JP4477436B2 - 荷電粒子線露光装置 - Google Patents
荷電粒子線露光装置 Download PDFInfo
- Publication number
- JP4477436B2 JP4477436B2 JP2004194775A JP2004194775A JP4477436B2 JP 4477436 B2 JP4477436 B2 JP 4477436B2 JP 2004194775 A JP2004194775 A JP 2004194775A JP 2004194775 A JP2004194775 A JP 2004194775A JP 4477436 B2 JP4477436 B2 JP 4477436B2
- Authority
- JP
- Japan
- Prior art keywords
- blanking
- charged particle
- electron beam
- particle beam
- electron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/045—Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/043—Beam blanking
- H01J2237/0435—Multi-aperture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3175—Lithography
- H01J2237/31774—Multi-beam
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electron Beam Exposure (AREA)
- Electron Sources, Ion Sources (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004194775A JP4477436B2 (ja) | 2004-06-30 | 2004-06-30 | 荷電粒子線露光装置 |
| US11/159,356 US7173262B2 (en) | 2004-06-30 | 2005-06-23 | Charged particle beam exposure apparatus, charged particle beam exposure method and device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004194775A JP4477436B2 (ja) | 2004-06-30 | 2004-06-30 | 荷電粒子線露光装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006019439A JP2006019439A (ja) | 2006-01-19 |
| JP2006019439A5 JP2006019439A5 (enExample) | 2007-08-16 |
| JP4477436B2 true JP4477436B2 (ja) | 2010-06-09 |
Family
ID=35656178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004194775A Expired - Fee Related JP4477436B2 (ja) | 2004-06-30 | 2004-06-30 | 荷電粒子線露光装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7173262B2 (enExample) |
| JP (1) | JP4477436B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4477436B2 (ja) * | 2004-06-30 | 2010-06-09 | キヤノン株式会社 | 荷電粒子線露光装置 |
| JP4559137B2 (ja) * | 2004-06-30 | 2010-10-06 | キヤノン株式会社 | 真空機器の製造装置及び製造方法 |
| US7770180B2 (en) * | 2004-12-21 | 2010-08-03 | Microsoft Corporation | Exposing embedded data in a computer-generated document |
| JP4657740B2 (ja) * | 2005-01-26 | 2011-03-23 | キヤノン株式会社 | 荷電粒子線光学系用収差測定装置、該収差測定装置を具備する荷電粒子線露光装置及び該装置を用いたデバイス製造方法 |
| JP2008004596A (ja) * | 2006-06-20 | 2008-01-10 | Canon Inc | 荷電粒子線描画方法、露光装置、及びデバイス製造方法 |
| JP5199921B2 (ja) * | 2009-03-06 | 2013-05-15 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置及び荷電粒子ビームの光軸ずれ補正方法 |
| KR102460680B1 (ko) * | 2017-10-02 | 2022-10-28 | 에이에스엠엘 네델란즈 비.브이. | 하전 입자 빔들을 사용하는 장치 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5144142A (en) * | 1989-05-19 | 1992-09-01 | Fujitsu Limited | Blanking aperture array, method for producing blanking aperture array, charged particle beam exposure apparatus and charged particle beam exposure method |
| US5262341A (en) * | 1989-05-19 | 1993-11-16 | Fujitsu Limited | Blanking aperture array and charged particle beam exposure method |
| US5260579A (en) * | 1991-03-13 | 1993-11-09 | Fujitsu Limited | Charged particle beam exposure system and charged particle beam exposure method |
| US5528048A (en) * | 1994-03-15 | 1996-06-18 | Fujitsu Limited | Charged particle beam exposure system and method |
| JP3299632B2 (ja) * | 1994-06-24 | 2002-07-08 | 株式会社日立製作所 | 電子線描画装置 |
| JP3647136B2 (ja) | 1996-04-23 | 2005-05-11 | キヤノン株式会社 | 電子ビーム露光装置 |
| JPH09240143A (ja) | 1996-03-04 | 1997-09-16 | Mitsubishi Paper Mills Ltd | 発色型可逆感熱記録材料及びその製造方法 |
| JPH09330868A (ja) | 1996-06-12 | 1997-12-22 | Canon Inc | 電子ビーム露光方法及びそれを用いたデバイス製造方法 |
| DE69738276T2 (de) | 1996-03-04 | 2008-04-03 | Canon K.K. | Elektronenstrahl-Belichtungsgerät, Belichtungsverfahren und Verfahren zur Erzeugung eines Objekts |
| JP3647143B2 (ja) | 1996-06-12 | 2005-05-11 | キヤノン株式会社 | 電子ビーム露光装置及びその露光方法 |
| JP3647128B2 (ja) | 1996-03-04 | 2005-05-11 | キヤノン株式会社 | 電子ビーム露光装置とその露光方法 |
| JP4647820B2 (ja) * | 2001-04-23 | 2011-03-09 | キヤノン株式会社 | 荷電粒子線描画装置、および、デバイスの製造方法 |
| JP3940310B2 (ja) * | 2002-04-04 | 2007-07-04 | 株式会社日立ハイテクノロジーズ | 電子ビーム描画方法及び描画装置、並びにこれを用いた半導体製造方法 |
| US6818911B2 (en) * | 2002-04-10 | 2004-11-16 | Canon Kabushiki Kaisha | Array structure and method of manufacturing the same, charged particle beam exposure apparatus, and device manufacturing method |
| JP4167904B2 (ja) * | 2003-01-06 | 2008-10-22 | 株式会社日立ハイテクノロジーズ | 電子ビーム描画装置及び電子ビーム描画方法 |
| JP4421836B2 (ja) * | 2003-03-28 | 2010-02-24 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| JP4313145B2 (ja) * | 2003-10-07 | 2009-08-12 | 株式会社日立ハイテクノロジーズ | 荷電粒子ビーム描画方法及び荷電粒子ビーム描画装置 |
| JP4477436B2 (ja) * | 2004-06-30 | 2010-06-09 | キヤノン株式会社 | 荷電粒子線露光装置 |
| JP4907092B2 (ja) * | 2005-03-01 | 2012-03-28 | 株式会社日立ハイテクノロジーズ | 電子ビーム描画装置および電子ビーム描画方法 |
-
2004
- 2004-06-30 JP JP2004194775A patent/JP4477436B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-23 US US11/159,356 patent/US7173262B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20060017019A1 (en) | 2006-01-26 |
| JP2006019439A (ja) | 2006-01-19 |
| US7173262B2 (en) | 2007-02-06 |
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