JP4485856B2 - 大電力用ｌｅｄランプ - Google Patents

大電力用ｌｅｄランプ Download PDF

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Publication number
JP4485856B2
JP4485856B2 JP2004172424A JP2004172424A JP4485856B2 JP 4485856 B2 JP4485856 B2 JP 4485856B2 JP 2004172424 A JP2004172424 A JP 2004172424A JP 2004172424 A JP2004172424 A JP 2004172424A JP 4485856 B2 JP4485856 B2 JP 4485856B2
Authority
JP
Japan
Prior art keywords
power distribution
emitting diode
mount
light
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004172424A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005353814A5 (enExample
JP2005353814A (ja
Inventor
俊幸 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2004172424A priority Critical patent/JP4485856B2/ja
Publication of JP2005353814A publication Critical patent/JP2005353814A/ja
Publication of JP2005353814A5 publication Critical patent/JP2005353814A5/ja
Application granted granted Critical
Publication of JP4485856B2 publication Critical patent/JP4485856B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
JP2004172424A 2004-06-10 2004-06-10 大電力用ｌｅｄランプ Expired - Fee Related JP4485856B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004172424A JP4485856B2 (ja) 2004-06-10 2004-06-10 大電力用ｌｅｄランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004172424A JP4485856B2 (ja) 2004-06-10 2004-06-10 大電力用ｌｅｄランプ

Publications (3)

Publication Number Publication Date
JP2005353814A JP2005353814A (ja) 2005-12-22
JP2005353814A5 JP2005353814A5 (enExample) 2007-06-28
JP4485856B2 true JP4485856B2 (ja) 2010-06-23

Family

ID=35588022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004172424A Expired - Fee Related JP4485856B2 (ja) 2004-06-10 2004-06-10 大電力用ｌｅｄランプ

Country Status (1)

Country Link
JP (1) JP4485856B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4793029B2 (ja) * 2006-03-03 2011-10-12 三菱化学株式会社 照明装置
WO2009002090A2 (en) * 2007-06-25 2008-12-31 Inix Co., Ltd. Light emitting diode module
WO2009014387A2 (en) * 2007-07-26 2009-01-29 Fawoo Technology Co., Ltd. Stick-type led lighting apparatus
JP5310672B2 (ja) * 2009-10-15 2013-10-09 日亜化学工業株式会社 発光装置及びその製造方法
JP2014197527A (ja) * 2013-03-04 2014-10-16 信越化学工業株式会社 車両用方向指示器
JP6094700B2 (ja) * 2013-03-04 2017-03-15 信越化学工業株式会社 車両用方向指示器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3186408B2 (ja) * 1994-03-25 2001-07-11 日立電線株式会社 多層リードフレーム及びその製造方法
JPH09321341A (ja) * 1996-05-30 1997-12-12 Nichia Chem Ind Ltd 光半導体装置及びその製造方法
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
JP4280050B2 (ja) * 2002-10-07 2009-06-17 シチズン電子株式会社 白色発光装置

Also Published As

Publication number Publication date
JP2005353814A (ja) 2005-12-22

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