JP4502214B2 - ハンダバンプの形成方法 - Google Patents
ハンダバンプの形成方法 Download PDFInfo
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- JP4502214B2 JP4502214B2 JP2006062200A JP2006062200A JP4502214B2 JP 4502214 B2 JP4502214 B2 JP 4502214B2 JP 2006062200 A JP2006062200 A JP 2006062200A JP 2006062200 A JP2006062200 A JP 2006062200A JP 4502214 B2 JP4502214 B2 JP 4502214B2
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Description
2 電極
3 フォトマスク
4 フィルム
5 ハンダペースト
5A ハンダバンプ
6 半導体チップ
10 基板本体
11 凹部
12 表層部
12’ フォトレジスト層
Claims (3)
- 感光性を有するポジ型の第1のレジスト層を、電極が設けられた基板の上に、当該電極を覆うように形成する工程と、
上記電極のパターンに対応した開口パターンを有するマスクを使用して行う露光処理と、現像処理とを、上記第1のレジスト層に施すことにより、当該第1のレジスト層において上記電極に対応する位置に開口部を形成する工程と、
上記開口部が形成された上記第1のレジスト層上に、第2のレジスト層となる感光性を有するポジ型のフィルムを圧着させる工程と、
上記マスクを再度使用して行う露光処理と、現像処理とを、上記フィルムに施すことにより、上記第1のレジスト層の上記開口部に連通する開口部を上記フィルムに形成する工程と、
上記第1のレジスト層の上記開口部と上記フィルムの上記開口部とからなり且つ上記電極が露出する凹部に、ハンダ材料を充填する工程と、
上記ハンダ材料を溶融させた後に固化させることにより、上記凹部内の電極上にハンダバンプを設ける工程と、を含むハンダバンプの形成方法。 - 凹部にハンダ材料を充填する上記工程では、上記凹部にハンダペーストを充填する、請求項1に記載のハンダバンプの形成方法。
- 凹部にハンダ材料を充填する上記工程では、上記凹部にハンダ粉末を充填する、請求項1に記載のハンダバンプの形成方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006062200A JP4502214B2 (ja) | 1998-08-10 | 2006-03-08 | ハンダバンプの形成方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22509298 | 1998-08-10 | ||
JP2006062200A JP4502214B2 (ja) | 1998-08-10 | 2006-03-08 | ハンダバンプの形成方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005229137A Division JP2005333162A (ja) | 1998-08-10 | 2005-08-08 | ハンダバンプの形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006173653A JP2006173653A (ja) | 2006-06-29 |
JP4502214B2 true JP4502214B2 (ja) | 2010-07-14 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006062200A Expired - Fee Related JP4502214B2 (ja) | 1998-08-10 | 2006-03-08 | ハンダバンプの形成方法 |
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Country | Link |
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JP (1) | JP4502214B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101162089B1 (ko) | 2011-06-28 | 2012-07-03 | 아페리오(주) | 플립칩 범프 제조방법 |
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- 2006-03-08 JP JP2006062200A patent/JP4502214B2/ja not_active Expired - Fee Related
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JP2006173653A (ja) | 2006-06-29 |
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