JP4522081B2 - Attaching / detaching apparatus, attaching / detaching system, and film forming apparatus - Google Patents

Attaching / detaching apparatus, attaching / detaching system, and film forming apparatus Download PDF

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JP4522081B2
JP4522081B2 JP2003402353A JP2003402353A JP4522081B2 JP 4522081 B2 JP4522081 B2 JP 4522081B2 JP 2003402353 A JP2003402353 A JP 2003402353A JP 2003402353 A JP2003402353 A JP 2003402353A JP 4522081 B2 JP4522081 B2 JP 4522081B2
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substrate
attachment
back plate
detachment
mounting
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JP2005166852A (en
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裕二 元原
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Kaneka Corp
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Description

本発明は、基板および背板を具備した装着体を搬送部材に対して着脱する着脱装置、当該着脱装置を備えて構成される着脱システム、並びに、当該着脱システムを備えた成膜装置に関する。   The present invention relates to an attachment / detachment device that attaches / detaches a mounting body including a substrate and a back plate to / from a conveying member, an attachment / detachment system configured to include the attachment / detachment device, and a film forming apparatus including the attachment / detachment system.

従来より、化学気相蒸着法(Chemical Vapor Deposition 以下、CVD法と称す)やスパッタリング法等の手法によりガラス板等の基板の表面に成膜を施す成膜装置が太陽電池パネルの製作やフラットパネルディスプレイの製作等に採用されている。上記したCVD法やスパッタリング法等を採用した成膜装置の多くは、基板が装着された基板ホルダと称される装着部材を成膜チャンバ内に導入して成膜処理を行う。   Conventionally, a film forming apparatus for forming a film on the surface of a substrate such as a glass plate by a chemical vapor deposition method (hereinafter referred to as a CVD method) or a sputtering method has been used for manufacturing a solar cell panel or a flat panel. It is used for display production. Many film forming apparatuses employing the above-described CVD method, sputtering method, and the like perform film forming processing by introducing a mounting member called a substrate holder on which a substrate is mounted into a film forming chamber.

近年、太陽電池パネルやフラットパネルディスプレイ等の大型化が進み、これに採用されるガラス板等の基板についても大型化する傾向にあり、人手による基板の着脱作業が困難となってきている。そこで、かかる問題を解決すべく、従来技術では下記特許文献1に示すような着脱装置が提案されている。   In recent years, solar cell panels, flat panel displays, and the like have been increased in size, and substrates such as glass plates employed therein have increased in size, making it difficult to manually attach and detach the substrates. Therefore, in order to solve such a problem, a detachable device as shown in Patent Document 1 below has been proposed in the related art.

下記特許文献1に開示されている着脱装置は、ハンドリングロボットのアームの先端に設けた吸着パッドに基板を吸着させて搬送し、基板ホルダに対して基板を着脱する構成となっている。
特開平2−101164号公報
The attachment / detachment device disclosed in the following Patent Document 1 is configured to attach and detach a substrate to / from a substrate holder by adsorbing and transporting the substrate to a suction pad provided at the tip of an arm of a handling robot.
JP-A-2-101164

上記した従来技術の着脱装置は、吸着パッドを基板の表面あるいは裏面に直接吸着させるものであるため、基板に吸着パッドの吸着痕が残ったり、吸着パッド表面の汚れが付着してしまう。基板の表面や裏面に吸着痕や汚れが付着してしまうと、基板の外観を損ねるばかりか、CVD法やスパッタリング法等による成膜状態に悪影響を与えてしまうという問題があった。   Since the above-described prior art attachment / detachment device directly adsorbs the suction pad to the front surface or back surface of the substrate, suction marks of the suction pad remain on the substrate or dirt on the surface of the suction pad adheres. If adsorption marks and dirt adhere to the front and back surfaces of the substrate, there is a problem that not only the appearance of the substrate is impaired, but also the film formation state by the CVD method, the sputtering method or the like is adversely affected.

また、CVD法等により成膜を行う場合、良好な成膜状態を得るために基板の背面にカーボンのような熱伝導率の高い背板を積み重ねて成膜作業を行うことが多い。この場合、上記特許文献1に開示されているような着脱装置では、基板および背板を積み重ねたままの状態で同時に基板ホルダに装着できないという問題がある。さらに具体的には、特許文献1に開示されている着脱装置では、ガラス基板の破損を考慮すると吸着力を必要以上に高くできない。さらに、上記したように背板としてカーボンのような多孔質の焼結体や不織布加工を施したものに対しては、ハンドリングロボットの吸着力を十分発揮できない。そのため、上記特許文献1に開示されているような着脱装置では、基板と背板とを同時に着脱することが極めて困難であり、ハンドリングロボットを採用しても基板および背板の着脱作業の作業効率をさほど向上できないという問題がある。   In addition, when a film is formed by a CVD method or the like, the film forming operation is often performed by stacking back plates having high thermal conductivity such as carbon on the back surface of the substrate in order to obtain a good film forming state. In this case, the attachment / detachment device as disclosed in Patent Document 1 has a problem that it cannot be simultaneously attached to the substrate holder while the substrate and the back plate are stacked. More specifically, in the attachment / detachment device disclosed in Patent Document 1, the suction force cannot be increased more than necessary in consideration of breakage of the glass substrate. Furthermore, as described above, the handling robot cannot sufficiently exert the attracting force on a porous sintered body such as carbon or a nonwoven fabric processed as a back plate. For this reason, in the attachment / detachment apparatus as disclosed in Patent Document 1, it is extremely difficult to attach / detach the substrate and the back plate at the same time. Even if a handling robot is used, the work efficiency of the attachment / detachment operation of the substrate and the back plate is difficult. There is a problem that cannot be improved so much.

そこで、本発明は、基板の表面や裏面を汚さず、基板と背板とを積み重ねたまま装着可能な着脱装置、当該着脱装置を備えて構成される着脱システム、並びに、当該着脱システムを備えた成膜装置の提供を目的とする。   Therefore, the present invention includes an attachment / detachment device that can be attached while the substrate and the back plate are stacked without contaminating the front and back surfaces of the substrate, an attachment / detachment system including the attachment / detachment device, and the attachment / detachment system. An object is to provide a film forming apparatus.

上記した問題に鑑み提供される請求項1に記載の発明は、基板はガラス製であり、基板の一部または全部を露出する露出口を有する装着部材に基板が取り付けられ、さらに前記基板の背面側に基板とほぼ等しい大きさであって基板と端部を揃えることができる大きさの背板が取り付けられた状態から、基板と背板とを重ねた装着体を基板と背板とを重ねたままの状態で取り外し、さらに少なくとも基板を取り替えて基板と背板とを重ねて前記装着部材に再装着する着脱装置であって、装着体の対向する縁面の内の、一方の対向する縁面あるいは双方の対向する縁面に当接して装着体を挟持し装着体を構成する基板および背板を2枚同時に把持する挟持手段と、前記挟持手段で装着体を挟持した状態で移動させる移動手段とを有することを特徴とする着脱装置である。 In the invention according to claim 1, provided in view of the above-described problem, the substrate is made of glass , the substrate is attached to a mounting member having an exposure opening exposing a part or all of the substrate, and the back surface of the substrate on the side, from a state in which the back plate is mounted a size capable of a substantially equal size as the substrate align the substrate and the end portion, and a substrate attachment body overlaid the substrate and the back plate and the back plate An attachment / detachment device for removing in an overlapped state, and further replacing at least the substrate and attaching the substrate and the back plate again to the attachment member , one of the opposing edge surfaces of the attachment body facing each other . A gripping means that grips the mounting body by contacting the edge surface or both opposing edge surfaces and grips both the substrate and the back plate constituting the mounting body at the same time, and moves while the mounting body is clamped by the clamping means And having a moving means A removable device to.

本発明の着脱装置は、挟持手段を基板および背板を積み重ねた装着体の縁面に当接させて挟持し、装着部材に着脱するものである。そのため、本発明の着脱装置によれば、基板の表面や裏面を汚すことなく装着体の着脱を行える。   The attachment / detachment apparatus of the present invention is configured to attach and detach the attachment means to and from the attachment member by bringing the holding means into contact with the edge surface of the attachment body in which the substrate and the back plate are stacked. Therefore, according to the attachment / detachment apparatus of the present invention, the attachment body can be attached / detached without contaminating the front surface or the back surface of the substrate.

本発明の着脱装置は、挟持手段によって基板および背板を積み重ねた状態でこれらを装着部材に装着できる。即ち、本発明の着脱装置は、基板および背板の着脱を同時に行える。従って、本発明によれば、基板および背板の装着部材への着脱工程を簡略化し、作業効率を格段に向上できる。   The detachable device of the present invention can be mounted on the mounting member in a state where the substrate and the back plate are stacked by the clamping means. That is, the attachment / detachment apparatus of the present invention can attach / detach the substrate and the back plate at the same time. Therefore, according to the present invention, the process of attaching and detaching the substrate and the back plate to the mounting member can be simplified and the working efficiency can be greatly improved.

また、本発明の着脱装置は、基板および背板の縁面を挟持する構成であるため、基板と背板をほぼ等しい大きさとしておくとこれらの端部を揃えた状態で装着部材に対して着脱できる。従って、本発明によれば、基板および背板を積み重ねた状態での位置決め精度を向上できる。   In addition, since the attachment / detachment device of the present invention is configured to sandwich the edge surfaces of the substrate and the back plate, if the substrate and the back plate are approximately equal in size, the ends are aligned with respect to the mounting member. Detachable. Therefore, according to the present invention, it is possible to improve positioning accuracy in a state where the substrate and the back plate are stacked.

請求項2に記載の発明は、挟持手段の先端部が鉤状であることを特徴とする請求項1に記載の着脱装置である。   The invention according to claim 2 is the attachment / detachment device according to claim 1, characterized in that the tip of the clamping means has a hook shape.

かかる構成によれば、挟持手段により挟持される装着体をしっかりと挟持しつつ、装着体の面方向への位置ズレを最小限に抑制できる。従って、本発明の着脱装置によれば、基板および背板を所定の位置に精度良く装着できると共に、挟持手段から装着体が脱落することによる破損等を確実に防止できる。   According to such a configuration, it is possible to minimize the displacement of the mounting body in the surface direction while firmly holding the mounting body clamped by the clamping means. Therefore, according to the attachment / detachment device of the present invention, the substrate and the back plate can be accurately mounted at predetermined positions, and damage or the like due to the mounting body falling off from the clamping means can be reliably prevented.

請求項3に記載の発明は、挟持手段が、所定の面上を所定方向に往復動する第1の可動部材と、前記面上を第1の可動部材の移動方向に対して交差する方向に往復動する第2の可動部材とを備えていることを特徴とする請求項1または2に記載の着脱装置である。   According to a third aspect of the present invention, the clamping means includes a first movable member that reciprocates on a predetermined surface in a predetermined direction, and a direction that intersects the moving direction of the first movable member on the surface. The attachment / detachment device according to claim 1, further comprising a second movable member that reciprocates.

本発明の着脱装置では、装着体が所定の面上において2方向から挟持される。さらに具体的には、例えば本発明の着脱装置によって立設された状態の装着体を挟持する場合は、装着体を第1の可動部材によって上下方向に挟持すると共に、第2の可動部材によって左右方向から挟持する構成とすることが可能である。そのため、本発明の着脱装置によれば、装着体をしっかりと保持した状態で着脱作業を行える。   In the attachment / detachment device of the present invention, the attachment body is clamped from two directions on a predetermined surface. More specifically, for example, when the mounting body in a state of being erected by the attachment / detachment device of the present invention is sandwiched, the mounting body is sandwiched vertically by the first movable member and left and right by the second movable member. It is possible to adopt a configuration in which it is sandwiched from the direction. Therefore, according to the attachment / detachment device of the present invention, the attachment / detachment operation can be performed with the attachment body firmly held.

また、本発明の着脱装置は、装着体を2方向から挟持するものであるため、基板と背板の端部をきっちりと揃えた状態で装着部材に対して着脱できる。従って、本発明によれば、基板および背板の積み重ねた時の位置決め精度を向上できる。   Moreover, since the attachment / detachment device of the present invention clamps the attachment body from two directions, the attachment / detachment device can be attached / detached to / from the attachment member in a state where the end portions of the substrate and the back plate are exactly aligned. Therefore, according to the present invention, the positioning accuracy when the substrate and the back plate are stacked can be improved.

請求項4に記載の発明は、移動手段が、複数の腕部と、挟持手段が装着された着脱部とを有し、隣接する腕部同士あるいは腕部と着脱部とは関節部を介して回動自在に接続されていることを特徴とする請求項1乃至3のいずれかに記載の着脱装置である。   According to a fourth aspect of the present invention, the moving means has a plurality of arm parts and an attaching / detaching part to which the holding means is attached, and the adjacent arm parts or the arm part and the attaching / detaching part are connected via the joint part. 4. The attachment / detachment device according to claim 1, wherein the attachment / detachment device is rotatably connected.

かかる構成によれば、着脱部の挟持手段によって挟持された装着体を所望の位置や角度で装着部材に装着できる。   According to this structure, the mounting body clamped by the clamping means of the detachable portion can be mounted on the mounting member at a desired position and angle.

請求項5に記載の発明は、請求項1乃至4のいずれかに記載の着脱装置と、前記着脱装置とは別個の部材であって装着体が装着される前記装着部材と、当該装着部材に対して装着体を固定状態とする固定手段とを有し、着脱装置は移動手段に装着され移動手段によって装着部材の近傍まで移動可能であり且つ装着部材から離反可能であるハンド部を有し、当該ハンド部に前記挟持手段と、前記固定手段を動かして固定状態あるいは固定解除状態とする着脱手段を具備していることを特徴とする着脱システムである。 The invention according to claim 5, the attachment apparatus according to any one of claims 1 to 4, and the mounting member mounting member a separate member is mounted to the detachable device, to the mounting member And a fixing means for fixing the mounting body in a fixed state, and the detachable device has a hand portion that is mounted on the moving means and can be moved to the vicinity of the mounting member by the moving means and can be separated from the mounting member, The attachment / detachment system is characterized in that the hand unit is provided with attachment / detachment means that moves the fixing means and moves the fixing means into a fixed state or a fixed release state.

本発明の着脱システムは、上記した着脱装置を備えているため、基板の表面や裏面を汚すことなく装着体の着脱を行える。さらに、本発明の着脱システムは、上記した着脱装置によって基板および背板を積み重ねた状態で同時に装着部材に装着できる。そのため、基板および背板の装着部材への着脱工程に要する作業時間が極めて短い。   Since the attachment / detachment system of the present invention includes the attachment / detachment device described above, the attachment body can be attached / detached without contaminating the front and back surfaces of the substrate. Furthermore, the attachment / detachment system of the present invention can be attached to the attachment member simultaneously with the substrate and the back plate being stacked by the attachment / detachment device described above. Therefore, the work time required for the process of attaching and detaching the substrate and the back plate to the mounting member is extremely short.

本発明の着脱システムは、上記した構成に加えて、装着部材に対して装着体を固定状態とする固定手段を有し、この固定手段を着脱装置の着脱手段によって固定状態あるいは固定解除状態とすることができる。そのため、本発明の着脱システムによれば、装着部材への装着体の着脱および固定作業を同時に行え、作業効率が極めて高い。   In addition to the configuration described above, the attachment / detachment system of the present invention has a fixing means for fixing the mounting body to the mounting member, and the fixing means is fixed or released by the attaching / detaching means of the attachment / detachment device. be able to. Therefore, according to the attachment / detachment system of the present invention, the attachment / detachment and fixing operations of the attachment body to / from the attachment member can be performed simultaneously, and the work efficiency is extremely high.

ここで、上記した着脱システムによって基板や背板を装着手段に装着した場合、この装着手段を水平状態として搬送すると撓みを起こし、場合によっては基板や、基板の表面に成膜された膜等が破損するおそれがある。   Here, when the substrate or back plate is mounted on the mounting means by the above-described attachment / detachment system, if the mounting means is transported in a horizontal state, bending occurs, and in some cases, the substrate, a film formed on the surface of the substrate, etc. There is a risk of damage.

そこで、かかる問題に鑑みて提供される請求項6に記載の発明は、装着体を立設状態で搬送する搬送手段を有することを特徴とする請求項5に記載の着脱システムである。 Accordingly, the invention according to claim 6 provided in view of such a problem is the attachment / detachment system according to claim 5, further comprising conveying means for conveying the mounting body in an upright state.

かかる構成によれば、搬送中における装着体の撓みやこれに起因する基板や背板等の破損を確実に防止できる。   According to such a configuration, it is possible to reliably prevent the bending of the mounting body during conveyance and the breakage of the substrate, the back plate, and the like due to this.

請求項7に記載の発明は、背板は、基板とほぼ等しい大きさであって基板と端部を揃えることができる大きさであって基板よりも小さいことを特徴とする請求項5または6に記載の着脱システムである。 The invention according to claim 7 is characterized in that the back plate is substantially equal in size to the substrate and can be aligned with the end portion of the substrate and is smaller than the substrate. The attachment / detachment system according to claim 1.

かかる構成によれば、着脱装置の挟持手段により基板を確実に挟持できる。従って、本発明の着脱システムによれば、装着体の着脱作業中における基板の脱落や、これによる基板の破損を確実に防止できる。   According to such a configuration, the substrate can be securely held by the holding means of the attachment / detachment device. Therefore, according to the mounting / demounting system of the present invention, it is possible to reliably prevent the substrate from falling off and the substrate from being damaged during the mounting / demounting operation of the mounting body.

請求項8に記載の発明は、装着部材が、装着体の装着される装着面を有し、当該装着面に着脱装置の挟持手段の一部を挿通可能な挿通口が設けられていることを特徴とする請求項5乃至7のいずれかに記載の着脱システムである。   The invention according to claim 8 is that the mounting member has a mounting surface on which the mounting body is mounted, and an insertion port through which a part of the holding means of the detachable device can be inserted is provided on the mounting surface. The attachment / detachment system according to any one of claims 5 to 7.

かかる構成によれば、装着体の着脱作業時に挟持手段が装着部材と干渉せず、装着体の着脱作業を効率良く行える。   According to such a configuration, the clamping means does not interfere with the mounting member during the mounting / demounting operation of the mounting body, and the mounting / demounting operation of the mounting body can be performed efficiently.

請求項9に記載の発明は、固定手段は、露出口の周囲に相当する位置にあることを特徴とする請求項5乃至8のいずれかに記載の着脱システムである。 The invention according to claim 9 is the attachment / detachment system according to any one of claims 5 to 8, wherein the fixing means is in a position corresponding to the periphery of the exposure opening.

本発明の着脱システムでは、装着部材に設けられた露出口の周囲に相当する位置に固定手段が設けられている。そのため、本発明の着脱システムによれば、装着体と装着部材の露出口との隙間の発生を防止し、装着部材の露出面側の雰囲気と装着面側の雰囲気とが露出口を介して繋がることを防止できる。   In the attachment / detachment system of the present invention, the fixing means is provided at a position corresponding to the periphery of the exposure opening provided in the attachment member. Therefore, according to the attachment / detachment system of the present invention, it is possible to prevent the gap between the mounting body and the exposure port of the mounting member, and the atmosphere on the exposed surface side of the mounting member and the atmosphere on the mounting surface side are connected via the exposure port. Can be prevented.

本発明の着脱システムによれば、装着体と装着部材の露出口との隙間を介した放電の回り込みや、ガスの流出入を確実に防止できる。従って、本発明の着脱システムによれば、例えばCVD法やスパッタリング法の様な手法による基板上に成膜作業を的確に行える。   According to the mounting / demounting system of the present invention, it is possible to reliably prevent the discharge from flowing through the gap between the mounting body and the exposure port of the mounting member and the inflow and outflow of gas. Therefore, according to the attachment / detachment system of the present invention, the film forming operation can be accurately performed on the substrate by a technique such as CVD or sputtering.

請求項10に記載の発明は、装着体を装着部材側に付勢する付勢手段を具備していることを特徴とする請求項5乃至9のいずれかに記載の着脱システムである。   A tenth aspect of the present invention is the attachment / detachment system according to any one of the fifth to ninth aspects, further comprising a biasing unit that biases the mounting body toward the mounting member.

かかる構成によれば、装着部材に対する装着体の位置ズレを確実に防止できる。   According to this configuration, it is possible to reliably prevent the displacement of the mounting body with respect to the mounting member.

また、本発明の着脱システムによれば、装着部材と装着体との位置ズレを確実に防止できるため、装着部材によって隔離された領域間におけるガスの流出入や放電の回り込み等が殆ど起こらない。従って、本発明の着脱システムによれば、例えばCVD法やスパッタリング法の様な手法による基板上に成膜作業を的確に行える。   Further, according to the mounting / demounting system of the present invention, the positional deviation between the mounting member and the mounting body can be reliably prevented, so that gas inflow / outflow and discharge wrap-around between regions isolated by the mounting member hardly occur. Therefore, according to the attachment / detachment system of the present invention, the film forming operation can be accurately performed on the substrate by a technique such as CVD or sputtering.

また、請求項5乃至10のいずれかに記載の着脱システムは、背板がカーボン製である場合にも好適に使用できる。(請求項11)
請求項12に記載の発明は、移動手段が、装着体を背板側から支持し、当該移動手段によって支持された装着体から少なくとも背板を残して少なくとも基板を着脱可能な移載手段を有し、当該移載手段が、基板の縁面側に当接する縁面当接部と、基板の表面に当接可能な鉤部とを有する挟持部材を有し、前記背板には、移載手段に設けられた挟持部材に相当する位置に前記鉤部と背板との干渉を阻止する切り欠き部が設けられていることを特徴とする請求項5乃至11のいずれかに記載の着脱システムである。
Moreover, the attachment / detachment system according to any one of claims 5 to 10 can be suitably used even when the back plate is made of carbon. (Claim 11)
In the twelfth aspect of the present invention, the moving means includes a transfer means for supporting the mounting body from the back plate side and detaching at least the substrate from the mounting body supported by the moving means, leaving at least the back plate. The transfer means has a holding member having an edge surface contact portion that contacts the edge surface side of the substrate and a collar portion that can contact the surface of the substrate, and the transfer plate is mounted on the back plate. The attachment / detachment system according to any one of claims 5 to 11, wherein a notch portion for preventing interference between the flange portion and the back plate is provided at a position corresponding to a clamping member provided in the means. It is.

本発明の着脱システムは、移動手段と移載手段との間で、移動手段側に支持された背板上にある基板のやりとりを行う。そのため、本発明の着脱システムによれば、人手を介せず基板および背板を備えた装着体の着脱および基板の交換を行える。   In the attachment / detachment system of the present invention, the substrate on the back plate supported on the movement means side is exchanged between the movement means and the transfer means. Therefore, according to the attachment / detachment system of the present invention, attachment / detachment of the mounting body including the substrate and the back plate and replacement of the substrate can be performed without human intervention.

本発明の着脱システムは、移載手段に基板の縁面側に当接する縁面当接部と、基板の表面に当接可能な鉤部とを有する挟持部材が設けられており、移動手段に支持された背板に、第2の移動手段に設けられた挟持部材の干渉を防止する切り欠き部を設けた構成となっている。そのため、上記した構成によれば、移動手段と移載手段との間における基板のやりとりをスムーズに行える。   In the attachment / detachment system of the present invention, the transfer means is provided with a clamping member having an edge surface contact portion that contacts the edge surface side of the substrate and a flange portion that can contact the surface of the substrate. The supported back plate is provided with a notch for preventing interference between the clamping members provided in the second moving means. Therefore, according to the configuration described above, the substrate can be exchanged smoothly between the moving means and the transfer means.

請求項13に記載の発明は、請求項5乃至12のいずれかに記載の着脱システムにより装着体の着脱を行うことを特徴とする成膜装置である。   According to a thirteenth aspect of the present invention, there is provided a film forming apparatus characterized in that a mounting body is attached / detached by the attaching / detaching system according to any of the fifth to twelfth aspects.

上記請求項5乃至12に記載の着脱システムは、いずれも装着体の着脱を容易かつ精度よく行える。そのため、本発明の成膜装置は、基板および装着体の着脱作業に要する時間が短く、成膜作業の作業効率を格段に向上できる。   In any of the attachment / detachment systems according to the fifth to twelfth aspects, the attachment body can be attached / detached easily and accurately. Therefore, the film forming apparatus of the present invention has a short time required for attaching and detaching the substrate and the mounting body, and can greatly improve the work efficiency of the film forming work.

また、上記請求項13に記載の成膜装置は、化学気相蒸着法により基板の表面に成膜を行うものに好適に使用できる。(請求項14)
なお、上記した着脱システムおよび製膜装置は、背板が、基板よりも熱伝導率が高いことを特徴とするものであってもよい。かかる構成によれば、前記着脱システムや製膜装置において装着体に対して作用する熱を基板面全体に略均等に作用させることができる。
In addition, the film forming apparatus according to the thirteenth aspect can be suitably used for an apparatus that forms a film on the surface of a substrate by chemical vapor deposition. (Claim 14)
In the above attachment / detachment system and film forming apparatus, the back plate may have a higher thermal conductivity than the substrate. According to this configuration, heat acting on the mounting body in the attachment / detachment system or the film forming apparatus can be applied to the entire substrate surface substantially evenly.

また、上記着脱システムおよび製膜装置において、装着体の線膨張係数が装着部材よりも低いことを特徴とするものであってもよい。かかる構成によれば、装着体を装着部材に装着した状態での熱膨張による装着体の反りを防止し、これによる基板・背板間の熱伝導特性や成膜特性の低下を防止できる。   Moreover, in the said attachment / detachment system and film forming apparatus, the linear expansion coefficient of the mounting body may be lower than that of the mounting member. According to such a configuration, it is possible to prevent warpage of the mounting body due to thermal expansion in a state where the mounting body is mounted on the mounting member, and it is possible to prevent deterioration of heat conduction characteristics and film formation characteristics between the substrate and the back plate.

本発明によれば、基板の表面や裏面を汚さず、基板と背板とを積み重ねたままの状態で装着部材に装着でき、基板と背板とを具備した装着体あるいは基板の着脱作業を効率よく行える着脱装置、着脱システム、並びに、成膜装置を提供できる。   According to the present invention, it is possible to mount the mounting member on the mounting member in a state where the substrate and the back plate are stacked without contaminating the front and back surfaces of the substrate, and to efficiently attach and detach the mounting body including the substrate and the back plate. A detachable apparatus, a detachable system, and a film forming apparatus that can be performed well can be provided.

続いて、本発明の一実施形態である着脱装置および着脱構造について、図面を参照しながら詳細に説明する。図1は、本実施形態の着脱システムを示す斜視図である。図2は、図1に示す着脱システムで採用されている着脱装置のハンド部を示す正面図である。図3(a)は、図2のハンド部が備える基板ハンドを示す正面図であり、同(b)は、同(a)の断面図、同(c)は、同(a)の斜視図である。図4(a),(b)は、図2のハンド部が備えるロックハンドを示す斜視図である。図5(a)は、本実施形態の着脱システムによって着脱される基板および背板を示す斜視図であり、同(b)は同(a)のA部拡大図である。図6(a)は図5に示す背板の正面図であり、同(b)は同(a)の背面図である。図7は、図5,6に示す背板の縁面近傍を示す斜視図である。図8は、図5,6に示す背板のロック部材の操作の様子を示す概念図である。図9(a)は、基板と背板とを重ね合わせた状態における縁面近傍を示す正面図であり、同(b)は同(a)のA−A断面図である。   Subsequently, an attachment / detachment device and an attachment / detachment structure according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view showing the attachment / detachment system of the present embodiment. FIG. 2 is a front view showing a hand portion of the attachment / detachment device employed in the attachment / detachment system shown in FIG. 3A is a front view showing a substrate hand included in the hand unit of FIG. 2, FIG. 3B is a sectional view of FIG. 3A, and FIG. 3C is a perspective view of FIG. It is. 4 (a) and 4 (b) are perspective views showing a lock hand included in the hand unit of FIG. Fig.5 (a) is a perspective view which shows the board | substrate and backplate which are attached or detached by the attachment / detachment system of this embodiment, The same (b) is the A section enlarged view of the same (a). 6 (a) is a front view of the back plate shown in FIG. 5, and FIG. 6 (b) is a rear view of FIG. 6 (a). FIG. 7 is a perspective view showing the vicinity of the edge surface of the back plate shown in FIGS. FIG. 8 is a conceptual diagram showing how the back plate locking member shown in FIGS. Fig.9 (a) is a front view which shows the edge surface vicinity in the state which overlap | superposed the board | substrate and the backplate, The same (b) is AA sectional drawing of the same (a).

図1において、Sは本実施形態の着脱システムであり、1は着脱システムSに採用されている着脱装置である。着脱システムSは、着脱装置1と、基板50および背板52を積み重ねた装着体68が着脱されるホルダー70と、基板移載装置80とを有する。   In FIG. 1, S is an attachment / detachment system of the present embodiment, and 1 is an attachment / detachment device employed in the attachment / detachment system S. The attachment / detachment system S includes the attachment / detachment device 1, a holder 70 to / from which a mounting body 68 in which the substrate 50 and the back plate 52 are stacked is attached / detached, and a substrate transfer device 80.

着脱装置1は、産業用ロボットアーム4の先端にハンド部5が取り付けられたものである。即ち、着脱装置1は、本体部2と、本体部2から延設されたアーム部3(腕部)とを有するロボットアーム4と、アーム部3の先端に装着されたハンド部5(着脱部)とを備えた構成となっている。着脱装置1は、ガラス製の基板50およびカーボン製の背板52を積み重ねた装着体68を挟持した状態で後述するホルダー70と所定の基板着脱位置(図示せず)との間を移動させる移動動作と、装着体68をホルダー70に対して着脱する着脱動作とを行うものである。   The attachment / detachment device 1 has a hand unit 5 attached to the tip of an industrial robot arm 4. That is, the attachment / detachment apparatus 1 includes a robot arm 4 having a main body 2 and an arm 3 (arm) extending from the main body 2, and a hand 5 (attachment / detachment) attached to the tip of the arm 3. ). The attachment / detachment apparatus 1 moves between a holder 70 (to be described later) and a predetermined substrate attachment / detachment position (not shown) in a state where the attachment body 68 in which the glass substrate 50 and the carbon back plate 52 are stacked is sandwiched. The operation and the attaching / detaching operation of attaching / detaching the mounting body 68 to / from the holder 70 are performed.

ロボットアーム4の本体部2は、底部6と、底部6に図示しないモータ等を介して回動自在に支持された胴部7とを有する。胴部7の天面8には、アーム部3およびハンド部5を作動させる動力源や電源装置等の機器類10が搭載されている。   The main body 2 of the robot arm 4 includes a bottom 6 and a body 7 that is rotatably supported on the bottom 6 via a motor or the like (not shown). Equipment 10 such as a power source and a power supply device for operating the arm unit 3 and the hand unit 5 is mounted on the top surface 8 of the body unit 7.

ロボットアーム4のアーム部3は、関節部11a,11bを介して本体部2に屈曲自在に接続された第1腕部12aおよび第2腕部12bと、これらに関節部15a,15bを介して屈曲自在に接続された第3腕部13を備えている。また、第3腕部13には、関節部15cを介して第4腕部14が接続されている。関節部11a〜b,15a〜cには、それぞれモーター等の動力源(図示せず)が内蔵されており、これらの動力を受けて第1腕部12a、第2腕部12b、第3腕部13、並びに、第4腕部14の屈曲状態が調整される。第4腕部14は、空気圧や油圧等によって伸縮するシリンダーあるいはボールネジ等を利用して伸縮する機構を備えている。   The arm part 3 of the robot arm 4 includes a first arm part 12a and a second arm part 12b that are flexibly connected to the main body part 2 via joint parts 11a and 11b, and joint parts 15a and 15b. A third arm portion 13 is provided which is flexibly connected. The fourth arm portion 14 is connected to the third arm portion 13 via a joint portion 15c. Each of the joint portions 11a to 11b and 15a to 15c has a built-in power source (not shown) such as a motor. The first arm portion 12a, the second arm portion 12b, and the third arm receive these powers. The bending state of the part 13 and the fourth arm part 14 is adjusted. The fourth arm portion 14 includes a mechanism that expands and contracts using a cylinder or a ball screw that expands and contracts by air pressure, hydraulic pressure, or the like.

第4腕部14の先端側には、ハンド部5が関節部17を介して第4腕部14の中心軸周りに回動可能なように接続されている。ハンド部5は、ステンレス等の金属材料を用いて作製したものであり、図2において上下方向に伸びる掌片部18,20を、左右方向に伸びる連結部21で連結したものであり、正面視が略「H」型の形状となっている。掌片部18,20には、後述するガラス製の基板50とカーボン製の背板52とを挟持する基板ハンド(挟持手段)22および背板52のロック部材56の操作を行うロックハンド23(着脱手段)がそれぞれ複数設けられている。   The hand portion 5 is connected to the distal end side of the fourth arm portion 14 via the joint portion 17 so as to be rotatable around the central axis of the fourth arm portion 14. The hand portion 5 is manufactured using a metal material such as stainless steel, and is formed by connecting palm pieces 18 and 20 extending vertically in FIG. 2 with a connecting portion 21 extending horizontally. Has a substantially “H” shape. The palm pieces 18 and 20 include a substrate hand (clamping means) 22 that clamps a glass substrate 50 and a carbon back plate 52, which will be described later, and a lock hand 23 (which operates a lock member 56 of the back plate 52). A plurality of attachment / detachment means are provided.

基板ハンド22は、図2に示すように左右の掌片部18,20の長手方向両端部および長手方向の中央部に所定の姿勢で固定されている。基板ハンド22は、図2および図3に示すように、スライドベース27と、パット28を積み重ねて固定すると共に、スライドベース27の側方に爪部材30を固定した構造を有する。   As shown in FIG. 2, the substrate hand 22 is fixed in a predetermined posture to both ends in the longitudinal direction of the left and right palm pieces 18, 20 and a central portion in the longitudinal direction. As shown in FIGS. 2 and 3, the substrate hand 22 has a structure in which a slide base 27 and a pad 28 are stacked and fixed, and a claw member 30 is fixed to the side of the slide base 27.

スライドベース27は、ロッド29aおよび動力伝達機構29bによって構成されるクランク機構に接続されている。スライドベース27は、ロッド29aおよび動力伝達機構29bの作動に伴って、掌片部18,20上を直線方向に摺動する。パット28は、弾力性を有するものであり、スライドベース27の表面側に固定されている。パット28は、基板ハンド22に基板50あるいは背板52が面接触することによる衝撃を緩和するためのものである。   The slide base 27 is connected to a crank mechanism constituted by a rod 29a and a power transmission mechanism 29b. The slide base 27 slides in the linear direction on the palm pieces 18 and 20 with the operation of the rod 29a and the power transmission mechanism 29b. The pad 28 has elasticity and is fixed to the surface side of the slide base 27. The pad 28 is for mitigating an impact caused by the surface contact of the substrate 50 or the back plate 52 with the substrate hand 22.

爪部材30は、図3のように当接部31と、当接部31の先端側にあって、鉤状に折れ曲がった鉤部32(脱落防止部)とを有する。爪部材30は、当接部31がスライドベース27およびパット28の側面に当接し、その先端部分にある鉤部32がパット28と対向するように固定されている。さらに具体的には、爪部材30は、図3(b)のようにパット28の表面および鉤部32によって略「コ」字形に開口した係止開口33を形成している。鉤部32は、表面側に間隔d分だけ突出している。間隔dは、基板50および背板52を積み重ねて構成される装着体68の厚さDよりも僅かに広い。   As shown in FIG. 3, the claw member 30 includes a contact portion 31 and a flange portion 32 (drop-off prevention portion) that is bent in a hook shape on the distal end side of the contact portion 31. The claw member 30 is fixed so that the abutment portion 31 abuts against the side surfaces of the slide base 27 and the pad 28, and the collar portion 32 at the tip portion thereof faces the pad 28. More specifically, the claw member 30 forms a locking opening 33 that is opened in a substantially “U” shape by the surface of the pad 28 and the flange 32 as shown in FIG. The collar portion 32 protrudes by a distance d on the surface side. The distance d is slightly wider than the thickness D of the mounting body 68 configured by stacking the substrate 50 and the back plate 52.

掌片部18,20に装着された基板ハンド22のうち、掌片部18,20の長手方向両端側に固定された基板ハンド22a,22bは、いずれも係止開口33が掌片部18,20の長手方向中央側に向くように固定されている。さらに詳細には、図2に示す状態において、掌片部18,20の上端側に固定されている基板ハンド22aは、係止開口33が下方を向くように固定されており、掌片部18,20の下端側に固定されている基板ハンド22bは、係止開口33が上方を向くように固定されている。掌片部18,20の上下に固定された基板ハンド22a,22bによって装着体68を挟持して上下方向への位置ズレを防止すると共に、装着体68の面方向への位置ズレを防止できる。   Of the substrate hands 22 attached to the palm pieces 18 and 20, the substrate hands 22a and 22b fixed to the both ends in the longitudinal direction of the palm pieces 18 and 20 are both provided with the locking openings 33. 20 is fixed so as to face the center in the longitudinal direction. More specifically, in the state shown in FIG. 2, the substrate hand 22 a fixed to the upper end side of the palm pieces 18, 20 is fixed so that the locking opening 33 faces downward. , 20 is fixed so that the locking openings 33 face upward. The mounting body 68 is sandwiched by the substrate hands 22a and 22b fixed above and below the palm pieces 18 and 20, thereby preventing the positional displacement in the vertical direction and preventing the positional displacement of the mounting body 68 in the surface direction.

また、掌片部18,20の長手方向中央部にある基板ハンド22cは、いずれも係止開口33が他方の掌片部20,18側を向くように固定されている。さらに具体的には、図2において掌片部18側に固定されている基板ハンド22cは、係止開口33が掌片部20側に向けて開口する姿勢で固定されており、掌片部20側に固定されている基板ハンド22cは、係止開口33が掌片部18側を向くように固定されている。そのため、ハンド部5は、基板ハンド22cによって装着体68を挟持して左右方向への位置ズレを防止すると共に、装着体68が面方向に位置ズレを起こさないように支持している。   In addition, the substrate hand 22c at the center in the longitudinal direction of the palm pieces 18 and 20 is fixed so that the locking opening 33 faces the other palm pieces 20 and 18 side. More specifically, the substrate hand 22c fixed to the palm piece portion 18 side in FIG. 2 is fixed in such a posture that the locking opening 33 opens toward the palm piece portion 20 side. The substrate hand 22c fixed to the side is fixed so that the locking opening 33 faces the palm piece 18 side. Therefore, the hand unit 5 holds the mounting body 68 by the substrate hand 22c to prevent the positional displacement in the left-right direction, and supports the mounting body 68 so that the positional displacement does not occur in the surface direction.

上記したように、ハンド部5は、図2に示す状態で上下方向に往復動する基板ハンド22a,22bと、これに直交する方向(左右方向)に往復動する基板ハンド22cとを備えており、これらが同時に作動してハンド部5の中心に位置する基板50および背板52の縁面に当接する。そのため、ハンド部5は、基板50および背板52を2枚同時に把持できると共に、把持する際に基板50および背板52の位置ズレを補正できる。   As described above, the hand unit 5 includes the substrate hands 22a and 22b that reciprocate in the vertical direction in the state shown in FIG. 2, and the substrate hand 22c that reciprocates in the direction (left-right direction) perpendicular thereto. These simultaneously operate and come into contact with the edge surfaces of the substrate 50 and the back plate 52 located at the center of the hand portion 5. Therefore, the hand unit 5 can grip the substrate 50 and the back plate 52 at the same time, and can correct the positional deviation between the substrate 50 and the back plate 52 when gripping.

ロックハンド23は、掌片部18,20の長手方向両端側に設けられた上下動ロックハンド23a,23bと、掌片部18,20の長手方向中間部に設けられた左右動ロックハンド23c,23dとを有する。上下動ロックハンド23a,23bおよび左右動ロックハンド23c,23dは、いずれも同様の動作を行うものであるが、その動作方向および一部の構成が異なる。   The lock hand 23 includes vertical movement lock hands 23a and 23b provided at both longitudinal ends of the palm pieces 18 and 20, and left and right movement lock hands 23c provided at intermediate portions in the longitudinal direction of the palm pieces 18 and 20. 23d. The vertical movement lock hands 23a and 23b and the left and right movement lock hands 23c and 23d all perform the same operation, but their operation directions and some configurations are different.

さらに具体的に説明すると、上下動ロックハンド23a,23bは、掌片部18,20の同士の間の側面から張り出した位置に片持ち状に固定されている。上下動ロックハンド23a,23bは、図2および図4(a)に示すように、いずれも連結軸21の延伸方向に伸びる2枚の保持板35,35と、両保持板35,35間を上下方向に繋ぐ2本の連結ガイド軸36,36と、この連結ガイド軸36,36に摺動自在に装着された摘体37,37とを有する。摘体37,37は、ブロック38,38の表面側にローラ40,40が回転自在に装着されて構成されている。摘体37,37は、連結ガイド軸36,36によって摺動自在に支持されており、その表面にローラ40,40が装着されている。摘体37,37は、いずれも図示しない動力源に接続されており、それぞれが連結ガイド軸36,36に案内され、上下方向に独立的あるいは一体的に摺動する。上下動ロックハンド23a,23bは、図8のようにローラ40,40の隙間に後述するロック部材56の把持部65を挟んだ状態で摘体37,37が連結ガイド軸36,36に案内されて上下動し、ロック部材56の開閉操作を行う。   More specifically, the vertical movement lock hands 23a and 23b are fixed in a cantilevered manner at positions protruding from the side surfaces between the palm pieces 18 and 20. As shown in FIG. 2 and FIG. 4A, the vertical movement lock hands 23a and 23b are formed between the two holding plates 35 and 35 extending in the extending direction of the connecting shaft 21 and the holding plates 35 and 35, respectively. Two connection guide shafts 36, 36 connected in the vertical direction, and knobs 37, 37 slidably mounted on the connection guide shafts 36, 36 are provided. The knobs 37, 37 are configured by rotatably mounting rollers 40, 40 on the surface side of the blocks 38, 38. The knobs 37 and 37 are slidably supported by connection guide shafts 36 and 36, and rollers 40 and 40 are mounted on the surfaces thereof. The knobs 37 and 37 are both connected to a power source (not shown), and are guided by connecting guide shafts 36 and 36, respectively, and slide independently or integrally in the vertical direction. As shown in FIG. 8, the vertical movement lock hands 23a, 23b are guided by the connecting guide shafts 36, 36 with the gripping portions 37, 37 sandwiched between the rollers 40, 40 with a gripping portion 65 of the lock member 56 described later. Then, the lock member 56 is opened and closed.

左右動ロックハンド23c,23dは、図2および図4(b)に示すように、いずれも掌片部18,20に固定された枠体42および断面形状が略「L」字形のガイド部材43によって包囲された空間内に、左右方向に延伸した2本の連結ガイド軸41,41が固定されており、この連結ガイド軸41,41に摘体45,45が摺動自在に装着された構成となっている。摘体45,45は、いずれも上記した摘体37と同様の構成を有し、ブロック46,46の表面側にローラ47,47が回転自在に装着されている。摘体45,45は、いずれも図示しない動力源に接続されており、連結ガイド軸41,41に案内されて左右方向に独立的あるいは一体的に摺動する。左右動ロックハンド23c,23dは、図8のようにローラ47,47の隙間に後述するロック部材56の摘体45,45が把持部65を挟んだ状態で左右方向に移動し、ロック部材56の操作を行う。   As shown in FIGS. 2 and 4B, the left and right lock hands 23c and 23d are both a frame 42 fixed to the palm pieces 18 and 20, and a guide member 43 having a substantially “L” -shaped cross section. The two connection guide shafts 41, 41 extending in the left-right direction are fixed in the space surrounded by the structure, and the knobs 45, 45 are slidably mounted on the connection guide shafts 41, 41. It has become. The knobs 45 and 45 have the same configuration as the knob 37 described above, and rollers 47 and 47 are rotatably mounted on the surface side of the blocks 46 and 46. The knobs 45 and 45 are both connected to a power source (not shown), and are guided by the connecting guide shafts 41 and 41 to slide independently or integrally in the left-right direction. As shown in FIG. 8, the left and right lock hands 23 c and 23 d move in the left and right directions with gripping portions 65 sandwiching grips 45 and 45 of a lock member 56 (described later) between the rollers 47 and 47. Perform the operation.

基板50は、略正方形のガラス板である。基板50は、熱伝導率が0.79W/m・Kであり、線膨張係数が8.5×10-6/Kである。また、基板50の背面51側に積み重ねられる背板52は、基板50と同様に略正方形の形状を有する板体である。背板52は、基板50よりも一回り小さい。さらに具体的には、背板52の一辺の長さLhは、基板50の一辺の長さLbよりも小さい。背板52の長さLhは、基板50の長さLbよりも0.2〜1.0mm程度小さいことが好ましく、0.4〜0.6mm程度小さいことがより一層好ましい。本実施形態では、背板52の長さLhが基板50の長さLbよりも0.5mm程度小さい。 The substrate 50 is a substantially square glass plate. The substrate 50 has a thermal conductivity of 0.79 W / m · K and a linear expansion coefficient of 8.5 × 10 −6 / K. Further, the back plate 52 stacked on the back surface 51 side of the substrate 50 is a plate body having a substantially square shape like the substrate 50. The back plate 52 is slightly smaller than the substrate 50. More specifically, the length Lh of one side of the back plate 52 is smaller than the length Lb of one side of the substrate 50. The length Lh of the back plate 52 is preferably smaller than the length Lb of the substrate 50 by about 0.2 to 1.0 mm, and more preferably about 0.4 to 0.6 mm. In the present embodiment, the length Lh of the back plate 52 is about 0.5 mm smaller than the length Lb of the substrate 50.

背板52は、基板50の面全体に略均等に熱を伝播させるべく、基板50よりも熱伝導率に優れていることが望ましい。本実施形態のように、基板50がガラス製である場合は、背板52の熱伝導率は100〜150W/m・K程度であることが望ましく、120〜130W/m・Kの範囲内にあることがより一層望ましい。本実施形態において採用されている背板52は、カーボン製であり、基板50と同様に略正方形の形状を有する板体である。背板52は、熱伝導率が128W/m・Kであり、線膨張係数が1.0×10-6/Kである。背板52は、基板50よりも熱伝導率が高いため、熱を基板50の面全体に略均等に作用させることができる。 It is desirable that the back plate 52 has a higher thermal conductivity than the substrate 50 so that heat can be propagated substantially uniformly over the entire surface of the substrate 50. As in this embodiment, when the substrate 50 is made of glass, the thermal conductivity of the back plate 52 is preferably about 100 to 150 W / m · K, and is within the range of 120 to 130 W / m · K. It is even more desirable to be. The back plate 52 employed in the present embodiment is made of carbon, and is a plate body having a substantially square shape like the substrate 50. The back plate 52 has a thermal conductivity of 128 W / m · K and a linear expansion coefficient of 1.0 × 10 −6 / K. Since the back plate 52 has higher thermal conductivity than the substrate 50, heat can be applied to the entire surface of the substrate 50 substantially evenly.

背板52は、基板50の背面に面接触する接触面53側が平坦である。一方、背板52の背面55側の外周部分には、図5および図6のように複数のロック部材56が固定されている。ロック部材56は、図7のように背板52の周部に縁面57および背面55と面一となるように埋め込まれて固定される固定板58と、この固定板58に対して直線方向に摺動可能に接続された摺動片61と、この摺動片61の一端側に固定された板バネ状の固定片62とを具備した構成となっている。摺動片61は長孔63を有し、この長孔63を介してネジ60が固定板58に固定されている。摺動片61は、他端側を垂直に屈曲させて形成された把持部65を有する。摺動片61は、図8に示すように上記した上下動ロックハンド23a,23bや左右動ロックハンド23c,23dによって把持部65が押し動かされ、ネジ60および長孔63に案内されて直線方向に移動する。これにより、図7および図8に矢印で示すように固定片62が背板52の縁面57から進退する。   The back plate 52 is flat on the side of the contact surface 53 that makes surface contact with the back surface of the substrate 50. On the other hand, a plurality of locking members 56 are fixed to the outer peripheral portion of the back plate 52 on the back surface 55 side as shown in FIGS. As shown in FIG. 7, the lock member 56 is embedded in and fixed to the peripheral portion of the back plate 52 so as to be flush with the edge surface 57 and the back surface 55, and a linear direction with respect to the fixed plate 58. The sliding piece 61 is slidably connected to the sliding piece 61, and a leaf spring-like fixing piece 62 fixed to one end side of the sliding piece 61. The sliding piece 61 has a long hole 63, and the screw 60 is fixed to the fixing plate 58 through the long hole 63. The sliding piece 61 has a gripping portion 65 formed by bending the other end side vertically. As shown in FIG. 8, the sliding piece 61 is guided by the screw 60 and the long hole 63 in the linear direction by the gripping portion 65 being pushed and moved by the vertical movement lock hands 23a and 23b and the left and right movement lock hands 23c and 23d. Move to. As a result, the fixed piece 62 advances and retreats from the edge surface 57 of the back plate 52 as indicated by arrows in FIGS.

背板52の4辺には、切り欠き66が設けられている。切り欠き66は、後述する基板移載装置80の基板ハンド22との干渉を防止するためのものであり、図5(b)のように背板52の接触面53側および縁面54に向けて開口した矩形状の形状を有する。切り欠き66は、基板ハンド22の鉤部32よりやや大きめとされている。切り欠き66は、図9のように、背板52に対して基板50を積み重ねた時に基板50によって覆われると、基板50の下方に隙間を形成する。そのため、図9(b)のように後述する基板移載装置80の基板ハンド22の鉤部32を基板50の背面55側からあてがい、矢印のように移動させると、背板52に積み重ねた基板50を挟持でき、さらに基板移載装置80を背板52から離反させると基板50を持ち上げることができる。   Cutouts 66 are provided on four sides of the back plate 52. The notch 66 is for preventing interference with the substrate hand 22 of the substrate transfer device 80 described later, and is directed toward the contact surface 53 side and the edge surface 54 of the back plate 52 as shown in FIG. And has an open rectangular shape. The notch 66 is slightly larger than the collar portion 32 of the substrate hand 22. As shown in FIG. 9, the notch 66 forms a gap below the substrate 50 when covered with the substrate 50 when the substrate 50 is stacked on the back plate 52. Therefore, as shown in FIG. 9B, when the flange portion 32 of the substrate hand 22 of the substrate transfer device 80 described later is applied from the back surface 55 side of the substrate 50 and moved as indicated by the arrow, the substrate stacked on the back plate 52 is stacked. 50 can be clamped, and the substrate 50 can be lifted by moving the substrate transfer device 80 away from the back plate 52.

続いて、本実施形態で採用されているホルダー70について説明する。図10(a)は、ホルダー70を示す正面図であり、同(b)は同(a)のA部拡大図、同(c)は同(b)のC−C断面図である。また、図11は、図10(a)のB部を示す斜視図である。   Subsequently, the holder 70 employed in the present embodiment will be described. 10A is a front view showing the holder 70, FIG. 10B is an enlarged view of a portion A of FIG. 10A, and FIG. 10C is a sectional view taken along the line CC of FIG. FIG. 11 is a perspective view showing a portion B in FIG.

ホルダー70は、上記した基板50および背板52の積み重ねた装着体68が装着される部材であり、ステンレス等の金属板を成型したものである。さらに具体的には、ホルダー70は、SUS304製であり、その熱伝導率は16.3W/m・Kであり、線膨張係数は17.3×10-6/Kである。ホルダー70は、上記した基板50や背板52よりも線膨張係数が大きい。そのため、基板50および背板52をホルダー70に装着した状態でこれらが熱膨張を起こしても、基板50や背板52が厚み方向に変形したり、この変形によって基板50と背板52との間に隙間が発生することを確実に防止できる。 The holder 70 is a member on which the mounting body 68 in which the above-described substrate 50 and back plate 52 are stacked is mounted, and is formed by molding a metal plate such as stainless steel. More specifically, the holder 70 is made of SUS304, its thermal conductivity is 16.3 W / m · K, and its linear expansion coefficient is 17.3 × 10 −6 / K. The holder 70 has a larger linear expansion coefficient than the substrate 50 and the back plate 52 described above. Therefore, even if the substrate 50 and the back plate 52 are mounted on the holder 70 and they are thermally expanded, the substrate 50 and the back plate 52 are deformed in the thickness direction. It is possible to reliably prevent a gap from occurring between them.

ホルダー70は、図10のように中央部に露出口71が形成された枠状の部材である。ホルダー70は、図10(c)のように基板50および背板52からなる装着体68が装着される装着面72と、装着面72から装着された基板50が露出する露出面73とを有する。ホルダー70は、装着面72側であって露出口71を取り囲む位置に段部75および切り欠き76を有する。段部75は、図10(c)に示すように基板50を嵌め込むための溝であり、露出面73側に基板50の脱落を防止するためのフランジ77を有する。   The holder 70 is a frame-like member having an exposure port 71 formed in the center as shown in FIG. As shown in FIG. 10C, the holder 70 has a mounting surface 72 on which the mounting body 68 including the substrate 50 and the back plate 52 is mounted, and an exposed surface 73 on which the substrate 50 mounted from the mounting surface 72 is exposed. . The holder 70 has a stepped portion 75 and a notch 76 at a position surrounding the exposure port 71 on the mounting surface 72 side. The step portion 75 is a groove for fitting the substrate 50 as shown in FIG. 10C, and has a flange 77 for preventing the substrate 50 from dropping off on the exposed surface 73 side.

切り欠き76は、露出口71を包囲する位置にあり、ホルダー70の厚み方向に貫通している。切り欠き76は、上記した着脱装置1のハンド部5を対向させたときに各基板ハンド22(22a〜22c)の爪部材30に相当する位置にある。切り欠き76は、爪部材30の鉤部32を挿通可能な大きさの開口領域を有する。そのため、ハンド部5に挟持された装着体68をホルダー70に装着すべく装着体68(基板50)をホルダー70の装着面72に密接させても、爪部材30は切り欠き76内に入り、ホルダー70と干渉しない。段部75の周囲であって、背板52のロック部材56に相当する位置には、図10および図11のように固定片62を挿入可能な係合具78が設けられている。   The notch 76 is positioned to surround the exposure port 71 and penetrates in the thickness direction of the holder 70. The notch 76 is located at a position corresponding to the claw member 30 of each substrate hand 22 (22a to 22c) when the hand portion 5 of the attachment / detachment device 1 described above is opposed. The notch 76 has an opening region with a size that allows the hook 32 of the claw member 30 to be inserted. Therefore, even if the mounting body 68 (substrate 50) is brought into close contact with the mounting surface 72 of the holder 70 so that the mounting body 68 held between the hand portions 5 is mounted on the holder 70, the claw member 30 enters the notch 76, It does not interfere with the holder 70. An engaging tool 78 into which the fixing piece 62 can be inserted is provided around the step portion 75 and at a position corresponding to the lock member 56 of the back plate 52 as shown in FIGS.

係合具78は、ホルダー70の中央側(露出口71側)に向けて開口している。そのため、段部75内に基板50が嵌るように装着体68を装着し、背板52に設けられたロック部材56の把持部65を往復動させると、バネ板状の固定片62が撓みながら係合具78の開口を出入りする。さらに具体的には、係合具78に対して固定片62を挿入すると、固定片62が撓んで背板52を基板50側に押しつけ、装着体68全体がホルダー70側に押しつけられ密着する。   The engagement tool 78 is opened toward the center side (the exposure port 71 side) of the holder 70. Therefore, when the mounting body 68 is mounted so that the substrate 50 fits in the stepped portion 75 and the gripping portion 65 of the lock member 56 provided on the back plate 52 is reciprocated, the spring plate-like fixing piece 62 is bent. The opening of the engagement tool 78 enters and exits. More specifically, when the fixing piece 62 is inserted into the engaging tool 78, the fixing piece 62 bends and presses the back plate 52 against the substrate 50, and the entire mounting body 68 is pressed against the holder 70 and comes into close contact.

続いて、本実施形態で採用されている基板移載装置80について説明する。図12は、基板移載装置80に採用されているハンド部の正面図である。また、図13は、基板移載装置80による基板の移載の様子を示す概念図である。   Next, the substrate transfer device 80 employed in this embodiment will be described. FIG. 12 is a front view of the hand unit employed in the substrate transfer apparatus 80. FIG. 13 is a conceptual diagram showing how a substrate is transferred by the substrate transfer device 80.

基板移載装置80は、図1のように上記した着脱装置1と大部分が同一の構成を有し、第4腕部14の先端に装着されているハンド部85の構成のみが異なる。基板移載装置80は、着脱装置1に対して基板50を換装するものである。基板移載装置80は、図13(a)のように、基板50および背板52を挟持した状態にある着脱装置1のハンド部5の上方にハンド部85を被せ、基板50のみを挟持して取り去ったり、図13(b)のようにハンド部5上に載置されている背板52上に基板50を積載するためのものである。   As shown in FIG. 1, the substrate transfer device 80 has the same configuration as that of the above-described attachment / detachment device 1, and is different only in the configuration of the hand portion 85 attached to the tip of the fourth arm portion 14. The substrate transfer device 80 replaces the substrate 50 with respect to the attachment / detachment device 1. As shown in FIG. 13A, the substrate transfer device 80 covers the hand portion 85 above the hand portion 5 of the detachable device 1 in a state where the substrate 50 and the back plate 52 are sandwiched, and sandwiches only the substrate 50. Or for loading the substrate 50 on the back plate 52 placed on the hand portion 5 as shown in FIG.

ハンド部85は、略全体がステンレス等の金属材料を用いて作製したものであり、図12のように掌片部81,82を連結部83で連結したものであり、正面視が略「H」型の形状となっている。掌片部81,82には、上記した背板52を挟持する基板ハンド22がそれぞれ複数設けられている。   The hand portion 85 is substantially entirely made of a metal material such as stainless steel, and is formed by connecting palm pieces 81 and 82 with a connecting portion 83 as shown in FIG. It has a shape of "". The palm pieces 81 and 82 are provided with a plurality of substrate hands 22 that sandwich the back plate 52 described above.

基板ハンド22は、上記した着脱装置1において採用されていたのと同一の構成を有するものであり、ロッド29aの動作に伴ってスライドベース27およびこれに固定された爪部材30が直線方向に往復動するものである。基板ハンド22は、図12に示すように着脱装置1のハンド部5上にハンド部85を被覆させた時に、ハンド部5側に搭載されている背板52の切り欠き66に相当する位置にハンド部85側の爪部材30が来るように配置されている。   The substrate hand 22 has the same configuration as that adopted in the above-described attachment / detachment device 1, and the slide base 27 and the claw member 30 fixed thereto are reciprocated in the linear direction in accordance with the operation of the rod 29a. It moves. As shown in FIG. 12, the substrate hand 22 is placed at a position corresponding to the notch 66 of the back plate 52 mounted on the hand unit 5 side when the hand unit 85 is covered on the hand unit 5 of the detachable device 1. It arrange | positions so that the nail | claw member 30 by the side of the hand part 85 may come.

続いて、本実施形態の着脱システムSの動作について詳細に説明する。着脱システムSは、図示しない制御装置を備えており、この制御装置の制御信号を受けて各部が所定の動作を行う。着脱システムSの制御装置は、大別して着脱装置1によるホルダー70への装着体68の装着作業、ホルダー70から装着体68を取り外す取り外し作業、並びに、着脱装置1によって保持されている基板50の換装作業を行うものである。以下、各作業時における動作について順次説明する。   Then, operation | movement of the attachment / detachment system S of this embodiment is demonstrated in detail. The attachment / detachment system S includes a control device (not shown), and each unit performs a predetermined operation in response to a control signal from the control device. The control device of the attachment / detachment system S is roughly divided into an attachment operation of the attachment body 68 to the holder 70 by the attachment / detachment device 1, a removal operation of removing the attachment body 68 from the holder 70, and replacement of the substrate 50 held by the attachment / detachment device 1. Work. Hereinafter, operations during each operation will be described in sequence.

着脱システムSにより装着体68の装着作業を行う場合、着脱装置1は、後述する換装作業や人手によりハンド部5上に基板50および背板52からなる装着体68を搭載する。この時、装着体68は、背板52がハンド部5側に向き、基板50が露出するように搭載される。また、背板52の背面側にあるロック部材56の把持部65は、図8のようにハンド部5の各部に設けられたロックハンド23(23a〜23d)のローラ40,40間あるいは47,47間に突出した状態となる。   When performing the mounting operation of the mounting body 68 by the mounting / demounting system S, the mounting / demounting device 1 mounts the mounting body 68 including the substrate 50 and the back plate 52 on the hand unit 5 by a replacement operation described later or manually. At this time, the mounting body 68 is mounted such that the back plate 52 faces the hand portion 5 side and the substrate 50 is exposed. Further, the gripping portion 65 of the lock member 56 on the back side of the back plate 52 is formed between the rollers 40 and 40 of the lock hand 23 (23a to 23d) provided in each portion of the hand portion 5 as shown in FIG. It will be in the state which protruded between 47.

上記したようにして装着体68が搭載されると、制御装置は、ハンド部5の各動力伝達機構29bを作動させ、ロッド29aを動作させる。これにより、ハンド部5の各基板ハンド22(22a〜22c)が摺動し、図3(b)のように当接部31が基板50および背板52の縁面54,57に当接し、基板50および背板52が上下左右から挟持された状態(チャック状態)となると同時に、これらの位置が揃う。   When the mounting body 68 is mounted as described above, the control device operates each power transmission mechanism 29b of the hand unit 5 to operate the rod 29a. Thereby, each board hand 22 (22a-22c) of the hand part 5 slides, and the contact part 31 contacts the edge surfaces 54 and 57 of the board 50 and the back plate 52 as shown in FIG. At the same time as the substrate 50 and the back plate 52 are sandwiched from the top, bottom, left, and right (chuck state), these positions are aligned.

上記したようにして基板50および背板52が挟持されると、本体部2の胴部7やアーム部3が作動を開始し、ハンド部5をホルダー70の近傍まで移動させる。その後、着脱システムSの制御手段は、ハンド部5を装着体68がホルダー70に対向する姿勢とする。制御手段は、ハンド部5に挟持されている基板50がホルダー70の段部75に納まり、基板ハンド22(22a〜22c)がホルダー70側の切り欠き76内に侵入するように位置を微調整しながらハンド部5をホルダー70側に緩やかに移動させる。   When the substrate 50 and the back plate 52 are sandwiched as described above, the body portion 7 and the arm portion 3 of the main body portion 2 start to operate, and the hand portion 5 is moved to the vicinity of the holder 70. Thereafter, the control means of the attachment / detachment system S places the hand unit 5 in a posture in which the mounting body 68 faces the holder 70. The control means finely adjusts the position so that the substrate 50 held by the hand portion 5 is accommodated in the stepped portion 75 of the holder 70 and the substrate hand 22 (22a to 22c) enters the notch 76 on the holder 70 side. While moving the hand portion 5 gently toward the holder 70 side.

ハンド部5に装着された基板50がホルダー70の装着面72に面接触したことが確認されると、制御手段はハンド部5の移動を中止する。その後、制御手段は、ハンド部5の各ロックハンド23(23a〜23d)を作動させる。これにより、各ロックハンド23に相当する位置にあるロック部材56の把持部65は、図8に矢印Lで示すようにハンド部5の各部に設けられた摘体37,45のローラ40あるいは47によって突き動かされ、固定片62が背板52の縁面57から突出し、ホルダー70側に固定された係合具78に嵌り込む。これにより、背板52がホルダー70に対してロックされた状態となる。   When it is confirmed that the substrate 50 mounted on the hand unit 5 is in surface contact with the mounting surface 72 of the holder 70, the control means stops the movement of the hand unit 5. Thereafter, the control means operates each lock hand 23 (23a to 23d) of the hand unit 5. As a result, the gripping portion 65 of the lock member 56 located at a position corresponding to each lock hand 23 is moved to the rollers 40 or 47 of the knobs 37 and 45 provided in each portion of the hand portion 5 as indicated by an arrow L in FIG. The fixed piece 62 protrudes from the edge surface 57 of the back plate 52 and fits into the engagement tool 78 fixed to the holder 70 side. As a result, the back plate 52 is locked with respect to the holder 70.

ロック部材56の固定片62と係合具78とが係合すると、制御手段は、各動力伝達機構29bを作動させ、ロッド29aを伸ばす。これにより、各基板ハンド22(22a〜22c)が装着体68の各縁面54,57から離れ、挟持状態が解除される。その後、制御手段は、胴部7やアーム部3を作動させてハンド部5をホルダー70から離反させ、一連の装着作業を終了する。   When the fixing piece 62 of the lock member 56 and the engagement tool 78 are engaged, the control means operates each power transmission mechanism 29b to extend the rod 29a. Thereby, each board | substrate hand 22 (22a-22c) leaves | separates from each edge surface 54 and 57 of the mounting body 68, and a clamping state is cancelled | released. Thereafter, the control means operates the body portion 7 and the arm portion 3 to separate the hand portion 5 from the holder 70, and completes a series of mounting operations.

着脱システムSにより装着体68の取り外し作業を行う場合、着脱装置1は、上記した装着作業と逆の手順で基板50および背板52をホルダー70から取り外す。さらに具体的には、取り外し作業を行う場合、制御手段は、胴部7やアーム部3を作動させ、基板ハンド22(22a〜22c)がホルダー70側の切り欠き76内に侵入するように位置を微調整しながらハンド部5をホルダー70に近づける。   When performing the removal operation of the mounting body 68 by the mounting / demounting system S, the mounting / demounting device 1 removes the substrate 50 and the back plate 52 from the holder 70 in the reverse order of the mounting operation described above. More specifically, when performing the removal work, the control means operates the body portion 7 and the arm portion 3 so that the substrate hand 22 (22a to 22c) enters the notch 76 on the holder 70 side. The hand part 5 is brought close to the holder 70 while finely adjusting.

基板ハンド22が切り欠き76内に侵入し、ハンド部5が背板52に面接触したことが確認されると、制御手段は、各ロッド29aを動作させ、これに接続された各基板ハンド22(22a〜22c)を摺動させる。図3(b)のように各基板ハンド22の爪部材30の当接部31が基板50および背板52の縁面54,57に当接したことが確認されると、基板50および背板52が上下左右から挟持された状態となる。   When it is confirmed that the substrate hand 22 has entered the notch 76 and the hand portion 5 has come into surface contact with the back plate 52, the control means operates each rod 29a and each substrate hand 22 connected thereto. Slide (22a-22c). When it is confirmed that the contact portion 31 of the claw member 30 of each substrate hand 22 contacts the edge surfaces 54 and 57 of the substrate 50 and the back plate 52 as shown in FIG. 3B, the substrate 50 and the back plate. 52 is sandwiched from above, below, left and right.

基板50および背板52が各爪部材30によって挟持されると、制御手段は、各ロックハンド23(23a〜23d)を作動させ、図8に矢印Uで示す方向に摘体37,45のローラ40あるいは47によりロック部材56の把持部65を突き動かす。これにより、各ロック部材56の固定片62がホルダー70の係合部78から脱離し、ロック状態が解除される。   When the substrate 50 and the back plate 52 are sandwiched between the claw members 30, the control means actuates the lock hands 23 (23a to 23d), and the rollers of the knobs 37 and 45 in the direction indicated by the arrow U in FIG. The gripping portion 65 of the lock member 56 is pushed by 40 or 47. Thereby, the fixing piece 62 of each lock member 56 is detached from the engaging portion 78 of the holder 70, and the locked state is released.

上記したようにしてロック状態が解除されると、制御手段は、胴部7やアーム部3を作動させてハンド部5をホルダー70から離反させると共に所定の基板保管位置まで装着体68を移動させる。ハンド部5が基板保管位置に至ると、ハンド部5は、基板50および背板52の固定側の面を上方に向けた状態となり、一連の取り外し作業を完了する。   When the locked state is released as described above, the control means operates the body portion 7 and the arm portion 3 to move the hand portion 5 away from the holder 70 and move the mounting body 68 to a predetermined substrate storage position. . When the hand unit 5 reaches the substrate storage position, the hand unit 5 is in a state in which the fixed side surfaces of the substrate 50 and the back plate 52 are directed upward, and a series of removal operations are completed.

着脱システムSは、基板移載装置80により、上記した手順に則ってホルダー70に対して着脱される装着体68のうち、基板50のみを換装する換装作業を行う。以下、基板移載装置80による換装作業について順を追って説明する。   The attachment / detachment system S performs a replacement operation for replacing only the substrate 50 among the attachments 68 attached to and detached from the holder 70 by the substrate transfer device 80 in accordance with the above-described procedure. Hereinafter, replacement work by the substrate transfer apparatus 80 will be described in order.

上記したように、所定の基板保管位置等において水平に配置されたハンド部5上に積載された装着体68から基板50を取り去る場合、基板移載装置80は、図13(a)のようにハンド部5上に積載された装着体68の上方から基板移載装置80のハンド部85を被せ、ハンド部85側のロッド29aを動作させる。これにより、ハンド部85側の爪部材30は、図9(b)のように背板52の切り欠き66内に侵入し、基板50の縁面54に当接する。その後、基板移載装置80は、ハンド部85を図13(a)のようにハンド部5から離れる方向に移動させる。これにより、基板移載装置80は、着脱装置1のハンド部5上に積載された装着体68から基板50のみを取り去り、この基板50を所定の基板保管場所(図示せず)に移動させる。   As described above, when the substrate 50 is removed from the mounting body 68 loaded on the hand unit 5 disposed horizontally at a predetermined substrate storage position or the like, the substrate transfer device 80 is configured as shown in FIG. The hand part 85 of the substrate transfer device 80 is covered from above the mounting body 68 loaded on the hand part 5, and the rod 29a on the hand part 85 side is operated. As a result, the claw member 30 on the hand portion 85 side enters the notch 66 of the back plate 52 as shown in FIG. 9B and contacts the edge surface 54 of the substrate 50. Thereafter, the substrate transfer device 80 moves the hand unit 85 in a direction away from the hand unit 5 as shown in FIG. As a result, the substrate transfer device 80 removes only the substrate 50 from the mounting body 68 loaded on the hand unit 5 of the attachment / detachment device 1, and moves the substrate 50 to a predetermined substrate storage location (not shown).

一方、所定の基板保管場所に保管されている基板50を着脱装置1のハンド部5上にある背板52上に積載する場合、前記保管場所においてハンド部85の基板ハンド22を収縮させて基板50を挟持し、着脱装置1のハンド部5近傍まで搬送する。その後、基板移載装置80は、ハンド部85を基板50がハンド部5側を向く姿勢とし、図13(b)のように着脱装置1のハンド部5上に面接触するまで近づける。この時、ハンド部85側の基板ハンド22の爪部材30は、背板52の切り欠き66内に侵入し、ハンド部5と干渉しない。ハンド部85に挟持された基板50がハンド部5側に搭載されている背板52に移載されたことが確認されると、基板移載装置80は、図9(b)に矢印Bで示すように爪部材30を切り欠き66内で鉤部32の先端が基板50の縁面54よりも外側の位置まで水平移動させた後、爪部材30を切り欠き66から抜き去る。これにより、基板移載装置80は、着脱装置1のハンド部5上に積載されている背板52上への基板50の積載作業を終了する。   On the other hand, when the substrate 50 stored in a predetermined substrate storage location is loaded on the back plate 52 on the hand portion 5 of the attachment / detachment apparatus 1, the substrate hand 22 of the hand portion 85 is contracted at the storage location to reduce the substrate. 50 is sandwiched and conveyed to the vicinity of the hand portion 5 of the detachable device 1. Thereafter, the substrate transfer device 80 brings the hand unit 85 into a posture in which the substrate 50 faces the hand unit 5 side, and brings the hand unit 85 close to the surface of the hand unit 5 of the attachment / detachment device 1 as shown in FIG. At this time, the claw member 30 of the substrate hand 22 on the hand portion 85 side enters the notch 66 of the back plate 52 and does not interfere with the hand portion 5. When it is confirmed that the substrate 50 sandwiched between the hand portions 85 has been transferred to the back plate 52 mounted on the hand portion 5 side, the substrate transfer device 80 is indicated by an arrow B in FIG. As shown, the claw member 30 is removed from the notch 66 after the claw member 30 is horizontally moved to a position outside the edge surface 54 of the substrate 50 in the notch 66. Thereby, the substrate transfer device 80 finishes the loading operation of the substrate 50 on the back plate 52 loaded on the hand portion 5 of the attachment / detachment device 1.

本実施形態の着脱システムSにおいて、着脱装置1は、基板ハンド22によって基板50および背板52の縁面54,57に当接させて挟持し、着脱するものである。そのため、着脱装置1によれば、表面や裏面を汚すことなく基板50の着脱が行える。   In the attachment / detachment system S of the present embodiment, the attachment / detachment device 1 is attached to and detached from the edge surfaces 54 and 57 of the substrate 50 and the back plate 52 by the substrate hand 22. Therefore, according to the attachment / detachment device 1, the substrate 50 can be attached / detached without contaminating the front surface or the back surface.

また、着脱装置1は、基板ハンド22によって基板50と背板52とを同時に挟持し、着脱することができる。さらに、着脱手段1は、基板50および背板52の着脱動作と同時に、ロックハンド23によってロック部材56の開閉作業を行える。そのため、着脱装置1は、基板50および背板52の着脱作業の作業効率が高い。   Further, the attachment / detachment device 1 can attach and detach the substrate 50 and the back plate 52 simultaneously by the substrate hand 22. Further, the attaching / detaching means 1 can open and close the lock member 56 by the lock hand 23 simultaneously with the attaching / detaching operation of the substrate 50 and the back plate 52. Therefore, the attachment / detachment apparatus 1 has high work efficiency of the attachment / detachment work of the substrate 50 and the back plate 52.

着脱装置1は、ハンド部5に平行な面上で上下方向に往復動する基板ハンド22a,22bと、左右方向に往復動する基板ハンド22cとによって縁面54,57を挟持するものである。また、基板50と背板52は僅かに大きさが異なるもののほぼ等しい大きさとされている。そのため、本実施形態の着脱システムSでは、基板ハンド22a〜22cによって基板50および背板52を挟持することによりこれらの端部を揃えた状態で着脱を行える。   The attachment / detachment device 1 is configured to sandwich the edge surfaces 54 and 57 between the substrate hands 22a and 22b that reciprocate in the vertical direction on the surface parallel to the hand portion 5 and the substrate hand 22c that reciprocates in the left and right directions. Moreover, although the board | substrate 50 and the backplate 52 differ in magnitude | size slightly, it is set as the substantially equal magnitude | size. Therefore, in the attachment / detachment system S of the present embodiment, the substrate 50 and the back plate 52 are sandwiched by the substrate hands 22a to 22c, and the attachment / detachment can be performed with these end portions aligned.

上記したように、基板ハンド22の爪部材30には、ハンド部5に対して平行方向に伸びる鉤部32がある。そのため、着脱装置1は、着脱動作時に基板ハンド22cとによって縁面54,57を挟持すると共に、基板50の表面側に鉤部32が僅かに回り込み把持した状態となる。従って、着脱装置1によれば、何らかの拍子にハンド部5の面方向に向かう外力が作用したとしても基板50や背板52が脱落しない。   As described above, the claw member 30 of the substrate hand 22 has the collar portion 32 extending in the direction parallel to the hand portion 5. Therefore, the attachment / detachment apparatus 1 is in a state in which the edge surfaces 54 and 57 are sandwiched by the substrate hand 22c during the attachment / detachment operation, and the collar portion 32 slightly wraps around and grips the surface side of the substrate 50. Therefore, according to the attachment / detachment device 1, the substrate 50 and the back plate 52 do not fall off even if an external force in the direction of the surface of the hand unit 5 acts on some beat.

上記した着脱システムSにおいて採用されているホルダー70には、着脱装置1の基板ハンド22に相当する位置に切り欠き76が設けられている。そのため、着脱動作を行うべく着脱装置1のハンド部5をホルダー70に近づけても、基板ハンド22がホルダー70に干渉せず、着脱作業を効率よく行える。   The holder 70 employed in the above attachment / detachment system S is provided with a notch 76 at a position corresponding to the substrate hand 22 of the attachment / detachment device 1. Therefore, even if the hand portion 5 of the attachment / detachment apparatus 1 is brought close to the holder 70 so as to perform the attachment / detachment operation, the substrate hand 22 does not interfere with the holder 70 and the attachment / detachment work can be performed efficiently.

着脱システムSは、ホルダー70と背板52との境界部分に複数のロック部材56を設けてロックする構成となっている。さらにロック部材56は、板バネ状の固定片62をホルダー70側の係合具78に侵入させてロック状態とするものである。背板52および基板50は、固定片62の弾性力によりホルダー70側に付勢され、しっかりと密接させた状態で固定される。そのため、着脱システムSによって基板50および背板52をホルダー70を装着すれば、例えばCVD法やスパッタリング法の様な手法による基板上に成膜作業を行ってもガスの流出入や放電の回り込み等による成膜不良が殆ど起こらない。   The attachment / detachment system S is configured to lock by providing a plurality of lock members 56 at the boundary between the holder 70 and the back plate 52. Further, the lock member 56 is configured to allow the plate spring-like fixing piece 62 to enter the engagement tool 78 on the holder 70 side to be locked. The back plate 52 and the substrate 50 are urged toward the holder 70 by the elastic force of the fixing piece 62, and are fixed in a state of being in close contact with each other. Therefore, if the holder 50 is mounted on the substrate 50 and the back plate 52 by the attachment / detachment system S, for example, the inflow / outflow of the gas and the discharge of the discharge even if the film forming operation is performed on the substrate by a technique such as CVD or sputtering. Almost no film formation failure due to.

本着脱システムSは、基板移載装置80を備えており、人手を介せず着脱装置1のハンド部5に対して基板50の移載を行える。そのため、本着脱システムSによれば、基板50の換装作業が極めてスムーズに行える。   The present attachment / detachment system S includes a substrate transfer device 80, and the substrate 50 can be transferred to the hand portion 5 of the attachment / detachment device 1 without human intervention. Therefore, according to the present attachment / detachment system S, the replacement work of the substrate 50 can be performed extremely smoothly.

また、背板52には、基板移載装置80のハンド部85に設けられた基板ハンド22の干渉を防止するための切り欠き66がある。そのため、基板50の取り替えを行うべく基板移載装置80のハンド部85を背板52に近づけても、基板ハンド22が背板52に干渉しない。   Further, the back plate 52 has a notch 66 for preventing interference of the substrate hand 22 provided in the hand portion 85 of the substrate transfer device 80. Therefore, the substrate hand 22 does not interfere with the back plate 52 even if the hand portion 85 of the substrate transfer device 80 is brought close to the back plate 52 in order to replace the substrate 50.

上記した着脱システムは、図14に示すCVD装置等の成膜装置に好適に使用できる。以下、上記した着脱システムをCVD装置に適用した例について図面を参照しながら詳細に説明する。図14は、本実施例のCVD装置を示す作動原理図である。   The above attachment / detachment system can be suitably used for a film forming apparatus such as a CVD apparatus shown in FIG. Hereinafter, an example in which the above attachment / detachment system is applied to a CVD apparatus will be described in detail with reference to the drawings. FIG. 14 is an operation principle diagram showing the CVD apparatus of this embodiment.

図14において、100は本実施例のCVD装置である。CVD装置100は、ガラス製の基板50に半導体層を成膜するものである。本実施形態のCVD装置100は、大きく分けて、基板受取・払出部102と、成膜チャンバー103とを有する。   In FIG. 14, reference numeral 100 denotes the CVD apparatus of this embodiment. The CVD apparatus 100 forms a semiconductor layer on a glass substrate 50. The CVD apparatus 100 of this embodiment is roughly divided into a substrate receiving / dispensing unit 102 and a film forming chamber 103.

順次説明すると、基板受取・払出部102は、上記実施形態で説明した着脱システムSを備えた構成であり、後述する基板キャリア105に立設状態に装着された一対の枠部材107の両側からホルダー70に基板50および背板52を装着する部分である。なお、図14においては、図面の簡略化のため、基板キャリア105の一方側に設けられている着脱システムSを省略している。   To explain sequentially, the substrate receiving / dispensing unit 102 is configured to include the attachment / detachment system S described in the above embodiment, and the holder is provided from both sides of a pair of frame members 107 mounted in a standing state on a substrate carrier 105 described later. 70 is a portion where the substrate 50 and the back plate 52 are mounted. In FIG. 14, the attachment / detachment system S provided on one side of the substrate carrier 105 is omitted for simplification of the drawing.

基板キャリア105は、細長い台車に二枚の枠部材107を対向して立設した様な形状をしている。すなわち基板キャリア105は、直方体のキャリアベース108を有し、その両側に合計8個の車輪110が設けられている。またキャリアベース108の底面には、ラック111が取り付けられている。   The substrate carrier 105 has such a shape that two frame members 107 are erected on an elongated carriage. That is, the substrate carrier 105 has a rectangular parallelepiped carrier base 108, and a total of eight wheels 110 are provided on both sides thereof. A rack 111 is attached to the bottom surface of the carrier base 108.

キャリアベース108の上方には、2組の枠部材107が平行かつ対向した状態となるように固定されている。枠部材107は、上記したホルダー70が固定されるホルダー保持枠109を連結板117を介して2枚並列に接続したものである。ホルダー保持枠109は、上辺114側が切り欠かれ、左右側辺112,113および底辺115によって囲まれたホルダー装着領域116を有する略「コ」字形の板体である。枠部材107は、底辺115の下端部をキャリアベース108の上方にネジ止めや溶接等により立設状態で固定されている。   Above the carrier base 108, two sets of frame members 107 are fixed so as to be parallel and opposed to each other. The frame member 107 is obtained by connecting two holder holding frames 109 to which the above-described holder 70 is fixed in parallel via a connecting plate 117. The holder holding frame 109 is a substantially “U” -shaped plate body having a holder mounting region 116 that is cut out on the upper side 114 side and surrounded by the left and right side sides 112 and 113 and the bottom side 115. The frame member 107 is fixed in a standing state with a lower end portion of the base 115 above the carrier base 108 by screwing or welding.

枠部材107には、図15のように、上記実施形態において説明したホルダー70がホルダー装着領域116にネジ止め固定される。枠部材107をキャリアベース108に固定した基板キャリア105は、基板受取・払出部102に沿って敷設されたレール118に沿って基板受取・払出部102の側方を移動し、成膜チャンバー103側に移動する。   As shown in FIG. 15, the holder 70 described in the above embodiment is fixed to the frame member 107 by screws to the holder mounting region 116. The substrate carrier 105 having the frame member 107 fixed to the carrier base 108 moves to the side of the substrate receiving / dispensing portion 102 along the rail 118 laid along the substrate receiving / dispensing portion 102, and the film forming chamber 103 side Move to.

基板キャリア105は基板受取・払出部102に至ると停止する。着脱システムSは、基板キャリア105が停止している間に、枠部材107に装着されたホルダー70に対する装着体68の着脱を行う。これにより、各基板50の露出面は、互いに対向し、枠部材107の内側を向いた状態となる。枠部材107,107に基板50および背板52から成る装着体68の装着が完了すると、基板キャリア105は、基板受取・払出部102の側方に敷設されたレール118に沿って移動し、成膜チャンバー103内に引き込まれる。   The substrate carrier 105 stops when it reaches the substrate receiving / dispensing section 102. The attachment / detachment system S attaches / detaches the attachment body 68 to / from the holder 70 attached to the frame member 107 while the substrate carrier 105 is stopped. As a result, the exposed surfaces of the respective substrates 50 face each other and face the inside of the frame member 107. When the mounting of the mounting body 68 including the substrate 50 and the back plate 52 on the frame members 107 and 107 is completed, the substrate carrier 105 moves along the rail 118 laid on the side of the substrate receiving / dispensing portion 102, It is drawn into the membrane chamber 103.

成膜チャンバー103は、プラズマCVD法により気体に成膜するキャビティーであり、従来公知のCVD装置の成膜チャンバーと同様の構成を有する。さらに具体的には、成膜チャンバー103は、内部に図示しないヒータやRF電極が設けられてた構成となっている。成膜チャンバー103は、RF電極内に原料ガスを供給すると共に、このRF電極に高周波交流を印加し、RF電極と基板キャリア105との間にグロー放電を発生させて原料ガスを分解し、基板キャリア105に立設された基板50の表面に薄膜を形成させるものである。   The film formation chamber 103 is a cavity for forming a film in a gas by a plasma CVD method, and has the same configuration as a film formation chamber of a conventionally known CVD apparatus. More specifically, the film forming chamber 103 has a configuration in which a heater and an RF electrode (not shown) are provided inside. The film forming chamber 103 supplies a source gas into the RF electrode, applies a high-frequency alternating current to the RF electrode, generates a glow discharge between the RF electrode and the substrate carrier 105, decomposes the source gas, and A thin film is formed on the surface of the substrate 50 erected on the carrier 105.

上記したように、上記実施形態の着脱システムSを採用したCVD装置100は、基板50や背板52の着脱を人手を介することなく行える。そのため、CVD装置100は、基板50への成膜作業の作業効率が高い。   As described above, the CVD apparatus 100 employing the attachment / detachment system S of the above embodiment can attach / detach the substrate 50 and the back plate 52 without manual intervention. Therefore, the CVD apparatus 100 has high work efficiency of the film forming operation on the substrate 50.

また、着脱システムSは、基板50の縁面54を挟持して着脱するものであるため、基板50の表面や裏面が汚れない。従って、CVD装置100によれば、基板50への良好な成膜状態が得られる。   Moreover, since the attachment / detachment system S is for attaching / detaching the substrate by holding the edge surface 54 of the substrate 50, the front and back surfaces of the substrate 50 are not contaminated. Therefore, according to the CVD apparatus 100, a good film formation state on the substrate 50 can be obtained.

本発明の一実施形態の着脱システムを示す斜視図である。It is a perspective view which shows the attachment / detachment system of one Embodiment of this invention. 図1に示す着脱システムで採用されている着脱装置の要部を示す正面図である。It is a front view which shows the principal part of the attachment / detachment apparatus employ | adopted with the attachment / detachment system shown in FIG. (a)は、図2の要部を示す正面図であり、同(b)は、同(a)の断面図、同(c)は、同(a)の斜視図である。(A) is a front view which shows the principal part of FIG. 2, (b) is sectional drawing of the same (a), (c) is a perspective view of the (a). (a),(b)は、図2の他の要部を示す斜視図である。(A), (b) is a perspective view which shows the other principal part of FIG. (a)は、図1に示す着脱システムによって着脱される基板および背板を示す斜視図であり、同(b)は同(a)のA部拡大図である。(A) is a perspective view which shows the board | substrate and backplate which are attached or detached by the attachment or detachment system shown in FIG. 1, The same (b) is the A section enlarged view of the same (a). (a)は図5に示す背板の正面図であり、同(b)は同(a)の背面図である。(A) is a front view of the back board shown in FIG. 5, (b) is a rear view of the same (a). 図5,6に示す背板の要部を示す斜視図である。It is a perspective view which shows the principal part of the backplate shown in FIG. 図5,6に示す背板のロック部材の操作の様子を示す概念図である。It is a conceptual diagram which shows the mode of operation of the locking member of the backplate shown to FIG. (a)は、基板と背板とを重ね合わせた状態の要部を示す正面図であり、同(b)は同(a)のA−A断面図である。(A) is a front view which shows the principal part of the state which overlap | superposed the board | substrate and the backplate, The same (b) is AA sectional drawing of the same (a). (a)は、ホルダー70を示す正面図であり、同(b)は同(a)のA部拡大図、同(c)は同(b)のC−C断面図、同(d)は同(a)のA部を示す斜視図である。(A) is the front view which shows the holder 70, (b) is the A section enlarged view of (a), (c) is CC sectional drawing of the (b), (d) is (d). It is a perspective view which shows the A section of the same (a). 図10(a)のB部を示す斜視図である。It is a perspective view which shows the B section of Fig.10 (a). 基板移載装置に採用されているハンド部の正面図である。It is a front view of the hand part employ | adopted as the board | substrate transfer apparatus. 基板移載装置による基板の移載の様子を示す概念図である。It is a conceptual diagram which shows the mode of the transfer of the board | substrate by a board | substrate transfer apparatus. 本発明の一実施例のCVD装置を示す作動原理図である。It is an operation | movement principle figure which shows the CVD apparatus of one Example of this invention. (a)は図14のCVD装置において採用されている基板キャリアの正面図であり、同(b)は同(a)の側面図である。(A) is a front view of a substrate carrier adopted in the CVD apparatus of FIG. 14, and (b) is a side view of (a).

符号の説明Explanation of symbols

1 着脱装置
4 ロボットアーム
5 ハンド部
22 基板ハンド
23 ロックハンド
32 鉤部
37,45 摘体
50 基板
51 背面
52 背板
53 接触面
54,57 縁面
55 背面
56 ロック部材
70 ホルダー(装着部材)
71 露出口
72 装着面
73 露出面
80 基板移載装置
85 ハンド部
100 CVD装置(成膜装置)
102 基板受取・払出部
DESCRIPTION OF SYMBOLS 1 Detachable device 4 Robot arm 5 Hand part 22 Substrate hand 23 Lock hand 32 Gutter part 37, 45 Hand pick 50 Substrate 51 Back surface 52 Back plate 53 Contact surface 54, 57 Edge surface 55 Back surface 56 Lock member 70 Holder (mounting member)
71 Exposed Port 72 Mounting Surface 73 Exposed Surface 80 Substrate Transfer Device 85 Hand Unit 100 CVD Device (Film Forming Device)
102 Board receiving / dispensing department

Claims (14)

基板はガラス製であり、基板の一部または全部を露出する露出口を有する装着部材に基板が取り付けられ、さらに前記基板の背面側に基板とほぼ等しい大きさであって基板と端部を揃えることができる大きさの背板が取り付けられた状態から、基板と背板とを重ねた装着体を基板と背板とを重ねたままの状態で取り外し、さらに少なくとも基板を取り替えて基板と背板とを重ねて前記装着部材に再装着する着脱装置であって、装着体の対向する縁面の内の、一方の対向する縁面あるいは双方の対向する縁面に当接して装着体を挟持し装着体を構成する基板および背板を2枚同時に把持する挟持手段と、前記挟持手段で装着体を挟持した状態で移動させる移動手段とを有することを特徴とする着脱装置。 The substrate is made of glass, and the substrate is attached to a mounting member having an exposure opening that exposes a part or all of the substrate. Further, on the back side of the substrate, the substrate and the end are approximately the same size as the substrate. After the back plate of a size that can be aligned is attached, remove the mounting body with the substrate and the back plate overlapped, with the substrate and the back plate overlapped, and at least replace the substrate to replace the substrate and the back plate. clamping a detachable device for re-inserted into the mounting member overlapping the plate, of the edge surface facing the mounting member, the contact with the mounting member to the edge surface facing edge surface or both to one face An attaching / detaching device comprising: a holding means for simultaneously holding two substrates and a back plate constituting the mounting body; and a moving means for moving the mounting body while holding the mounting body by the holding means. 挟持手段は、先端部が鉤状であることを特徴とする請求項1に記載の着脱装置。   The attachment / detachment device according to claim 1, wherein the holding means has a hook-like tip. 挟持手段は、所定の面上を所定方向に往復動する第1の可動部材と、前記面上を第1の可動部材の移動方向に対して交差する方向に往復動する第2の可動部材とを備えていることを特徴とする請求項1または2に記載の着脱装置。   The sandwiching means includes a first movable member that reciprocates on a predetermined surface in a predetermined direction, and a second movable member that reciprocates on the surface in a direction intersecting the moving direction of the first movable member. The attachment / detachment device according to claim 1, further comprising: 移動手段は、複数の腕部と、挟持手段が装着された着脱部とを有し、隣接する腕部同士あるいは腕部と着脱部とは関節部を介して回動自在に接続されていることを特徴とする請求項1乃至3のいずれかに記載の着脱装置。   The moving means has a plurality of arm parts and an attaching / detaching part to which the holding means is attached, and the adjacent arm parts or the arm part and the attaching / detaching part are rotatably connected via the joint part. The attachment / detachment device according to any one of claims 1 to 3. 請求項1乃至4のいずれかに記載の着脱装置と、前記着脱装置とは別個の部材であって装着体が装着される前記装着部材と、当該装着部材に対して装着体を固定状態とする固定手段とを有し、着脱装置は移動手段に装着され移動手段によって装着部材の近傍まで移動可能であり且つ装着部材から離反可能であるハンド部を有し、当該ハンド部に前記挟持手段と、前記固定手段を動かして固定状態あるいは固定解除状態とする着脱手段を具備していることを特徴とする着脱システム。   5. The attachment / detachment device according to claim 1, the attachment member which is a member separate from the attachment / detachment device and to which the attachment body is attached, and the attachment body is fixed to the attachment member. A fixing means, and the attachment / detachment device has a hand portion that is mounted on the moving means and can be moved to the vicinity of the mounting member by the moving means and can be separated from the mounting member. An attachment / detachment system comprising: attachment / detachment means for moving the fixing means to a fixed state or a fixed release state. 装着体を立設状態で搬送する搬送手段を有することを特徴とする請求項5に記載の着脱システム。   6. The attachment / detachment system according to claim 5, further comprising conveying means for conveying the mounting body in a standing state. 背板は、基板とほぼ等しい大きさであって基板と端部を揃えることができる大きさであって基板よりも小さいことを特徴とする請求項5または6に記載の着脱システム。 The attachment / detachment system according to claim 5 or 6, wherein the back plate is substantially equal in size to the substrate and can be aligned with the end portion of the substrate and is smaller than the substrate. 装着部材は、装着体が装着される装着面を有し、当該装着面には着脱装置の挟持手段の一部を挿通可能な挿通口が設けられていることを特徴とする請求項5乃至7のいずれかに記載の着脱システム   The mounting member has a mounting surface on which the mounting body is mounted, and the mounting surface is provided with an insertion port through which a part of the holding means of the attachment / detachment device can be inserted. The detachable system according to any one of 固定手段は、露出口の周囲に相当する位置にあることを特徴とする請求項5乃至8のいずれかに記載の着脱システム。   9. The attachment / detachment system according to claim 5, wherein the fixing means is located at a position corresponding to the periphery of the exposure port. 装着体を装着部材側に付勢する付勢手段を具備していることを特徴とする請求項5乃至9のいずれかに記載の着脱システム。   The attaching / detaching system according to claim 5, further comprising an urging unit that urges the mounting body toward the mounting member. 背板はカーボン製であることを特徴とする請求項5乃至10のいずれかに記載の着脱システム。   The attachment / detachment system according to any one of claims 5 to 10, wherein the back plate is made of carbon. 移動手段は、装着体を背板側から支持し、当該移動手段によって支持された装着体から少なくとも背板を残して少なくとも基板を着脱可能な移載手段を有し、当該移載手段は、基板の縁面側に当接する縁面当接部と、基板の表面に当接可能な鉤部とを有する挟持部材を有し、前記背板には、移載手段に設けられた挟持部材に相当する位置に前記鉤部と背板との干渉を阻止する切り欠き部が設けられていることを特徴とする請求項5乃至11のいずれかに記載の着脱システム。   The moving means has a transfer means for supporting the mounting body from the back plate side and detaching at least the substrate leaving at least the back plate from the mounting body supported by the moving means. A holding member having an edge contact portion that contacts the edge surface side and a flange that can contact the surface of the substrate, and the back plate corresponds to the holding member provided in the transfer means The attachment / detachment system according to any one of claims 5 to 11, wherein a notch portion for preventing interference between the flange portion and the back plate is provided at a position to be mounted. 請求項5乃至12のいずれかに記載の着脱システムにより装着体の着脱を行うことを特徴とする成膜装置。   A film forming apparatus, wherein the attachment body is attached / detached by the attachment / detachment system according to claim 5. 化学気相蒸着法により基板の表面に成膜を行うことを特徴とする請求項13に記載の成膜装置。   The film forming apparatus according to claim 13, wherein the film is formed on the surface of the substrate by chemical vapor deposition.
JP2003402353A 2003-12-02 2003-12-02 Attaching / detaching apparatus, attaching / detaching system, and film forming apparatus Expired - Fee Related JP4522081B2 (en)

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JPS6243144A (en) * 1985-08-21 1987-02-25 Toshiba Corp Wafer attaching and detaching apparatus
JPH02101164A (en) * 1988-10-06 1990-04-12 Shin Meiwa Ind Co Ltd Automatic transposing device for substrate
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JPH08252790A (en) * 1995-03-15 1996-10-01 Fujitsu Ltd Robot and semiconductor manufacturing equipment
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