JP4529544B2 - Ｌｅｄの製造方法 - Google Patents

Ｌｅｄの製造方法 Download PDF

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Publication number
JP4529544B2
JP4529544B2 JP2004152166A JP2004152166A JP4529544B2 JP 4529544 B2 JP4529544 B2 JP 4529544B2 JP 2004152166 A JP2004152166 A JP 2004152166A JP 2004152166 A JP2004152166 A JP 2004152166A JP 4529544 B2 JP4529544 B2 JP 4529544B2
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JP
Japan
Prior art keywords
resin
chromaticity
led
phosphor
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004152166A
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English (en)
Japanese (ja)
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JP2005333069A (ja
JP2005333069A5 (enExample
Inventor
茂夫 藤澤
慶一 森屋
庄吾 佐久間
晴志 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
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Stanley Electric Co Ltd
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Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2004152166A priority Critical patent/JP4529544B2/ja
Publication of JP2005333069A publication Critical patent/JP2005333069A/ja
Publication of JP2005333069A5 publication Critical patent/JP2005333069A5/ja
Application granted granted Critical
Publication of JP4529544B2 publication Critical patent/JP4529544B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Led Device Packages (AREA)
JP2004152166A 2004-05-21 2004-05-21 Ｌｅｄの製造方法 Expired - Lifetime JP4529544B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004152166A JP4529544B2 (ja) 2004-05-21 2004-05-21 Ｌｅｄの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004152166A JP4529544B2 (ja) 2004-05-21 2004-05-21 Ｌｅｄの製造方法

Publications (3)

Publication Number Publication Date
JP2005333069A JP2005333069A (ja) 2005-12-02
JP2005333069A5 JP2005333069A5 (enExample) 2007-06-28
JP4529544B2 true JP4529544B2 (ja) 2010-08-25

Family

ID=35487490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004152166A Expired - Lifetime JP4529544B2 (ja) 2004-05-21 2004-05-21 Ｌｅｄの製造方法

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JP (1) JP4529544B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5956937B2 (ja) * 2006-02-03 2016-07-27 日立化成株式会社 光半導体素子搭載用パッケージ基板の製造方法
JP2007288139A (ja) * 2006-03-24 2007-11-01 Sumitomo Chemical Co Ltd モノシリック発光デバイス及びその駆動方法
US7763478B2 (en) * 2006-08-21 2010-07-27 Cree, Inc. Methods of forming semiconductor light emitting device packages by liquid injection molding
WO2008075851A1 (en) * 2006-12-19 2008-06-26 Seoul Semiconductor Co., Ltd. Fabrication method of epoxy molding compound tablet and the epoxy molding compound tablet thereby and fabrication method of white emitting device thereby
WO2009118985A2 (en) 2008-03-25 2009-10-01 Kabushiki Kaisha Toshiba Light emitting device, and method and apparatus for manufacturing same
JP2010153648A (ja) * 2008-12-25 2010-07-08 Seiwa Electric Mfg Co Ltd 発光ダイオードの製造方法
JP5417888B2 (ja) * 2009-02-24 2014-02-19 豊田合成株式会社 発光装置の製造方法
JP5755420B2 (ja) * 2010-09-01 2015-07-29 日亜化学工業株式会社 発光装置
JP2013048130A (ja) * 2011-08-29 2013-03-07 Panasonic Corp 樹脂塗布装置および樹脂塗布方法
JP2014056929A (ja) * 2012-09-12 2014-03-27 Sharp Corp 発光素子モジュールの製造方法および発光素子モジュール基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01221589A (ja) * 1988-02-25 1989-09-05 Kanzaki Paper Mfg Co Ltd 緑液の苛性化法
JP2797666B2 (ja) * 1990-07-12 1998-09-17 日立化成工業株式会社 半導体封止用タブレットの製造装置
JP2592753B2 (ja) * 1992-09-18 1997-03-19 日東電工株式会社 半導体封止用樹脂タブレット
JPH113656A (ja) * 1997-06-12 1999-01-06 Sony Corp 蛍光体スラリーの色度補正方法
JP3541709B2 (ja) * 1998-02-17 2004-07-14 日亜化学工業株式会社 発光ダイオードの形成方法
JP3900144B2 (ja) * 1998-02-17 2007-04-04 日亜化学工業株式会社 発光ダイオードの形成方法
DE50008093D1 (de) * 1999-07-23 2004-11-11 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Leuchtstoffanordnung wellenlängenkonvertierende vergussmasse und lichtquelle
JP4350232B2 (ja) * 1999-10-05 2009-10-21 株式会社朝日ラバー 蛍光被覆体製造支援方法、及びその製造支援システム
TW459403B (en) * 2000-07-28 2001-10-11 Lee Jeong Hoon White light-emitting diode
JP2002246651A (ja) * 2001-02-20 2002-08-30 Hitachi Cable Ltd 発光ダイオード及びその製造方法
JP3925137B2 (ja) * 2001-10-03 2007-06-06 日亜化学工業株式会社 発光装置の製造方法

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Publication number Publication date
JP2005333069A (ja) 2005-12-02

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