JP4456620B2 - 検出装置 - Google Patents
検出装置 Download PDFInfo
- Publication number
- JP4456620B2 JP4456620B2 JP2007163767A JP2007163767A JP4456620B2 JP 4456620 B2 JP4456620 B2 JP 4456620B2 JP 2007163767 A JP2007163767 A JP 2007163767A JP 2007163767 A JP2007163767 A JP 2007163767A JP 4456620 B2 JP4456620 B2 JP 4456620B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- printed circuit
- detection method
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
- G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
101 ピン
11 プリント回路板
12 孔
20,40 検出装置
21,41 書き換え可能チップ
23,43 代替プリント回路板
24 固定ピン
25,431 ピン
26 シェル
261 固定素子
27 収容空間
29 スイッチ
42 接続プリント回路板
421 ピン
Claims (18)
- プリント回路板に電気的に接続された複数のピンを有するチップを検出する検出方法であって、
複数のピンを有する書き換え可能チップと、
前記書き換え可能チップに電気的に接続され、両側に設置された複数のピンを有し、前記書き換え可能チップのピンに電気的に接続された代替プリント回路板と、
前記チップと前記書き換え可能チップに接続され、前記チップと前記書き換え可能チップを制御するスイッチと、
を含む検出装置を提供する工程と、
前記チップのピンに、前記代替プリント回路板のピンを接触させる工程と、
前記チップが検出された際に、前記チップを無効にし、前記書き換え可能チップを有効にするためにスイッチを操作する工程と、
からなる検出方法。 - 前記代替プリント回路板は、前記代替プリント回路板を固定するための少なくとも1つの固定部を有することを特徴とする請求項1に記載の検出方法。
- 前記代替プリント回路板は、3つの固定部を有することを特徴とする請求項2に記載の検出方法。
- 前記代替プリント回路板は、前記代替プリント回路板のピンを保護するシェルを有することを特徴とする請求項1に記載の検出方法。
- 前記シェルは、固定素子を含むことを特徴とする請求項4に記載の検出方法。
- 前記シェルは、前記チップを収容する空間を含むことを特徴とする請求項4に記載の検出方法。
- 前記代替プリント回路板のピンは、スプリングピンであることを特徴とする請求項1に記載の検出方法。
- 前記代替プリント回路板のピンは、弾力性があることを特徴とする請求項1に記載の検出方法。
- 前記弾力性のあるピンは自由端を含み、前記自由端は水平方向に移動することを特徴とする請求項8に記載の検出方法。
- プリント回路板に電気的に接続された複数のピンを有するチップを検出する検出方法であって、
複数のピンを有する書き換え可能チップと、
複数のピンを有し、前記書き換え可能チップに電気的に接続される接続プリント回路板と、
前記書き換え可能チップと前記接続プリント回路板に電気的に接続され、両側に設置された複数のピンを含み、前記書き換え可能チップのピンに電気的に接続された代替プリント回路板と、
前記チップと前記書き換え可能チップに接続され、前記チップと前記書き換え可能チップを制御するスイッチと、
を含む検出装置を提供する工程と、
前記チップのピンに、前記代替プリント回路板のピンを接触させる工程と、
前記チップが検出された際に、前記チップを無効にし、前記書き換え可能チップを有効にするためにスイッチを操作する工程と、
からなる検出方法。 - 前記代替プリント回路板は、前記プリント回路板を固定するための少なくとも1つの固定部を有することを特徴とする請求項10に記載の検出方法。
- 前記代替プリント回路板は、3つの固定部を有することを特徴とする請求項11に記載の検出方法。
- 前記代替プリント回路板は、前記代替プリント回路板のピンを保護するシェルを有することを特徴とする請求項10に記載の検出方法。
- 前記シェルは、固定素子を含むことを特徴とする請求項13に記載の検出方法。
- 前記シェルは、前記チップを収容する空間を含むことを特徴とする請求項13に記載の検出方法。
- 前記代替プリント回路板のピンは、スプリングピンであることを特徴とする請求項10に記載の検出方法。
- 前記代替プリント回路板のピンは、弾力性があることを特徴とする請求項10に記載の検出方法。
- 前記弾力性のあるピンは自由端を含み、前記自由端は水平方向に移動することを特徴とする請求項17に記載の検出方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095137526A TWI310460B (en) | 2006-10-12 | 2006-10-12 | Detection device for chip |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008096421A JP2008096421A (ja) | 2008-04-24 |
JP4456620B2 true JP4456620B2 (ja) | 2010-04-28 |
Family
ID=39246821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007163767A Expired - Fee Related JP4456620B2 (ja) | 2006-10-12 | 2007-06-21 | 検出装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7768288B2 (ja) |
JP (1) | JP4456620B2 (ja) |
CN (1) | CN101169464A (ja) |
FR (1) | FR2907229B1 (ja) |
TW (1) | TWI310460B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2317330B1 (en) | 2009-09-11 | 2013-12-11 | Giga-Byte Technology Co., Ltd. | Pin connector and chip test fixture having the same |
CN102095956B (zh) * | 2009-12-11 | 2013-02-13 | 名硕电脑(苏州)有限公司 | 检测装置及检测方法 |
JP6365467B2 (ja) * | 2015-08-28 | 2018-08-01 | 株式会社デンソー | 断線検出装置 |
CN108076588A (zh) * | 2016-11-11 | 2018-05-25 | 技嘉科技股份有限公司 | 电子装置 |
CN110553832A (zh) * | 2019-10-17 | 2019-12-10 | 苏州晟达力芯电子科技有限公司 | 一种机械部件旋转检测的装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01160377A (ja) | 1987-12-15 | 1989-06-23 | Matsushita Electric Works Ltd | インバータの制御回路 |
JPH0477834A (ja) | 1990-07-16 | 1992-03-11 | Nippon Chemicon Corp | インサーキットエミュレータ |
JPH0695908A (ja) | 1992-06-02 | 1994-04-08 | Nec Corp | マイクロコンピュータ開発用システム・ボードの評価方 法およびその評価用プローブ |
US6885213B2 (en) * | 2002-09-13 | 2005-04-26 | Logicvision, Inc. | Circuit and method for accurately applying a voltage to a node of an integrated circuit |
US7129730B2 (en) * | 2004-12-15 | 2006-10-31 | Chipmos Technologies (Bermuda) Ltd. | Probe card assembly |
-
2006
- 2006-10-12 TW TW095137526A patent/TWI310460B/zh not_active IP Right Cessation
- 2006-10-27 CN CN200610136684.3A patent/CN101169464A/zh active Pending
-
2007
- 2007-01-18 US US11/654,558 patent/US7768288B2/en not_active Expired - Fee Related
- 2007-01-31 FR FR0700694A patent/FR2907229B1/fr not_active Expired - Fee Related
- 2007-06-21 JP JP2007163767A patent/JP4456620B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI310460B (en) | 2009-06-01 |
FR2907229A1 (fr) | 2008-04-18 |
FR2907229B1 (fr) | 2012-12-21 |
TW200817697A (en) | 2008-04-16 |
US7768288B2 (en) | 2010-08-03 |
US20080155312A1 (en) | 2008-06-26 |
CN101169464A (zh) | 2008-04-30 |
JP2008096421A (ja) | 2008-04-24 |
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