JP4449544B2 - 内部電極パターンの形成方法とこれを用いた積層セラミック電子部品の製造方法 - Google Patents

内部電極パターンの形成方法とこれを用いた積層セラミック電子部品の製造方法 Download PDF

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Publication number
JP4449544B2
JP4449544B2 JP2004117600A JP2004117600A JP4449544B2 JP 4449544 B2 JP4449544 B2 JP 4449544B2 JP 2004117600 A JP2004117600 A JP 2004117600A JP 2004117600 A JP2004117600 A JP 2004117600A JP 4449544 B2 JP4449544 B2 JP 4449544B2
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Japan
Prior art keywords
internal electrode
thin film
metal thin
support
resin layer
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Expired - Fee Related
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JP2004117600A
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Japanese (ja)
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JP2005303030A (ja
JP2005303030A5 (enExample
Inventor
淳夫 長井
健吾 中村
孝彦 辻村
冬希 阿部
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2004117600A priority Critical patent/JP4449544B2/ja
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Publication of JP2005303030A5 publication Critical patent/JP2005303030A5/ja
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JP2004117600A 2004-04-13 2004-04-13 内部電極パターンの形成方法とこれを用いた積層セラミック電子部品の製造方法 Expired - Fee Related JP4449544B2 (ja)

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JP2004117600A JP4449544B2 (ja) 2004-04-13 2004-04-13 内部電極パターンの形成方法とこれを用いた積層セラミック電子部品の製造方法

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JP2004117600A JP4449544B2 (ja) 2004-04-13 2004-04-13 内部電極パターンの形成方法とこれを用いた積層セラミック電子部品の製造方法

Publications (3)

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JP2005303030A JP2005303030A (ja) 2005-10-27
JP2005303030A5 JP2005303030A5 (enExample) 2007-05-24
JP4449544B2 true JP4449544B2 (ja) 2010-04-14

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JP2004117600A Expired - Fee Related JP4449544B2 (ja) 2004-04-13 2004-04-13 内部電極パターンの形成方法とこれを用いた積層セラミック電子部品の製造方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4591151B2 (ja) * 2005-03-30 2010-12-01 パナソニック株式会社 内部電極パターンの形成方法とこれを用いた積層セラミック電子部品の製造方法
JP6457628B2 (ja) * 2015-03-25 2019-01-23 京セラ株式会社 電子部品

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