JP4486461B2 - 携帯型電子装置 - Google Patents

携帯型電子装置 Download PDF

Info

Publication number
JP4486461B2
JP4486461B2 JP2004278903A JP2004278903A JP4486461B2 JP 4486461 B2 JP4486461 B2 JP 4486461B2 JP 2004278903 A JP2004278903 A JP 2004278903A JP 2004278903 A JP2004278903 A JP 2004278903A JP 4486461 B2 JP4486461 B2 JP 4486461B2
Authority
JP
Japan
Prior art keywords
cable
flexible cable
electronic device
flexible
portable electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004278903A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006093510A (ja
JP2006093510A5 (enExample
Inventor
清之 畑中
慎吾 山口
哲 神林
孝夫 篠田
諭 渡邊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2004278903A priority Critical patent/JP4486461B2/ja
Publication of JP2006093510A publication Critical patent/JP2006093510A/ja
Publication of JP2006093510A5 publication Critical patent/JP2006093510A5/ja
Application granted granted Critical
Publication of JP4486461B2 publication Critical patent/JP4486461B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Telephone Set Structure (AREA)
JP2004278903A 2004-09-27 2004-09-27 携帯型電子装置 Expired - Fee Related JP4486461B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004278903A JP4486461B2 (ja) 2004-09-27 2004-09-27 携帯型電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004278903A JP4486461B2 (ja) 2004-09-27 2004-09-27 携帯型電子装置

Publications (3)

Publication Number Publication Date
JP2006093510A JP2006093510A (ja) 2006-04-06
JP2006093510A5 JP2006093510A5 (enExample) 2007-05-24
JP4486461B2 true JP4486461B2 (ja) 2010-06-23

Family

ID=36234170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004278903A Expired - Fee Related JP4486461B2 (ja) 2004-09-27 2004-09-27 携帯型電子装置

Country Status (1)

Country Link
JP (1) JP4486461B2 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4504213B2 (ja) * 2005-02-02 2010-07-14 富士通株式会社 防水キャップ及び電子機器
JP4560793B2 (ja) * 2005-09-16 2010-10-13 日本電気株式会社 携帯情報端末
WO2008062731A1 (fr) 2006-11-24 2008-05-29 Fujitsu Limited Dispositif électronique portable
JP5348603B2 (ja) * 2007-02-13 2013-11-20 Ｎｏｋ株式会社 シール構造体
JP4691694B2 (ja) * 2007-04-10 2011-06-01 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 電子機器及びその組立方法
KR101127371B1 (ko) * 2007-07-20 2012-03-29 후지쯔 가부시끼가이샤 밀봉 구조, 전자 기기, 밀봉 방법, 가스켓 및 그 제조 방법
JP4678017B2 (ja) * 2007-07-31 2011-04-27 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 Ｆｐｃ実装構造及びｆｐｃ
JP4829263B2 (ja) 2008-02-25 2011-12-07 富士通株式会社 防水型電子機器
JP2009225193A (ja) * 2008-03-17 2009-10-01 Fujitsu Ltd 携帯端末装置
JP4993383B2 (ja) * 2008-05-13 2012-08-08 日本メクトロン株式会社 シール構造体
JP4438883B2 (ja) * 2008-06-19 2010-03-24 パナソニック株式会社 防水構造付き携帯端末装置
JP2010074897A (ja) * 2008-09-17 2010-04-02 Fujitsu Ltd ヒンジモジュール及び電子機器
WO2010055605A1 (ja) * 2008-11-14 2010-05-20 三菱電機株式会社 フラットケーブルの保護固定具
JP2010161230A (ja) * 2009-01-08 2010-07-22 Sumitomo Electric Printed Circuit Inc 配線体、配線体の配設構造、および電子機器
JP5212267B2 (ja) * 2009-06-09 2013-06-19 富士通モバイルコミュニケーションズ株式会社 電子機器
JP5354281B2 (ja) * 2009-06-25 2013-11-27 日本メクトロン株式会社 シール構造体
JP2010071464A (ja) * 2009-08-07 2010-04-02 Fujitsu Ltd ヒンジモジュール及び電子機器
JP5560758B2 (ja) * 2009-12-28 2014-07-30 住友電気工業株式会社 防水部材付きフレキシブル回路基板及びその製造方法
JP2012004214A (ja) * 2010-06-15 2012-01-05 Sumitomo Bakelite Co Ltd 防水部材付きフレキシブル回路基板及びその製造方法
TWI430530B (zh) 2010-08-02 2014-03-11 A cable - like flexible circuit cable with a waterproof section
CN102385950B (zh) * 2010-09-06 2013-08-14 易鼎股份有限公司 具有防水区段的束状软性电路排线
JP6263353B2 (ja) * 2013-09-04 2018-01-17 東芝テック株式会社 携帯情報端末
JP7057246B2 (ja) * 2018-07-30 2022-04-19 日本メクトロン株式会社 フレキシブル配線基板及びバッテリーモジュール

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5199199U (enExample) * 1975-02-05 1976-08-09
JP2518497Y2 (ja) * 1990-11-14 1996-11-27 ナイルス部品株式会社 ケーシング内外の電気接続装置
JPH04126668U (ja) * 1991-05-07 1992-11-18 沖電気工業株式会社 接続部の耐圧構造
JP3411448B2 (ja) * 1996-07-03 2003-06-03 沖電気工業株式会社 半導体素子の樹脂封止金型及び半導体装置の製造方法
JP2003142836A (ja) * 2001-11-05 2003-05-16 Seiko Instruments Inc 電子機器
JP2003152352A (ja) * 2001-11-09 2003-05-23 Casio Comput Co Ltd 機器の気密構造
JP3791510B2 (ja) * 2002-05-13 2006-06-28 日本電気株式会社 防水構造を備える折り畳み型携帯端末装置

Also Published As

Publication number Publication date
JP2006093510A (ja) 2006-04-06

Similar Documents

Publication Publication Date Title
JP4486461B2 (ja) 携帯型電子装置
JP5003762B2 (ja) 密封構造、電子機器及びガスケットの製造方法
US8581118B2 (en) Seal structure, method of forming seal structure, wire body, and electronic apparatus
JP4680231B2 (ja) コネクタ
KR101612892B1 (ko) 전자 기기의 시일 구조
US8265264B2 (en) Waterproof electronic appliance
KR100731844B1 (ko) 휴대용 전자 장치
JP4424445B1 (ja) 電子機器
JP2009026966A (ja) シール構造、電子装置、携帯装置及びシール方法
CN102918942B (zh) 密封构造体
CN102045976B (zh) 电子装置
CN106128827B (zh) 侧键结构及移动终端
JP4900590B2 (ja) 電子機器の防水構造
CN102439951A (zh) 移动终端装置及电子设备
KR101208222B1 (ko) 전자 장치
KR20110119752A (ko) 전자기기
JP4162674B2 (ja) フレキシブル配線基板及び電子機器
JP2003142836A (ja) 電子機器
CN101998794B (zh) 防水型电子设备
JP2005348341A (ja) 携帯用電子機器
JP5258031B2 (ja) 接続フレキシブル配線基板、該配線基板の防水実装構造及び防水実装方法、並びに防水型携帯電子端末
JP2010067822A (ja) 配線体，シール構造および電子機器
JP4935864B2 (ja) 配線体、シール構造及び電子機器
JP2011024280A (ja) シール部材及びシール部材の製造方法
WO2010026935A1 (ja) シール構造、シール構造の形成方法、配線体及び電子機器

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070329

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070906

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070906

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20091218

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20091222

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100216

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20100216

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20100216

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100323

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100326

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130402

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140402

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees