

FIG. 11 is an end view showing a cooling device for a heat-generating component according to Embodiment 10 of the present invention.

FIG. 12 is a perspective view showing a conventional cooling device for a heat-generating component.

[Explanation of symbols]

1 heat generating component, 2 mounting board, 2a, 2b holes, 3, 3
A, 3B heat sink, 4 cooling gas, 5 gap,
6,8,10 High pressure chamber, 7,9 Low pressure chamber, 10a nozzle.

Claims (11)

[Claims] A heat generating component such as an electronic component or an electronic device module mounted on a mounting board such as a board or a wiring board is formed by using a cooling gas such as cooling air or a cooling inert gas. A cooling device for a heat-generating component, wherein a hole for allowing a cooling gas to flow between the front and back of the mounting substrate is formed in a periphery of the heat-generating component. 2. A cooling device for a heat-generating component according to claim 1, wherein a heat sink is provided on the heat-generating component on the front side of the mounting board so as to allow cooling gas to flow through the hole and conduct heat. 3. A cooling device for a heat-generating component, wherein the heat sink according to claim 2 is integrated. 4. A cooling device for a heat-generating component according to claim 1, wherein the flow of the cooling gas through the hole is a flow from the front side to the back side of the mounting board. 5. The cooling device for a heat-generating component according to claim 4, wherein the flow of the cooling gas through the hole from the front side to the back side of the mounting board is created by a high-pressure closed space arranged on the front side of the mounting board. 6. A cooling device for a heat-generating component according to claim 4, wherein the flow of the cooling gas through the hole from the front side to the back side of the mounting board is created by a low-pressure closed space arranged on the back side of the mounting board. 7. A cooling device for a heat-generating component according to claim 1, wherein the flow of the cooling gas through the hole is a flow from the back side to the front side of the mounting board. 8. A cooling device for a heat-generating component according to claim 7, wherein the flow of the cooling gas through the hole from the back side to the front side of the mounting board is created by a high-pressure closed space arranged on the back side of the mounting board. 9. A cooling device for a heat-generating component according to claim 7, wherein the flow of the cooling gas through the hole from the back side to the front side of the mounting board is created by a low-pressure closed space arranged on the front side of the mounting board. 10. A heat generating component such as an electronic component or an electronic device module mounted on a mounting board such as a board or a wiring board is formed by using a cooling gas such as a cooling air or a cooling inert gas. In a cooling device for a heat-generating component, a hole is formed in a mounting board at a position corresponding to an abdomen of the heat-generating component, and the cooling gas is blown to the abdomen of the heat-generating component by the hole. Heating component cooling device. 11. A heat-generating component such as an electronic component or an electronic device module mounted on a mounting board such as a board or a wiring board is formed by using a cooling board such as cooling air or a cooling inert gas. In a cooling device for a heat-generating component, a hole is formed in a mounting substrate at a position corresponding to the abdomen of the heat-generating component, and a heat sink is attached to the abdomen of the heat-generating component through the hole, and the heat sink is cooled on the back side of the mounting substrate. A cooling device for a heat-generating component, wherein the device is cooled by a flow of a working gas.