JP4455166B2 - リードフレーム - Google Patents

リードフレーム Download PDF

Info

Publication number
JP4455166B2
JP4455166B2 JP2004160230A JP2004160230A JP4455166B2 JP 4455166 B2 JP4455166 B2 JP 4455166B2 JP 2004160230 A JP2004160230 A JP 2004160230A JP 2004160230 A JP2004160230 A JP 2004160230A JP 4455166 B2 JP4455166 B2 JP 4455166B2
Authority
JP
Japan
Prior art keywords
slit
lead
die pad
lead frame
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004160230A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005340669A (ja
JP2005340669A5 (enExample
Inventor
道弘 柳澤
守一 吉池
敏幸 月岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apic Yamada Corp
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Priority to JP2004160230A priority Critical patent/JP4455166B2/ja
Publication of JP2005340669A publication Critical patent/JP2005340669A/ja
Publication of JP2005340669A5 publication Critical patent/JP2005340669A5/ja
Application granted granted Critical
Publication of JP4455166B2 publication Critical patent/JP4455166B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2004160230A 2004-05-28 2004-05-28 リードフレーム Expired - Fee Related JP4455166B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004160230A JP4455166B2 (ja) 2004-05-28 2004-05-28 リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004160230A JP4455166B2 (ja) 2004-05-28 2004-05-28 リードフレーム

Publications (3)

Publication Number Publication Date
JP2005340669A JP2005340669A (ja) 2005-12-08
JP2005340669A5 JP2005340669A5 (enExample) 2007-06-14
JP4455166B2 true JP4455166B2 (ja) 2010-04-21

Family

ID=35493857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004160230A Expired - Fee Related JP4455166B2 (ja) 2004-05-28 2004-05-28 リードフレーム

Country Status (1)

Country Link
JP (1) JP4455166B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101867106B1 (ko) 2010-03-30 2018-06-12 다이니폰 인사츠 가부시키가이샤 Led용 수지 부착 리드 프레임, 반도체 장치, 반도체 장치의 제조 방법 및 led용 수지 부착 리드 프레임의 제조 방법
CN103190008B (zh) 2010-11-02 2016-07-06 大日本印刷株式会社 Led元件搭载用引线框、附有树脂引线框、半导体装置的制造方法及半导体元件搭载用引线框
CN107742472B (zh) * 2017-09-25 2021-03-26 昆山国显光电有限公司 封装掩膜板、封装方法及显示面板

Also Published As

Publication number Publication date
JP2005340669A (ja) 2005-12-08

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