JP4508939B2 - Electronic heating element cooling device - Google Patents

Description

  The present invention relates to a device for cooling an electronic heating element such as a CPU or MPU, and more particularly to a cooling device for an electronic heating element that is small in size and excellent in heat dissipation and quietness.

  In recent years, the amount of heat generation (power consumption) of the entire computer (hereinafter referred to as “PC”) has been increasing year by year, and among the various parts constituting the PC, the heat generation amount is particularly large among CPUs and MPUs. (Hereinafter referred to as “electronic heating element”). In particular, some CPUs have a TDP (thermal design power) exceeding 100 W, and the maximum one is 115 W (such as Pentium 4 (registered trademark) 600 series).

  As a device for cooling such an electronic heating element, an air cooling type cooling device and a water cooling type cooling device are generally used.

  In the air-cooling type cooling device, the contact surface of the heat sink is joined to the surface (heat radiation surface) of the electronic heating element via a heat conductor made of a heat conductive sheet or silicon grease, Then, the electronic heating element is cooled by sending air from the fan.

  The water-cooling type cooling device fixes a water-cooling jacket (water-cooling head) through which the coolant flows on the surface (heat radiation surface) of the electronic heating element, and also includes an outlet / inlet of the radiator provided outside and the inlet / outlet of the cooling head. A circulation channel formed using a tube or the like is provided between them. A pump is provided between the radiator and the water cooling jacket, and when the pump is driven, a coolant circulates between the radiator and the cooling head through the tube. For this reason, the heat generated by the electronic heating element is carried out of the cooling head through the tube together with the cooling liquid as a medium. The cooling liquid warmed at this time is cooled by the radiator and then returned to the cooling head (electronic heating element) side to cool the electronic heating element.

  As other cooling devices, for example, those using a cooling gas or the Peltier effect exist.

For example, Patent Documents 1 and 2 exist as prior art documents related to the above technique.
JP 2002-280780 A JP 2002-335091 A

  Both the air-cooling type cooling device and the water-cooling type cooling device are known to have a high cooling capacity. However, as the heat generation amount of the electronic heating element increases, further improvement of the cooling capacity is required in the future.

  However, since the heat sink of the air-cooled cooling device and the cooling jacket of the water-cooled cooling device are both in contact with only the surface (heat radiating surface) of the electronic heating element, heat is generated only from one surface of the electronic heating element. There is a limit to improving the cooling efficiency.

  In this regard, it is possible to increase the cooling efficiency by increasing the flow rate of air that hits the heat sink in the air-cooled cooling device, and by increasing the flow rate of air that hits the radiator in the water-cooled cooling device.

  However, for that purpose, it is necessary to increase the number of rotations of the fan or to employ a fan having a large aperture. However, in the former method, the operation sound (wind noise or rotation sound) of the fan during rotation is greatly reduced or silenced. There is a problem that it is not suitable for noise reduction. On the other hand, the latter method has a problem that it is difficult to downsize the entire PC.

  The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to provide a cooling device for an electronic heating element having excellent cooling capacity by itself or in combination with a conventional cooling method.

  Another object of the present invention is to provide a cooling device for an electronic heating element that is small in size and excellent in heat dissipation and quietness.

The present invention relates to a cooling device for cooling an electronic heating element held in a socket ,
The socket comprises a housing in which the electronic heat-generating body is mounted, said electronic heating element possess a lid body that holds in the housing to cool the electronic heating element in at least one of the lid and the housing cooling Means are provided ,
A high-temperature portion where the temperature is increased according to the uneven distribution of heat generated by the electronic heating element and a low-temperature portion where the temperature is lower than the high-temperature portion are formed, and the cooling means includes both the high-temperature portion and the low-temperature portion. A cooling pipe that passes through the region, a cooling liquid inside the cooling pipe, a pair of pumps provided at both ends of the cooling pipe, and when one of the pumps applies a positive pressure, the other pump has a negative pressure. Driver means for driving the pump is provided so as to provide the above .

  In the cooling device for an electronic heating element of the present invention, the heat generated by the electronic heating element such as a CPU can be taken away directly or via a socket holding the electronic heating element. The heating element can be cooled more efficiently. For this reason, when combined with a conventional cooling device, it is possible to provide a cooling device for an electronic heating element that is more excellent in cooling capacity. Therefore, since it becomes possible to set the rotation speed of the fan of the conventional cooling device low, the quietness of PC can be improved.

In the present invention, for example, in both the high temperature part and the low temperature part, the cooling pipe is bent in a state where a plurality of pipe lines in which the flow of the cooling liquid is opposite to each other are adjacent to each other.

Alternatively, the high temperature part is formed in a central part of a region where the cooling means is disposed , the low temperature part is formed in a peripheral part of the high temperature part, and the cooling pipe alternates between the high temperature part and the low temperature part. Is bent to pass through.

In the above, it is preferable that the cooling pipe is alternately bent at the high temperature part and the low temperature part, and that the pitch of the bent cooling pipe is wider than the high temperature part.

In order to increase the cooling capacity, it is good preferable that air-cooling fan is provided.

  The present invention can provide a cooling device for an electronic heating element having excellent cooling performance as a single unit.

  In addition, when combined with a conventional cooling device, it is not necessary to increase the air flow rate of the fan, so that it is possible to contribute to the noise reduction of the PC on which such a cooling device for an electronic heating element is mounted.

  Further, since the cooling pipe is integrated with the socket, it is not necessary to fix the water cooling jacket formed separately as in the conventional case to the electronic heating element. Furthermore, since it is not necessary to employ a fan having a large aperture, it is possible to contribute to downsizing of the entire PC.

FIG. 1 is a plan view showing a cooling device for an electronic heating element as a first reference example , and FIG. 2 is a sectional view taken along line 2-2 of FIG.

The cooling device shown in FIGS. 1 and 2 has a socket 10A for holding an electronic heating element 1 such as a CPU. The socket 10 </ b> A includes a frame-shaped housing 11 and a lid 12 that is rotatably supported with a hinge portion 13 provided at one end of the housing 11 as a fulcrum.

  As shown in FIG. 2, the housing 11 is fixed at a predetermined position on the mother board 5. A recess 11a is formed inside the housing 11, and an interposer 15 is provided in the recess 11a. A plurality of elastic contacts 16 and 17 are provided on the upper and lower surfaces of the interposer 15. The individual elastic contacts 16 on the upper side of the interposer 15 and the individual elastic contacts 17 on the lower side are electrically connected to each other via a plurality of conductors 18 embedded in the thickness of the interposer 15. The lower elastic contact 17 is placed in contact with a plurality of counter electrodes 5 a formed on the mother board 5.

  Examples of the elastic contacts 16 and 17 include a spiral contact in which the conductive deformation portion rises in a spiral shape from the peripheral portion toward the center, a stressed metal that causes the elastic deformation portion to bend by applying different internal stresses, An adhesive connector disclosed in Japanese Patent Application Laid-Open Nos. 2004-186026 and 2004-281116 can be used.

  A heat sink 20 is provided on the upper surface of the housing 11. The heat sink 20 is formed of aluminum or the like having high thermal conductivity, and a plurality of heat radiation fins 21, 21,.

  As shown in FIG. 2, the heat sink 20 may be one in which the radiating fins 21 are formed integrally with the lid body 12 or may be formed separately. In the case of the heat sink 20 in which the heat radiating fins 21 are integrated with the lid body 12, the upper surface of the metal cover provided on the lower surface of the lid body 12 and the surface side of the electronic heating element 1 (heat radiation). Surface) (hereinafter referred to as “the surface of the electronic heating element 1”). When the heat sink 20 is separate from the lid 12, an opening in which the bottom surface (contact surface) of the heat sink and the surface of the electronic heating element 1 are formed in the lid 12 (see FIG. 3). ). In any case, it is preferable that the lower surface of the heat sink 20 and the surface of the electronic heating element 1 be joined via a heat conductor (not shown) made of a heat conductive sheet or silicon grease.

  Within the pitch dimension in the width direction of the heat radiating fins 21 forming the heat sink 20, a meandering shape (also referred to as a meander shape) formed by bending a plurality of continuous pipes made of copper or the like is used. The cooling pipe 23 is fixed by brazing, for example. The meandering portion of the cooling pipe 23 is a meandering portion 23A. Between the one end 23a and the other end 23b of the cooling pipe 23, for example, a pump 31, a radiator 32, and the like are provided. One circulation channel is formed.

  The electronic heating element 1 is mounted in the recess 11a of the housing 11 with the lid 12 opened. Next, the lid 12 is turned in the closing direction to be closed, and the housing 11 and the lid 12 are locked using locking means as shown in FIG. 11 and the lid body 12.

  At this time, the surface of the lid 12 and the surface of the electronic heating element 1 are brought into close contact with each other via a heat conductor. At the same time, the electronic heating element 1 is pressurized in the Z2 direction by the lid 12 so that the elastic contacts 16 and 17 are slightly elastically deformed in the Z direction. Thereby, a plurality of external connection electrodes (LGA) 1 a provided on the lower surface of the electronic heating element 1 and a plurality of counter electrodes 5 a formed on the mother board 5 connect the elastic contacts 16, 17 of the interposer 15. Are connected to each other.

  A cooling liquid 35 is injected into the cooling pipe 23. Then, by starting the pump 31, the coolant 35 circulates in the cooling pipe 23. When the coolant 35 passes through the meandering portion 23 </ b> A of the cooling pipe 23, it takes away the heat generated by the electronic heating element 1. Then, the coolant 35 warmed at this time is cooled by the radiator 32 and returned to the meandering portion 23A on the heat sink 20 again. For this reason, since heat can be exchanged between the heat sink 20 and the radiator 32 using the cooling liquid 35 as a medium, the cooling capacity can be increased as compared with the case of the heat sink 20 alone.

If it is desired to further cool the electronic heating element 1, the heat sink 20 may be directly air-cooled by providing a fan 39 above the heat sink 20, as indicated by a dotted line in FIG. Conventionally, there is a cooling device that is air-cooled by providing a fan 39 on the top of the heat sink 20, but in the cooling device of the first reference example , in addition to this, the heat sink 20 is forcibly water-cooled using the cooling pipe 23. Therefore, it is possible to further increase the cooling capacity.

FIG. 3 is a perspective view showing a socket constituting the cooling device for the electronic heating element of the second reference example of the present invention.

Socket 10B shown in FIG. 3 has substantially the same construction as the socket 10A, has a housing 11 fixed to the motherboard side, the lid 12 rotatably mounted at the hinge portion 13. An opening 12 </ b> A is formed at the center of the lid 12. The surface of the electronic heating element 1 is exposed to the outside of the socket 10B through the opening 12A, and the surface of the electronic heating element 1 and the contact surface of the heat sink can be joined through the opening 12A. Is possible.

  A hooking portion 14 is formed at the end of the lid 12. A hooked portion 11 b is formed at the end of the housing 11 that faces the hooked portion 14. The hooking portion 14 and the hooked portion 11b form a locking means for fixing the housing 11 and the lid body 12 in a closed state.

However, in the cooling device for the electronic heating element of the second reference example, a groove 11B is formed between the outer portion of the housing 11 forming the socket 10B and the recess 11a so as to surround the recess 11a. Is different.

  In the groove 11B, communication grooves 11B1 and 11B2 are formed continuously to the outside of the housing 11. In the premises of the groove 11B and the communication grooves 11B1 and 11B2, a cooling pipe 25 is provided which is formed in a substantially coil shape by winding a single thin tube a plurality of times in accordance with the shape of the groove 11B. That is, the winding portion 25A of the cooling pipe 25 is provided inside the groove 11B, and one end 25a and the other end 25b of the cooling pipe 25 are respectively connected to the housing 11 via the communication groove 11B1 and the communication groove 11B2. It extends to the outside. The cooling pipe 25 is preferably a copper pipe having a high thermal conductivity, but may be a steel pipe or a resin tube.

  In addition, a pump, a radiator, and the like are provided between the one end 25a and the other end 25b of the cooling pipe 25 in the same manner as described above to form one circulation channel together with the cooling pipe 25. is doing.

When the pump is started and the coolant 35 is circulated between the winding portion 25A of the cooling pipe 25 and the radiator, the heat generated from the electronic heating element 1 can be removed. In particular, since the winding portion 25A of the cooling pipe 25 is arranged so as to surround the periphery of the electronic heating element 1, the heat generated from the side surface of the electronic heating element 1 can be cooled.

Therefore, heat generated mainly from the surface of the electronic heating element 1 is cooled using a conventional heat sink and fan combination, and in addition to this, heat generated from the side surface of the electronic heating element 1 is the second reference example. If it cools with this cooling device, it can be set as a cooling device with higher cooling capacity.

FIG. 4 is a cross-sectional view similar to FIG. 2 showing a socket constituting the cooling device for the electronic heating element of the third reference example .

Socket 10C also said socket 10A shown in FIG. 4, 10B and is substantially similar configuration, the upper part of the lid 12 rotatably mounted at the hinge portion 13, heat sink 20 formed integrally or separately Further, a fan 39 is attached to the upper portion of the heat sink 20.

However, the socket 10C of the third reference example, the socket 10A, is different in 10B with the following points.

That is, the housing 11 of the third reference example has a bottom portion 11A. The bottom portion 11A has a plurality of through holes facing a plurality of external connection electrodes (LGA) 1a provided on the lower surface of the electronic heating element 1. A hole 11c is provided. An electrode 11d is formed on the upper surface of the through hole 11c, and a convex electrode 11e protruding in the Z2 direction is formed on the lower surface. The electrode 11d and the convex electrode 11e are conductively connected via a conductor 19 provided in the through hole 11c.

  The through hole 11c has a diameter of less than 1 mm, and the conductor 19, the electrode 11d and the convex electrode 11e can be formed by gold plating or the like, and the inside of the through hole 11c is filled with the gold plated conductor 19. ing. For this reason, the inside and the outside of the recess 11 a of the housing 11 are separated from each other, and the liquid in the recess 11 a is difficult to leak to the outside of the housing 11.

  A pair of opposing grooves 11f and 12a are respectively provided on the upper surface of the four inner walls forming the concave portion 11a and the lower surface of the lid body 12 facing the inner wall, and the pair of opposing grooves 11f and 12a are provided within the premises. Is provided with a packing (or O-ring) 27 made of rubber or the like. For this reason, when the housing 11 is closed with the lid 12 and locked with the locking means, the inside of the recess 11a can be sealed.

  Further, among the four inner walls forming the recess 11a, a pair of opposed inner walls 11C and 11D are formed with through holes 11C1 and 11D1 that pass through to the side, and pipes or the like are fixed to the through holes 11C1 and 11D1. A formed inlet 41 and outlet 42 are provided.

  The socket 10C as described above is fixed in a state of being positioned at a predetermined position on the mother board 5. That is, the socket 10C is fixed by being soldered in a state where the plurality of convex electrodes 11e and the plurality of counter electrodes 5a formed on the mother board 5 are arranged to face each other.

  One end of tubes 43, 43 provided outside is connected to the inlet 41 and the outlet 42 of the socket 10C fixed on the mother board 5, and the other end of the tubes 43, 43 is a socket. It is connected to a pump, a radiator, a reserve tank and the like provided outside 10C.

  An interposer 15 similar to the above is provided in the recessed portion 11a of the housing 11, and the tips of a plurality of elastic contacts 17 provided on the lower surface of the interposer 15 are provided on the bottom surface 11A of the recessed portion 11a. Each of the plurality of electrodes 11d is elastically contacted.

  When the electronic heating element 1 is mounted in the recess 11a, the lid body 12 is closed and locked by a locking means, the electronic heating element 1 can be sealed in the socket 10C. At this time, a plurality of external connection electrodes 1a provided on the lower surface of the electronic heating element 1 and a plurality of counter electrodes 5a provided on the mother board 5 are connected to an elastic contact 16, conductor 18 provided on the interposer 15, The elastic contact 17 and the electrode 11d, the conductor 19, and the convex electrode 11e provided on the bottom surface of the recess 11a are electrically connected.

  The cooling liquid 35 is preferably poured before closing the lid 12, more preferably by pouring water into the lid 12 before mounting the electronic heating element 1 in the recess 11 a. is there.

In the cooling device of the third reference example, when the pump is started and the coolant 35 is circulated between the recess 11a and an external radiator, the coolant 35 in the recess 11a is discharged from the discharge port 42 and the tube. It is led to the radiator through 43. At the same time, the coolant 35 in the radiator can be guided into the recess 11 a through the tube 43 and the inlet 41. At this time, the cooling liquid 35 directly takes heat generated by the electronic heating element 1 and moves to the radiator, so that the electronic heating element 1 can be efficiently cooled.

  In particular, the cooling water penetrates between the elastic contacts 16 and 17, and the bottom surface of the electronic heating element 1 and the external connection electrode 1a can be directly water-cooled, so that the electronic heating element 1 is cooled with extremely high efficiency. can do.

  Here, the cooling liquid 35 is preferably a liquid having non-conductivity so as to insulate the electrodes, and more preferably a liquid having a low viscosity so as to ensure a predetermined flow rate. Examples of the liquid having non-conductivity include insulating oil. For example, Fluorinert (registered trademark) which is a fluorine-based inert liquid can be used as the liquid having a lower viscosity.

  In addition, since the coolant is liable to leak from the connection portion, it is necessary to replenish it periodically. If a reserve tank for the coolant is provided in the circulation path, it can be made almost maintenance-free. In addition, even when the coolant is replenished, it is only necessary to replenish the reserve tank, and it is not necessary to replenish the socket 10C by opening the socket 10C. Therefore, the refilling operation of the coolant 35 can be facilitated.

The structure which cools the electronic heat generating body 1 only with the said cooling device may be sufficient, and it may be used in combination with another cooling device.

The heat generated mainly from the surface of the electronic heating element 1 is cooled in a cooling device comprising a combination of a heat sink and a fan similar to the above, and the heat generated from the lower surface of the electronic heating element 1 is that of the third reference example. If it cools with a cooling device, it can be set as the cooling device provided with the extremely high cooling capacity.

Next, an embodiment of the present invention will be described.
FIG. 5 is a plan view similar to FIG. 1 showing the socket constituting the cooling device for the electronic heating element as the first embodiment of the present invention, FIG. 6 is a cross-sectional view showing the configuration of the micropump, and A is the positive A pressure state, B indicates a negative pressure state.

As shown in FIG. 5, when the temperature distribution on the surface of the electronic heating element 1 in the driving state is measured, it has a high temperature portion 1A in the central region and a temperature higher than that of the high temperature portion 1A in the peripheral portion. A configuration having a low low temperature portion 1B is common. Therefore, in the first embodiment, the fact that the temperature distribution appears on the surface (heat dissipating surface) of the electronic heating element 1 is used.

The socket 10D shown in FIG. 5 has substantially the same configuration as the sockets 10A to C shown in the respective reference examples , and a housing 11 fixed on the mother board 5 and a lid that is rotatably provided at the hinge portion 13. It consists of a body 12.

However, the cooling device shown in the first embodiment is different in that a plurality of heat sinks 20A and 20B are provided in a distributed form. Among these, the heat sink 20A provided at the center of the upper surface is for the high temperature portion 1A, and the heat sink 20B provided on the peripheral side away from the center of the upper surface is for the low temperature portion 1B.

  The heat sinks 20A and 20B may be directly fixed to the surface of the electronic heating element 1 through the opening 12A formed in the lid 12 of the socket 10, or in the socket 10 that does not have the opening 12A. May be integrally formed or fixed on the surface of the lid 12. The heat sinks 20A, 20B have the same configuration in that they have a plurality of heat radiation fins 21, 21,.

Like the first reference example, cooling pipes 51 and 52 made of meandering pipes are arranged between the heat radiation fins 21 of the heat sinks 20A and 20B. The cooling pipe 51 and the cooling pipe 52 are formed continuously by bending one pipe. Alternatively, the cooling pipe 51 and the cooling pipe 52 may be formed by bundling a plurality of fine diameter pipes bent in a meandering manner.

  The cooling pipe 51 and the cooling pipe 52 are separately formed, and one end of the cooling pipe 51 and one end of the cooling pipe 52 are connected by another pipe or tube. Also good.

  As shown in FIG. 5, micro pumps 60A and 60B are connected to the other ends of the cooling pipes 51 and 52, respectively. The micropumps 60A and 60B include, for example, a pressure chamber 61 that contains a coolant 35 as a refrigerant as shown in FIGS. 6A and 6B, a diaphragm 62 that is provided on one surface of the pressure chamber 61 and elastically deforms, A driving unit 63 that is installed on the diaphragm 62 and deforms the diaphragm 62 is provided. As the driving means 63, for example, PZT, TiNi, an electrostatic driving electrode material, an artificial muscle formed by providing opposing electrodes on both sides of a dielectric elastomer, or the like can be used. Moreover, as the diaphragm 62, what is shape | molded into a thin film shape, for example with a metal, Si, poly Si, rubber | gum, other various plastic materials, etc., is used elastically. When the driving means 63 elastically deforms the diaphragm 62, the volume of the pressure chamber 61 can be changed.

  The cooling pipes 51 and 52 are filled with the cooling liquid 35 and are in a sealed state. The diaphragm 62 of the micropump 60A and the diaphragm 62 of the micropump 60B are alternately driven while maintaining a complementary relationship. That is, when the diaphragm 62 of the micropump 60A is driven to the positive pressure state (the state in which the volume is increased) shown in FIG. 6A, the diaphragm 62 of the micropump 60B is in the negative pressure state (the volume is reduced as shown in FIG. 6B). When the diaphragm 62 of the micropump 60A is driven to a negative pressure, the diaphragm 62 of the micropump 60B is driven to a positive pressure.

  For this reason, the cooling liquid 35 filled in the cooling pipes 51 and 52 is bilaterally opposite to each other (a direction from the cooling pipe 51 toward the cooling pipe 52 and a direction from the cooling pipe 52 toward the cooling pipe 51). It is possible to function as a pump to be moved.

  In addition, driver means for generating a predetermined electric signal for driving the driving means 63 of the micropumps 60A and 60B in a complementary manner is provided (not shown). The micro pumps 60A and 60B are driven alternately by receiving an electrical signal from the driver means.

Thus, by alternately driving the micropumps 60A and 60B, the coolant 35 heated in the cooling pipe 51 provided in the high temperature part 1A is moved to the cooling pipe 52 provided in the low temperature part 1B. Can be made. The coolant 35 cooled in the cooling pipe 52 on the low temperature part 1B side can be moved again to the cooling pipe 51 on the high temperature part 1A side. That is, it is possible to perform heat exchange by moving the coolant 35 as a refrigerant between the cooling pipe 51 located in the high temperature part 1A and the cooling pipe 52 located in the low temperature part 1B. . Therefore, also in the first embodiment of the present invention shown in FIG. 5, the heat generated by the electronic heating element 1 can be cooled. For this reason, the temperature rise of the main body of the electronic heating element 1 and further the temperature rise in the PC case having the electronic heating element 1 can be suppressed.

In the first embodiment, a small PZT or the like can be used as a driving means for the micropumps 60A and 60B, and a radiator is not required. Therefore, the cooling device is small and has excellent power saving performance. It is possible.

  Further, if the heat sinks 20A and 20B are forcibly air-cooled using a fan in the same manner as described above, a cooling device with higher cooling capacity can be obtained.

In the first embodiment, one low temperature part 1B corresponds to one high temperature part 1A, and heat exchange is performed only between them. However, the present invention is not limited to this. Absent. That is, a configuration in which a plurality of low temperature portions 1B correspond to one high temperature portion 1A and heat exchange is performed may be used, and in this case, a cooling device having further excellent cooling capability can be obtained.

FIG. 7 is a plan view similar to FIG. 1 showing a socket constituting a cooling device for an electronic heating element as a second embodiment of the present invention.

  In FIG. 7, a single pipe is bent on the surface of the lid 12 constituting the socket 10 </ b> E, and in a flat star shape (also referred to as a substantially radial shape or a fan shape) between the central portion and the peripheral portion of the lid 12. The structure to which the arranged cooling pipe 70 is fixed is shown. The center of the cooling pipe 70 passes through the high temperature part 1A of the electronic heating element 1, and the peripheral part of the cooling pipe 70 has a lower temperature than that of the high temperature part 1A. The pitch width between the adjacent cooling pipes 70 arranged so as to face the portion 1B is such that the pitch width W1 of the high temperature portion 1A is wider than the pitch width W2 on the low temperature portion 1B side. It is formed with.

The cooling liquid 35 is filled in the cooling pipe 70 arranged in a substantially pleat shape, and micro pumps 60A and 60B similar to those in the first embodiment are provided at both ends of the cooling pipe 70. Each is provided. The micro pumps 60A and 60B are driven alternately in the same manner as described above.
Yes.

When the micropumps 60A and 60B are driven alternately, the cooling liquid 35 can be moved in the cooling pipe 70 in both the forward direction from the micropump 60A to the micropump 60B and the opposite direction. For this reason, the coolant 35 heated in the high temperature part 1A can be moved to the low temperature part 1B. Moreover, the coolant 35 cooled in the low temperature part 1B can be moved to the high temperature part 1A. That is, heat exchange can be performed by moving the cooling liquid 35 as a refrigerant between the cooling pipe 70 located in the high temperature part 1A and the cooling pipe 70 located in the low temperature part 1B. For this reason, also in what is shown as the second embodiment in FIG. 7, the heat generated by the electronic heating element 1 held in the socket 10E can be cooled. For this reason, the temperature rise of the main body of the electronic heating element 1 and further the temperature rise in the PC case having the electronic heating element 1 can be suppressed.

In the cooling device shown in the second embodiment, towards the pitch width W1 of the cooling pipe 70 of the high temperature portion 1A is narrower compared to the pitch W2 of the cooling pipe 70 of the low temperature portion 1B side. For this reason, the cooling area per unit length of the cooling pipe 70 located in the low temperature part 1B can be widened, and the cooling pipe 70 is cooled as compared with the case where the cooling pipe 70 is arranged with a constant pitch width (see, for example, FIG. 5). The liquid 35 can be efficiently cooled.

FIG. 8 is a cross-sectional view similar to FIG. 4 showing a socket constituting a cooling device for an electronic heating element of a fourth reference example of the present invention.

The socket 10F shown in FIG. 8 is substantially the same as the socket 10C of the third reference example except that the inlet 12 and the outlet 42 are provided in the structure of the lid 12 and the inner walls 11C and 11D of the housing 11. is there.

The surface of the lid 12 forming the socket 10F shown in the fourth reference example has a dome shape, and a plurality of heat pipes 81 made of cylindrical thin tubes are planted on the surface. The heat pipe 81 has a narrow tube sealed in a reduced pressure state, and a working fluid (heat medium) made of water, sodium, potassium, chlorofluorocarbon, or the like is sealed therein. The heat pipe 81 is provided with a wick (not shown) made of a groove, a wire mesh, and the like, which exhibits a capillary phenomenon. A pressing portion 12b that presses the surface of the electronic heating element 1 in the Z1 direction is integrally formed inside the lid body 12.

  A configuration in which a fan for air-cooling the plurality of heat pipes 81 is provided outside the socket 10F.

In the cooling device for an electronic heating element of the fourth reference example, heat generated from the electronic heating element 1 is transmitted to the lid body 12 via the pressing portion 12b. At this time, the hydraulic fluid of the heat pipe 81 absorbs heat at the end (evaporating part) on the lid 12 side, which is one end of the heat pipe 81, and dissipates heat at the other open end (condensing part). To do. That is, the hydraulic fluid is vaporized by removing latent heat in the evaporation unit, and is liquefied by discarding latent heat in the condensing unit. Since the liquefied hydraulic fluid is heavier than gas, it travels through the wick and returns to the evaporation section (capillary phenomenon). That is, since the hydraulic fluid is circulated in the heat pipe 81 in the order of liquid → gas → liquid, heat convection is generated, so that the heat generated by the electronic heating element 1 can be released to the outside of the socket 10F and cooled. it can.

Further, as shown in FIG. 8, a configuration may be adopted in which a plurality of through holes are formed in the lid body 12 and one end (evaporating part) of the heat pipe 81 opened is attached to the through hole. In this configuration, the working fluid that has been heated and vaporized in the socket 10 </ b> F can permeate into the heat pipe 81. Then, the heat generated by the electronic heating element 1 can be released to the outside of the socket 10F by the same action as described above. In this reference example , since the working fluid that has absorbed heat can enter the heat pipe 81 and move to the other open end (condensing portion) to directly dissipate heat, the electronic heating element can be more efficiently dissipated. 1 can be cooled.

In the fourth reference example , the configuration in which the plurality of heat pipes 81 are provided on the surface of the dome-shaped lid is described . However, for example , the heat sink 20 is placed on the socket lid 12 shown in FIG. Instead of, a configuration in which a plurality of heat pipes 81 are provided may be employed.

Next, a new aspect of the heat sink as a kind of cooling device will be described.
9 to 14 are side views showing an embodiment of a heat sink.

  The heat sinks 91 and 92 shown in FIG. 9 and FIG. 10 are spiral heat sinks each having a heat radiating portion whose tip portion rises in a spiral shape from the peripheral edge toward the center.

  However, the heat sink 91 shown in FIG. 9 has a mount portion 91 a fixed to the surface of the electronic heating element 1, and a heat conduction portion between the tip 91 c of the spiral heat dissipation portion 91 b and the surface of the electronic heating element 1. 91d is provided.

  On the other hand, in the heat sink 92 shown in FIG. 10, the tip 92 c of the spiral heat radiating portion 92 b is fixed to the surface of the electronic heating element 1, and the heat conducting portion 92 d is between the mount portion 92 a and the surface of the electronic heating element 1. Is provided.

  The heat sink 91 is suitable for the electronic heating element 1 that generates heat from the entire surface because the entire mounting portion 91a having a large area is fixed to the surface of the electronic heating element 1. The heat sink 92 is particularly suitable for the electronic heating element 1 that generates heat partially from the center of the surface because the tip 92c having a small area is fixed to the surface of the electronic heating element 1.

  In any of the heat sinks 91 and 92, the heat generated from the surface of the electronic heating element 1 is dissipated through the shortest path via the heat conducting portions 91d and the heat conducting portions 92d other than the spiral heat radiating portions 91b and 92b. It is possible.

  Next, the heat sink 93 shown in FIG. 11 has a plurality of heat radiating fins A, B, C and D as in the conventional heat sink. However, these radiating fins A, B, C, and D are different in that a large number of recesses 93a are formed on the surface.

  In the heat sink 93 shown in this embodiment, the substantial surface area can be made larger than that of the conventional heat sink, so that the heat sink can have a higher cooling capacity.

  On the other hand, in the heat sinks 94 and 95 shown in FIGS. 12 and 13, a large number of spirals 94a and 95a formed by, for example, microfabrication are provided on the surfaces of the plurality of heat radiation fins A, B, C and D. 12, the heat sink 94 shown in FIG. 12 has the tip of the spiral 94a fixed to the surface of the radiating fin as in FIG. 10, and the heat sink 95 shown in FIG. 13 has the outermost periphery of the spiral 95a formed in the mainspring shape. The end of the part is fixed to the surface of the heat radiation fins A, B, C and D.

  Also in these embodiments, the multiple spirals 94a, 95a can expand the substantial surface area of the entire heat sink. Therefore, it is possible to increase the cooling capacity of the heat sinks 94 and 95 as a whole.

  Next, FIG. 14 shows a side view of a heat sink having a self-adjusting function, where A shows a compressed state at normal temperature and B shows an expanded state at high temperature.

  The heat sink 96 shown in FIG. 14 has a configuration similar to the heat sink 91 shown in FIG. 9 except that the heat conductive portion 91d is not provided at the center and that it is formed of a shape memory alloy. For example, a Ti—Ni alloy, an Au—Cd alloy, an Ag—Cd alloy, a Cu—Au—Zn alloy, or the like can be used as an alloy that exhibits shape memory properties.

  As shown in FIG. 14B, the heat sink 96 stores the compressed state in which the heat radiating portion contracts in the Z direction as shown in FIG. 14A as the shape at normal temperature, and the spiral heat radiating portion rises in the Z2 direction as the shape at high temperature. The expanded state is stored. Therefore, the heat sink 96 is in a compressed state shown in FIG. 14A in the vicinity of room temperature before the electronic heating element 1 generates heat. When the electronic heating element 1 is operated and the temperature of the surface of the electronic heating element 1 is increased by the heat generated by itself, the shape of the heat sink 96 expands as shown in FIG. Transformed into a state.

  In the compressed state, the posture of the heat radiating portion 96b of the heat sink 96 is in a state close to a horizontal posture (FIG. 14A), but when the temperature gradually rises, the heat radiating portion 96b is in a posture close to vertical as shown in FIG. 14B. Can be approached. For this reason, for example, the air sent from the fan 39 toward the heat sink 96 can expand the area where the air hits the heat radiating portion 96b as the temperature rises. That is, the heat sink 96 can increase its own cooling capacity in accordance with the temperature rise of the electronic heating element 1. For this reason, the heat sink 96 can self-adjust the cooling capacity in accordance with a change in temperature, and a suitable heat sink can be provided.

The top view which shows the cooling device of the electronic heating element of the 1st reference example , Sectional drawing in the 2-2 line of FIG. The perspective view which shows the socket which comprises the cooling device of the electronic heating element of a 2nd reference example , Sectional drawing similar to FIG. 2 which shows the socket which comprises the cooling device of the electronic heating element of the 3rd reference example , The top view similar to FIG. 1 which shows the socket which comprises the cooling device of the electronic heat generating body as the 1st Embodiment of this invention, It is sectional drawing which shows the structure of a micropump, A is a positive pressure state, B is a negative pressure state, The top view similar to FIG. 1 which shows the socket which comprises the cooling device of the electronic heat generating body as the 2nd Embodiment of this invention, Sectional drawing similar to FIG. 4 which shows the socket which comprises the cooling device of the electronic heating element of the 4th reference example , A side view showing an embodiment of a heat sink, The side view which shows other embodiment of a heat sink, The side view which shows other embodiment of a heat sink, The side view which shows other embodiment of a heat sink, The side view which shows other embodiment of a heat sink, A side view of a heat sink having a self-adjusting function is shown, A is a compressed state at normal temperature, B is an expanded state at high temperature,

Explanation of symbols

Socket 10, 10A, 10B, 10C, 10D, 10E
DESCRIPTION OF SYMBOLS 11 Housing 11a Recessed part 11b Engagement part 12 Lid 13 Hinge part 14 Engagement part 15 Interposer 16, 17 Elastic contact 18, 19 Conductor 20, 20A, 20B Heat sink 21 Radiation fin 23, 25 Cooling pipe 31 Pump 32 Radiator 35 Coolant 39 Fan 41 Inlet 42 Outlet 51, 52 Cooling pipes 60A, 60B Micro pump 61 Pressure chamber 62 Diaphragm 63 Driving means 70 Cooling pipe 81 Heat pipes 91, 92, 93, 94, 95 Heat sinks 91a, 92a Mount part 91b , 92b Heat radiation part 91c, 92c Tip 91d, 92d Heat conduction part 93a Recess 96 Heat sink 96b Heat radiation part A, B, C, D Heat radiation fin

Claims (6)

In the cooling device for cooling the electronic heating element held in the socket ,
The socket comprises a housing in which the electronic heat-generating body is mounted, said electronic heating element possess a lid body that holds in the housing to cool the electronic heating element in at least one of the lid and the housing cooling Means are provided ,
A high-temperature portion where the temperature is increased according to the uneven distribution of heat generated by the electronic heating element and a low-temperature portion where the temperature is lower than the high-temperature portion are formed, and the cooling means includes both the high-temperature portion and the low-temperature portion. A cooling pipe that passes through the region, a cooling liquid inside the cooling pipe, a pair of pumps provided at both ends of the cooling pipe, and when one of the pumps applies a positive pressure, the other pump has a negative pressure. The electronic heating element cooling device is provided with driver means for driving the pump so as to provide the above . 2. The electronic heating element according to claim 1 , wherein the cooling pipe is bent in a state where a plurality of pipes in which the flow of the cooling liquid is opposite to each other are adjacent to each other in both the high temperature part and the low temperature part . Cooling system. The high temperature part is formed at a central part of a region where the cooling means is disposed , the low temperature part is formed at a peripheral part of the high temperature part, and the cooling pipe alternately passes through the high temperature part and the low temperature part. 2. The cooling device for an electronic heating element according to claim 1, wherein the electronic heating element is bent so as to be bent . The cooling device for an electronic heating element according to claim 3, wherein the cooling pipe is alternately bent at the high temperature part and the low temperature part, and the pitch of the bent cooling pipe is wider at the low temperature part than at the high temperature part. . It claims 1 air-cooling fan is provided cooling apparatus for an electronic heating element according to any one of 4. The coolant, the cooling device for an electronic heating element according to any one of claims 1 is moved alternately to the two-way 5 between one pump and other pump.

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