JP3654205B2

JP3654205B2 - Vacuum processing apparatus and substrate transfer method in vacuum processing apparatus

Info

Publication number: JP3654205B2
Application number: JP2001075799A
Authority: JP
Inventors: 良太古川
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2001-03-16
Filing date: 2001-03-16
Publication date: 2005-06-02
Anticipated expiration: 2021-03-16
Also published as: JP2002273197A

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum treatment apparatus capable of preventing the feed mistake of a substrate, and a substrate feed method in the vacuum treatment apparatus. SOLUTION: In the substrate feed method in the vacuum treatment apparatus for performing the feed of the substrate 5 in and out of the placing part 7a in a vacuum chamber 2a, the substrate 5 is held in a horizontal posture in a feed-in guide part 10 at the time of feed-in operation to be allowed to stand by and the feed-in guide part 10 is allowed to approach the placing part 7a by a cylinder 15 when the vacuum chamber 2a is in an open state to be connected to a substrate guide part 8, and the substrate 5 on the feed-in guide part 10 is moved on the placing part 7a by a feed-in arm 13. At the time of feed-out operation, a feed-out guide part 11 is allowed to approach the placing part 7a by a cylinder 18 to be connected to the substrate guide part 8 and the substrate 5 on the placing part 7a is fed out to the feed-out guide part 11 by a feed-out arm 14. By this constitution, the discontinuous part of the guide part is not generated at the time of feed of the substrate 5 and the feed in and out of the substrate 5 can be certainly performed.

Description

【０００１】
【発明の属する技術分野】
本発明は、基板を対象としてプラズマ処理などの真空処理を行う真空処理装置及び真空処理装置における基板搬送方法に関するものである。
【０００２】
【従来の技術】
基板の表面処理を行う装置として、プラズマ処理装置が知られている。このプラズマ処理装置は、減圧雰囲気の処理室内でプラズマを発生させて対象物である基板のプラズマ処理を行うものである。処理室内に基板を搬入する方法として、一般に平面状に設けられた搬送路上で基板を水平姿勢で搬送する方法が用いられている。この方法は基板の幅寸法に対応して側面ガイドが設けられた搬送路上に基板を載置し、基板の後端部を押送する方法などによって、基板の処理室への搬入および処理室からの搬出を行うものである。
【０００３】
【発明が解決しようとする課題】
ところで、処理室の内部は外部から遮断された密閉構造とする必要があるため、上記搬送路上に処理室の内外を遮断する側壁が下降する部分では、搬送路は処理室の側壁の厚さに相当する隙間分だけ途切れて不連続となる。したがって、この不連続部分を基板が通過する際には、基板は上下方向及び左右方向のいずれもガイドされない状態で移動する。このとき、搬送対象が薄型の基板などそりや撓みを生じやすい基板である場合には、この隙間部分で基板の先端部が不連続部に引っかかり、搬送ミスを起こしやすい。そしてこの搬送ミスにより基板の破損を生じたり、また位置ずれ状態のまま処理室内でのプラズマ処理が実行されて、異常放電を誘発するなどの不具合の原因となっていた。
【０００４】
そこで本発明は、基板の搬送ミスを防止することができる真空処理装置及び真空処理装置における基板搬送方法を提供することを目的とする。
【０００５】
【課題を解決するための手段】
請求項１記載の真空処理装置は、処理対象の基板の真空処理を行う処理室を形成し上下に開閉可能な真空チャンバと、前記処理室内に配設され前記基板を載置するとともに基板の搬送を案内するための基板ガイド部を有する載置部と、前記載置部に搬入される基板を水平姿勢で保持するとともに載置部への基板の搬入動作時に基板をガイドする搬入ガイド部と、載置部からの基板の搬出動作時に基板をガイドするとともに搬出された基板を水平姿勢で保持する搬出ガイド部と、前記真空チャンバが開状態のときに前記搬入ガイド部および搬出ガイド部をそれぞれ載置部に対して接近させて連結するガイド移動手段と、前記搬入ガイド部上の基板を載置部上に移動させる基板搬入移動手段と、載置部上の基板を前記搬出ガイド部上に移動させる基板搬出移動手段とを備えた。
【０００６】
請求項２記載の真空処理装置における基板搬送方法は、上下に開閉可能な真空チャンバ内に形成され真空処理を行う処理室に処理対象の基板を搬入し処理室から搬出する真空処理装置における基板搬送方法であって、前記処理室に配設され前記基板が載置される載置部に基板を搬入する搬入動作は、前記載置部に搬入される基板を搬入ガイド部に水平姿勢で保持させて待機させる待機工程と、前記真空チャンバが開状態のときに前記搬入ガイド部を載置部に対して接近させこの載置部の基板ガイドと連結させる搬入ガイド連結工程と、搬入ガイド連結状態において搬入ガイド部上の基板を基板搬入移動手段によって載置部上に移動させる搬入移動工程とを含み、前記処理室内の載置部から基板を搬出する搬出動作は、前記真空チャンバが開状態のときに搬出ガイド部を載置部に対して接近させて前記基板ガイド部と連結させる搬出ガイド連結工程と、搬出ガイド連結状態において載置部上の基板を基板搬出移動手段によって搬出ガイド部上に移動させる搬出移動工程とを含む。
【０００７】
請求項３記載の真空処理装置における基板搬送方法は、請求項２記載の真空処理装置における基板搬送方法であって、前記搬入ガイド部と搬出ガイド部とを基板ガイド部に連結しているときに、搬入移動工程と搬出移動工程とを同時に行う。
【０００８】
本発明によれば、処理室内への基板の搬入動作時に基板をガイドする搬入ガイド部と処理室からの基板の搬出動作時に基板をガイドする搬出ガイド部とを水平移動させるガイド移動手段を備え、真空チャンバが開状態のときに搬入ガイド部および搬出ガイド部をそれぞれ載置部に対して接近させて、載置部上における基板の搬送動作時に基板を案内する基板ガイド部と連結することにより、基板搬送時にガイド部の不連続部分が発生せず、処理室への基板の搬入・搬出を確実に行うことができる。
【０００９】
【発明の実施の形態】
次に本発明の実施の形態を図面を参照して説明する。図１は本発明の一実施の形態の真空処理装置の斜視図、図２は本発明の一実施の形態の真空処理装置の載置部の斜視図、図３、図４は本発明の一実施の形態の真空処理装置の部分斜視図、図５、図６は本発明の一実施の形態の真空処理装置における基板搬送方法の動作説明図である。
【００１０】
まず、図１を参照して真空処理装置の全体構造を説明する。図１において、真空処理装置は、基板供給部１、真空処理部２および基板回収部３より構成される。真空処理部２は、ベース部６と蓋部材９より構成され蓋部材９が昇降することにより上下に開閉可能な真空チャンバ２ａを備えており、蓋部材９がベース部６の上面に当接した状態で、真空チャンバ２ａは処理対象の基板の真空処理を行うための密閉された処理室９ａを形成する（図５（ａ）参照）。
【００１１】
図２に示すように、ベース部６上の上記処理室９ａ内には、電極部７がベース部６の上面から上方に突出して設けられており、電極部７の上面は処理対象の基板５を載置する載置部７ａとなっている。載置部７ａは基板５を載置するとともに基板５の搬送を案内するための基板ガイド部８を有している。基板ガイド部８の上面には、基板搬送時に基板５の側面をガイドする３条のガイドレール８ａ，８ｂ，８ｃが設けられており、２枚の基板５を同時に載置・搬送できるようになっている。
【００１２】
蓋部材９が下降してその側壁部が当接するベース部６の上面にはシール部材６ｃが装着されており、当接時に蓋部材９とベース部６上面とを密閉する。またベース部６の上面には、ガス供給孔６ａ、真空排気・大気導入孔６ｂが設けられている。
【００１３】
図１において基板供給部１は、真空処理対象の基板５を段積み状態で多数収納するマガジン４を備えており、マガジン４と真空処理部２の間には搬入ガイド部１０が配設されている。搬入ガイド部１０は、マガジン４から押し出され載置部７ａに搬入される基板５を水平姿勢で保持するとともに、載置部７ａへの基板５の搬入動作時に基板５をガイドする。搬入ガイド部１０上の基板５は、さらに電極部７上の基板ガイド部８へ乗り移り、載置部７ａへ搬入される。この基板搬入動作時の基板５の移動は、搬入アーム１３によって基板５を押送することによって行われる。
【００１４】
基板回収部３は、基板供給部１と同様のマガジン４を備えており、真空処理部２と基板回収部３との間には、搬出ガイド部１１が配設されている。搬出ガイド部１１は、載置部７ａからの基板５の搬出動作時に基板５をガイドするとともに搬出された基板５を水平姿勢で保持する。真空処理部２において真空処理された基板５は、基板ガイド部８から搬出ガイド部１１上に乗り移り、さらに搬出ガイド部１１上からマガジン４内に押し込まれて回収される。この基板搬出動作時の基板５の移動は、搬送アーム１４によって基板５を押送することによって行われる。
【００１５】
次に図３、図４を参照して、基板５を電極部７上の載置部７ａへ搬入し、搬出する基板搬送機構の詳細について説明する。図３において、搬入ガイド部１０、搬出ガイド部１１は、それぞれアーム部材１６，１７によって保持されている。アーム部材１６，１７は、それぞれシリンダ１５，１８のロッド１５ａ，１８ａに結合されており、搬入ガイド部１０、搬出ガイド部１１はそれぞれシリンダ１５，１８によってＸ方向に水平往復動可能となっている。
【００１６】
また搬入ガイド部１０、搬出ガイド部１１は、それぞれ基板ガイド部８のガイドレール８ａ，８ｂ，８ｃと同様の配列の、ガイドレール１０ａ，１０ｂ，１０ｃおよびガイドレール１１ａ，１１ｂ，１１ｃを備えている。ここで搬入ガイド部１０、搬出ガイド部１１の基板ガイド部８に対する相対位置は、Ｙ方向についてはガイドレール１０ａ，１０ｂ，１０ｃおよびガイドレール１１ａ，１１ｂ，１１ｃが、それぞれ対応するガイドレール８ａ，８ｂ，８ｃと同一直線上に位置するように、またＺ方向については、搬入ガイド部１０、搬出ガイド部１１の搬送面が基板ガイド部８の搬送面と同一高さとなるように配置されている。
【００１７】
したがって、図４に示すようにシリンダ１５を駆動して、搬入ガイド部１０の下流側の端部１０ｅが載置部７ａに接近するように、すなわち、端部１０ｅが基板ガイド部８の上流側の端部８ｄに接近するように搬入ガイド部１０を水平移動させることにより、搬入ガイド部１０は基板ガイド部８と連結する。
【００１８】
また同様に、シリンダ１８を駆動して、搬出ガイド部１１の上流側の端部１１ｄが載置部７ａに接近するように、すなわち、端部１１ｄが基板ガイド部８の下流側の端部８ｅに接近するように搬出ガイド部１１を水平移動させることにより、搬出ガイド部１１は基板ガイド部８と連結する。シリンダ１５，１８は、真空チャンバ２ａが開状態のときに搬入ガイド部１０および搬出ガイド部１１をそれぞれ載置部７ａに対して接近させて連結するガイド移動手段となっている。
【００１９】
この連結は、搬入ガイド部１０の一方側（下流側）と載置部７ａとを連結し、同時に搬出ガイド部１１の他方側（上流側）と載置部７ａとを連結する形態となっている。なお、上記実施の形態においては、図３に示すように搬入ガイド部１０の下流側の端部１０ｅが基板ガイド部８の上流側の端部８ｄに、また搬出ガイド部１１の上流側の端部１１ｄが基板ガイド部８の下流側の端部８ｅに、それぞれほとんど当接する位置まで接近させる例を示しているが、接近状態において、基板５の乗り移りに差し障りがない範囲で各連結面に隙間を設けるようにしてもよい。
【００２０】
そしてこの連結状態において、搬入ガイド部１０から載置部７ａへの基板５の搬入、および載置部７ａから搬出ガイド部１１への基板５の搬出が行われる。Ｘ方向に配設された移動テーブル１２には、搬入アーム１３、搬出アーム１４が設けられており、搬入アーム１３は搬入ガイド部１０と基板ガイド部８を移動範囲として、また搬出アーム１４は基板ガイド部８と搬出ガイド部１１を移動範囲として、それぞれＸ方向に移動する。また搬入アーム１３、搬出アーム１４は図示しない上下動機構により上下動可能となっている。
【００２１】
搬入アーム１３、搬出アーム１４は、それぞれ搬送爪１３ａ，１４ａを備えており、搬送爪１３ａ，１４ａを基板５の後端部に当接させた状態で移動テーブル１２を駆動することにより、搬入アーム１３、搬出アーム１４はそれぞれ搬入ガイド部１０から基板ガイド部８へ、また基板ガイド部８から搬出ガイド部１１へ基板５を移動させる。したがって移動テーブル１２と搬入アーム１３は、搬入ガイド部１０上の基板５を載置部７ａ上に移動させる基板搬入移動手段となっており、また移動テーブル１２と搬出アーム１４は、載置部７ａ上の基板５を搬出ガイド部１１上に移動させる基板搬出移動手段となっている。
【００２２】
この真空処理装置の基板搬送機構は上記のような構成となっており、以下真空処理装置における基板搬送動作について、図５、図６を参照して説明する。図５、図６は、１つの基板５を対象として処理室９ａ内での真空処理が完了した後、この基板５を搬出して新たな基板５を処理室９ａ内の載置部７ａに搬入するまでの一連の動作を示している。
【００２３】
図５（ａ）において、真空チャンバ２ａの蓋部材９はベース部６上に下降した状態にあり、この状態で形成される処理室９ａ内では、電極部７上の基板ガイド部８に載置された基板５を対象とした真空処理が行われている。このとき、搬入ガイド部１０では既に次の基板５が水平姿勢で保持されて待機状態にあり、搬出ガイド部１１は空状態となっている。そして、搬入アーム１３の搬送爪１３ａ、搬出アーム１４の搬送爪１４ａは、それぞれ待機位置にある。
【００２４】
処理室９ａ内での真空処理が完了すると、図５（ｂ）に示すように、蓋部材９が上昇して真空チャンバ２ａが開状態となる。そしてこの後搬送爪１４ａが基板ガイド部８の上流側まで移動する。次いで図５（ｃ）に示すように、搬入ガイド部１０および搬出ガイド部１１をそれぞれ基板ガイド部８に対して接近させ連結する。
【００２５】
そしてこの状態で、搬送爪１３ａ，１４ａを下降させ、搬入ガイド部１０上の基板５、基板ガイド部８上の基板５のそれぞれの後端部に位置させる。次いで図５（ｄ）に示すように搬送爪１３ａ，１４ａを下流側へ移動させることにより、真空処理後の基板５は載置部７ａから搬出ガイド部１１上へ搬出されるとともに、新たな基板５が搬入ガイド部１０上から載置部７ａへ搬入される。この基板搬送動作時において、ベース部６上のシール部材６ｃは上方を搬入ガイド部１０および搬出ガイド部１１によって覆われた状態となることから、シール部材６ｃを異物の接触などによる損耗から保護することができる。
【００２６】
この後、図６（ａ）に示すように、搬送爪１３ａ，１４ａを上昇させ、次いで図６（ｂ）に示すように、搬入ガイド部１０、搬出ガイド部１１を載置部７ａから離隔させるとともに、搬送爪１３ａ，１４ａをそれぞれの待機位置まで退去させる。これにより、新たな真空処理の１サイクルが開始可能な状態となる。
【００２７】
この後図６（ｃ）に示すように、蓋部材９をベース部６上に下降させて形成された処理室９ａ内では、新たな基板５を対象として真空処理が行われるとともに、搬入ガイド部１０には次の基板５がマガジン４から押し出されて供給され、搬入ガイド部１０にて待機状態となる。また搬出ガイド部１１に搬出された処理済みの基板５は、搬送爪１４ａによって下流側のマガジン４内に押し込まれて回収される。
【００２８】
上記説明したように、上記基板搬送方法において、処理室９ａの載置部７ａに基板５を搬入する搬入動作は、載置部７ａに搬入される基板５を搬入ガイド部１０に水平姿勢で保持させて待機させる待機工程と、真空チャンバ２ａが開状態のときに搬入ガイド部１０を載置部７ａに対して接近させこの載置部７ａの基板ガイド部８と連結させる搬入ガイド連結工程と、搬入ガイド連結状態において搬入ガイド部１０上の基板５を搬入アーム１３によって載置部７ａ上に移動させる搬入移動工程とを含んだものとなっている。
【００２９】
また載置部７ａから処理済みの基板５を搬出する搬出動作は、真空チャンバ２ａが開状態のときに搬出ガイド部１１を載置部７ａに対して接近させて基板ガイド部８と連結させる搬出ガイド連結工程と、搬出ガイド連結状態において載置部７ａ上の基板５を搬出アーム１４によって搬出ガイド部１１上に移動させる搬出移動工程とを含むものとなっている。そして上記基板搬送動作においては、搬入ガイド部１０と搬出ガイド部１１とを基板ガイド部８に連結しているときに、搬入移動工程と搬出移動工程とを同時に行う形態となっている。
【００３０】
このような基板搬送方法を採用することにより、基板搬送時に基板を案内するガイド部の不連続部分が発生せず、薄型基板のような反りや撓みを生じやすく搬送ミスが発生しやすい基板を対象とする場合にあっても、処理室への基板の搬入・搬出を確実に行うことができる。
【００３１】
【発明の効果】
本発明によれば、処理室内への基板の搬入動作時に基板をガイドする搬入ガイド部と処理室からの基板の搬出動作時に基板をガイドする搬出ガイド部とを水平移動させるガイド移動手段を備え、真空チャンバが開状態のときに搬入ガイド部および搬出ガイド部をそれぞれ載置部に対して接近させて、載置部上における基板の搬送動作時に基板を案内する基板ガイド部と連結するようにしたので、基板搬送時にガイド部の不連続部分が発生せず、薄型基板を対象とする場合にあっても処理室への基板の搬入・搬出を確実に行うことができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態の真空処理装置の斜視図
【図２】本発明の一実施の形態の真空処理装置の載置部の斜視図
【図３】本発明の一実施の形態の真空処理装置の部分斜視図
【図４】本発明の一実施の形態の真空処理装置の部分斜視図
【図５】本発明の一実施の形態の真空処理装置における基板搬送方法の動作説明図
【図６】本発明の一実施の形態の真空処理装置における基板搬送方法の動作説明図
【符号の説明】
１基板供給部
２真空処理部
２ａ真空チャンバ
３基板回収部
５基板
７電極部
７ａ載置部
８基板ガイド部
１０搬入ガイド部
１１搬出ガイド部
１２移動テーブル
１３搬入アーム
１４搬出アーム
１５，１８シリンダ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a vacuum processing apparatus that performs vacuum processing such as plasma processing on a substrate, and a substrate transport method in the vacuum processing apparatus.
[0002]
[Prior art]
A plasma processing apparatus is known as an apparatus for performing surface treatment of a substrate. This plasma processing apparatus generates plasma in a processing chamber in a reduced-pressure atmosphere to perform plasma processing on a target substrate. As a method for carrying a substrate into a processing chamber, a method is generally used in which a substrate is transported in a horizontal posture on a planar transport path. In this method, the substrate is placed on a transfer path provided with side guides corresponding to the width dimension of the substrate, and the rear end portion of the substrate is pushed in. Carrying out.
[0003]
[Problems to be solved by the invention]
By the way, since the inside of the processing chamber needs to have a sealed structure that is blocked from the outside, in the portion where the side wall that shuts off the inside and outside of the processing chamber descends on the transfer path, the transfer path has the thickness of the side wall of the processing chamber. It becomes discontinuous with a corresponding gap. Therefore, when the substrate passes through the discontinuous portion, the substrate moves in a state where neither the vertical direction nor the horizontal direction is guided. At this time, if the object to be transported is a substrate that tends to bend or bend, such as a thin substrate, the leading end of the substrate is caught by a discontinuous portion at this gap, and a transport error is likely to occur. Then, the substrate is damaged due to the conveyance mistake, or the plasma processing is performed in the processing chamber while being in a misaligned state, which causes problems such as inducing abnormal discharge.
[0004]
Then, an object of this invention is to provide the substrate processing method in a vacuum processing apparatus and a vacuum processing apparatus which can prevent the conveyance mistake of a board | substrate.
[0005]
[Means for Solving the Problems]
The vacuum processing apparatus according to claim 1, wherein a processing chamber for performing vacuum processing of a substrate to be processed is formed, a vacuum chamber that can be opened and closed vertically, and the substrate disposed in the processing chamber for placing the substrate and transporting the substrate A placement unit having a substrate guide part for guiding the substrate, a loading guide part for holding the substrate carried into the placement part in a horizontal posture and guiding the substrate during the loading operation of the substrate to the placement part, The unloading guide unit that guides the substrate during the unloading operation of the substrate from the mounting unit and holds the unloaded substrate in a horizontal posture, and the loading guide unit and the unloading guide unit when the vacuum chamber is in an open state, respectively. A guide moving means for bringing the substrate on the loading guide portion into connection with the placement portion; a substrate loading movement means for moving the substrate on the loading guide portion onto the placement portion; and a substrate on the loading portion moved on the carry-out guide portion. Make And a plate unloading moving means.
[0006]
3. A substrate transfer method in a vacuum processing apparatus according to claim 2, wherein the substrate is transferred in a vacuum chamber formed in a vacuum chamber that can be opened and closed vertically, and a substrate to be processed is carried into and out of the process chamber. The carrying-in operation for carrying a substrate into a placement unit disposed in the processing chamber and on which the substrate is placed is configured to hold the substrate carried into the placement unit in a horizontal posture on the carry-in guide unit. A standby step for waiting, a loading guide coupling step for bringing the loading guide portion close to the mounting portion and connecting to the substrate guide of the loading portion when the vacuum chamber is open, and a loading guide coupling state A loading and moving step of moving the substrate on the loading guide portion onto the mounting portion by the substrate loading and moving means, and the unloading operation for unloading the substrate from the mounting portion in the processing chamber opens the vacuum chamber. An unloading guide connecting step of bringing the unloading guide portion close to the mounting portion and connecting the unloading guide portion to the substrate guide portion; And an unloading / moving step of moving to
[0007]
The substrate transfer method in the vacuum processing apparatus according to claim 3 is the substrate transfer method in the vacuum processing apparatus according to claim 2, wherein the carry-in guide portion and the carry-out guide portion are connected to the substrate guide portion. The carry-in movement process and the carry-out movement process are performed simultaneously.
[0008]
According to the present invention, it is provided with a guide moving means for horizontally moving a carry-in guide portion that guides the substrate during the carry-in operation of the substrate into the processing chamber and a carry-out guide portion that guides the substrate during the carry-out operation of the substrate from the processing chamber, By bringing the carry-in guide portion and the carry-out guide portion close to the placement portion when the vacuum chamber is in an open state, and connecting with the substrate guide portion that guides the substrate during the substrate transport operation on the placement portion, A discontinuous portion of the guide portion does not occur when the substrate is transported, and the substrate can be reliably carried into and out of the processing chamber.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of a vacuum processing apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a mounting portion of the vacuum processing apparatus according to an embodiment of the present invention, and FIGS. FIG. 5 is a partial perspective view of the vacuum processing apparatus of the embodiment, and FIG. 5 and FIG.
[0010]
First, the overall structure of the vacuum processing apparatus will be described with reference to FIG. In FIG. 1, the vacuum processing apparatus includes a substrate supply unit 1, a vacuum processing unit 2, and a substrate recovery unit 3. The vacuum processing unit 2 includes a base chamber 6 and a lid member 9, and includes a vacuum chamber 2 a that can be opened and closed vertically when the lid member 9 moves up and down, and the lid member 9 is in contact with the upper surface of the base unit 6. In this state, the vacuum chamber 2a forms a sealed processing chamber 9a for performing vacuum processing on the substrate to be processed (see FIG. 5A).
[0011]
As shown in FIG. 2, an electrode portion 7 is provided in the processing chamber 9 a on the base portion 6 so as to protrude upward from the upper surface of the base portion 6, and the upper surface of the electrode portion 7 is the substrate 5 to be processed. It becomes the mounting part 7a which mounts. The placement portion 7 a has a substrate guide portion 8 for placing the substrate 5 and guiding the conveyance of the substrate 5. Three guide rails 8a, 8b, and 8c are provided on the upper surface of the substrate guide portion 8 to guide the side surface of the substrate 5 when the substrate is transported, so that two substrates 5 can be placed and transported simultaneously. ing.
[0012]
A seal member 6c is mounted on the upper surface of the base portion 6 that comes into contact with the side wall portion of the lid member 9 that is lowered, and seals the lid member 9 and the upper surface of the base portion 6 at the time of contact. A gas supply hole 6 a and a vacuum exhaust / atmosphere introduction hole 6 b are provided on the upper surface of the base portion 6.
[0013]
In FIG. 1, the substrate supply unit 1 includes a magazine 4 that stores a large number of substrates 5 to be vacuum processed in a stacked state, and a carry-in guide unit 10 is disposed between the magazine 4 and the vacuum processing unit 2. Yes. The carry-in guide unit 10 holds the substrate 5 pushed out from the magazine 4 and carried into the placement unit 7a in a horizontal posture, and guides the substrate 5 when the substrate 5 is carried into the placement unit 7a. The substrate 5 on the carry-in guide unit 10 is further transferred to the substrate guide unit 8 on the electrode unit 7 and carried into the placement unit 7a. The substrate 5 is moved during the substrate loading operation by pushing the substrate 5 by the loading arm 13.
[0014]
The substrate collection unit 3 includes a magazine 4 similar to the substrate supply unit 1, and a carry-out guide unit 11 is disposed between the vacuum processing unit 2 and the substrate collection unit 3. The unloading guide unit 11 guides the substrate 5 during the unloading operation of the substrate 5 from the placement unit 7a, and holds the unloaded substrate 5 in a horizontal posture. The substrate 5 that has been vacuum-processed in the vacuum processing unit 2 is transferred from the substrate guide unit 8 onto the carry-out guide unit 11 and further pushed into the magazine 4 from the carry-out guide unit 11 and collected. The movement of the substrate 5 during the substrate carry-out operation is performed by pushing the substrate 5 by the transfer arm 14.
[0015]
Next, with reference to FIG. 3 and FIG. 4, the details of the substrate transport mechanism that carries the substrate 5 in and out of the mounting portion 7 a on the electrode portion 7 will be described. In FIG. 3, the carry-in guide portion 10 and the carry-out guide portion 11 are held by arm members 16 and 17, respectively. The arm members 16 and 17 are coupled to the rods 15a and 18a of the cylinders 15 and 18, respectively. The carry-in guide portion 10 and the carry-out guide portion 11 can be horizontally reciprocated in the X direction by the cylinders 15 and 18, respectively. .
[0016]
The carry-in guide unit 10 and the carry-out guide unit 11 include guide rails 10a, 10b, and 10c and guide rails 11a, 11b, and 11c that are arranged in the same manner as the guide rails 8a, 8b, and 8c of the board guide unit 8, respectively. . Here, relative positions of the carry-in guide portion 10 and the carry-out guide portion 11 with respect to the substrate guide portion 8 are such that the guide rails 10a, 10b, 10c and the guide rails 11a, 11b, 11c correspond to the guide rails 8a, 8b in the Y direction, respectively. , 8c, and in the Z direction, the carrying surfaces of the carry-in guide unit 10 and the carry-out guide unit 11 are arranged to be the same height as the carrying surface of the substrate guide unit 8.
[0017]
Therefore, as shown in FIG. 4, the cylinder 15 is driven so that the downstream end portion 10 e of the carry-in guide portion 10 approaches the mounting portion 7 a, that is, the end portion 10 e is upstream of the substrate guide portion 8. The carry-in guide unit 10 is connected to the substrate guide unit 8 by horizontally moving the carry-in guide unit 10 so as to approach the end 8d.
[0018]
Similarly, the cylinder 18 is driven so that the upstream end portion 11 d of the carry-out guide portion 11 approaches the placement portion 7 a, that is, the end portion 11 d is the downstream end portion 8 e of the substrate guide portion 8. The carry-out guide portion 11 is connected to the substrate guide portion 8 by horizontally moving the carry-out guide portion 11 so as to approach the substrate. The cylinders 15 and 18 serve as guide moving means for bringing the carry-in guide portion 10 and the carry-out guide portion 11 close to the placement portion 7a and connecting them when the vacuum chamber 2a is open.
[0019]
This connection connects the one side (downstream side) of the carry-in guide part 10 and the placement part 7a, and simultaneously connects the other side (upstream side) of the carry-out guide part 11 and the placement part 7a. Yes. In the above embodiment, as shown in FIG. 3, the downstream end portion 10 e of the carry-in guide portion 10 is connected to the upstream end portion 8 d of the substrate guide portion 8 and the upstream end portion of the carry-out guide portion 11. Although an example is shown in which the portion 11d approaches the downstream end portion 8e of the substrate guide portion 8 to a position where the portion 11d is almost in contact with each other, there is a gap between each connection surface in a range where there is no hindrance to the transfer of the substrate 5 in the approached state. May be provided.
[0020]
In this connected state, the substrate 5 is carried from the carry-in guide portion 10 to the placement portion 7 a and the substrate 5 is carried from the placement portion 7 a to the carry-out guide portion 11. The moving table 12 arranged in the X direction is provided with a carry-in arm 13 and a carry-out arm 14. The carry-in arm 13 uses the carry-in guide portion 10 and the substrate guide portion 8 as a movement range, and the carry-out arm 14 serves as a substrate. The guide unit 8 and the carry-out guide unit 11 are moved in the X direction, respectively, using the movement range. The carry-in arm 13 and the carry-out arm 14 can be moved up and down by a vertical movement mechanism (not shown).
[0021]
The carry-in arm 13 and the carry-out arm 14 are provided with carrying claws 13a and 14a, respectively, and the carry-in arm is driven by driving the moving table 12 with the carrying claws 13a and 14a being in contact with the rear end portion of the substrate 5. 13. The carry-out arm 14 moves the substrate 5 from the carry-in guide portion 10 to the substrate guide portion 8 and from the substrate guide portion 8 to the carry-out guide portion 11, respectively. Therefore, the moving table 12 and the carry-in arm 13 serve as substrate carrying-in moving means for moving the substrate 5 on the carry-in guide unit 10 onto the placement unit 7a, and the movement table 12 and the carry-out arm 14 are arranged on the placement unit 7a. It is a substrate carry-out moving means for moving the upper substrate 5 onto the carry-out guide portion 11.
[0022]
The substrate transfer mechanism of the vacuum processing apparatus has the above-described configuration, and the substrate transfer operation in the vacuum processing apparatus will be described below with reference to FIGS. 5 and 6, after the vacuum processing in the processing chamber 9 a is completed for one substrate 5, the substrate 5 is unloaded and a new substrate 5 is loaded into the placement unit 7 a in the processing chamber 9 a. A series of operations up to is shown.
[0023]
In FIG. 5A, the lid member 9 of the vacuum chamber 2a is lowered onto the base portion 6, and is placed on the substrate guide portion 8 on the electrode portion 7 in the processing chamber 9a formed in this state. Vacuum processing is performed on the substrate 5 that has been processed. At this time, the next substrate 5 is already held in a horizontal posture in the carry-in guide unit 10 and is in a standby state, and the carry-out guide unit 11 is in an empty state. And the conveyance nail | claw 13a of the carrying-in arm 13 and the conveyance claw 14a of the carrying-out arm 14 are each in a standby position.
[0024]
When the vacuum processing in the processing chamber 9a is completed, the lid member 9 is raised and the vacuum chamber 2a is opened as shown in FIG. 5 (b). Thereafter, the transport claw 14 a moves to the upstream side of the substrate guide portion 8. Next, as shown in FIG. 5C, the carry-in guide portion 10 and the carry-out guide portion 11 are respectively brought close to and connected to the substrate guide portion 8.
[0025]
In this state, the transport claws 13 a and 14 a are lowered and positioned at the rear end portions of the substrate 5 on the carry-in guide portion 10 and the substrate 5 on the substrate guide portion 8. Next, as shown in FIG. 5 (d), the transport claws 13a and 14a are moved to the downstream side, whereby the substrate 5 after the vacuum processing is carried out from the placement portion 7a onto the carry-out guide portion 11 and a new substrate. 5 is carried in from the carrying-in guide part 10 to the mounting part 7a. During the substrate transport operation, the seal member 6c on the base portion 6 is covered with the carry-in guide portion 10 and the carry-out guide portion 11 so that the seal member 6c is protected from wear due to contact with foreign matter. be able to.
[0026]
Thereafter, as shown in FIG. 6A, the transport claws 13a and 14a are raised, and then the carry-in guide portion 10 and the carry-out guide portion 11 are separated from the placement portion 7a as shown in FIG. 6B. At the same time, the conveying claws 13a and 14a are moved back to their respective standby positions. As a result, one cycle of a new vacuum process can be started.
[0027]
Thereafter, as shown in FIG. 6C, in the processing chamber 9a formed by lowering the lid member 9 on the base portion 6, vacuum processing is performed on a new substrate 5, and a carry-in guide portion is formed. The next substrate 5 is pushed out of the magazine 4 and supplied to 10, and the carry-in guide unit 10 enters a standby state. Further, the processed substrate 5 carried out to the carry-out guide part 11 is pushed into the magazine 4 on the downstream side and collected by the conveyance claw 14a.
[0028]
As described above, in the substrate transport method, the loading operation for loading the substrate 5 into the placement unit 7a of the processing chamber 9a holds the substrate 5 loaded into the placement unit 7a in the horizontal position on the loading guide unit 10. A standby process for waiting, and a carry-in guide coupling process in which the carry-in guide unit 10 is brought close to the placement unit 7a when the vacuum chamber 2a is in an open state and coupled to the substrate guide unit 8 of the placement unit 7a, This includes a carry-in movement step in which the substrate 5 on the carry-in guide portion 10 is moved onto the placement portion 7a by the carry-in arm 13 in the carry-in guide connected state.
[0029]
Further, the unloading operation for unloading the processed substrate 5 from the mounting portion 7a is carried out by bringing the unloading guide portion 11 closer to the mounting portion 7a and connecting to the substrate guide portion 8 when the vacuum chamber 2a is open. This includes a guide connecting step and a carry-out moving step in which the substrate 5 on the placement portion 7a is moved onto the carry-out guide portion 11 by the carry-out arm 14 in the carry-out guide connected state. And in the said board | substrate conveyance operation, when the carrying-in guide part 10 and the carrying-out guide part 11 are connected with the board | substrate guide part 8, it becomes a form which performs a carrying-in movement process and a carrying-out movement process simultaneously.
[0030]
By adopting such a substrate transfer method, the discontinuous portion of the guide part that guides the substrate during substrate transfer does not occur, and it is intended for substrates that are prone to warp and bend like thin substrates and that are likely to cause transfer errors. Even in this case, it is possible to reliably carry the substrate into and out of the processing chamber.
[0031]
【The invention's effect】
According to the present invention, it is provided with a guide moving means for horizontally moving a carry-in guide portion that guides the substrate during the carry-in operation of the substrate into the processing chamber and a carry-out guide portion that guides the substrate during the carry-out operation of the substrate from the processing chamber, When the vacuum chamber is in an open state, the carry-in guide portion and the carry-out guide portion are brought close to the placement portion, and are connected to the substrate guide portion that guides the substrate when the substrate is transported on the placement portion. Therefore, a discontinuous portion of the guide portion does not occur when the substrate is transported, and the substrate can be reliably loaded into and unloaded from the processing chamber even when a thin substrate is targeted.
[Brief description of the drawings]
FIG. 1 is a perspective view of a vacuum processing apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of a mounting portion of the vacuum processing apparatus according to an embodiment of the present invention. 4 is a partial perspective view of the vacuum processing apparatus according to the embodiment. FIG. 4 is a partial perspective view of the vacuum processing apparatus according to the embodiment of the present invention. FIG. 6 is an operation explanatory view of a substrate transfer method in a vacuum processing apparatus according to an embodiment of the present invention.
DESCRIPTION OF SYMBOLS 1 Substrate supply part 2 Vacuum processing part 2a Vacuum chamber 3 Substrate recovery part 5 Substrate 7 Electrode part 7a Placement part 8 Substrate guide part 10 Carry-in guide part 11 Carry-out guide part 12 Moving table 13 Carry-in arm 14 Carry-out arm 15, 18 Cylinder

Claims

A vacuum chamber that forms a processing chamber for performing vacuum processing of a substrate to be processed and that can be opened and closed vertically, and a substrate guide portion that is disposed in the processing chamber and places the substrate and guides the conveyance of the substrate. A loading unit, a loading guide unit that holds the substrate loaded into the loading unit in a horizontal posture and guides the substrate during the loading operation of the substrate to the loading unit, and a substrate unloading operation from the loading unit A carry-out guide portion that guides the substrate and holds the unloaded substrate in a horizontal posture, and the carry-in guide portion and the carry-out guide portion are respectively connected to the placement portion when the vacuum chamber is in an open state. Guide moving means, substrate carry-in moving means for moving the substrate on the carry-in guide section onto the placement section, and substrate carry-out movement means for moving the substrate on the placement section onto the carry-out guide section. The vacuum processing apparatus according to claim.

A substrate transfer method in a vacuum processing apparatus for carrying a substrate to be processed into a processing chamber that is formed in a vacuum chamber that can be opened and closed vertically and performing vacuum processing, and is disposed in the processing chamber. The carrying-in operation of carrying the substrate into the placement unit on which the substrate is placed includes a standby step in which the substrate carried into the placement unit is held in a horizontal posture by the loading guide unit, and the vacuum chamber is in an open state. A loading guide connecting step of sometimes bringing the loading guide portion closer to the loading portion and coupling the loading guide portion to the substrate guide of the loading portion; and placing the substrate on the loading guide portion by the loading / unloading movement means in the loading guide coupled state An unloading operation for unloading the substrate from the mounting unit in the processing chamber by bringing the unloading guide unit closer to the mounting unit when the vacuum chamber is open. Previous A vacuum processing apparatus comprising: a carry-out guide coupling step for coupling with the substrate guide portion; and a carry-out movement step for moving the substrate on the placement portion onto the carry-out guide portion by the substrate carry-out movement means in the carry-out guide coupled state. Substrate transport method.

3. The substrate transfer method in a vacuum processing apparatus according to claim 2, wherein when the carry-in guide portion and the carry-out guide portion are connected to the substrate guide portion, the carry-in movement step and the carry-out movement step are performed simultaneously.