JP4532741B2 - 小型化された部品を熱的に安定して支持する装置 - Google Patents

小型化された部品を熱的に安定して支持する装置 Download PDF

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Publication number
JP4532741B2
JP4532741B2 JP2000581492A JP2000581492A JP4532741B2 JP 4532741 B2 JP4532741 B2 JP 4532741B2 JP 2000581492 A JP2000581492 A JP 2000581492A JP 2000581492 A JP2000581492 A JP 2000581492A JP 4532741 B2 JP4532741 B2 JP 4532741B2
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JP
Japan
Prior art keywords
support
optical
holding part
base
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000581492A
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English (en)
Japanese (ja)
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JP2002529789A5 (enExample
JP2002529789A (ja
Inventor
ド グラフェンリード クリスチャン レミー
マルコ アントニオ スクーサ
Original Assignee
ライカ ゲオジステームス アクチエンゲゼルシャフト
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Application filed by ライカ ゲオジステームス アクチエンゲゼルシャフト filed Critical ライカ ゲオジステームス アクチエンゲゼルシャフト
Publication of JP2002529789A publication Critical patent/JP2002529789A/ja
Publication of JP2002529789A5 publication Critical patent/JP2002529789A5/ja
Application granted granted Critical
Publication of JP4532741B2 publication Critical patent/JP4532741B2/ja
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Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/008—Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S248/00—Supports
    • Y10S248/901—Support having temperature or pressure responsive feature

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2000581492A 1998-11-05 1999-10-29 小型化された部品を熱的に安定して支持する装置 Expired - Lifetime JP4532741B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19850888A DE19850888A1 (de) 1998-11-05 1998-11-05 Einrichtung zur Halterung eines miniaturisierten Bauteils
DE19850888.3 1998-11-05
PCT/EP1999/008207 WO2000028367A1 (de) 1998-11-05 1999-10-29 Einrichtung zur thermisch stabilen halterung eines miniaturisierten bauteils

Publications (3)

Publication Number Publication Date
JP2002529789A JP2002529789A (ja) 2002-09-10
JP2002529789A5 JP2002529789A5 (enExample) 2006-12-14
JP4532741B2 true JP4532741B2 (ja) 2010-08-25

Family

ID=7886707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000581492A Expired - Lifetime JP4532741B2 (ja) 1998-11-05 1999-10-29 小型化された部品を熱的に安定して支持する装置

Country Status (5)

Country Link
US (1) US6554244B1 (enExample)
EP (1) EP1127287B1 (enExample)
JP (1) JP4532741B2 (enExample)
DE (2) DE19850888A1 (enExample)
WO (1) WO2000028367A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6903884B2 (en) * 2002-11-15 2005-06-07 Sumitomo Electric Industries, Ltd. Optical device and fixing member used in the device
EP1424156A1 (en) 2002-11-29 2004-06-02 Leica Geosystems AG Process for soldering miniaturized components onto a base plate
EP1424884A1 (de) * 2002-11-29 2004-06-02 Leica Geosystems AG Verfahren zur Montage miniaturisierter Bauteile auf einer Trägerplatte
DE10335111B4 (de) * 2003-07-31 2006-12-28 Infineon Technologies Ag Montageverfahren für ein Halbleiterbauteil
DE10347450B4 (de) * 2003-10-13 2006-05-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Keramiksubstrate mit integrierten mechanischen Strukturen zum direkten Fassen von optischen Bauelementen
GB0401998D0 (en) * 2004-01-30 2004-03-03 Tyco Electronics Raychem Nv Optical device
US7064908B2 (en) * 2004-04-21 2006-06-20 The Boeing Company Laser beam jitter reduction device on a laser optical bench
US20060082771A1 (en) * 2004-10-14 2006-04-20 Agilent Technologies, Inc. Mount of optical components
US8651677B2 (en) * 2010-06-28 2014-02-18 Lexmark International, Inc. Mounting mechanism for a component of an imaging apparatus, and methods of making and using same
US8607513B2 (en) 2011-12-30 2013-12-17 Panelclaw, Inc. Thermal growth compensators, systems, and methods

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4116537A (en) * 1975-10-08 1978-09-26 Honeywell Inc. Thermal compensation apparatus
US4268123A (en) * 1979-02-26 1981-05-19 Hughes Aircraft Company Kinematic mount
JPS56113109A (en) 1980-02-14 1981-09-05 Fujitsu Ltd Optical system supporting structure
FR2534663A1 (fr) 1982-10-15 1984-04-20 Matra Structure de fixation d'une piece a un support
DE3634196A1 (de) 1986-10-08 1988-04-21 Zeiss Carl Fa Einrichtung zur verbindung zweier koerper mit unterschiedlichen thermischen ausdehnungskoeffizienten
JPS647670A (en) * 1987-06-30 1989-01-11 Nec Corp Air-cooled argon laser oscillator
SE458072B (sv) 1987-07-03 1989-02-20 Ericsson Telefon Ab L M Anordning foer att vid varierande temperatur haalla en optisk lins i oenskat laege i en linsfattning
JPH03209411A (ja) * 1989-09-19 1991-09-12 Asahi Optical Co Ltd 光学部品の保持構造
JPH03179416A (ja) * 1989-12-08 1991-08-05 Toshiba Corp 光学装置
US5493452A (en) * 1990-10-31 1996-02-20 Olympus Optical Company Limited Lens retaining barrel
JP2725493B2 (ja) * 1991-08-27 1998-03-11 日本電気株式会社 空冷式アルゴンイオンレーザ管
JP3493682B2 (ja) * 1993-04-14 2004-02-03 株式会社ニコン 鏡筒支持装置及び露光装置
DE19533426A1 (de) 1994-11-15 1996-05-23 Leica Ag Mechanisches Befestigungssystem für ein modular gefaßtes mikrooptisches Element
JPH08220409A (ja) * 1995-02-13 1996-08-30 Nikon Corp 光学機器
DE29603024U1 (de) * 1996-02-21 1996-04-18 Fa. Carl Zeiss, 89518 Heidenheim Spannungsfreie Lagerung

Also Published As

Publication number Publication date
EP1127287A1 (de) 2001-08-29
WO2000028367A1 (de) 2000-05-18
JP2002529789A (ja) 2002-09-10
DE19850888A1 (de) 2000-05-11
EP1127287B1 (de) 2002-07-17
DE59902079D1 (de) 2002-08-22
US6554244B1 (en) 2003-04-29

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