JP4462490B2 - Electronic parts holding and transport mechanism - Google Patents

Description

  The present invention relates to an electronic component holding and conveying mechanism that holds an electronic component and intermittently conveys it to a process processing mechanism, and more particularly to an improvement in the configuration of a suction nozzle included in an electronic component holding means. is there.

  In general, electronic components such as semiconductor elements are manufactured by sequentially nesting a plurality of process processes such as electrode cutting, electrode processing, electrical property measurement, marking, appearance inspection, and tape packing. Specifically, as an electronic component manufacturing apparatus that performs such various process processes, a plurality of mechanisms for performing process processes are arranged between the carry-in part and the carry-out part of the electronic parts, and an electronic component holding and transporting mechanism. There is known a type that sequentially conveys to each process processing mechanism using the.

  The outline of the operation in this type of electronic component manufacturing apparatus is as follows. First, the electronic component holding and conveying mechanism receives the electronic component from the electronic component carry-in section, and the holding means such as the suction nozzle holds this and conveys it to the process processing mechanism by the conveying means such as the turntable. When the electronic component reaches the process processing mechanism, the holding and conveying mechanism stops the conveyance of the electronic component and delivers the electronic component to the process processing mechanism. Upon receiving the electronic component, the process processing mechanism performs a predetermined process on the electronic component. After the process processing is completed, the holding and transport mechanism receives the electronic component from the process processing mechanism, and transports it to the next process processing mechanism while holding the electronic component again. The electronic components are sent to each process processing mechanism while repeating such a cycle of progress and stop, and the process is sequentially performed. When all the processes are completed, the electronic components are unloaded from the electronic component unloading unit.

  In the above-described electronic component manufacturing apparatus, the processing line in the process processing mechanism is arranged in the vertical direction from the transport line that is the electronic component transport path so that the electronic component being transported does not collide with the process processing mechanism and is damaged. It is provided sufficiently apart in the horizontal direction. Therefore, when the holding and conveying mechanism delivers the electronic component to the process processing mechanism, the electronic component is moved from the conveying line to the processing line, and after the process processing is completed, the holding and conveying mechanism receives the electronic component from the process processing mechanism. On the other hand, the electronic component must be returned from the processing line to the transfer line.

  That is, it is necessary to move the electronic component between the transport line and the processing line. Therefore, in the electronic component holding and conveying mechanism, the electronic component holding means is a movable holding means that can reciprocate. Further, in the electronic component holding and conveying mechanism, the holding unit driving means for moving the movable holding means is also an indispensable element. As a specific holding unit driving means, a cam, a lever, a rod or the like is used, and the movable holding means is configured to move at a predetermined moving speed by a predetermined moving amount at a predetermined timing. .

  By the way, a suction nozzle that sucks the electronic component is employed as the movable holding means of the electronic component. The suction nozzle is usually made of steel and has a suction hole penetrating in the longitudinal direction. The tip of the suction hole is opened at the center of the tip surface of the suction nozzle, and the base end of the suction hole is connected to the suction device via a suction tube.

  In such a suction nozzle, the tip surface is brought into contact with the surface of the electronic component, and at the same time, air is sucked from the suction hole using a suction device, and the electronic component is sucked by making the suction hole into a vacuum state. In this adsorbed state, the electronic component is picked up and transported to the next process processing mechanism. When the conveyed electronic component reaches a predetermined position, the vacuum state inside the suction hole is released to remove the suction force, and the electronic component is moved from the nozzle tip surface to a predetermined position of the process processing mechanism. When the process process is completed, the suction nozzle again brings the tip surface into contact with the surface of the electronic component, sucks the electronic component with the inside of the suction hole in a vacuum state, and transports it to the next position.

  As described above, since the suction nozzle is entirely made of steel, the tip surface that comes into contact with the electronic component is also made of steel. On the other hand, the outer peripheral surface of the electronic component is covered with a resin containing glass fiber or the like. Therefore, when the suction nozzle holds and holds the electronic component, if the tip surface of the suction nozzle hits the electronic component, the tip surface of the suction nozzle may be significantly worn by the resin component of the electronic component or an edge may be formed on the outer peripheral surface of the tip. there were. If an edge is generated on the outer peripheral surface of the suction nozzle, the surface of the electronic component may be damaged when the electronic component is sucked, which may cause the electronic component to be defective. Further, in combination with the wear of the suction nozzle tip surface, a gap is formed between the electronic component and the suction nozzle tip surface, so that the vacuum state inside the suction hole becomes insufficient and the suction force is weakened. As a result, there is a concern that an electronic component falls from the suction nozzle during conveyance or the conveyance position with respect to the process processing mechanism is shifted.

  Further, when the tip surface of the suction nozzle is made of steel, there are the following problems. That is, as shown in FIG. 7, the electronic component 3 is provided with a horizontal lead portion 21 extending laterally from the side surface of the resin portion, but a vertical lead portion 22 protruding upward from the upper surface of the resin portion. It may be out. At this time, if the suction nozzle for sucking the electronic component is made of steel, there is a possibility that an accurate characteristic value may not be measured in the electrical characteristic inspection process.

In order to deal with the above problems, various conventional techniques have been proposed. For example, Patent Document 1 discloses an adsorption nozzle whose tip surface is formed of a super-hard sintered body whose main component is diamond or cBN. According to the suction nozzle described in Patent Document 1, the wear resistance is greatly improved by forming the tip surface with a super-hard sintered body. Therefore, it is possible to avoid wear on the tip surface of the suction nozzle and generation of an edge and maintain a strong suction force. Thereby, the fall of an electronic component and the shift | offset | difference of a conveyance position can be prevented, and the reliability of holding | maintenance conveyance performance can be improved. In addition, since the suction nozzle is formed from a super-hard sintered body, even when the lead portion (electrode portion) is protruded from the upper surface of the resin portion, when the electrical characteristics are inspected like a steel nozzle, It is not a hindrance. Therefore, the electrical characteristic value can be accurately measured.
JP 2003-39368 A

  However, the following problems have been pointed out in the above prior art. That is, when the ultra-hard sintered body is formed at the tip of the suction nozzle, a suction hole is also provided on the super-hard sintered body side, but this suction hole and the suction hole of the main body portion of the suction nozzle are not shifted. Both must be securely joined. Therefore, conventionally, it is necessary to perform a joining operation such as brazing a super-hard sintered body to the main body portion of the suction nozzle, or to integrally sinter-mold the main body portion of the suction nozzle and the super-hard sintered body. Met. Since such a joining operation or a sintering forming operation is involved, the suction nozzle of Patent Document 1 has a high manufacturing cost.

  Further, when brazing the super-hard sintered body to the main body portion of the suction nozzle, it is important that the thermal expansion coefficients of both are the same in order to ensure a good brazed state. For this reason, it is necessary to form a layer made of the same material as that of the main body on one surface of the super-hard sintered body, and the super-hard sintered body does not have a two-layer structure consisting of a steel layer and a super-hard sintered body layer. Did not get.

  As described above, in the prior art, not only the joining work between the super-hard sintered body and the suction nozzle body is troublesome, but also the production itself of the super-hard sintered body having a two-layer structure is troublesome. It was. For this reason, the economic burden has increased, and the increase in manufacturing cost has been serious. In the field of manufacturing electronic parts, the demand for cost reduction is very strict, and even if one part is expensive, the improvement has been strongly desired.

  The present invention has been proposed in order to solve the above problems, and its purpose is to divide the suction nozzle into a main body side and a front end side, so that only the nozzle portion on the front end side that comes into contact with the electronic component is provided. It is easy to replace, and by fixing and integrating the two divided nozzle parts separately, it eliminates troublesome joining work and secures excellent economic efficiency. It is an object of the present invention to provide an electronic component holding and conveying mechanism that can be manufactured at low cost and that achieves both durability and economy.

  In order to achieve the above-described object, the present invention conveys the movable holding unit to a process processing mechanism that is sequentially arranged while repeating a cycle of moving and stopping, and a movable holding unit that holds an electronic component and can reciprocate. In an electronic component holding and conveying mechanism provided with conveying means and a holding unit driving means for moving the movable holding means so as to deliver and receive the electronic component to and from the process processing mechanism, It has various structural features.

That is, the movable holding means is provided with a suction nozzle that can be divided into a main body nozzle portion and a front end nozzle portion, and the main body nozzle portion and the front end nozzle portion are separately fixed to integrate both nozzle portions. A fixed block is provided, and the fixed block is separated from the piece that is fixed to the main body nozzle portion and the piece that supports the tip nozzle portion, and is perpendicular to the axis of the nozzle portions between the two pieces. A notch portion extending in the axial direction is provided, and arranged in the axial direction of the two nozzle portions, and the main body nozzle portion and the tip nozzle portion are provided between the nozzle portions by the two pieces. It is characterized in that it is clamped and fixed in an axial direction perpendicular to the axes of the two nozzle portions in a state where it can be directly contacted without interposing the fixing block on the same axis.

According to the present invention described above, since the fixing block fixes the main body nozzle portion and the tip nozzle portion separately, it is easy to adjust their positions. Therefore, the two nozzle portions can be reliably integrated, and there is no fear that the nozzle portions are shifted from each other to weaken the suction force, and the suction nozzle can exhibit an excellent suction force. In addition, if the tip nozzle part is worn or edged while the electronic parts are being sucked, the tip nozzle part and main body nozzle part can be divided and only the tip nozzle part can be replaced immediately. The replacement work time is short, and good holding and conveying performance is maintained, so that the reliability is improved.

In addition, the notch part reliably absorbs mounting errors when fastening the main body nozzle part and tip nozzle part separately to the fixed block, or processing errors caused by processing the main body nozzle part and tip nozzle part separately. be able to. Therefore, the bonding surface of the main body nozzle part and the tip nozzle part does not shift, and the suction nozzle divided into two nozzle parts can be handled as an integrated object, making it easy to manufacture suction nozzles with excellent suction power Is possible.

  As described above, according to the present invention, by dividing the suction nozzle into the main body nozzle portion and the tip nozzle portion, only the tip nozzle portion contacting the electronic component can be easily replaced. By fixing and integrating the two nozzle parts separately, it is possible to save troublesome joining work and ensure excellent economy, and it is possible to manufacture high-performance suction nozzles at low cost. In addition, a holding and conveying mechanism for electronic components can be provided.

  Hereinafter, an example of the best mode for carrying out the present invention (hereinafter referred to as an embodiment) will be specifically described with reference to FIGS. First, the overall configuration of the present embodiment will be described with reference to FIGS. 1 and 2, and subsequently, the configuration around the suction nozzle, which is a feature of the present embodiment, will be described with reference to FIGS. 3 to 6.

[1. Overall configuration of this embodiment]
FIG. 1 is a schematic diagram of a vertical plane showing an outline of the configuration of the present embodiment, and FIG. 2 is a schematic diagram of a horizontal plane showing an arrangement relationship of main parts thereof. As shown in FIGS. 1 and 2, the holding and conveying mechanism 1 holds a plurality of electronic components 3 and proceeds with respect to a plurality of process units (process processing mechanisms) 2 that are sequentially arranged in an arc shape at equal intervals. And it conveys sequentially, repeating the cycle to stop.

  As shown in FIG. 1, the electronic component holding and conveying mechanism 1 according to this embodiment includes a plurality of holding units 12 (movable holding means) and a turntable (conveying means) 13 that conveys the holding units 12 to the process unit 2. It has. The holding unit 12 is provided with a suction nozzle 11 that can move up and down to hold the electronic component 3. The suction nozzle 11 has a tip nozzle portion 11a that can be attached to and detached from a main body portion (a main body nozzle portion described later), and when the suction nozzle 11 is lowered, the tip nozzle portion 11a is accurately an electronic component to the process unit 2. 3 is received and delivered. Further, the holding and conveying mechanism 1 includes a direct drive motor 14 for driving the turntable 13, a plurality of drive units 15 provided independently of each other so as to individually drive the holding unit 12, and a spring 16 for returning the suction nozzle 11. I have. Details of each part are as follows.

  As shown in FIG. 1, the holding unit 12 includes a suction nozzle 11 and a support portion 12a that movably supports the suction nozzle 11 in the vertical direction, and is attached to the turntable 13 by the support portion 12a. It has been. The turntable 13 is horizontally disposed above the plurality of process units 2 arranged in an arc shape so as to be separated from the process unit 2 and overlap the process unit 2 at the outer periphery thereof. A plurality of holding units 12 are arranged at the same interval as the plurality of process units 2 on the outer peripheral portion of each of the plurality of process units 2.

  In this case, as shown in FIG. 2, when one holding unit 12 overlaps one process unit 2, the other holding units 12 overlap each of the process units 2 as shown in FIG. 2. Thus, it is arranged on the outer periphery of the turntable 13. More specifically, as shown in FIG. 1, the plurality of process units 2 includes a process processing unit 2 a that performs process processing on the electronic component 3, and the center of the process processing unit 2 a on the horizontal plane is the turntable 13. Are arranged so as to be positioned at equal intervals on one coaxial circle. The plurality of holding units 12 are arranged such that the centers of the tip portions of the suction nozzles 11 are located at the same intervals on the circle where the centers of the process units 2a of the process unit 2 are located. Has been placed.

  In FIG. 1, only two process units 2 and two holding units 12 are shown from the viewpoint of simplifying the drawing. However, in actuality, as shown in FIG. A number of process units 2 are arranged in the direction, and a number of holding units 12 are also arranged on the outer periphery of the turntable 13. Further, as shown in FIG. 1, the direct drive motor 14 is coaxially disposed below the turntable 13 and directly drives the turntable 13.

  On the other hand, as shown in FIG. 1, each drive unit 15 is provided corresponding to each of the process units 2, and abuts on the upper end portion of the suction nozzle 11 of the holding unit 12 to push the suction nozzle 11 downward. The operation rod 15a for driving and the drive part 15b which drives it are provided. The plurality of drive units 15 are arranged above the turntable 13 so as to be separated from the conveyance path of the holding unit 12 and overlap each other above the corresponding process unit 2 via the turntable 13. It is fixed integrally with the process unit 2 by the part 15c.

  Further, the drive unit 15 moves the operation rod 15a up and down by the drive unit 15b, thereby moving the suction nozzle 11 up and down between the upper position and the lower position, and moving the electronic component 3 held by the suction nozzle 11 to the transport path. It moves between the upper conveyance line and the processing line on the process processing unit 2a of the process unit 2. More specifically, each drive unit 15 is disposed such that the center of the operation rod 15a on the horizontal plane overlaps the center of the corresponding process processing unit 2a of each process unit 2 on the horizontal plane.

  A spring 16 is provided on the upper surface of the support portion 12 a of the holding unit 12. The spring 16 is configured to push up the suction nozzle 11 from the lower position to the upper position when the operation rod 15a of the drive unit 15 returns to the original position. The drive control pattern of the suction nozzle 11 by the drive unit 15, that is, the drive control of the movement time, the movement amount, the movement speed, the movement timing, the load, etc. between the upper position and the lower position of the suction nozzle 11 by the operation of the operation rod 15a. The pattern is individually set for each process according to the process unit 2 corresponding to each drive unit 15.

[2. Configuration around suction nozzle according to this embodiment]
In the present embodiment according to the present invention, the configuration of the suction nozzle 11 included in the holding unit 12 has a feature, and this point will be described in detail with reference to FIGS. 3 to 5 are schematic views of the vertical plane showing the main part of the present embodiment, FIG. 3 and FIG. 4 are side views, and FIG. 5 is a front view. FIG. 6 is a cross-sectional view of the vertical surface of the suction nozzle in the present embodiment.

  As shown in FIGS. 3 to 6, the suction nozzle 11 is divided into a long main body nozzle portion 11 b and a tip nozzle portion 11 a that contacts the electronic component 3. Of these, the tip nozzle portion 11a is formed of a super-hard sintered body. A suction hole 11c (shown in FIG. 6) passes through each of the nozzle portions 11a and 11b. When the nozzle portions 11a and 11b are integrated, the suction hole 11c communicates to form a single hole. Is arranged. Further, a connection hole 11d (shown in FIG. 6) is provided in the upper part on the main body nozzle portion 11b side, and is connected to a suction device (not shown) via the suction tube 20 (see FIGS. 3 and 4). ).

  Moreover, as shown in FIGS. 3-5, the fixed block 17 which fixes and integrates both nozzle parts 11a and 11b separately in the lower part of the suction nozzle 11 is provided. A notch 17a is formed in the center of the fixed block 17 so as to extend in the horizontal direction. Further, a cushioning material 18 such as urethane rubber is provided on the upper portion of the fixed block 17. The cushioning material 18 comes into contact with the lower surface of the turntable 13 when the suction nozzle 11 is raised.

  In addition, the height of the conveyance line of the electronic component 3 is regulated when the cushioning material 18 installed on the fixed block 17 hits the lower surface of the turntable 13. That is, the fixed block 17 is also a reference for determining the height of the conveyance line of the electronic component 3. Further, as shown in FIGS. 3 and 4, the fixing block 17 is fixed to the turntable 13 by a knock pin 19. The fixed block 17 and the knock pin 19 are fixed by driving, and the suction unit 12 and the knock pin 19 are freely slidable.

[3. Operation of this embodiment]
In the present embodiment having the above configuration, the electronic component 3 is held and transported as follows. First, the plurality of electronic components 3 are sequentially conveyed to the plurality of process units 2 by rotating the turntable 13 while the plurality of electronic components 3 are sucked and held by the suction nozzles 11 of the plurality of holding units 12. Each holding unit 12 holding the electronic component 3 stops the turntable 13 when reaching each stop position corresponding to each process unit 2.

  In this case, the center on the horizontal plane of the suction nozzle 11 of each holding unit 12 at each stop position corresponding to each process unit 2 is the center on the horizontal plane of the process unit 2 and the drive corresponding to the process unit 2. The operation rod 15a of the unit 15 overlaps the center on the horizontal plane. That is, the suction nozzle 11 of each holding unit 12 at each stop position can be driven by the operation rod 15 a of each drive unit 15. From such a state, in each drive unit 15, the operating rod 15 a is moved up and down to move the electronic component 3 to the transport position on the transport path by the turntable 13 and the processing position on the process processing unit 2 a of the process unit 2. Move between.

  As shown in FIG. 3, immediately after the electronic component 3 has been transported from the previous process, the suction nozzle 11 is in the raised position, and the height relationship of the electronic component 3 is at the transport line height. From this state, in each drive unit 15, the suction rod 11 is pushed down from the upper position to the lower position while the return spring 16 is contracted by lowering the operation rod 15 a by the drive portion 15 b (FIGS. 3 to 4). What).

  At this time, as the suction nozzle 11 is pushed by the operation rod 15 a, the fixed block 17 moves right under the slide of the knock pin 19. When the electronic component 3 reaches the processing line height, the suction nozzle 11 releases the suction, and the electronic component 3 is mounted at a predetermined position of the process unit 2. By such an operation, the electronic component 3 held at the nozzle tip portion 11a of the suction nozzle 11 is moved from the transfer position on the transfer path by the turntable 13 to the process position on the process processing unit 2a of the process unit 2, and the process is performed. Can be delivered to unit 2.

  Then, after each electronic component 3 is processed by each process unit 2, each electronic component 3 is again sucked and held by the suction nozzle 11 of each holding unit 12. The operating rod 15a is raised by the portion 15b. When the raised operating rod 15a is separated from the suction nozzle 11, the suction nozzle 11 and the fixed block 17 are pushed up from the lower position to the upper position by the accumulated force of the return spring 16 to return (from FIG. 4 to FIG. 3). At this time, the upper surface of the fixed block 17 hits the lower surface of the turntable 13 due to the stored force of the spring 16, but the shock is mitigated because of the buffer material 18. As described above, the electronic component 3 held at the suction tip 11a of the suction nozzle 11 is returned from the processing position on the process unit 2 step processing portion 2a to the transfer position on the transfer path by the turntable 13.

  When the electronic component 3 returns from the processing line height to the conveyance line height, the turn table 13 rotates by one pitch and conveys the electronic component 3 to the next process unit 2. By repeating the horizontal movement of the holding unit 12 by the rotation of the turntable 13, the stop at each stop position, the lowering of the electronic component 3 to the processing position, and the raising of the electronic component 3 to the transport position as described above as a cycle. A plurality of processes by the plurality of process units 2 can be sequentially performed on each electronic component 3.

[4. Effects of this embodiment]
The operational effects of the present embodiment as described above are as follows. That is, since the fixed block 17 fixes and integrates the tip nozzle portion 11a and the main body nozzle portion 11b, the operation of joining the two nozzle portions 11a and 11b and the sintering molding operation are not required, and the suction nozzle 11 can be simplified. Can be manufactured.

  In addition, the fixing block 17 fixes the tip nozzle portion 11a and the main body nozzle portion 11b separately, and has a notch portion 17a, so that it is easy to absorb mounting errors and processing errors. Accordingly, the two nozzle portions 11a and 11b can be reliably integrated and fixed. For this reason, nozzle part 11a, 11b does not shift | deviate, but the suction hole 11c is not clogged, and can show high adsorption power.

  Further, even if the tip nozzle portion 11a is worn or edged while the electronic component 3 is being sucked, the tip nozzle portion 11a and the body nozzle portion 11b are divided (that is, the tip nozzle portion 11a is divided into the body nozzle portion). 11b), only the tip nozzle portion 11a can be replaced. Thereby, replacement work time can be shortened and work cost can be reduced. In addition, good holding and conveying performance can be maintained for a long time, which can contribute to improvement in reliability.

  Moreover, in this embodiment, since the front-end | tip nozzle part 11a is formed from the ultra-hard sintered body, the abrasion resistance of the suction nozzle 11 front-end | tip surface can be improved. Furthermore, since the life of the tip nozzle portion 11a is extended, the replacement frequency is low and economical. In addition, since the tip nozzle part 11a is a super-hard sintered body, even if the electronic component 3 has the electrode which has come out on the resin part upper surface, an exact electrical property value can be measured. In addition, in the present embodiment in which both the nozzle portions 11a and 11b are fixed by the fixing block 17, it is not necessary to make the tip nozzle portion 11a a two-layer structure of a steel layer and a super-hard sintered body layer, and the manufacturing cost is greatly reduced. Is possible. In addition, since the ultra-high hardness sintered body has conductivity, an electrical influence on the electronic component 3 can be suppressed as a configuration in which a ground is connected thereto.

  Furthermore, in this embodiment, since the shock generated when the holding unit 12 is raised is reduced by the shock absorbing material 18 hitting the lower surface of the turn table 13, the electronic component 3 sucked by the suction nozzle 11 is caused by the shock. It does not fall from the suction nozzle 11. Therefore, the electronic component 3 can be stably held and conveyed. In this embodiment, when the suction nozzle 11 is pushed down by the drive rod 15a, the fixed block 17 is also lowered, and the spring 16 is contracted accordingly. Thereafter, the suction nozzle 11 and the fixed block 17 are lifted using the force by which the contracted spring 16 returns. In other words, the use of the spring 16 can simplify the configuration of the holding unit 12.

[5. Other Embodiments]
Note that the present invention is not limited to the above-described embodiment, and various other modifications can be similarly implemented within the scope of the present invention. For example, the present invention can be similarly applied to various types of conveyance means that can convey a plurality of movable holding means. Further, the present invention can be applied to a production line in which a plurality of conveying means are installed. Furthermore, the holding unit 12 and the operating rod 15a may be coupled by vacuum suction or mechanical means from the start of lowering to the completion of lifting, and the moving speed may be controlled by the drive unit 15. In the above embodiment, the drive unit 15 that drives the holding unit 12 is provided for each process unit 2. However, the present invention is not limited to this, and the drive unit 15 may be provided for each holding unit 12.

  Furthermore, as an embodiment in which the tip nozzle portion 11a of the suction nozzle 11 is formed of an ultra-high hardness sintered body, the surface of the tip nozzle portion 11a is an ultra-high hardness coating obtained by vapor-phase synthesis of diamond or cBN ultra-hard particles. (Diamond coating or cBN coating) may be used.

FIG. 2 is a schematic diagram of a vertical plane showing an outline of a configuration in one form of a holding unit drive control device that holds and transports a plurality of electronic components as a basic embodiment of the present invention. The schematic diagram of the horizontal surface which shows the arrangement | positioning relationship of the principal part of the holding | maintenance unit drive control apparatus shown in FIG. FIG. 2 is a schematic diagram showing a plurality of specific configuration examples of the drive unit shown in FIG. 1. Explanatory drawing explaining operation | movement of the drive unit and holding | maintenance unit shown in FIG. The schematic diagram which shows an example of another embodiment to which this invention is applied. The schematic diagram which shows an example of another embodiment to which this invention is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electronic component holding | maintenance conveyance mechanism 2 ... Process unit (process processing mechanism)
2a ... process processing part 3 ... electronic component 11 ... suction nozzle 11a ... tip nozzle part 11b ... main body nozzle part 12 ... holding unit (movable holding means)
12a ... support part 13 ... turntable (conveying means)
DESCRIPTION OF SYMBOLS 14 ... Direct drive motor 15 ... Drive unit 15a ... Operation rod 15b ... Drive part 15c ... Connection part 16 ... Spring 17 ... Fixed block 18 ... Buffer material 19 ... Knock pin 20 ... Suction tube

Claims (1)

Movable holding means that holds electronic components and can reciprocate, conveying means that conveys the movable holding portion to sequentially arranged process processing mechanisms while repeating a cycle of advancement and stop, and the electronic to the process processing mechanism In an electronic component holding and conveying mechanism provided with holding unit driving means for moving the movable holding means so as to deliver and receive parts,
The movable holding means is provided with a suction nozzle that can be divided into a main body nozzle portion and a tip nozzle portion,
The main body nozzle part and the tip nozzle part are separately fixed, and a fixing block for integrating both nozzle parts is provided ,
The fixed block is
A piece fixed to the main body nozzle part and a piece supporting the tip nozzle part are separated, and a notch part extending in an axial direction perpendicular to the axis of the two nozzle parts is separated between the two pieces. And arranged side by side in the axial direction of the two nozzle parts,
Further, the two nozzle pieces can be in direct contact with the main body nozzle portion and the tip nozzle portion on the same axis between the two nozzle portions without interposing the fixed block. An electronic component holding and conveying mechanism characterized in that it is clamped and fixed in an axial direction perpendicular to the axis .

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