JP4508785B2 - 積層体の形成方法及びこれを用いた電子源、画像表示装置の製造方法 - Google Patents
積層体の形成方法及びこれを用いた電子源、画像表示装置の製造方法 Download PDFInfo
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Description
少なくとも樹脂成分とガラス微粒子とからなる誘電体ペーストを用いて、上記導電層前駆体パターンの少なくとも一部を覆う誘電層前駆体パターンを形成する工程と、
上記導電層前駆体パターンと誘電層前駆体パターンとを同時に焼成する焼成工程とを有する、少なくとも一部で導電層と誘電層とが積層する積層体の形成方法であって、
上記焼成工程において、焼成温度を、上記導電体ペーストの樹脂成分の分解温度以上及び誘電体ペーストの樹脂成分の分解温度以上であって、誘電体ペーストのガラス微粒子の焼結開始温度未満の温度領域にて所定の時間保持した後、
該ガラス微粒子の焼結開始温度以上、軟化点未満の温度領域にて焼成を行うことを特徴とする。
図3〜図7の工程に従って、電子源を作製した。
実施例1と同様に基板11上に素子電極2,3を形成した後、SUS#400カレンダー加工のスクリーン版を用いて電極作製済みのガラス基板上にAuペースト(エチルセルソース樹脂を樹脂成分として使用)を線幅80μmでスクリーン印刷法で塗布し、100℃で10分ほど保持し乾燥させて導電層前駆体パターン12aを形成した(図4)。塗膜は乾燥後の膜厚が13μmであった。
2,3 素子電極
4 導電性膜
5 電子放出部
11 基板
12 下配線
12a 導電層前駆体パターン
13 絶縁層
13a 絶縁層前駆体パターン
14 上配線
15 電子放出素子
16 リアプレート
17 支持枠
18 フェースプレート
19 蛍光膜
20 メタルバック
21 高圧電源
91 基板
92 感光性ペースト
93 マスク
94 露光部
95 配線パターン
Claims (5)
- 基板上に、少なくとも樹脂成分と導電体微粒子とガラス微粒子とからなる導電体ペーストを用いて導電層前駆体パターンを形成する工程と、
少なくとも樹脂成分とガラス微粒子とからなる誘電体ペーストを用いて、上記導電層前駆体パターンの少なくとも一部を覆う誘電層前駆体パターンを形成する工程と、
上記導電層前駆体パターンと誘電層前駆体パターンとを同時に焼成する焼成工程とを有する、少なくとも一部で導電層と誘電層とが積層する積層体の形成方法であって、
上記焼成工程において、焼成温度を、上記導電体ペーストの樹脂成分の分解温度以上及び誘電体ペーストの樹脂成分の分解温度以上であって、誘電体ペーストのガラス微粒子の焼結開始温度未満の温度領域にて所定の時間保持した後、
該ガラス微粒子の焼結開始温度以上、軟化点未満の温度領域にて焼成を行うことを特徴とする積層体の形成方法。 - 上記導電体ペーストが感光性ペーストである請求項1に記載の積層体の形成方法。
- 上記導電体ペーストが導電体微粒子として銀微粒子を含有する請求項1または2に記載の積層体の形成方法。
- 基板上に複数の電子放出素子と、絶縁層を介して互いに交差し、該電子放出素子をマトリクス配線する複数の下配線と上配線とを有する電子源の製造方法であって、上記下配線と絶縁層とを、請求項1〜3のいずれかに記載の積層体の形成方法により形成することを特徴とする電子源の製造方法。
- 基板上に複数の電子放出素子と、絶縁層を介して互いに交差し、該電子放出素子をマトリクス配線する複数の下配線と上配線とを有する電子源と、上記電子放出素子から放出された電子の照射によって発光する発光部材を有する画像形成部材とを備えた画像表示装置の製造方法であって、上記電子源を請求項4に記載の電子源の製造方法により製造することを特徴とする画像表示装置の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2004251412A JP4508785B2 (ja) | 2004-08-31 | 2004-08-31 | 積層体の形成方法及びこれを用いた電子源、画像表示装置の製造方法 |
US11/212,639 US7470554B2 (en) | 2004-08-31 | 2005-08-29 | Forming method of stacking structure and manufacturing method of electron source and image display apparatus using such method |
KR1020050079188A KR100740179B1 (ko) | 2004-08-31 | 2005-08-29 | 적층 구조체의 형성방법, 그리고, 이 방법을 이용한 전자원및 화상표시장치의 제조방법 |
CNB2005100990055A CN100459015C (zh) | 2004-08-31 | 2005-08-31 | 叠层体的形成方法及使用了此叠层体的电子源、图像显示装置的制造方法 |
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JP2004251412A JP4508785B2 (ja) | 2004-08-31 | 2004-08-31 | 積層体の形成方法及びこれを用いた電子源、画像表示装置の製造方法 |
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JP2006073208A JP2006073208A (ja) | 2006-03-16 |
JP4508785B2 true JP4508785B2 (ja) | 2010-07-21 |
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JP2004251412A Expired - Fee Related JP4508785B2 (ja) | 2004-08-31 | 2004-08-31 | 積層体の形成方法及びこれを用いた電子源、画像表示装置の製造方法 |
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US (1) | US7470554B2 (ja) |
JP (1) | JP4508785B2 (ja) |
KR (1) | KR100740179B1 (ja) |
CN (1) | CN100459015C (ja) |
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KR100922810B1 (ko) * | 2007-12-11 | 2009-10-21 | 주식회사 잉크테크 | 흑화 전도성 패턴의 제조방법 |
JPWO2010143614A1 (ja) * | 2009-06-10 | 2012-11-22 | 旭硝子株式会社 | 太陽電池モジュールの製造方法 |
KR102584993B1 (ko) * | 2018-02-08 | 2023-10-05 | 삼성전기주식회사 | 커패시터 부품 및 그 제조방법 |
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JPS594095A (ja) * | 1982-06-30 | 1984-01-10 | 株式会社日立製作所 | 混成集積回路の製造方法 |
JPH07135386A (ja) * | 1993-11-09 | 1995-05-23 | Toray Ind Inc | セラミックス・グリーンシート上にパターンを形成する方法 |
JP2001093404A (ja) * | 1999-07-21 | 2001-04-06 | Sharp Corp | 電子源及びその製造方法 |
JP2002198626A (ja) * | 2000-12-27 | 2002-07-12 | Kyocera Corp | 低温焼成セラミック回路基板の製造方法 |
JP2003101178A (ja) * | 2001-09-25 | 2003-04-04 | Kyocera Corp | 貫通導体用組成物 |
JP2003133689A (ja) * | 2001-08-03 | 2003-05-09 | Canon Inc | 部材パターンの製造方法、及び、配線、回路基板、電子源、画像形成装置の製造方法 |
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JPH11135904A (ja) * | 1997-08-29 | 1999-05-21 | Dainippon Printing Co Ltd | 厚膜電極 |
JP2000311600A (ja) * | 1999-02-23 | 2000-11-07 | Canon Inc | 電子源、画像形成装置並びに配線基板の製造方法および該製造方法を用いた電子源、画像形成装置並びに配線基板 |
JP3397738B2 (ja) | 1999-02-25 | 2003-04-21 | キヤノン株式会社 | 電子源および画像形成装置 |
WO2002019369A1 (fr) * | 2000-08-30 | 2002-03-07 | Matsushita Electric Industrial Co., Ltd. | Unite d'affichage a plasma et son procede de fabrication |
US6653232B2 (en) * | 2001-08-03 | 2003-11-25 | Canon Kabushiki Kaisha | Method of manufacturing member pattern and method of manufacturing wiring, circuit substrate, electron source, and image-forming apparatus |
-
2004
- 2004-08-31 JP JP2004251412A patent/JP4508785B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-29 KR KR1020050079188A patent/KR100740179B1/ko not_active IP Right Cessation
- 2005-08-29 US US11/212,639 patent/US7470554B2/en not_active Expired - Fee Related
- 2005-08-31 CN CNB2005100990055A patent/CN100459015C/zh not_active Expired - Fee Related
Patent Citations (6)
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JPS594095A (ja) * | 1982-06-30 | 1984-01-10 | 株式会社日立製作所 | 混成集積回路の製造方法 |
JPH07135386A (ja) * | 1993-11-09 | 1995-05-23 | Toray Ind Inc | セラミックス・グリーンシート上にパターンを形成する方法 |
JP2001093404A (ja) * | 1999-07-21 | 2001-04-06 | Sharp Corp | 電子源及びその製造方法 |
JP2002198626A (ja) * | 2000-12-27 | 2002-07-12 | Kyocera Corp | 低温焼成セラミック回路基板の製造方法 |
JP2003133689A (ja) * | 2001-08-03 | 2003-05-09 | Canon Inc | 部材パターンの製造方法、及び、配線、回路基板、電子源、画像形成装置の製造方法 |
JP2003101178A (ja) * | 2001-09-25 | 2003-04-04 | Kyocera Corp | 貫通導体用組成物 |
Also Published As
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US20060046474A1 (en) | 2006-03-02 |
CN100459015C (zh) | 2009-02-04 |
US7470554B2 (en) | 2008-12-30 |
KR20060050734A (ko) | 2006-05-19 |
JP2006073208A (ja) | 2006-03-16 |
CN1763888A (zh) | 2006-04-26 |
KR100740179B1 (ko) | 2007-07-16 |
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