JP4486985B2 - 固体撮像装置および電子情報機器 - Google Patents
固体撮像装置および電子情報機器 Download PDFInfo
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Description
前記半導体基板の、該リセットトランジスタが形成されてそのチャネル領域を一部が形成している第2導電型半導体領域の不純物濃度プロファイルは、前記周辺回路を構成する周辺回路トランジスタが形成されている第2導電型半導体領域の不純物濃度プロファイルと異なり、かつ前記増幅トランジスタが形成されている第2導電型半導体領域の不純物濃度プロファイルと異なることが好ましい。
図1は、本発明の実施形態1による固体撮像装置を説明する図であり、図1(a)は、画素の平面構造を示し、図1(b)は、図1(a)のIA−IA’線断面の構造、図1(a)のIB−IB’線断面の構造、および周辺回路部における周辺回路トランジスタの断面構造を示している。
図8は、本発明の実施形態2による固体撮像装置を説明する図であり、図8(a)は、画素の平面構造を示し、図8(b)は、図8(a)のIIA−IIA’線断面の構造、図8(a)のIIB−IIB’線断面の構造、および周辺回路部における周辺回路トランジスタの断面構造を示している。
(実施形態3)
なお、上記実施形態1および2では、特に説明しなかったが、上記実施形態1および2の固体撮像装置の少なくともいずれかを撮像部に用いた例えばデジタルビデオカメラ、デジタルスチルカメラなどのデジタルカメラや、画像入力カメラ、スキャナ、ファクシミリ、カメラ付き携帯電話装置などの画像入力デバイスを有した電子情報機器を、本発明の実施形態3として説明する。
101 p型埋込み半導体層
102 n型半導体層
103 p+型半導体層
104、104a、110b、111、111a、111b p型半導体領域
105 素子分離部
106 ゲート絶縁膜
108 フローティングディフュージョン(n+拡散領域)
110a リークストッパ
114 転送ゲート
114e、115c〜115e、116c、116d コンタクトホール
115 リセットTrゲート
115b、116b、117b ドレイン領域
116 増幅Trゲート
116a、117a ソース領域
117 周辺Trゲート
121〜125、223〜225 レジスト膜
121a、122a、123a、124a、125a、223a、234a、225a レジスト開口
X 画素部
X1 画素受光部
X2 画素転送部
X3 リセットトランジスタ
X4 増幅トランジスタ
Y 周辺回路部
Y1 周辺回路トランジスタ
Claims (6)
- 第1導電型の半導体基板と、該半導体基板上に複数の画素を形成してなる画素部と、該半導体基板の該画素部周辺の領域に該画素を駆動する周辺回路を形成してなる周辺回路部とを備えた固体撮像装置であって、
該各画素は、
入射光を光電変換により信号電荷に変換する画素受光部と、
該信号電荷を蓄積して該蓄積された信号電荷に応じた信号電圧を発生する電荷蓄積部と、
該信号電圧を増幅して出力する増幅トランジスタとを備え、
前記半導体基板は、その表面に形成された溝内に絶縁材料を埋め込んでなる素子分離部と、該素子分離部の側面および底面を覆うよう該半導体基板内に形成され、該素子分離部からその周辺の半導体領域へのリーク電流を阻止する第2導電型リークストッパとを有し、
前記増幅トランジスタが配置されてそのチャネルを一部が形成している第2導電型半導体領域は、該第2導電型リークストッパと同じイオン注入処理により形成したものであり、
該半導体基板の、該増幅トランジスタが形成されている第2導電型半導体領域の不純物濃度は、該周辺回路を構成する周辺回路トランジスタが形成されてそのチャネルを一部が形成している第2導電型半導体領域の不純物濃度より低く、
前記画素部におけるトランジスタは、アナログ信号処理回路を構成するものであり、
前記周辺回路部における周辺回路トランジスタは、デジタル信号処理回路を構成するものであり、
前記第1導電型の半導体基板は、燐をドーピングしたn型シリコン基板であり、
前記第2導電型半導体領域は、ボロンを注入したp型半導体領域である固体撮像装置。 - 前記各画素は、前記電荷蓄積部に蓄積された信号電荷をリセットするリセットトランジスタを有し、
前記半導体基板の、該リセットトランジスタが形成されてそのチャネルを一部が形成している第2導電型半導体領域は、前記周辺回路を構成する周辺回路トランジスタが形成されている第2導電型半導体領域と同じイオン注入処理により形成したものである請求項1に記載の固体撮像装置。 - 前記各画素は、前記画素受光部と前記電荷蓄積部との間に形成され、該画素受光部で発生した信号電荷を該電荷蓄積部に転送する転送トランジスタを有し、
前記半導体基板の、該転送トランジスタのチャネル領域を構成する第2導電型半導体領域は、該リセットトランジスタが形成されてそのチャネル領域を一部が形成している第2導電型半導体領域とは異なる不純物濃度プロファイルを有する請求項2に記載の固体撮像装置。 - 前記各画素は、前記電荷蓄積部に蓄積された信号電荷をリセットするリセットトランジスタを有し、
前記半導体基板の、該リセットトランジスタが形成されてそのチャネル領域を一部が形成している第2導電型半導体領域の不純物濃度プロファイルは、前記周辺回路を構成する周辺回路トランジスタが形成されている第2導電型半導体領域の不純物濃度プロファイルと異なり、かつ前記増幅トランジスタが形成されている第2導電型半導体領域の不純物濃度プロファイルと異なる請求項1に記載の固体撮像装置。 - 前記各画素は、前記画素受光部と前記電荷蓄積部との間に形成され、該画素受光部で発生した信号電荷を該電荷蓄積部に転送する転送トランジスタを有し、
該転送トランジスタのチャネル領域は、該リセットトランジスタが形成されている第2導電型半導体領域内に形成されている請求項4に記載の固体撮像装置。 - 撮像部を備えた電子情報機器であって、
該撮像部として請求項1ないし5のいずれかに記載の固体撮像装置を用いたものである電子情報機器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2007204691A JP4486985B2 (ja) | 2007-08-06 | 2007-08-06 | 固体撮像装置および電子情報機器 |
US12/222,207 US7714263B2 (en) | 2007-08-06 | 2008-08-05 | Solid-state image capturing apparatus, manufacturing method for the solid-state image capturing apparatus, and electronic information device |
KR1020080077152A KR101017906B1 (ko) | 2007-08-06 | 2008-08-06 | 고체 촬상 장치, 고체 촬상 장치의 제조 방법, 및 전자정보 기기 |
CN2008101444004A CN101364606B (zh) | 2007-08-06 | 2008-08-06 | 固态图像捕获设备及其制造方法、和电子信息装置 |
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JP2007204691A JP4486985B2 (ja) | 2007-08-06 | 2007-08-06 | 固体撮像装置および電子情報機器 |
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JP4486985B2 true JP4486985B2 (ja) | 2010-06-23 |
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JP2010258094A (ja) * | 2009-04-22 | 2010-11-11 | Panasonic Corp | 固体撮像装置 |
JP5325006B2 (ja) * | 2009-04-22 | 2013-10-23 | パナソニック株式会社 | 固体撮像装置 |
US8319262B2 (en) * | 2009-07-31 | 2012-11-27 | Sri International | Substrate bias for CMOS imagers |
US8138531B2 (en) * | 2009-09-17 | 2012-03-20 | International Business Machines Corporation | Structures, design structures and methods of fabricating global shutter pixel sensor cells |
JP2012033894A (ja) * | 2010-06-30 | 2012-02-16 | Canon Inc | 固体撮像装置 |
JP6342033B2 (ja) * | 2010-06-30 | 2018-06-13 | キヤノン株式会社 | 固体撮像装置 |
US9040341B2 (en) * | 2012-06-04 | 2015-05-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Image device and methods of forming the same |
US10094988B2 (en) * | 2012-08-31 | 2018-10-09 | Micron Technology, Inc. | Method of forming photonics structures |
US8754576B2 (en) | 2012-09-28 | 2014-06-17 | Elwha Llc | Low pressure lamp using non-mercury materials |
CN103346161A (zh) * | 2013-06-24 | 2013-10-09 | 上海华力微电子有限公司 | 改善重叠背照式cmos图像传感器图像信号质量的方法 |
JP2015035450A (ja) | 2013-08-07 | 2015-02-19 | 株式会社東芝 | 固体撮像装置および固体撮像装置の製造方法 |
JP6387745B2 (ja) | 2014-08-29 | 2018-09-12 | セイコーエプソン株式会社 | 固体撮像装置及びその製造方法 |
JP6587497B2 (ja) * | 2014-10-31 | 2019-10-09 | 株式会社半導体エネルギー研究所 | 半導体装置 |
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