JP4540212B2 - Rewinding guide for bonding wire and rewinding method using the same - Google Patents

Rewinding guide for bonding wire and rewinding method using the same Download PDF

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JP4540212B2
JP4540212B2 JP2000324415A JP2000324415A JP4540212B2 JP 4540212 B2 JP4540212 B2 JP 4540212B2 JP 2000324415 A JP2000324415 A JP 2000324415A JP 2000324415 A JP2000324415 A JP 2000324415A JP 4540212 B2 JP4540212 B2 JP 4540212B2
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wire
rewinding
guide
winding
spool
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JP2002134548A (en
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紀明 原田
哲一 弓削
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Tanaka Denshi Kogyo KK
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Tanaka Denshi Kogyo KK
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Description

【０００１】
【発明の属する技術分野】
本発明は半導体素子用ボンディングワイヤの製造時の巻替工程に用いる巻替ガイド及びそれを用いた巻替方法に関し、詳しくはガイドの寿命が長く且つワイヤの直進性に優れた巻替ガイド及びそれを用いた巻替方法に関する。
【０００２】
【従来の技術】
現在、半導体装置の実装において、半導体素子の電極と外部リードや基板を接続する方法として、半導体素子用ボンディングワイヤ（以下「本ワイヤ」とも略称する）を用いてボールボンディング法により配線する方法、本ワイヤを用いてバンプを形成し、該バンプを介して接続する方法が用いられている。
【０００３】
前述の本ワイヤは、伸線工程で巻き取られた後、巻き替えて、半導体素子用に用いて好適な巻線形態としてスプールに巻取って使用されている。ここで好適な巻線形態としては、スプールに本ワイヤを整列巻きにしたり、スプールに本ワイヤを往復してクロス状に重ねていくクロス多層巻きにして巻き取られている。
該巻き替えを行うに当たっては、従来から往復運動が可能な軸先端に回転可能なローラを取り付け、回転ローラを巻替ガイドとしてスプールに巻取って所定の巻線形態としている。例えば特開平４−２０４６０号には整列巻き、特開平４−３５１２２２号にはクロス多層巻きの巻線形態を得る為の回転ローラをガイドとした巻替方法が開示されている。図３に特開平４−３５１２２２号に記載されている巻取り装置の例を示す。巻取り装置本体２１の回転駆動軸２２に取りつけた巻取りスプール２３に対して、ワイヤ２４を往復動可能な軸２５の先端の回転ローラ２６を介して供給し、巻取りスプール２３を回転駆動軸２２で回転させてワイヤ２４を引き出しつつ、軸２５を往復動させることにより、図に示すようにワイヤ２４を巻取りスプール２３にクロス多層巻きすることができる。
【０００４】
【発明が解決しようとする課題】
一方回転ローラを巻替ガイドとした巻き替え方法では、狭い空間で大きなスペースをとることに加えて、構造が複雑になるという問題を有している。この為、本出願人は巻替ガイドとして石英ガラス製非回転式のガイドを用いて巻替えをしたところ、本ワイヤにキズ不良が発生する迄のガイドの寿命が短くなりこれの交換の為生産性が低下すると共に、巻き取った本ワイヤにキズ不良が発生していない場合でも、直進性が悪くなるという欠点が生じてきた。該直進性は半導体装置が高密度化してくるに伴い、隣接した配線同士が短絡事故を生じることを防止するために本ワイヤに要求される特性である。
【０００５】
この為本出願人等は先に巻替ガイドとして硬質基材表面にダイヤモンドライクカーボン膜を被覆して用いることにより、非回転式巻替ガイドで案内して巻取機で巻き取る本ワイヤの巻替方法を特願平１１−１６００２２号明細書で提案した。しかしながら、生産性の向上の為に更なる巻替ガイドの寿命の向上が要求されている。
【０００６】
本発明は前述の事情に鑑みなされたものでありその目的とするところは、巻戻機から繰り出された本ワイヤを巻替ガイドで案内して巻取機で巻き取っても本ワイヤにキズ不良が発生する迄のガイドの寿命が長くなると共に直進性を向上出来る本ワイヤの巻替ガイド及びそれを用いた巻替方法を提供することにある。
【０００７】
【課題を解決するための手段】
本発明は、上記目的を達成するために、下記を提供する。
（１）硬質基材表面に炭素及び超硬質合金成分を含有する膜が被覆されていることを特徴とする半導体素子用ボンディングワイヤの巻替ガイド。
（２）超硬質合金成分がＷＣ，ＴｉＣのうち何れか１種であることを特徴とする請求項１記載の半導体素子用ボンディングワイヤの巻替ガイド。
【０００８】
（３）伸線工程後に巻戻機から繰り出されたボンディングワイヤを巻替ガイドで案内して巻取機で巻取るボンディングワイヤの巻替方法において、該巻替ガイドが硬質基材表面に超硬質合金成分を含有したダイヤモンドライクカーボン膜が被覆されていることを特徴とする半導体素子用ボンディングワイヤの巻替方法。
【０００９】
【発明の実施の形態】
（１）半導体素子用ボンディングワイヤ
▲１▼ このボンディングワイヤはボールボンディング法などによる配線用ワイヤのほか、バンプ形成用ワイヤも含むものである。
▲２▼ ワイヤとしては、例えばＡｕ，Ａｌ，Ｃｕ，Ｐｔ等をベース金属としてＣａ，Ｂｅ，Ｎｉ等を必要に応じて添加元素として含有させたものが用いられるが、本発明では特に限定するものではない。この中でも金線（金合金線）が最も好ましく用いられる。
【００１０】
▲３▼ ワイヤの線径は１０〜１００μｍが好ましく用いられる。この中でも直径２０〜５０μｍが最も好ましく用いられる。
▲４▼ 本発明の半導体素子用ボンディングワイヤは、伸線工程後のワイヤを対象とし、本発明の巻取りは伸線工程に於ける巻取を含まない。但し伸線加工後のアニール等は終了したもの、していないものの何れでも良い。
【００１１】
▲５▼ また、本発明の巻取り工程のために、ワイヤ表面には潤滑剤を被覆してワイヤ同士の表面付着力を減じさせてワイヤを巻線形態からほどき易くする効果を付与したものが好ましい。このような潤滑剤としては、有機系、無機系の潤滑剤が例示出来るが界面活性剤を主成分とするものが好ましい。その平均膜厚は１〜５００Åが好ましい。
（２）巻替工程
▲１▼ 本発明の半導体素子用ボンディングワイヤは、伸線工程後のワイヤを対象にしている。伸線工程においても、伸線加工されたワイヤは巻き取られるが、本発明の巻取方法はこの伸線工程中の巻取は含まない。本発明の巻取は、巻取後の巻出しの作業性（解きほぐれ性）に優れまた巻出されるワイヤの直進性に優れることを特徴とし、主として半導体素子のボンディング作業に用いる為にスプールに所定の巻線長さ及び巻線形態に巻取り、出荷される巻取り（巻替え）工程を対象としている。本発明の巻取は、限定するわけではないが、伸線工程中における巻取りとは、一般的に、目的が異なり、また巻取りの際のワイヤ張力や、巻線長さ及び巻線形態とりわけその要求精度が異なる。本発明で用いる巻替ガイドは、伸線工程の巻取りにも適用可能であるが、本発明は伸線工程後にむけられている。
【００１２】
▲２▼ 半導体素子用ボンディングワイヤは、所定の線径に伸線加工される伸線工程の後、アニール工程、潤滑剤被覆工程等の伸線後の処理が必要に応じて施される。本発明の巻取工程は、伸線加工の後にスプールに巻き取られる工程であれば、途中でアニール工程、潤滑剤被覆工程等の伸線後の処理を同時に行うものであっても良い。あるいは、アニール工程、潤滑剤被覆工程等は、別工程で行ってもよい。
【００１３】
▲３▼ 上記のように、本発明は半導体素子のボンディング作業用に出荷するための最終巻取り（巻替え）工程を主として対象としているが、伸線工程後であれば、後の処理工程における巻取りや、出荷されたワイヤの再度の巻替え等の巻取工程も含まれる。これらの場合にも、本発明の精密な巻取り性、ワイヤの直進性、ガイド寿命の利点は得られる。
（３）巻線長さ及び巻線形態
出荷用スプールへの巻線長さは、一般に、１００〜５０００ｍのものが好ましく用いられ、さらに長くなる傾向である。
【００１４】
巻線形態は、限定されず、整列巻きも可能であるが、長尺となり多層巻きにする場合は、クロス多層巻きとすることが好ましく、解きほどき性に適した、交差角、ピッチ長さを適宜選定することが望ましい。一般的には、例えば、交差角としては１度２０分〜５度１５分、ピッチとしては２〜８mmが好ましい。
（４）巻替ガイド形状
本発明の巻替ガイドの形状に特に制限はないが、図１に図示するように、２本の棒状ガイド６の間で案内するようにした巻替えガイド５とすることが好ましい。このようにして２本の棒状ガイドの間で案内することにより、ワイヤを精密に案内出来、精密な巻線形態とすることが出来る。また、本発明の巻替ガイドの形状を他の形状の非回転式の形状としてもよいし、必要に応じて回転式のロール状にして用いることも出来る。
（５）巻替ガイド基材
本発明に用いる巻替ガイドは、巻替ガイド基材としての硬質基材表面に炭素及び超硬質合金成分を含有する膜を被覆したものである。
【００１５】
ここで硬質基材とは超硬合金、セラミックス、ガラス等が例示できる。超硬合金は炭化タングステン、炭化チタン、炭化タンタル、コバルト等を主成分とする超硬合金が例示出来、セラミックスは、アルミナセラミックス、ジルコニアセラミックス、炭化珪素質セラミックス、窒化珪素質セラミックス、窒化アルミ質セラミックスが例示出来、ガラスはケイ酸塩ガラス、リン酸塩ガラス、ホウ酸塩ガラス等が例示出来る。
【００１６】
この中でも硬質の超硬合金又はセラミックスを用いることが好ましい。
（６）被膜成分
本発明になる被膜成分としては、炭素及び超硬質合金成分を含有する膜であることが必要である。
ここで超硬質合金成分とは周期表第IV，Ｖ，VI族の金属又は合金及びその炭化物、窒化物、ホウ化物、ケイ化物をいう。この中でもＷＣ，ＴｉＣ，ＴｉＮが好ましく用いられる。
【００１７】
本発明の被膜成分としての炭素は非晶質炭素ないしダイヤモンドライクカーボン（以下「ＤＬＣ」ともいう）であるが、ＤＬＣが好ましい。
ここでＤＬＣはＣＶＤやＰＶＤで形成されるダイヤモンド様被膜を主成分とする硬質皮膜である。本発明のＤＬＣ被膜はＰＶＤ処理において、１００〜２００℃の低温で生成されるアモルファス炭素を主成分とすることが好ましい。本発明被膜ではさらに超硬質合金成分を含有させるようにしたものである。ＤＬＣ（あるいは炭素）と超硬質合金成分とは、混合物の状態で存在してもよいが、原子サイズの厚みで層状に繰り返し配列させて両方を含有することがＤＬＣの物性をより良く維持しながら超硬質合金成分による改質をすることができるので好ましい。しかし、この混合（超格子的積層）によってＤＬＣがある程度非晶質化してもよい。
【００１８】
前記ＤＬＣ単独被膜ではＨｖが３０００〜５０００の高硬度の被膜が得られ、これに超硬質合金成分を含有させると硬度はＨｖが９００〜１３００に低下するものの、本発明の課題である巻替ガイドの寿命が向上するようになる。
（７）被膜の特性
被膜厚さは０．１〜１０μｍとして用いることが好ましく、更に好ましくは、１〜５μｍである。硬度はカーボン膜生成温度及び超硬質合金成分の種類と量を調整して、Ｈｖが９００〜１３００として用いることが好ましく、更に好ましくはＨｖが１０００〜１２００である。
（８）被膜形成方法
本発明になる炭素及び超硬質合金成分を含有する被膜は、その形成方法自体は公知の方法によることができるが、巻替ガイドの硬質基材表面に真空蒸着、イオンプレーティング、スパッタリング等ＰＶＤにより形成する方法が好ましく用いられる。前記炭素皮膜は１００〜２００℃の低温で生成するようにすると非晶質（アモルファス）炭素が主成分の被膜ができる。又本発明の被膜は、炭素及び超硬質合金成分を含有しており、非晶質炭素と超硬質合金成分が原子サイズの厚みで相互に配列されていると考えられている。この為、ＤＬＣ単独膜と対比して硬度は低下するものの、密着力が向上して本発明の課題に対して効果的に作用するものと考えられる。
【００１９】
この中で、真空蒸着法はセラミックスを蒸発させ、基材に付着、析出させる方法である。この方法には、レーザー等高エネルギーを蒸発源としてセラミックスを直接溶融し、蒸着させる方法と反応性のガス中で金属を蒸発させ、気相中で反応させながら基材上に析出させる方法がある。又イオンプレーティング法は真空蒸着法にプラズマ反応によるイオン化機構を付加した方法である。又スパッタリング法は高真空にした後反応性ガスを封入し、金属に高エネルギーの原子、分子、イオン等を衝突させ、原子を放出させて生成したセラミックスを基材に析出させる方法である。
（９）被膜中間層
本発明に用いる巻替ガイドの被膜構造は基材表面と本発明被膜の間に中間層を設けることが出来る。該中間層としては密着性向上の為に基材面にＣｒやＴｉ膜を形成したり、本発明被膜に弾性をもたせる為にＷＣやＴｉＣ膜を形成すること等が例示出来る。
（１０）巻替方法の例
図１を用いて巻替ガイド及び該ガイドを用いた巻替え工程の一例を説明する。
【００２０】
ワイヤ供給機構（詳細は図示せず、全体を１で示す。）の供給スプールに、前工程である伸線工程において伸線加工されたワイヤが巻き込まれている。
ワイヤ供給機構において供給スプールは着脱自在に取り付けられている。供給スプールからのワイヤ２は、ガイドローラから巻取機構へ順次誘導する。ワイヤ２は巻取機構の駆動力によって供給スプールから引き出すことが出来る。
【００２１】
巻取機構は、水平方向へ往復動させるトラバース機構（図示せず）により駆動される回転軸３に着脱自在に取り付けされる巻取スプール４により構成される。ワイヤ２が巻取スプール４により巻取りされる直前の位置に巻替ガイド５を設置する。ワイヤ２の通過位置は巻替ガイド５で規定されて、往復動する巻取スプール４にクロス多層巻きされる。巻取スプール４が回転軸３に着脱自在に取り付けされ、ワイヤ２は矢印方向に巻替ガイド５で案内されてスプール４に巻き取られる。この巻替ガイド５は、２本の棒状ガイド６で構成され、ワイヤ２はその間隔によって案内される。上記では巻取スプールがトラバース機構により水平方向へ往復動するように駆動されるが、巻取スプール４の水平方向を固定し、巻替ガイド５を往復動させて巻き取ってもよい。
（１１）発明の効果
本発明になる巻替ガイド及びそれを用いた巻替方法によれば、巻替ガイドが硬質基材に炭素及び超硬質合金成分を含有する被膜を被覆した為、ワイヤにキズ不良が発生する迄のガイドの寿命が長くなると共に巻き取ったワイヤの直進性を向上することが可能になる。
【００２２】
巻替ガイド表面のキズが最初はワイヤの直進性に影響を与え、キズの進行に伴いワイヤキズに進展していくものと推定出来る。
【００２３】
【実施例】
以下実施例に基づき本発明を具体的に説明する。
（実施例１）
図１に示す巻替ガイド５を次の方法で作成した。
直径が２．５mmで長さが４５mmと５１mmの２本の超硬合金製のガイド基材の表面をラップ仕上げによりＲｍａｘ０．２μｍまで研磨し、脱脂処理及び洗浄を行った。
【００２４】
次いでこの超硬合金製ガイド基材表面にイオンプレーティング法により、炭素及びＴｉＣを含有する膜を１００〜２００℃で生成し、非晶質カーボンとＴｉＣが混在するようにして厚さ３μｍの被膜を被覆したガイド６を得た。得られた長さ４５mmのガイドと長さ５１mmのガイドを１本ずつ、図１に示すようにガイド受け７に装着して非回転式巻替ガイド５を組み立てた。
【００２５】
次いで、高純度金に１０重量ppm のＣａと４０重量ppm のＧｅを含有させ、直径２５μｍに伸線加工した後、アニール処理、潤滑剤塗布して仕上げた金合金線を巻替用供給ワイヤとして準備した。
ワイヤ供給機構１へこのワイヤを装着し、巻取機構の駆動力によってワイヤ２を供給スプールから引き出して巻取機構で巻き取らせた。ワイヤ２の通過速度は３５ｍ／分とした。巻取機構には上記の非回転式巻替ガイド５を図１のように取り付けて用いた。巻取機構の回転軸３を水平方向へ往復動させることにより長さ２０００ｍのワイヤをクロス多層巻きに巻き替えて、得られた巻替製品を試料Ａとした。
（実施例２）
超硬合金製ガイド基材表面に生成する膜を炭素及びＷＣとすること以外は実施例１と同様にして、巻き替え試験を行い、得られた巻取製品を試料Ｂとした。
（参考例）
超硬合金製ガイド基材表面に生成する膜をＣＶＤで厚さ１μｍのＤＬＣ（ダイヤモンドライクカーボン）被膜を形成したこと以外は実施例１と同様にして巻き替え試験を行い、得られた巻取製品を試料Ｃとした。
（比較例）
石英ガラスを用いたこと以外は実施例１と同様にして巻き替え試験を行い、得られた巻取製品を試料Ｄとした。
（測定方法）
▲１▼ ガイド寿命
ワイヤを各巻取ガイドを用いて巻替えて、ワイヤにキズ不良が発生するまでの処理長さを計測した。試料Ｄの処理長さを基準として各試料の処理長さを指数にして表１に示した。
▲２▼ 直進性測定
本出願人が特願平９−３６０９９４号明細書に開示した直進性測定装置を用いて直進性を測定した。図２にその斜視図を示す。
【００２６】
図２の装置において、１１は風防容器であり、１２は正面扉である。少なくとも該正面部の下方は透明性材質である。１３はワイヤを巻き回したスプール、１４は繰り出しモータ、１５はコントローラ、１６は正面部下方に設けた平面鏡、１７はワイヤ、１８は正面扉１２の外側で平面鏡高さに設けた透明性目盛り部である。この装置の上方の繰り出しモータ１４の回転軸に連結したスプール装着部にワイヤを巻き回したスプール１３を装着し、該装着部下方に平面鏡１６を配置し、その全面に目盛り部１８を配置している。
【００２７】
スプールから繰り出されるワイヤ１７は、平面鏡１６の前方を落下するが、図２の装置では正面扉１２を閉じると、透明な正面扉１２に形成された目盛り部１８が間にワイヤ１７を置いて平面鏡１６と平行になる。そこで、透明な目盛り部１８を通してワイヤ１７をみながら、平面鏡１６に写るワイヤの像がワイヤ１７と一致する位置から観察し、目盛り部１８を利用して以下に説明するワイヤの直進性を測定する。
【００２８】
ワイヤのネジレの測定は、平面鏡や目盛り部は不要であり、スプールから繰り出され、スプールから落下するワイヤの先端部の回転角を測定するだけで良い。
装置内上部のモータ１４の回転軸に装着したワイヤ１７をモータの回転に伴い下方に落下させて、次の通りネジレ及び蛇行幅を測定して直進性を評価した。
ａ）ネジレ
ワイヤ先端をＬ字型に曲げて１ｍストローク当たりの回転数を測定した。各試料毎にワイヤを切断しながら１０回測定し、その回転数の平均値をネジレとした。試料Ｄのネジレを基準として試料Ａ〜Ｄのネジレを指数として表１に示した。
ｂ）蛇行幅
ネジレ測定を終えたワイヤ１７を更に落下させて、モータを停止し、垂直長さ２０cm当たりの蛇行幅を図２に示す目盛り１８を用いて測定した。
【００２９】
ネジレ測定と同様に１０回測定し、その平均値を蛇行幅とした。試料Ｄの蛇行幅を基準として試料Ａ〜Ｄの蛇行幅を指数として表１に示した。
【００３０】
【表１】

Figure 0004540212
【００３１】
（測定結果）
本発明方法により得られた試料Ａ，Ｂのワイヤは試料Ｄのワイヤと対比してガイド寿命で１７０〜１９０倍、直進性に於いても２０〜２５倍の高品質のものと出来ることが判る。又ＤＬＣ被膜を有する巻替ガイドを用いて巻き替えて得られた試料Ｃのワイヤは、試料Ｄのワイヤと対比してガイド寿命で７０倍であり、本発明になる巻替ガイドの方が優れていることが判る。
【００３２】
【発明の効果】
本発明の方法に従い、伸線工程後に硬質基材表面に炭素及び超硬質合金成分を含有する膜を被覆した巻替ガイドを用いて、半導体素子用ワイヤの巻取を行った場合、ワイヤにキズ不良が発生するまでのガイド寿命が長くなると共に直進性を向上させることが出来る。
【図面の簡単な説明】
【図１】本発明による半導体素子用ボンディングワイヤの巻取り装置の例を示す。
【図２】巻き取った半導体素子用ボンディングワイヤの直進性の試験装置を示す。
【図３】従来の半導体素子用ボンディングワイヤの巻取り装置の例を示す。
【符号の説明】
１…ワイヤ供給機構
２…ワイヤ
３…回転軸
４…巻取りスプール
５…非回転式巻替えガイド
６…棒状ガイド
７…ガイド受け
１１…風防用容器
１２…正面扉
１３…ワイヤを巻き回したスプール
１４…繰り出しモータ
１５…コントローラ
１６…平面鏡
１７…ワイヤ
１８…透明性目盛り部
２１…巻取り装置本体
２２…回転駆動軸
２３…巻取りスプール
２４…ワイヤ
２５…往復動可能な軸
２６…回転ローラ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a rewinding guide used in a rewinding process at the time of manufacturing a bonding wire for a semiconductor device and a rewinding method using the rewinding guide, and more particularly, a rewinding guide having a long guide life and excellent linearity of the wire, and the rewinding guide. It is related with the rewind method using.
[0002]
[Prior art]
Currently, in semiconductor device mounting, as a method of connecting an electrode of a semiconductor element to an external lead or substrate, a method of wiring by a ball bonding method using a bonding wire for semiconductor element (hereinafter also referred to as “main wire”), this A method of forming bumps using wires and connecting via the bumps is used.
[0003]
The above-described wire is wound in a wire drawing process, then wound and wound on a spool as a suitable winding form for use in a semiconductor element. Here, as a preferable winding form, the main wire is wound on the spool in an aligned manner, or the cross wire is wound in the form of a cross multi-layer winding in which the main wire is reciprocated on the spool and overlapped in a cross shape.
In performing the rewinding, a rotatable roller is attached to the tip of a shaft that can reciprocate conventionally, and the rotating roller is wound around a spool as a rewinding guide to form a predetermined winding form. For example, Japanese Patent Laid-Open No. 4-20460 discloses a winding method using a rotating roller as a guide for obtaining a winding form of aligned winding, and Japanese Patent Laid-Open No. 4-351222. FIG. 3 shows an example of a winding device described in JP-A-4-351222. A wire 24 is supplied to a take-up spool 23 attached to the rotary drive shaft 22 of the take-up device main body 21 via a rotary roller 26 at the tip of a shaft 25 that can reciprocate, and the take-up spool 23 is supplied to the rotary drive shaft. The wire 24 can be wound around the take-up spool 23 as shown in the figure by rotating the shaft 25 in a reciprocating manner while pulling out the wire 24 by rotating at 22.
[0004]
[Problems to be solved by the invention]
On the other hand, the rewinding method using a revolving roller as a rewinding guide has a problem that the structure becomes complicated in addition to taking a large space in a narrow space. For this reason, when the present applicant uses a quartz glass non-rotating guide as a rewinding guide, the rewinding of the guide is shortened until the wire is damaged. As a result, there is a drawback in that straightness deteriorates even when the wound wire has no flaw defect. The straightness is a characteristic required for this wire in order to prevent a short circuit accident between adjacent wirings as the density of semiconductor devices increases.
[0005]
For this reason, the present applicants previously used the surface of a hard base material coated with a diamond-like carbon film as a rewinding guide, so that the wire can be wound with a winder guided by a non-rotating rewinding guide. An alternative method was proposed in Japanese Patent Application No. 11-160022. However, further improvement of the life of the rewinding guide is required for improving productivity.
[0006]
The present invention has been made in view of the above-described circumstances, and the object of the present invention is to prevent the wire from being wound even if the wire unwound from the rewinding machine is guided by the rewinding guide and wound by the winder. It is an object of the present invention to provide a rewinding guide for a wire and a rewinding method using the same, which can increase the life of the guide until the occurrence of the problem and improve the straightness.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides the following.
(1) A rewinding guide for a bonding wire for a semiconductor element, characterized in that a hard substrate surface is coated with a film containing carbon and a super-hard alloy component.
(2) The rewinding guide for bonding wires for semiconductor elements according to claim 1, wherein the superhard alloy component is one of WC and TiC.
[0008]
(3) In a method of rewinding a bonding wire in which a bonding wire fed out from a rewinding machine after the wire drawing process is guided by a rewinding guide and wound by a winder, the rewinding guide is super-hard on the surface of a hard substrate. A method of rewinding a bonding wire for a semiconductor element, characterized in that a diamond-like carbon film containing an alloy component is coated.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
(1) Bonding wire for semiconductor element (1) This bonding wire includes a wire for bump formation in addition to a wire for wiring by a ball bonding method or the like.
(2) As the wire, for example, Au, Al, Cu, Pt or the like, which contains Ca, Be, Ni or the like as an additive element as necessary, is used as a base metal, but the present invention is particularly limited. is not. Among these, a gold wire (gold alloy wire) is most preferably used.
[0010]
(3) The wire diameter is preferably 10 to 100 μm. Among these, a diameter of 20 to 50 μm is most preferably used.
(4) The bonding wire for a semiconductor element of the present invention is intended for a wire after the wire drawing process, and the winding of the present invention does not include the winding in the wire drawing process. However, the annealing after the wire drawing process may be either finished or not.
[0011]
(5) Also, for the winding process of the present invention, the wire surface is coated with a lubricant to reduce the surface adhesion between the wires, thereby giving the effect of making the wire easier to unwind from the winding form. Is preferred. Examples of such a lubricant include organic and inorganic lubricants, but those having a surfactant as a main component are preferable. The average film thickness is preferably 1 to 500 mm.
(2) Rewinding process (1) The bonding wire for a semiconductor element of the present invention is intended for the wire after the wire drawing process. Even in the wire drawing step, the wire that has been drawn is wound, but the winding method of the present invention does not include winding during the wire drawing step. The winding of the present invention is characterized by excellent workability (unwinding property) of unwinding after winding, and excellent linearity of the wire to be unwound. It is intended for a winding (rewinding) step of winding and shipping to a predetermined winding length and winding form. The winding of the present invention is not limited, but generally has a different purpose from the winding in the wire drawing process, and the wire tension, winding length and winding form during winding In particular, the required accuracy differs. The rewinding guide used in the present invention is applicable to winding in the wire drawing process, but the present invention is intended after the wire drawing process.
[0012]
{Circle around (2)} The bonding wires for semiconductor elements are subjected to post-drawing processing such as an annealing step and a lubricant coating step after the drawing step of drawing to a predetermined wire diameter, if necessary. As long as the winding process of the present invention is a process that is wound on a spool after the wire drawing process, a post-drawing process such as an annealing process and a lubricant coating process may be performed at the same time. Or you may perform an annealing process, a lubricant coating process, etc. by another process.
[0013]
(3) As described above, the present invention is mainly intended for the final winding (rewinding) process for shipping for the bonding operation of the semiconductor element. A winding process such as winding or rewinding the shipped wire is also included. Even in these cases, the advantages of the precise winding property, straightness of the wire, and guide life of the present invention can be obtained.
(3) Winding length and winding form Generally, the winding length to the shipping spool is preferably 100 to 5000 m and tends to be longer.
[0014]
The winding form is not limited, and aligned winding is also possible. However, in the case of a long and multi-layer winding, a cross multi-layer winding is preferable, and a crossing angle and a pitch length suitable for unwinding property It is desirable to select as appropriate. In general, for example, the crossing angle is preferably 1 to 20 minutes to 5 degrees and 15 minutes, and the pitch is preferably 2 to 8 mm.
(4) Rewinding guide shape Although there is no restriction | limiting in particular in the shape of the rewinding guide of this invention, it is set as the rewinding guide 5 made to guide between the two rod-shaped guides 6 as shown in FIG. It is preferable. By guiding between the two rod-shaped guides in this way, the wire can be guided accurately and a precise winding configuration can be obtained. Moreover, the shape of the rewinding guide of this invention is good also as non-rotating type of another shape, and can also be used in the shape of a rotating roll as needed.
(5) Rewind guide base material The rewind guide used in the present invention is obtained by coating the surface of a hard base material as a rewind guide base material with a film containing carbon and a super hard alloy component.
[0015]
Examples of the hard base material include cemented carbide, ceramics, and glass. Examples of cemented carbide include cemented carbides mainly composed of tungsten carbide, titanium carbide, tantalum carbide, cobalt, etc., and ceramics include alumina ceramics, zirconia ceramics, silicon carbide ceramics, silicon nitride ceramics, and aluminum nitride ceramics. Examples of the glass include silicate glass, phosphate glass, and borate glass.
[0016]
Among these, it is preferable to use a hard cemented carbide or ceramic.
(6) Film component The film component according to the present invention is required to be a film containing carbon and a super hard alloy component.
Here, the superhard alloy component refers to metals or alloys of Group IV, V, and VI of the periodic table and carbides, nitrides, borides, and silicides thereof. Of these, WC, TiC, and TiN are preferably used.
[0017]
The carbon as the film component of the present invention is amorphous carbon or diamond-like carbon (hereinafter also referred to as “DLC”), and DLC is preferable.
Here, DLC is a hard film mainly composed of a diamond-like film formed by CVD or PVD. The DLC film of the present invention is preferably composed mainly of amorphous carbon produced at a low temperature of 100 to 200 ° C. in the PVD treatment. The coating of the present invention further contains a superhard alloy component. DLC (or carbon) and the superhard alloy component may exist in the form of a mixture, but it is possible to repeatedly arrange them in layers with an atomic size thickness while maintaining the physical properties of DLC better. This is preferable because it can be modified with a superhard alloy component. However, the DLC may be made amorphous to some extent by this mixing (superlattice lamination).
[0018]
With the DLC single coating, a high-hardness coating having a Hv of 3000 to 5000 is obtained. When a superhard alloy component is added to the DLC coating, the hardness decreases to 900-1300, but the rewind guide is the subject of the present invention. Life expectancy will improve.
(7) Film characteristics The film thickness is preferably 0.1 to 10 [mu] m, more preferably 1 to 5 [mu] m. The hardness is preferably adjusted as the carbon film formation temperature and the kind and amount of the superhard alloy component, and Hv is preferably used as 900 to 1300, and more preferably Hv is 1000 to 1200.
(8) Film Forming Method The film containing the carbon and superhard alloy component according to the present invention can be formed by a known method, but vacuum deposition, ion plating on the surface of the hard base material of the rewind guide. A method of forming by PVD such as coating and sputtering is preferably used. When the carbon film is formed at a low temperature of 100 to 200 ° C., a film mainly composed of amorphous carbon can be formed. Further, the coating of the present invention contains carbon and a super hard alloy component, and it is considered that amorphous carbon and the super hard alloy component are arranged with a thickness of atomic size. For this reason, although the hardness is reduced as compared with the DLC single film, it is considered that the adhesive force is improved and effectively acts on the problem of the present invention.
[0019]
Among them, the vacuum deposition method is a method of evaporating ceramics and depositing and depositing them on a substrate. This method includes a method of directly melting and evaporating ceramics using high energy such as a laser as an evaporation source and a method of evaporating a metal in a reactive gas and depositing it on a substrate while reacting in a gas phase. . The ion plating method is a method in which an ionization mechanism by a plasma reaction is added to the vacuum deposition method. The sputtering method is a method in which a reactive gas is sealed after making a high vacuum, high energy atoms, molecules, ions, etc. are collided with a metal, and atoms are released to deposit ceramics produced on the substrate.
(9) Coating intermediate layer The coating structure of the rewind guide used in the present invention can provide an intermediate layer between the substrate surface and the coating of the present invention. Examples of the intermediate layer include forming a Cr or Ti film on the substrate surface for improving adhesion, or forming a WC or TiC film for imparting elasticity to the coating of the present invention.
(10) Example of Rewinding Method An example of a rewinding guide and a rewinding process using the guide will be described with reference to FIG.
[0020]
A wire that has been drawn in a drawing process, which is a previous process, is wound on a supply spool of a wire supply mechanism (the details are not shown, and the whole is indicated by 1).
In the wire supply mechanism, the supply spool is detachably attached. The wire 2 from the supply spool is sequentially guided from the guide roller to the winding mechanism. The wire 2 can be pulled out from the supply spool by the driving force of the winding mechanism.
[0021]
The winding mechanism includes a winding spool 4 that is detachably attached to a rotary shaft 3 that is driven by a traverse mechanism (not shown) that reciprocates in the horizontal direction. A rewind guide 5 is installed at a position immediately before the wire 2 is wound by the take-up spool 4. The passing position of the wire 2 is defined by the rewinding guide 5 and is wound around the winding spool 4 that reciprocates in a multilayer manner. A take-up spool 4 is detachably attached to the rotary shaft 3, and the wire 2 is guided by the rewind guide 5 in the direction of the arrow and is taken up by the spool 4. The rewinding guide 5 is composed of two rod-shaped guides 6 and the wire 2 is guided by the interval. In the above description, the take-up spool is driven so as to reciprocate in the horizontal direction by the traverse mechanism. However, the take-up spool 4 may be fixed in the horizontal direction and taken up by reciprocating the rewind guide 5.
(11) Effects of the Invention According to the rewinding guide and the rewinding method using the same according to the present invention, the rewinding guide coats a hard base material with a coating containing carbon and a super-hard alloy component. It is possible to increase the life of the guide until a defect occurs, and to improve the straightness of the wound wire.
[0022]
It can be presumed that scratches on the surface of the rewinding guide initially affect the straightness of the wire and progress to wire scratches as the scratches progress.
[0023]
【Example】
The present invention will be specifically described below based on examples.
Example 1
The rewind guide 5 shown in FIG. 1 was created by the following method.
The surfaces of two cemented carbide guide bases having a diameter of 2.5 mm and a length of 45 mm and 51 mm were polished to a Rmax of 0.2 μm by lapping, and then degreased and washed.
[0024]
Next, a film containing carbon and TiC is formed on the surface of the guide substrate made of cemented carbide by ion plating at 100 to 200 ° C., and a film having a thickness of 3 μm is formed so that amorphous carbon and TiC are mixed. A guide 6 coated with was obtained. The obtained 45 mm long guide and 51 mm long guide were mounted on the guide receiver 7 as shown in FIG. 1 to assemble the non-rotating rewind guide 5.
[0025]
Next, high purity gold contains 10 ppm by weight of Ca and 40 ppm by weight of Ge, and after wire drawing to a diameter of 25 μm, a gold alloy wire finished by annealing and applying a lubricant is used as a supply wire for rewinding. Got ready.
This wire was attached to the wire supply mechanism 1, and the wire 2 was pulled out from the supply spool by the driving force of the winding mechanism and wound up by the winding mechanism. The passing speed of the wire 2 was 35 m / min. The above-described non-rotating rewinding guide 5 is attached to the winding mechanism as shown in FIG. By rotating the rotary shaft 3 of the winding mechanism in the horizontal direction, a wire having a length of 2000 m was re-wound into a cross multilayer winding, and the obtained re-wound product was designated as sample A.
(Example 2)
A rewinding test was conducted in the same manner as in Example 1 except that the film formed on the surface of the guide substrate made of cemented carbide was carbon and WC.
(Reference example)
A rewinding test was carried out in the same manner as in Example 1 except that a DLC (diamond-like carbon) film having a thickness of 1 μm was formed by CVD on the surface of the guide substrate made of cemented carbide. The product was Sample C.
(Comparative example)
A rewinding test was conducted in the same manner as in Example 1 except that quartz glass was used, and the obtained wound product was designated as Sample D.
(Measuring method)
(1) Guide life The wire was re-wound using each winding guide, and the treatment length until the wire was defective was measured. Table 1 shows the processing length of each sample as an index based on the processing length of sample D.
(2) Straightness measurement The straightness was measured using the straightness measurement device disclosed in Japanese Patent Application No. 9-360994. FIG. 2 shows a perspective view thereof.
[0026]
In the apparatus of FIG. 2, 11 is a windshield container and 12 is a front door. At least below the front part is a transparent material. 13 is a spool around which a wire is wound, 14 is a feeding motor, 15 is a controller, 16 is a plane mirror provided below the front portion, 17 is a wire, and 18 is a transparent scale portion provided at the height of the plane mirror outside the front door 12. It is. A spool 13 around which a wire is wound is mounted on a spool mounting portion connected to a rotating shaft of a feeding motor 14 above the apparatus, a plane mirror 16 is disposed below the mounting portion, and a scale portion 18 is disposed on the entire surface. Yes.
[0027]
The wire 17 fed out of the spool falls in front of the plane mirror 16, but when the front door 12 is closed in the apparatus of FIG. 2, the scale portion 18 formed on the transparent front door 12 puts the wire 17 between them and puts the plane mirror in between. 16 and parallel. Therefore, while observing the wire 17 through the transparent scale portion 18, the wire image reflected on the plane mirror 16 is observed from the position where it coincides with the wire 17, and the straightness of the wire described below is measured using the scale portion 18. .
[0028]
The measurement of the twist of the wire does not require a plane mirror or a scale, and it is only necessary to measure the rotation angle of the tip of the wire that is fed out of the spool and dropped from the spool.
The wire 17 attached to the rotating shaft of the motor 14 in the upper part of the apparatus was dropped downward as the motor rotated, and the straightness was evaluated by measuring the twist and meandering width as follows.
a) The tip of the twisted wire was bent into an L shape and the number of rotations per 1 m stroke was measured. Measurement was performed 10 times while cutting the wire for each sample, and the average value of the number of rotations was defined as twist. Table 1 shows the twists of the samples A to D as indices based on the twist of the sample D.
b) The meandering width torsion measurement of the wire 17 was further dropped, the motor was stopped, and the meandering width per vertical length of 20 cm was measured using the scale 18 shown in FIG.
[0029]
The measurement was performed 10 times in the same manner as the twist measurement, and the average value was defined as the meandering width. Table 1 shows the meandering width of samples A to D as an index based on the meandering width of sample D.
[0030]
[Table 1]
Figure 0004540212
[0031]
(Measurement result)
It can be seen that the wires of Samples A and B obtained by the method of the present invention can have a high quality of 170 to 190 times as long as the guide life and 20 to 25 times as long as the straightness as compared with the wire of Sample D. . Further, the wire of the sample C obtained by rewinding using the rewinding guide having the DLC film has a guide life of 70 times that of the wire of the sample D, and the rewinding guide according to the present invention is superior. You can see that
[0032]
【The invention's effect】
According to the method of the present invention, when a wire for a semiconductor element is wound using a rewind guide in which a hard substrate surface is coated with a film containing carbon and a superhard alloy component after the wire drawing step, the wire is scratched. It is possible to increase the guide life until a defect occurs and improve straightness.
[Brief description of the drawings]
FIG. 1 shows an example of a winding device for a bonding wire for a semiconductor device according to the present invention.
FIG. 2 shows a straightness test apparatus for a wound bonding wire for a semiconductor element.
FIG. 3 shows an example of a conventional bonding wire winding device for semiconductor elements.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Wire supply mechanism 2 ... Wire 3 ... Rotating shaft 4 ... Winding spool 5 ... Non-rotating rewinding guide 6 ... Bar-shaped guide 7 ... Guide receiver 11 ... Windshield container 12 ... Front door 13 ... Spool which wound the wire DESCRIPTION OF SYMBOLS 14 ... Feed motor 15 ... Controller 16 ... Plane mirror 17 ... Wire 18 ... Transparent scale part 21 ... Winding device main body 22 ... Rotation drive shaft 23 ... Winding spool 24 ... Wire 25 ... Reciprocating shaft 26 ... Rotating roller

Claims (3)

硬質基材表面にダイヤモンドライクカーボン及び超硬質合金成分を含有する、硬度が９００〜１３００Ｈｖの膜が被覆されていることを特徴とする半導体素子用ボンディングワイヤの巻替ガイド。A rewinding guide for a bonding wire for a semiconductor element, characterized in that a hard substrate surface is coated with a film having a hardness of 900 to 1300 Hv and containing diamond-like carbon and a super-hard alloy component. 超硬質合金成分がＷＣ，ＴｉＣのうち何れか１種であることを特徴とする請求項１記載の半導体素子用ボンディングワイヤの巻替ガイド。  2. The rewinding guide for bonding wires for semiconductor elements according to claim 1, wherein the super hard alloy component is one of WC and TiC. 伸線工程後に巻戻機から繰り出されたボンディングワイヤを巻替ガイドで案内して巻取機で巻取るボンディングワイヤの巻替方法において、該巻替ガイドが硬質基材表面に超硬質合金成分を含有したダイヤモンドライクカーボン膜が被覆されていることを特徴とする半導体素子用ボンディングワイヤの巻替方法。  In a method for rewinding a bonding wire in which a bonding wire fed from a rewinding machine is guided by a rewinding guide and wound by a winder after the wire drawing process, the rewinding guide has a super-hard alloy component on the surface of a hard substrate. A method for rewinding a bonding wire for a semiconductor element, characterized in that the diamond-like carbon film is coated.
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