JP4542329B2 - Ｌｅｄ照明光源 - Google Patents

Ｌｅｄ照明光源 Download PDF

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Publication number
JP4542329B2
JP4542329B2 JP2003384495A JP2003384495A JP4542329B2 JP 4542329 B2 JP4542329 B2 JP 4542329B2 JP 2003384495 A JP2003384495 A JP 2003384495A JP 2003384495 A JP2003384495 A JP 2003384495A JP 4542329 B2 JP4542329 B2 JP 4542329B2
Authority
JP
Japan
Prior art keywords
light source
illumination light
led illumination
wavelength
spectral transmittance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003384495A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004193581A (ja
JP2004193581A5 (enExample
Inventor
正 矢野
正則 清水
伸幸 松井
龍海 瀬戸本
哲志 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2003384495A priority Critical patent/JP4542329B2/ja
Publication of JP2004193581A publication Critical patent/JP2004193581A/ja
Publication of JP2004193581A5 publication Critical patent/JP2004193581A5/ja
Application granted granted Critical
Publication of JP4542329B2 publication Critical patent/JP4542329B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP2003384495A 2002-11-25 2003-11-14 Ｌｅｄ照明光源 Expired - Lifetime JP4542329B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003384495A JP4542329B2 (ja) 2002-11-25 2003-11-14 Ｌｅｄ照明光源

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002340367 2002-11-25
JP2003384495A JP4542329B2 (ja) 2002-11-25 2003-11-14 Ｌｅｄ照明光源

Publications (3)

Publication Number Publication Date
JP2004193581A JP2004193581A (ja) 2004-07-08
JP2004193581A5 JP2004193581A5 (enExample) 2006-11-02
JP4542329B2 true JP4542329B2 (ja) 2010-09-15

Family

ID=32774722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003384495A Expired - Lifetime JP4542329B2 (ja) 2002-11-25 2003-11-14 Ｌｅｄ照明光源

Country Status (1)

Country Link
JP (1) JP4542329B2 (enExample)

Families Citing this family (36)

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DE202004011015U1 (de) * 2004-07-14 2004-11-11 Tridonic Optoelectronics Gmbh LED-Strahler mit trichterförmiger Linse
WO2006009189A1 (ja) * 2004-07-22 2006-01-26 Matsushita Electric Industrial Co., Ltd. 収納庫およびそれを有する冷蔵庫
JP4591106B2 (ja) * 2005-02-10 2010-12-01 パナソニック電工株式会社 白色発光装置
JP2006314082A (ja) * 2005-04-04 2006-11-16 Nippon Sheet Glass Co Ltd 発光ユニット、該発光ユニットを用いた照明装置及び画像読取装置
JP2007003174A (ja) * 2005-05-26 2007-01-11 Matsushita Electric Ind Co Ltd 冷蔵庫
JP2007003062A (ja) * 2005-05-26 2007-01-11 Matsushita Electric Ind Co Ltd 冷蔵庫
JPWO2007023807A1 (ja) * 2005-08-23 2009-02-26 株式会社東芝 発光装置とそれを用いたバックライトおよび液晶表示装置
EP1935040A1 (en) * 2005-10-05 2008-06-25 Philips Intellectual Property & Standards GmbH Phosphor-converted electroluminescent device with absorbing filter
JP4665832B2 (ja) * 2006-05-26 2011-04-06 パナソニック電工株式会社 発光装置ならびにそれを用いる白色光源および照明装置
JP5271258B2 (ja) * 2006-08-09 2013-08-21 パナソニック株式会社 発光装置
DE102006046199A1 (de) * 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US7942556B2 (en) * 2007-06-18 2011-05-17 Xicato, Inc. Solid state illumination device
US7884545B2 (en) * 2008-03-24 2011-02-08 Citizen Holdings Co., Ltd. LED light source and method for adjusting chromaticity of LED light source
WO2011024818A1 (ja) 2009-08-26 2011-03-03 三菱化学株式会社 白色半導体発光装置
US8378563B2 (en) * 2010-01-15 2013-02-19 Express Imaging Systems, Llc Apparatus, method to change light source color temperature with reduced optical filtering losses
WO2011108053A1 (ja) * 2010-03-01 2011-09-09 パナソニック株式会社 Ｌｅｄランプおよびｌｅｄ照明装置
CN102473821B (zh) * 2010-05-14 2013-05-29 松下电器产业株式会社 Led模块、led灯和照明装置
CN102918666B (zh) 2010-07-22 2015-09-09 京瓷株式会社 发光装置
JP5974394B2 (ja) * 2011-03-23 2016-08-23 パナソニックＩｐマネジメント株式会社 白色発光装置及びこれを用いた照明器具
KR101822537B1 (ko) 2011-03-31 2018-01-29 삼성디스플레이 주식회사 발광 다이오드 패키지, 이의 제조 방법, 및 이를 갖는 표시 장치
EP2756225B1 (en) 2011-09-14 2017-05-17 Express Imaging Systems, LLC Apparatus, method to enhance color contrast in phosphor-based solid state lights
DE102011089144A1 (de) * 2011-12-20 2013-06-20 Osram Gmbh WEIßES LICHT ABGEBENDES LEUCHTMITTEL
KR101974348B1 (ko) 2012-09-12 2019-05-02 삼성전자주식회사 발광소자 패키지 및 그 제조방법
DE102014217986A1 (de) * 2014-03-27 2015-10-01 Tridonic Jennersdorf Gmbh LED Modul mit integrierter Sekundäroptik
JP6365159B2 (ja) * 2014-09-16 2018-08-01 日亜化学工業株式会社 発光装置
JP6638292B2 (ja) 2015-09-30 2020-01-29 日亜化学工業株式会社 装置光源
US9961731B2 (en) 2015-12-08 2018-05-01 Express Imaging Systems, Llc Luminaire with transmissive filter and adjustable illumination pattern
CN106935696B (zh) 2015-12-29 2019-06-07 通用电气照明解决方案有限公司 用于光过滤的复合材料、发光设备和用于确定复合材料的掺杂浓度或厚度的方法
US10544917B2 (en) 2016-08-24 2020-01-28 Express Imaging Systems, Llc Shade and wavelength converter for solid state luminaires
JP6695990B2 (ja) * 2016-09-21 2020-05-20 積水化成品工業株式会社 Ｌｅｄ照明カバー用光拡散体及びその用途
US10886437B2 (en) * 2016-11-03 2021-01-05 Lumileds Llc Devices and structures bonded by inorganic coating
TWI803526B (zh) * 2017-10-19 2023-06-01 日商大日本印刷股份有限公司 色彩校正用觀察器、及使用其之色彩校正組
KR102172835B1 (ko) * 2018-10-15 2020-11-02 주식회사 소룩스 색변환 기반의 연색성 개선을 위한 엣지 조명
KR102155320B1 (ko) * 2018-10-15 2020-09-11 주식회사 소룩스 형광체 인쇄형 ｐｃｂ기판 기반의 조명
KR102261011B1 (ko) * 2019-05-15 2021-06-07 주식회사 라이트전자 돔형 uv led 램프
JP7260793B2 (ja) 2020-03-27 2023-04-19 日亜化学工業株式会社 発光装置

Family Cites Families (8)

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JPH11145519A (ja) * 1997-09-02 1999-05-28 Toshiba Corp 半導体発光素子、半導体発光装置および画像表示装置
JP2000011954A (ja) * 1998-06-18 2000-01-14 Matsushita Electron Corp 蛍光ランプおよびその製造方法
JP3645422B2 (ja) * 1998-07-14 2005-05-11 東芝電子エンジニアリング株式会社 発光装置
JP2000230172A (ja) * 1998-12-09 2000-08-22 Sharp Corp 蛍光部材及びそれを用いた発光素子
JP3367096B2 (ja) * 1999-02-02 2003-01-14 日亜化学工業株式会社 発光ダイオードの形成方法
JP3509665B2 (ja) * 1999-11-30 2004-03-22 日亜化学工業株式会社 発光ダイオード
JP4406490B2 (ja) * 2000-03-14 2010-01-27 株式会社朝日ラバー 発光ダイオード
US6522065B1 (en) * 2000-03-27 2003-02-18 General Electric Company Single phosphor for creating white light with high luminosity and high CRI in a UV led device

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